CN111422819B - Sensor packaging structure, packaging method thereof and electronic equipment - Google Patents

Sensor packaging structure, packaging method thereof and electronic equipment Download PDF

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Publication number
CN111422819B
CN111422819B CN202010241811.6A CN202010241811A CN111422819B CN 111422819 B CN111422819 B CN 111422819B CN 202010241811 A CN202010241811 A CN 202010241811A CN 111422819 B CN111422819 B CN 111422819B
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substrate
adhesive film
integrated circuit
circuit chip
chip
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CN111422819A (en
Inventor
于永革
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Goertek Microelectronics Inc
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Goertek Microelectronics Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)

Abstract

The invention discloses a sensor packaging structure, a sensor packaging method and electronic equipment. Wherein, the packaging structure includes: a substrate; the cover cap is covered on the surface of the substrate and surrounds the substrate to form a containing cavity; the sensor chip is arranged in the accommodating cavity; the integrated circuit chip is arranged in the accommodating cavity and is electrically connected with the substrate and the sensor chip; and the adhesive film layer is coated on the surface of the integrated circuit chip, which is back to the substrate. The technical scheme of the invention can solve the problem that the adjacent chips are easy to be polluted due to smaller chip spacing in the dispensing process.

Description

Sensor packaging structure, packaging method thereof and electronic equipment
Technical Field
The present invention relates to the field of semiconductor devices, and in particular, to a sensor package structure, a sensor package method, and an electronic device.
Background
As the size of semiconductor devices is smaller, the chip pitch within the package structure is smaller, and as the shielding requirements for external corrosion and the like are higher, it is required to cover the surface of the integrated circuit chip with a protective layer. At present, a dispensing mode is generally adopted to realize the coating of the chips, but the chips are easy to pollute when the dispensing operation is carried out due to smaller chip spacing.
The foregoing is provided merely for the purpose of facilitating understanding of the technical solutions of the present invention and is not intended to represent an admission that the foregoing is prior art.
Disclosure of Invention
The invention mainly aims to provide a sensor packaging structure, a sensor packaging method and electronic equipment, and aims to solve the problem that a nearby chip is easy to pollute due to smaller chip spacing in the dispensing process.
In order to achieve the above object, the present invention provides a sensor package structure, including: a substrate; the cover cap is covered on the surface of the substrate and surrounds the substrate to form a containing cavity; the sensor chip is arranged in the accommodating cavity; the integrated circuit chip is arranged in the accommodating cavity and is electrically connected with the substrate and the sensor chip; and the adhesive film layer is coated on the surface of the integrated circuit chip, which is back to the substrate.
Optionally, the adhesive film layer covers the surface of the integrated circuit chip facing away from the substrate and the peripheral side surfaces.
Optionally, the adhesive film layer is made of silica gel.
Optionally, the thickness of the adhesive film layer is not less than 10 μm.
Optionally, a pad is disposed on a surface of the substrate facing the accommodating cavity, the sensor chip and the integrated circuit chip are both disposed on a surface of the substrate, a welding point is disposed on a surface of the sensor chip facing away from the substrate, a first pin and a second pin are disposed on a surface of the integrated circuit chip facing away from the substrate, and the adhesive film layer is provided with a first through hole exposing the first pin and a second through hole exposing the second pin; the packaging structure further comprises a first connecting wire and a second connecting wire, one end of the first connecting wire penetrates through the first through hole and is connected with the first pin, the other end of the first connecting wire is connected with the bonding pad, one end of the second connecting wire penetrates through the second through hole and is connected with the second pin, and the other end of the second connecting wire is connected with the welding point.
Optionally, the sensor chip is a microphone sensor chip, the substrate or the cover is provided with a sound hole corresponding to the microphone sensor chip, and the sound hole is communicated with the accommodating cavity.
