CN111422819A - Sensor packaging structure, packaging method thereof and electronic equipment - Google Patents

Sensor packaging structure, packaging method thereof and electronic equipment Download PDF

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Publication number
CN111422819A
CN111422819A CN202010241811.6A CN202010241811A CN111422819A CN 111422819 A CN111422819 A CN 111422819A CN 202010241811 A CN202010241811 A CN 202010241811A CN 111422819 A CN111422819 A CN 111422819A
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China
Prior art keywords
substrate
integrated circuit
adhesive film
circuit chip
chip
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CN202010241811.6A
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Chinese (zh)
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CN111422819B (en
Inventor
于永革
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Goertek Microelectronics Inc
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Goertek Microelectronics Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)

Abstract

The invention discloses a sensor packaging structure, a packaging method thereof and electronic equipment. Wherein, the packaging structure includes: a substrate; the cover cap is arranged on the surface of the substrate in a covering mode and encloses to form an accommodating cavity; the sensor chip is arranged in the accommodating cavity; the integrated circuit chip is arranged in the accommodating cavity and is electrically connected with the substrate and the sensor chip; and the adhesive film layer is coated on the surface of the integrated circuit chip, which faces away from the substrate. The technical scheme of the invention can solve the problem that the chips beside the chip are easily polluted due to the small chip spacing in the dispensing process.

Description

Sensor packaging structure, packaging method thereof and electronic equipment
Technical Field
The invention relates to the technical field of semiconductor devices, in particular to a sensor packaging structure, a packaging method thereof and electronic equipment.
Background
As the size of semiconductor devices is getting smaller, the chip pitch in the package structure is getting smaller, and meanwhile, as the shielding requirements for external corrosion and the like are getting higher, it is required to coat a protective layer on the surface of the integrated circuit chip. At present, the chip is usually coated by dispensing, but because the chip spacing is small, the chip beside the chip is easily polluted during dispensing operation.
The above is only for the purpose of assisting understanding of the technical aspects of the present invention, and does not represent an admission that the above is prior art.
Disclosure of Invention
The invention mainly aims to provide a sensor packaging structure, a packaging method thereof and electronic equipment, and aims to solve the problem that chips beside a sensor are easily polluted due to small chip spacing in a dispensing process.
In order to achieve the above object, the present invention provides a sensor package structure, including: a substrate; the cover cap is arranged on the surface of the substrate in a covering mode and encloses to form an accommodating cavity; the sensor chip is arranged in the accommodating cavity; the integrated circuit chip is arranged in the accommodating cavity and is electrically connected with the substrate and the sensor chip; and the adhesive film layer is coated on the surface of the integrated circuit chip, which faces away from the substrate.
Optionally, the adhesive film layer covers a surface of the integrated circuit chip facing away from the substrate and peripheral side surfaces.
Optionally, the material of the adhesive film layer is silica gel.
Optionally, the thickness of the adhesive film layer is not less than 10 μm.
Optionally, a bonding pad is arranged on the surface of the substrate facing the accommodating cavity, the sensor chip and the integrated circuit chip are both arranged on the surface of the substrate, a bonding point is arranged on the surface of the sensor chip facing away from the substrate, a first pin and a second pin are arranged on the surface of the integrated circuit chip facing away from the substrate, and the adhesive film layer is provided with a first through hole exposing the first pin and a second through hole exposing the second pin; the packaging structure further comprises a first connecting wire and a second connecting wire, one end of the first connecting wire penetrates through the first through hole and is connected to the first pin, the other end of the first connecting wire is connected to the bonding pad, one end of the second connecting wire penetrates through the second through hole and is connected to the second pin, and the other end of the second connecting wire is connected to the welding point.
Optionally, the sensor chip is a microphone sensor chip, the substrate or the cover cap has a sound hole corresponding to the microphone sensor chip, and the sound hole is communicated with the accommodating cavity.
The invention also provides a sensor packaging method, which comprises the following steps:
providing a substrate, a cover cap, a sensor chip, an integrated circuit chip and a rubber membrane;
mounting the sensor chip and the integrated circuit chip on the surface of the substrate;
attaching a glue film sheet on the surface of the integrated circuit chip, which faces away from the substrate;
heating the adhesive film to melt the adhesive film, and then curing to obtain an adhesive film layer covering the surface of the integrated circuit chip, which faces away from the substrate;
and encapsulating the cover on the surface of the substrate to form an encapsulation structure with an accommodating cavity in an enclosing manner, wherein the sensor chip, the integrated circuit chip and the adhesive film layer are all positioned in the accommodating cavity.
Optionally, before the step of attaching the adhesive film to the surface of the integrated circuit chip facing away from the substrate, the method further includes:
and arranging a glue point on the surface of the integrated circuit chip, which is back to the substrate.
Optionally, a bonding pad is arranged on the surface of the substrate, a welding point is arranged on the surface of the sensor chip, a first pin and a second pin are arranged on the surface of the integrated circuit chip, and a first through hole and a second through hole are formed in the adhesive film;
the step of attaching the sensor chip and the integrated circuit chip to the surface of the substrate includes:
the welding point of the sensor chip is opposite to the surface of the substrate provided with the welding pad, and the sensor chip is attached to the surface of the substrate provided with the welding pad;
the first pin and the second pin of the integrated circuit chip are opposite to the surface of the substrate provided with the bonding pad, and the integrated circuit chip is attached to the surface of the substrate provided with the bonding pad;
the step of attaching a glue film to the surface of the integrated circuit chip facing away from the substrate comprises:
aligning the first through hole of the adhesive film sheet with the first pin, aligning the second through hole with the second pin, and attaching the adhesive film sheet on the surface of the integrated circuit chip, which faces away from the substrate;
before the step of heating the adhesive film to melt and then curing the adhesive film to obtain the adhesive film layer covering the surface of the integrated circuit chip, which faces away from the substrate, the method further comprises the following steps:
providing a first connecting wire and a second connecting wire;
one end of the first connecting wire penetrates through the first through hole and is electrically connected with the first pin, and the other end of the first connecting wire is electrically connected with the bonding pad;
and one end of the second connecting wire penetrates through the second through hole and is electrically connected with the second pin, and the other end of the second connecting wire is electrically connected with the welding point.
Optionally, in the step of heating the adhesive film to melt the adhesive film and then curing the adhesive film to obtain the adhesive film layer covering the surface of the integrated circuit chip facing away from the substrate, the temperature range of the adhesive film is 80 ℃ to 300 ℃.
The invention further provides an electronic device, which includes the sensor package structure, and the package structure includes: a substrate; the cover cap is arranged on the surface of the substrate in a covering mode and encloses to form an accommodating cavity; the sensor chip is arranged in the accommodating cavity; the integrated circuit chip is arranged in the accommodating cavity and is electrically connected with the substrate and the sensor chip; and the adhesive film layer is coated on the surface of the integrated circuit chip, which faces away from the substrate.
According to the technical scheme, the cover cap is covered on the substrate to enclose the substrate to form the containing cavity, the sensor chip and the integrated circuit chip electrically connected with the sensor chip are arranged in the containing cavity, and the adhesive film layer is used for coating the surface of the integrated circuit chip, which faces away from the substrate, so that the shielding and protecting effects are realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of a package structure according to an embodiment of the invention;
FIG. 2 is a schematic cross-sectional view of another perspective of the package structure;
FIG. 3 is a flowchart illustrating steps of a method for fabricating a package structure according to an embodiment of the present invention;
FIG. 4 is a flowchart illustrating a manufacturing method of a package structure according to another embodiment of the present invention;
FIG. 5 is a schematic structural diagram after step S20 in FIG. 3;
FIG. 6 is a schematic structural diagram after step S21 in FIG. 3;
FIG. 7 is a schematic structural diagram of FIG. 4 after step S30 a;
fig. 8 is a schematic structural diagram after step S33 in fig. 4.