The invention also provides a sensor packaging method, which comprises the following steps:
providing a substrate, a cover cap, a sensor chip, an integrated circuit chip and a rubber membrane;
attaching the sensor chip and the integrated circuit chip to the surface of the substrate;
attaching a rubber membrane to the surface of the integrated circuit chip, which is opposite to the substrate;
heating the adhesive film sheet to melt the adhesive film sheet, and then solidifying the adhesive film sheet to obtain an adhesive film layer coating the surface of the integrated circuit chip, which is back to the substrate;
and packaging the cover cap on the surface of the substrate to form a packaging structure with a containing cavity, wherein the sensor chip, the integrated circuit chip and the adhesive film layer are all positioned in the containing cavity.
Optionally, before the step of attaching the adhesive film to the surface of the integrated circuit chip facing away from the substrate, the method further includes:
and setting a glue point on the surface of the integrated circuit chip, which is opposite to the substrate.
Optionally, a bonding pad is arranged on the surface of the substrate, a welding point is arranged on the surface of the sensor chip, a first pin and a second pin are arranged on the surface of the integrated circuit chip, and a first through hole and a second through hole are formed in the adhesive film sheet;
the step of mounting the sensor chip and the integrated circuit chip on the surface of the substrate includes:
the welding point of the sensor chip is opposite to the surface of the substrate provided with the welding pad, and the sensor chip is attached to the surface of the substrate provided with the welding pad;
the first pin and the second pin of the integrated circuit chip are opposite to the surface of the substrate provided with the bonding pad, and the integrated circuit chip is attached to the surface of the substrate provided with the bonding pad;
the step of attaching the adhesive film to the surface of the integrated circuit chip facing away from the substrate comprises the following steps:
aligning the first through hole of the adhesive film to the first pin, aligning the second through hole to the second pin, and attaching the adhesive film to the surface of the integrated circuit chip, which is opposite to the substrate;
and heating the adhesive film sheet to melt the adhesive film sheet, and solidifying the adhesive film sheet to obtain an adhesive film layer coating the surface of the integrated circuit chip, which is opposite to the substrate, wherein the adhesive film layer further comprises:
providing a first connecting wire and a second connecting wire;
one end of the first connecting wire passes through the first through hole and is electrically connected with the first pin, and the other end of the first connecting wire is electrically connected with the bonding pad;
one end of the second connecting wire passes through the second through hole and is electrically connected to the second pin, and the other end of the second connecting wire is electrically connected to the welding point.
Optionally, in the step of heating the adhesive film to melt and then solidifying the adhesive film to obtain an adhesive film layer covering the surface of the integrated circuit chip facing away from the substrate, the temperature of heating the adhesive film is in a range of 80 ℃ to 300 ℃.
The invention also provides electronic equipment, which comprises the sensor packaging structure, wherein the packaging structure comprises: a substrate; the cover cap is covered on the surface of the substrate and surrounds the substrate to form a containing cavity; the sensor chip is arranged in the accommodating cavity; the integrated circuit chip is arranged in the accommodating cavity and is electrically connected with the substrate and the sensor chip; and the adhesive film layer is coated on the surface of the integrated circuit chip, which is back to the substrate.
According to the technical scheme, the cover cap is covered with the substrate to form the accommodating cavity, the sensor chip and the integrated circuit chip electrically connected with the sensor chip are arranged in the accommodating cavity, and meanwhile, the surface of the integrated circuit chip, which is opposite to the substrate, is covered by the adhesive film layer to realize the shielding protection effect, so that the existing adhesive dispensing mode is replaced to cover the integrated circuit chip, the problem that the adjacent chip is easy to pollute due to smaller chip spacing in the adhesive dispensing process can be effectively avoided, and the reliability and the yield of the packaging structure are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic cross-sectional view of an embodiment of a package structure according to the present invention;
FIG. 2 is a schematic cross-sectional view of another view of the package structure;
FIG. 3 is a flowchart illustrating steps of a method for fabricating a package structure according to an embodiment of the present invention;
FIG. 4 is a flowchart illustrating steps of another embodiment of a method for fabricating a package structure according to the present invention;
FIG. 5 is a schematic diagram of the structure after step S20 in FIG. 3;
fig. 6 is a schematic structural diagram of the structure after step S21 in fig. 3;
fig. 7 is a schematic structural diagram of the structure after step S30a in fig. 4;
fig. 8 is a schematic structural diagram after step S33 in fig. 4.