The reference numbers illustrate:
reference numerals Name (R) Reference numerals Name (R)
100 Packaging structure 41 First pin
100a Containing cavity 42 Second pin
10 Substrate 43 Glue point
11 Bonding pad 50 Film layer
12 Sound hole 50a Rubber diaphragm
20 Cover cap 51 First of allThrough hole
30 Sensor chip 52 Second through hole
31 Welding point 60 First connecting wire
40 Integrated circuit chip 70 Second connecting wire
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The present invention provides a package structure 100.
Referring to fig. 1 and 2, in an embodiment of the invention, a sensor package structure 100 includes: a substrate 10; the cover 20 is covered on the surface of the substrate 10, and encloses to form an accommodating cavity 100 a; the sensor chip 30, the sensor chip 30 is arranged in the accommodating cavity 100 a; the integrated circuit chip 40 is arranged in the accommodating cavity 100a, and the integrated circuit chip 40 is electrically connected to the substrate 10 and the sensor chip 30; and the adhesive film layer 50, wherein the adhesive film layer 50 covers the surface of the integrated circuit chip 40 opposite to the substrate 10.
Here, the substrate 10 is a printed circuit board, and may be a silicon substrate 10, an epoxy resin substrate 10, etc., one surface of which is formed with a circuit for electrical connection and is provided with a signal lead-out pad 11 connected with the circuit, and the other surface of which is opened with an exposure opening corresponding to the pad 11 to expose the pad 11 for external connection of an electronic component. The cover 20 is usually glued to the surface of the substrate 10 on which the pads 11 are disposed, and the two are assembled together to form a receiving cavity 100a, and the pads 11 are located in the receiving cavity 100 a. The sensor chip 30 is disposed in the accommodating cavity 100a, and the sensor chip 30 may be an environmental sensor chip 30, such as an air pressure sensor chip 30, a humidity sensor chip 30, a temperature sensor chip 30, or an acoustic sensor chip 30, such as a microphone sensor chip 30, without limitation, and is within the scope of the present invention. The integrated circuit chip 40 is also disposed in the accommodating cavity 100a, and the integrated circuit chip 40 is electrically connected to the bonding pad 11 of the substrate 10 and the sensor chip 30, and the electrical connection may be performed by wire bonding or by disposing metal wires in the substrate 10. The adhesive film layer 50 covers the surface of the integrated circuit chip 40 opposite to the substrate 10, so that the integrated circuit chip 40 can be effectively shielded and protected, and the adhesive film layer 50 is directly used for protection without dispensing operation, thereby effectively avoiding the problem that chips beside the chip are easily polluted due to small chip spacing in the dispensing process, and improving the reliability and yield of the packaging structure 100.
Here, the material of the adhesive film layer 50 is generally a plastic material, such as silica gel, thermosetting epoxy plastic, thermosetting phenolic plastic, etc., and the adhesive film layer 50 is generally formed by heating the adhesive film 50a to melt and then curing.
Therefore, it can be understood that, in the technical scheme of the present invention, the cover 20 is covered on the substrate 10 to form the accommodating cavity 100a, the sensor chip 30 and the integrated circuit chip 40 electrically connected to the sensor chip 30 are disposed in the accommodating cavity 100a, and the adhesive film layer 50 is used to coat the surface of the integrated circuit chip 40 opposite to the substrate 10 to achieve the shielding effect, instead of the conventional method of coating the integrated circuit chip 40 by using a dispensing method, so that the problem of easy pollution of the chips beside due to small chip spacing in the dispensing process can be effectively avoided, thereby improving the reliability and yield of the package structure 100.
Further, the adhesive film layer 50 covers the surface of the integrated circuit chip 40 facing away from the substrate 10 and the peripheral side surface. The adhesive film layer 50 covers the surface of the integrated circuit chip 40 opposite to the substrate 10 and the peripheral side surface thereof, so that the shielding effect is better. Of course, the size of the adhesive film layer 50 may be larger, and the peripheral edge thereof is wrapped on the surface of the substrate 10, so as to achieve the effective shielding effect and enhance the stability of the integrated circuit chip 40.
Optionally, the material of the adhesive film layer 50 is silica gel. The material of the silica gel film layer 50 is silica gel, so that the material cost is low, and the silica gel film layer 50 is obtained by easy operation, namely the silica gel film layer is formed by heating a silica gel sheet to be melted and then solidifying, and the operation is simple and effective.
Alternatively, the thickness of the adhesive film layer 50 is not less than 10 μm. In order to ensure that the adhesive film layer 50 has a shielding effect on the integrated circuit chip 40, the thickness of the adhesive film layer 50 is not less than 10 μm, and the thickness can be set according to the actual requirement of the user.
Referring to fig. 2 again, in an embodiment of the invention, a bonding pad 11 is disposed on a surface of the substrate 10 facing the accommodating cavity 100a, the sensor chip 30 and the integrated circuit chip 40 are both disposed on the surface of the substrate 10, a bonding pad 31 is disposed on a surface of the sensor chip 30 facing away from the substrate 10, a first pin 41 and a second pin 42 are disposed on a surface of the integrated circuit chip 40 facing away from the substrate 10, and the adhesive layer 50 is disposed with a first through hole exposing the first pin 41 and a second through hole 52 exposing the second pin 42; the package structure 100 further includes a first connection wire 60 and a first connection wire 70, one end of the first connection wire 60 passes through the first through hole and is connected to the first pin 41, the other end is connected to the pad 11, one end of the first connection wire 70 passes through the second through hole 52 and is connected to the second pin 42, and the other end is connected to the bonding pad 31.
Here, the sensor chip 30 and the integrated circuit chip 40 are both attached to the surface of the substrate 10 on which the pads 11 are provided by means of adhesive. The first through hole 51 and the second through hole 52 of the adhesive film layer 50 are both substantially square in shape and respectively expose the first lead 41 and the second lead 42, but of course, the shape of the first through hole 51 and the second through hole 52 may also be circular or other reasonable and effective shapes, and all fall within the protection scope of the present invention. Here, the first connecting wires 60 and the first connecting wires 70 are generally gold wires, and the electrical connection between the integrated circuit chip 40, the sensor chip 30 and the substrate 10 is realized through the first connecting wires 60 and the first connecting wires 70, it can be understood that the connection operation is performed after the adhesive film layer 50 is attached, compared with the conventional connection operation performed before the dispensing operation, the technical solution of the present invention can effectively avoid the problem that the connection may be damaged in the dispensing process, and ensure the reliability of the use of the package structure 100.
It should be noted that, the number of the first leads 41, the pads 11 and the first connecting wires 60 may be plural, and the first leads 41 and the pads 11 correspond to each other one by one and are electrically connected through one first connecting wire 60. Similarly, the number of the second leads 42, the soldering points 31 and the first connecting wires 70 may also be multiple, and the second leads 42 and the soldering points 31 are in one-to-one correspondence and electrically connected through one first connecting wire 70.
In an embodiment of the present invention, the sensor chip 30 is a microphone sensor chip 30, the substrate 10 or the cover 20 has a sound hole 12 corresponding to the microphone sensor chip 30, and the sound hole 12 is communicated with the accommodating cavity 100 a.
Referring to fig. 1 again, the sensor chip 30 is a microphone sensor chip 30, the substrate 10 has a sound hole 12 corresponding to the microphone sensor chip 30, and the sound hole 12 is communicated with the accommodating cavity 100a for sensing and detecting an external sound source. Of course, the sound hole 12 may be opened in the cover 20 to sense and detect the external sound source.
Referring to fig. 3, fig. 5 to fig. 8, the present invention further provides a manufacturing method of the package structure 100, wherein the manufacturing method of the package structure 100 includes the following steps:
step S10, providing the substrate 10, the cover 20, the sensor chip 30, the integrated circuit chip 40, and the adhesive film 50 a;
step S20, attaching the sensor chip 30 and the integrated circuit chip 40 to the surface of the substrate 10;
step S30, attaching the adhesive film 50a to the surface of the integrated circuit chip 40 opposite to the substrate 10;
step S40, heating the adhesive film 50a to melt it, and then curing it to obtain the adhesive film 50 covering the surface of the integrated circuit chip 40 opposite to the substrate 10;
step S50, encapsulating the cover 20 on the surface of the substrate 10 to form an encapsulation structure 100 having an accommodating cavity 100a, where the sensor chip 30, the integrated circuit chip 40, and the adhesive film layer 50 are all located in the accommodating cavity 100 a.