Reference numerals illustrate:
reference numerals Name of the name Reference numerals Name of the name
100 Packaging structure 41 First pin
100a Accommodating cavity 42 Second pin
10 Substrate board 43 Glue dot
11 Bonding pad 50 Adhesive film layer
12 Acoustic aperture 50a Adhesive film sheet
20 Cover cap 51 First through hole
30 Sensor chip 52 Second through hole
31 Welding point 60 First connecting wire
40 Integrated circuit chip 70 Second connecting wire
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, the technical solutions of the embodiments of the present invention may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the technical solutions, and when the technical solutions are contradictory or cannot be implemented, the combination of the technical solutions should be considered as not existing, and not falling within the scope of protection claimed by the present invention.
The present invention proposes a package structure 100.
Referring to fig. 1 and 2, in an embodiment of the invention, a sensor package 100 includes: a substrate 10; a cover 20, wherein the cover 20 covers the surface of the substrate 10 and encloses a containing cavity 100a; the sensor chip 30, the sensor chip 30 locates in the holding cavity 100a; the integrated circuit chip 40, the integrated circuit chip 40 locates in holding cavity 100a, and connect to base plate 10 and sensor chip 30 electrically; and the adhesive film layer 50 is coated on the surface of the integrated circuit chip 40, which is opposite to the substrate 10.
The substrate 10 is a printed circuit board, and may be a silicon substrate 10, an epoxy resin substrate 10, or the like, and has a circuit formed on one surface thereof for electrical connection, a signal lead-out pad 11 connected to the circuit, and an exposing port formed on the other surface thereof corresponding to the pad 11 for exposing the pad 11 for external connection with an electronic component. The cover 20 is typically glued to the surface of the substrate 10 on which the pads 11 are provided, and the two are assembled together to form a housing cavity 100a, and the pads 11 are located in the housing cavity 100a. The sensor chip 30 is disposed in the accommodating cavity 100a, and the sensor chip 30 may be an environmental sensor chip 30, such as an air pressure sensor chip 30, a humidity sensor chip 30, a temperature sensor chip 30, or an acoustic sensor chip 30, such as a microphone sensor chip 30, which is not limited herein, and is within the scope of the present invention. The integrated circuit chip 40 is also disposed in the accommodating cavity 100a, and the integrated circuit chip 40 is electrically connected to the bonding pad 11 of the substrate 10 and the sensor chip 30, and the electrical connection may be performed by wire bonding operation or by disposing metal wires in the substrate 10. The adhesive film layer 50 coats the surface of the integrated circuit chip 40, which is back to the substrate 10, so that the integrated circuit chip 40 can be effectively shielded and protected, and the adhesive film layer 50 is directly adopted for protection, so that the dispensing operation is not needed, the problem that the chips beside the adhesive film layer are easy to pollute due to smaller chip spacing in the dispensing process is effectively avoided, and the reliability and the yield of the packaging structure 100 are improved.
Here, the material of the adhesive film 50 is generally a plastic material, such as a silicone, a thermosetting epoxy plastic, a thermosetting phenolic plastic, etc., and the adhesive film 50 is generally formed by heating the adhesive film 50a to melt and then solidifying.
Therefore, it can be understood that in the technical solution of the present invention, the cover 20 is covered with the substrate 10 to form the accommodating cavity 100a, and the sensor chip 30 and the integrated circuit chip 40 electrically connected with the sensor chip 30 are disposed in the accommodating cavity 100a, and meanwhile, the adhesive film layer 50 is used to cover the surface of the integrated circuit chip 40 facing away from the substrate 10 to achieve the shielding protection effect, so that the existing adhesive dispensing method is replaced to cover the integrated circuit chip 40, and the problem that the adjacent chip is easily polluted due to smaller chip spacing in the adhesive dispensing process can be effectively avoided, thereby improving the reliability and yield of the package structure 100.