Specifically, the sensor chip 30 and the integrated circuit chip 40 are first attached to the surface of the substrate 10 by gluing, that is, a conductive double-sided tape is attached to the surface of the sensor chip and the surface of the integrated circuit chip 40, and then attached to the surface of the substrate 10 by the conductive double-sided tape. Then, the adhesive film 50a is attached to the surface of the integrated circuit chip 40 opposite to the substrate 10, and the size of the adhesive film 50a is slightly smaller than that of the integrated circuit chip 40. Then, the adhesive film 50a is heated to melt the adhesive film 50a into a flowing liquid state, and the liquid state is coated on the surface of the integrated circuit chip 40, and then the adhesive film 50 coated on the surface of the integrated circuit chip 40 is obtained after solidification. Finally, the cover 20 is packaged on the surface of the substrate 10 by gluing, so as to form the packaging structure 100 with the accommodating cavity 100a, and the sensor chip 30, the integrated circuit chip 40 and the glue film layer 50 are all located in the accommodating cavity 100 a.
It can be understood that, the adhesive film layer 50 is formed by directly heating the adhesive film 50a to cover the integrated circuit chip 40, rather than using the dispensing operation to cover the integrated circuit chip 40, which effectively avoids the problem of chip pollution caused by the small chip spacing during the dispensing process, thereby improving the reliability and yield of the package structure 100.
It should be noted that, the size of the adhesive film 50a may be slightly smaller than the size of the integrated circuit chip 40, and the adhesive film 50 formed after melting and curing by heating just can completely cover the surface of the integrated circuit chip 40 opposite to the substrate 10, so as to effectively play a role of shielding. Certainly, the size of the adhesive film 50a may also be slightly larger than the size of the integrated circuit chip 40, and the adhesive film layer 50 formed after being heated, melted and solidified can completely cover the surface of the integrated circuit chip 40 facing away from the substrate 10 and the peripheral surface, so that the shielding effect is better. Further, the adhesive film layer 50 formed after heating, melting and curing can completely cover the surface of the integrated circuit chip 40 opposite to the substrate 10, the peripheral surface and the surface of the substrate 10, so that an effective shielding effect can be achieved, and the stability of the integrated circuit chip 40 can be enhanced.
Further, before step S30, the method further includes:
in step S21, a glue dot 43 is disposed on the surface of the ic chip 40 opposite to the substrate 10.
Here, before the adhesive film 50a is applied, a glue dot 43 is applied to the surface of the integrated circuit chip 40 facing away from the substrate 10 to pre-fix the adhesive film 50a, which is beneficial for the subsequent heating operation.
In an embodiment of the present invention, a bonding pad 11 is disposed on a surface of the substrate 10, a bonding pad 31 is disposed on a surface of the sensor chip 30, a first pin 41 and a second pin 42 are disposed on a surface of the integrated circuit chip 40, and a first through hole and a second through hole 52 are disposed on the adhesive film 50 a;
referring to fig. 4, 5 to 8, step S20 includes:
step S20a, mounting the bonding pad 31 of the sensor chip 30 on the surface of the substrate 10 on which the bonding pad 11 is disposed, and attaching the sensor chip 30 to the surface of the substrate 10 on which the bonding pad 11 is disposed;
step S20b, the first lead 41 and the second lead 42 of the integrated circuit chip 40 are opposite to the surface of the substrate 10 on which the bonding pad 11 is disposed, and the integrated circuit chip 40 is attached to the surface of the substrate 10 on which the bonding pad 11 is disposed.