Further, the adhesive film layer 50 covers the surface of the integrated circuit chip 40 facing away from the substrate 10 and the peripheral side surface. The adhesive film layer 50 covers the surface of the integrated circuit chip 40 facing away from the substrate 10 and also covers the peripheral side surfaces thereof, so that the shielding and protecting effects are better. Of course, the size of the adhesive film layer 50 can be larger, and the peripheral edge of the adhesive film layer is wrapped on the surface of the substrate 10, so that the adhesive film layer can play an effective role in shielding and protecting, and can enhance the stability of the integrated circuit chip 40.
Optionally, the adhesive film layer 50 is made of silica gel. The material of the adhesive film layer 50 is silica gel, so that the cost of the material is low, and the operation is easy, namely, the adhesive film layer 50 is formed by heating a silica gel sheet to melt and then solidify, and the operation is simple and effective.
Alternatively, the thickness of the adhesive film layer 50 is not less than 10 μm. In order to ensure that the adhesive film layer 50 plays a role in shielding and protecting the integrated circuit chip 40, the thickness of the adhesive film layer 50 is not less than 10 μm, and the thickness can be set according to the actual requirements of users.
Referring to fig. 2 again, in an embodiment of the present invention, a surface of the substrate 10 facing the accommodating cavity 100a is provided with a bonding pad 11, both the sensor chip 30 and the integrated circuit chip 40 are disposed on the surface of the substrate 10, a surface of the sensor chip 30 facing away from the substrate 10 is provided with a bonding pad 31, a surface of the integrated circuit chip 40 facing away from the substrate 10 is provided with a first pin 41 and a second pin 42, and the adhesive film layer 50 is provided with a first through hole exposing the first pin 41 and a second through hole 52 exposing the second pin 42; the package structure 100 further includes a first connection wire 60 and a first connection wire 70, wherein one end of the first connection wire 60 passes through the first through hole and is connected to the first pin 41, the other end is connected to the pad 11, one end of the first connection wire 70 passes through the second through hole 52 and is connected to the second pin 42, and the other end is connected to the solder joint 31.
Here, the sensor chip 30 and the integrated circuit chip 40 are attached to the surface of the substrate 10 provided with the pads 11 by means of adhesion. The first through hole 51 and the second through hole 52 of the adhesive film layer 50 are both substantially square, and the first pin 41 and the second pin 42 are respectively exposed, however, the shapes of the first through hole 51 and the second through hole 52 may be circular or other reasonable and effective shapes, which are all within the scope of the present invention. The first connection wires 60 and 70 are generally gold wires, and the first connection wires 60 and 70 are used to realize electrical connection among the integrated circuit chip 40, the sensor chip 30 and the substrate 10, and it can be understood that the connection operation is performed after the adhesive film layer 50 is attached.
It should be noted that, the number of the first pins 41, the pads 11 and the first connecting wires 60 may be plural, and the first pins 41 and the pads 11 are in one-to-one correspondence and are electrically connected through a first connecting wire 60. Similarly, the number of the second pins 42, the soldering points 31 and the first connecting wires 70 may be plural, and the second pins 42 and the soldering points 31 are in one-to-one correspondence and are electrically connected through a first connecting wire 70.
In an embodiment of the present invention, the sensor chip 30 is a microphone sensor chip 30, and the substrate 10 or the cover 20 is provided with an acoustic hole 12 corresponding to the microphone sensor chip 30, and the acoustic hole 12 is communicated with the accommodating cavity 100a.
Referring to fig. 1 again, the sensor chip 30 is a microphone sensor chip 30, and the substrate 10 has a sound hole 12 corresponding to the microphone sensor chip 30, and the sound hole 12 is communicated with the accommodating cavity 100a for sensing and detecting an external sound source. Of course, the sound hole 12 may be formed in the cover 20, so as to sense and detect an external sound source.
Referring to fig. 3 and fig. 5 to fig. 8, the present invention further provides a method for manufacturing a package structure 100, where the method for manufacturing the package structure 100 includes the following steps:
step S10, providing a substrate 10, a cover 20, a sensor chip 30, an integrated circuit chip 40 and a plastic film sheet 50a;
step S20, attaching the sensor chip 30 and the integrated circuit chip 40 to the surface of the substrate 10;
step S30, attaching the adhesive film 50a to the surface of the integrated circuit chip 40 facing away from the substrate 10;
step S40, heating the adhesive film 50a to melt and then solidify the adhesive film to obtain an adhesive film 50 covering the surface of the integrated circuit chip 40 facing away from the substrate 10;
in step S50, the cover 20 is encapsulated on the surface of the substrate 10 to form an encapsulation structure 100 with a cavity 100a, and the sensor chip 30, the integrated circuit chip 40 and the adhesive film layer 50 are all located in the cavity 100a.