Accordingly, step S30 includes:
step S30a, aligning the first through hole of the adhesive film 50a with the first lead 41, aligning the second through hole 52 with the second lead 42, and attaching the adhesive film 50a on the surface of the integrated circuit chip 40 opposite to the substrate 10.
Accordingly, before step S40, the method includes:
step S31, providing the first connecting wire 60 and the first connecting wire 70;
step S32, passing one end of the first connecting wire 60 through the first through hole and electrically connecting to the first lead 41, and electrically connecting the other end of the first connecting wire 60 to the pad 11;
in step S33, one end of the first connecting wire 70 is passed through the second through hole 52 and electrically connected to the second lead 42, and the other end of the first connecting wire 70 is electrically connected to the soldering point 31.
Specifically, the adhesive film 50a is pre-formed with a first through hole and a second through hole 52, when the adhesive film 50a is mounted, the first through hole is aligned with the first pin 41 of the integrated circuit chip 40, and the second through hole 52 is aligned with the second pin 42 of the integrated circuit chip 40, so that after the adhesive film 50a is mounted, the first pin 41 is exposed from the first through hole, the second pin 42 is exposed from the second through hole 52, and then the first connecting wire 60 can be used to connect the first pin 41 and the bonding pad 11 through a routing operation, and the first connecting wire 70 is used to connect the second pin 42 and the bonding pad 31 of the sensor chip 30, so as to electrically communicate the integrated circuit chip 40 with the sensor chip 30 and the substrate 10.
It can be understood that, in the present invention, the first connecting wires 60 and the first connecting wires 70 are correspondingly passed through the first through holes and the second through holes 52 of the adhesive film 50a to achieve the electrical connection between the integrated circuit chip 40, the sensor chip 30 and the substrate 10, and the connection operation is performed after the adhesive film 50 is attached, compared with the conventional connection operation performed before the dispensing operation, the problem of possible damage to the connection during the dispensing process can be effectively avoided, and the reliability of the use of the package structure 100 is ensured. Before the adhesive film 50a is attached, a glue dot 43 is applied on the surface of the integrated circuit chip 40 opposite to the substrate 10 to pre-fix the adhesive film 50a, which is also beneficial to the subsequent wiring operation.
It should be noted that, the number of the first leads 41, the pads 11 and the first connecting wires 60 may be plural, and the first leads 41 and the pads 11 correspond to each other one by one and are electrically connected through one first connecting wire 60. Similarly, the number of the second leads 42, the soldering points 31 and the first connecting wires 70 may also be multiple, and the second leads 42 and the soldering points 31 are in one-to-one correspondence and electrically connected through one first connecting wire 70.
Alternatively, in step S40, the temperature range for heating the adhesive film sheet 50a is 80 ℃ to 300 ℃.
The temperature range of the heated glue film 50a is 80 ℃ to 300 ℃, and in the temperature range, along with the increase of the heating temperature, the glue film 50a is melted into flowing liquid firstly, coated on the surface of the integrated circuit chip 40, and then cured to obtain the glue film 50.
The present invention also provides an electronic device, which includes the package structure 100 as described above, and the specific structure of the package structure 100 refers to the foregoing embodiments. Since the electronic device adopts all technical solutions of all the foregoing embodiments, at least all the beneficial effects brought by the technical solutions of the foregoing embodiments are achieved, and no further description is given here.
It should be noted that the electronic device may be a mobile phone, a watch, an earphone, a bracelet, or the like, and the package structure 100 is generally installed in a housing of the electronic device, so that the electronic device can implement more functions.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (11)

1. A sensor package structure, comprising:
a substrate;
the cover cap is arranged on the surface of the substrate in a covering mode and encloses to form an accommodating cavity;
the sensor chip is arranged in the accommodating cavity;
the integrated circuit chip is arranged in the accommodating cavity and is electrically connected with the substrate and the sensor chip; and
and the adhesive film layer is coated on the surface of the integrated circuit chip, which faces away from the substrate.
2. The package structure of claim 1, wherein the adhesive film layer covers a surface of the integrated circuit chip facing away from the substrate and peripheral side surfaces.