Specifically, the sensor chip 30 and the integrated circuit chip 40 are first attached to the surface of the substrate 10 by means of adhesion, that is, a conductive double-sided tape is attached to the surface of the sensor chip and the surface of the integrated circuit chip 40, and the conductive double-sided tape is attached to the surface of the substrate 10. Then, the adhesive film 50a is adhered to the surface of the integrated circuit chip 40 facing away from the substrate 10, and the size of the adhesive film 50a is slightly smaller than the size of the integrated circuit chip 40. And then heating the adhesive film 50a to enable the adhesive film 50a to be melted into a flowing liquid state, coating the surface of the integrated circuit chip 40, and solidifying to obtain the adhesive film layer 50 coating the surface of the integrated circuit chip 40. Finally, the cover 20 is sealed on the surface of the substrate 10 by gluing, so as to form a packaging structure 100 with a containing cavity 100a, and the sensor chip 30, the integrated circuit chip 40 and the adhesive film layer 50 are all located in the containing cavity 100a.
It can be appreciated that the adhesive film 50a is directly used to form the adhesive film 50 to cover the integrated circuit chip 40, instead of the dispensing operation to cover the integrated circuit chip 40, the problem that the chips beside the chip are easily polluted due to smaller chip spacing in the dispensing process is effectively avoided, so that the reliability and yield of the package structure 100 are improved.
It should be noted that, the size of the adhesive film 50a may be slightly smaller than the size of the integrated circuit chip 40, and the adhesive film 50 formed after heating, melting and solidifying can completely cover the surface of the integrated circuit chip 40 facing away from the substrate 10, so as to effectively play a role of shielding and protecting. Of course, the size of the adhesive film 50a may be slightly larger than the size of the integrated circuit chip 40, and the adhesive film 50 formed after heating, melting and solidifying can completely cover the surface of the integrated circuit chip 40 facing away from the substrate 10 and the peripheral surface thereof, so that the shielding and protecting effects thereof are better. Further, the adhesive film layer 50 formed after heating, melting and solidifying can completely cover the surface, the peripheral surface and the surface of the substrate 10, which are opposite to the surface of the integrated circuit chip 40, so that not only can an effective shielding and protecting effect be achieved, but also the stability of the integrated circuit chip 40 can be enhanced.
Further, before step S30, the method further includes:
in step S21, an adhesive 43 is disposed on the surface of the integrated circuit chip 40 facing away from the substrate 10.
Before the adhesive film 50a is applied, an adhesive 43 is dispensed on the surface of the integrated circuit chip 40 facing away from the substrate 10, so as to pre-fix the adhesive film 50a, which is beneficial to the subsequent heating operation.
In an embodiment of the present invention, the surface of the substrate 10 is provided with the bonding pad 11, the surface of the sensor chip 30 is provided with the bonding pad 31, the surface of the integrated circuit chip 40 is provided with the first pin 41 and the second pin 42, and the adhesive film 50a is provided with the first through hole and the second through hole 52;
referring to fig. 4 and fig. 5 to 8, in step S20, the method includes:
step S20a, namely, attaching the sensor chip 30 to the surface of the substrate 10 provided with the bonding pad 11, with the bonding pad 31 of the sensor chip 30 facing away from the surface of the substrate 10 provided with the bonding pad 11;
in step S20b, the first pins 41 and the second pins 42 of the integrated circuit chip 40 are opposite to the surface of the substrate 10 provided with the bonding pads 11, and the integrated circuit chip 40 is mounted on the surface of the substrate 10 provided with the bonding pads 11.
Accordingly, in step S30, it includes:
in step S30a, the first through hole of the adhesive film 50a is aligned with the first pin 41, the second through hole 52 is aligned with the second pin 42, and the adhesive film 50a is adhered to the surface of the integrated circuit chip 40 facing away from the substrate 10.
Accordingly, before step S40, it includes:
step S31, providing a first connection wire 60 and a first connection wire 70;
step S32, one end of the first connecting wire 60 passes through the first through hole and is electrically connected to the first pin 41, and the other end of the first connecting wire 60 is electrically connected to the bonding pad 11;
in step S33, one end of the first connecting wire 70 passes through the second through hole 52 and is electrically connected to the second pin 42, and the other end of the first connecting wire 70 is electrically connected to the soldering point 31.
Specifically, the adhesive film 50a is provided with a first through hole and a second through hole 52 in advance, when the adhesive film 50a is attached, the first through hole is aligned with the first pin 41 of the integrated circuit chip 40, the second through hole 52 is aligned with the second pin 42 of the integrated circuit chip 40, after the adhesive film 50a is attached, the first pin 41 is exposed by the first through hole, the second pin 42 is exposed by the second through hole 52, then the first pin 41 and the bonding pad 11 can be connected by a wire bonding operation through the first connecting wire 60, and the first connecting wire 70 is connected with the second pin 42 and the bonding point 31 of the sensor chip 30, so as to realize the electrical communication between the integrated circuit chip 40 and the sensor chip 30 and the substrate 10.
It can be appreciated that the first connection wire 60 and the first connection wire 70 correspondingly penetrate the first through hole and the second through hole 52 of the adhesive film 50a to realize the electrical connection among the integrated circuit chip 40, the sensor chip 30 and the substrate 10, and the connection operation is performed after the adhesive film 50 is attached, so that the problem of damage to the connection in the dispensing process can be effectively avoided, and the reliability of the package structure 100 is ensured. Before the adhesive film 50a is attached, an adhesive 43 is dispensed on the surface of the integrated circuit chip 40 facing away from the substrate 10, so as to pre-fix the adhesive film 50a, which is also beneficial to subsequent wire connection operation.
It should be noted that, the number of the first pins 41, the pads 11 and the first connecting wires 60 may be plural, and the first pins 41 and the pads 11 are in one-to-one correspondence and are electrically connected through a first connecting wire 60. Similarly, the number of the second pins 42, the soldering points 31 and the first connecting wires 70 may be plural, and the second pins 42 and the soldering points 31 are in one-to-one correspondence and are electrically connected through a first connecting wire 70.
Optionally, in step S40, the temperature of the adhesive sheet 50a is heated in a range of 80 ℃ to 300 ℃.
The temperature of the heating film 50a is 80 ℃ to 300 ℃, and in this temperature range, the film 50a is melted into flowing liquid with the increase of the heating temperature, and covers the surface of the integrated circuit chip 40, and then is solidified to obtain the film 50.
The invention also proposes an electronic device comprising a packaging structure 100 as described above, the specific structure of the packaging structure 100 being referred to the previous embodiments. The electronic device adopts all the technical solutions of all the embodiments, so that the electronic device has at least all the beneficial effects brought by the technical solutions of the embodiments, and the detailed description is omitted.
It should be noted that, the electronic device may be a mobile phone, a watch, an earphone, a bracelet, etc., and the package structure 100 is generally installed in a housing of the electronic device, so that the electronic device can implement more functions.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.

Claims (11)

1. A sensor package structure, comprising:
a substrate;
the cover cap is covered on the surface of the substrate and surrounds the substrate to form a containing cavity;
the sensor chip is arranged in the accommodating cavity;
an integrated circuit chip disposed in the accommodating cavity ， And is electrically connected to the substrate and the sensor chip; and
the adhesive film layer is coated on the surface of the integrated circuit chip, which is back to the substrate; the adhesive film layer is formed by heating the adhesive film sheet to melt and then solidifying the adhesive film sheet.
2. The package structure of claim 1, wherein the adhesive film layer covers a surface of the integrated circuit chip facing away from the substrate and a peripheral side surface.