3. The package structure of claim 1, wherein the adhesive layer is made of silicone.
4. The package structure of claim 1, wherein the adhesive film layer has a thickness of not less than 10 μm.
5. The package structure according to claim 1, wherein a bonding pad is disposed on a surface of the substrate facing the accommodating cavity, the sensor chip and the integrated circuit chip are both disposed on the surface of the substrate, a bonding pad is disposed on a surface of the sensor chip facing away from the substrate, a first pin and a second pin are disposed on a surface of the integrated circuit chip facing away from the substrate, and the adhesive layer is formed with a first through hole exposing the first pin and a second through hole exposing the second pin;
the packaging structure further comprises a first connecting wire and a second connecting wire, one end of the first connecting wire penetrates through the first through hole and is connected to the first pin, the other end of the first connecting wire is connected to the bonding pad, one end of the second connecting wire penetrates through the second through hole and is connected to the second pin, and the other end of the second connecting wire is connected to the welding point.
6. The package structure according to any one of claims 1 to 5, wherein the sensor chip is a MEMS chip, and the substrate or the cover has a sound hole corresponding to the MEMS chip, and the sound hole is communicated with the accommodating cavity.
7. A method of packaging a sensor, the method comprising the steps of:
providing a substrate, a cover cap, a sensor chip, an integrated circuit chip and a rubber membrane;
mounting the sensor chip and the integrated circuit chip on the surface of the substrate;
attaching a glue film sheet on the surface of the integrated circuit chip, which faces away from the substrate;
heating the adhesive film to melt the adhesive film, and then curing to obtain an adhesive film layer covering the surface of the integrated circuit chip, which faces away from the substrate;
and encapsulating the cover on the surface of the substrate to form an encapsulation structure with an accommodating cavity in an enclosing manner, wherein the sensor chip, the integrated circuit chip and the adhesive film layer are all positioned in the accommodating cavity.
8. The packaging method of claim 7, wherein the step of applying an adhesive film to the surface of the integrated circuit chip facing away from the substrate further comprises:
and arranging a glue point on the surface of the integrated circuit chip, which is back to the substrate.
9. The packaging method according to claim 7, wherein a bonding pad is disposed on a surface of the substrate, a bonding pad is disposed on a surface of the sensor chip, a first pin and a second pin are disposed on a surface of the integrated circuit chip, and a first through hole and a second through hole are formed in the adhesive film;
the step of attaching the sensor chip and the integrated circuit chip to the surface of the substrate includes:
the welding point of the sensor chip is opposite to the surface of the substrate provided with the welding pad, and the sensor chip is attached to the surface of the substrate provided with the welding pad;
the first pin and the second pin of the integrated circuit chip are opposite to the surface of the substrate provided with the bonding pad, and the integrated circuit chip is attached to the surface of the substrate provided with the bonding pad;
the step of attaching a glue film to the surface of the integrated circuit chip facing away from the substrate comprises:
aligning the first through hole of the adhesive film sheet with the first pin, aligning the second through hole with the second pin, and attaching the adhesive film sheet on the surface of the integrated circuit chip, which faces away from the substrate;
before the step of heating the adhesive film to melt and then curing the adhesive film to obtain the adhesive film layer covering the surface of the integrated circuit chip, which faces away from the substrate, the method further comprises the following steps:
providing a first connecting wire and a second connecting wire;
one end of the first connecting wire penetrates through the first through hole and is electrically connected with the first pin, and the other end of the first connecting wire is electrically connected with the bonding pad;
and one end of the second connecting wire penetrates through the second through hole and is electrically connected with the second pin, and the other end of the second connecting wire is electrically connected with the welding point.
10. The packaging method according to any one of claims 7 to 9, wherein in the step of heating the adhesive film to melt and then curing the adhesive film to obtain the adhesive film layer covering the surface of the integrated circuit chip facing away from the substrate, the adhesive film is heated at a temperature ranging from 80 ℃ to 300 ℃.
11. An electronic device, characterized in that the electronic device comprises a sensor package structure according to any one of claims 1 to 6.
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