3. The package structure of claim 1, wherein the adhesive layer is made of silica gel.
4. The package structure of claim 1, wherein the thickness of the glue film layer is not less than 10 μm.
5. The packaging structure of claim 1, wherein a bonding pad is arranged on the surface of the substrate facing the accommodating cavity, the sensor chip and the integrated circuit chip are both arranged on the surface of the substrate, a bonding pad is arranged on the surface of the sensor chip facing away from the substrate, a first pin and a second pin are arranged on the surface of the integrated circuit chip facing away from the substrate, and the adhesive film layer is provided with a first through hole exposing the first pin and a second through hole exposing the second pin;
the packaging structure further comprises a first connecting wire and a second connecting wire, one end of the first connecting wire penetrates through the first through hole and is connected with the first pin, the other end of the first connecting wire is connected with the bonding pad, one end of the second connecting wire penetrates through the second through hole and is connected with the second pin, and the other end of the second connecting wire is connected with the welding point.
6. The package structure according to any one of claims 1 to 5, wherein the sensor chip is a MEMS chip, and the substrate or the cover is provided with an acoustic hole corresponding to the MEMS chip, the acoustic hole communicating with the accommodation cavity.
7. A method of packaging a sensor, the method comprising the steps of:
providing a substrate, a cover cap, a sensor chip, an integrated circuit chip and a rubber membrane;
attaching the sensor chip and the integrated circuit chip to the surface of the substrate;
attaching a rubber membrane to the surface of the integrated circuit chip, which is opposite to the substrate;
heating the adhesive film sheet to melt the adhesive film sheet, and then solidifying the adhesive film sheet to obtain an adhesive film layer coating the surface of the integrated circuit chip, which is back to the substrate;
and packaging the cover cap on the surface of the substrate to form a packaging structure with a containing cavity, wherein the sensor chip, the integrated circuit chip and the adhesive film layer are all positioned in the containing cavity.
8. The packaging method of claim 7, wherein the step of attaching the adhesive film to the surface of the integrated circuit chip facing away from the substrate further comprises:
and setting a glue point on the surface of the integrated circuit chip, which is opposite to the substrate.
9. The packaging method of claim 7, wherein a bonding pad is disposed on a surface of the substrate, a bonding pad is disposed on a surface of the sensor chip, a first pin and a second pin are disposed on a surface of the integrated circuit chip, and a first through hole and a second through hole are formed in the adhesive film;
the step of mounting the sensor chip and the integrated circuit chip on the surface of the substrate includes:
the welding point of the sensor chip is opposite to the surface of the substrate provided with the welding pad, and the sensor chip is attached to the surface of the substrate provided with the welding pad;
the first pin and the second pin of the integrated circuit chip are opposite to the surface of the substrate provided with the bonding pad, and the integrated circuit chip is attached to the surface of the substrate provided with the bonding pad;
the step of attaching the adhesive film to the surface of the integrated circuit chip facing away from the substrate comprises the following steps:
aligning the first through hole of the adhesive film to the first pin, aligning the second through hole to the second pin, and attaching the adhesive film to the surface of the integrated circuit chip, which is opposite to the substrate;
and heating the adhesive film sheet to melt the adhesive film sheet, and solidifying the adhesive film sheet to obtain an adhesive film layer coating the surface of the integrated circuit chip, which is opposite to the substrate, wherein the adhesive film layer further comprises:
providing a first connecting wire and a second connecting wire;
one end of the first connecting wire passes through the first through hole and is electrically connected with the first pin, and the other end of the first connecting wire is electrically connected with the bonding pad;
one end of the second connecting wire passes through the second through hole and is electrically connected to the second pin, and the other end of the second connecting wire is electrically connected to the welding point.
10. The packaging method according to any one of claims 7 to 9, wherein in the step of heating the adhesive film to melt and then solidify the adhesive film, a temperature of the adhesive film is in a range of 80 ℃ to 300 ℃.
11. An electronic device, characterized in that it comprises a sensor package structure according to any one of claims 1 to 6.
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CN112911490B (en) * 2021-01-19 2023-01-24 潍坊歌尔微电子有限公司 Sensor packaging structure, manufacturing method thereof and electronic equipment
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