CN218123385U

CN218123385U - Packaged product and electronic device

Info

Publication number: CN218123385U
Application number: CN202222271344.9U
Authority: CN
Inventors: 王超
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2022-08-26
Filing date: 2022-08-26
Publication date: 2022-12-23
Anticipated expiration: 2032-08-26

Abstract

The utility model provides a packaged product and electronic equipment, the packaged product includes base plate, articulamentum, protection glue film, cover and locate the shell of base plate, and set up in chip and the pad of base plate, base plate and shell pass through the welding ring electricity to be connected, the articulamentum connects base plate and shell, chip and pad pass through the gold thread to be connected, the pad coats and is stamped the protection glue film; still including setting up the separator between protection glue film and articulamentum, the separator includes bonding glue film and isolation layer, and the bonding glue film bonds in the base plate, and the isolation layer bonds in the one side that the bonding glue film deviates from the base plate in order to keep apart protection glue film and articulamentum. Because of the spacer arrangement, the distance between the solder ring and the solder pad can be arranged closer. The packaging product has the advantages of small size of the packaging product, reduction of the risk of bad products, improvement of the yield of the product, simple process, firm bonding of the shell and no short circuit of the product. The packaged product may be a sensor.

Description

Packaged product and electronic device

Technical Field

The utility model relates to an encapsulation product technical field especially relates to an encapsulation product and electronic equipment.

Background

With the rapid development of consumer electronics, functions of mobile phones, smart watches and the like are more and more, integrated sensors are more and more, and the space reserved for a single sensor is smaller and smaller, which requires that the size of the sensor must be smaller. Under the condition that Moore's law meets a bottleneck, the size of a chip cannot be infinitely reduced, which puts a very high demand on the packaging of a sensor, and the packaging size needs to be reduced as much as possible so as to continuously improve the competitiveness of products. However, in the sensor in the prior art, the conductive glue adhered to the housing has strong flowability, so that a larger safety distance is required between the conductive glue and the routing Pad on the circuit board. Moreover, the glue on the circuit board for preventing Pad corrosion is easy to flow to the welding ring area, and the bonding of the shell is influenced. This results in a particularly large area between the wire bonding Pad of the chip and the solder ring of the solder shell, which results in a large product size, and there are risks that the glue for bonding the shell flows to the Pad of the circuit board, which results in a short circuit of the product, and the glue for preventing corrosion of the Pad flows to the solder ring area, which results in a small bonding force of the shell.

Therefore, there is a need for a new packaged product and an electronic device, which solve or at least alleviate the above technical drawbacks.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a encapsulation product and electronic equipment, aim at solving among the prior art encapsulation product size great, and have the technical problem of product short circuit and shell adhesion undersize.

In order to achieve the above object, according to one aspect of the present invention, the present invention provides a packaged product, which includes a substrate, a connection layer, a protection adhesive layer, a shell covering the substrate, and a chip and a pad disposed on the substrate, wherein the substrate is electrically connected to the shell through a solder ring, the connection layer connects the substrate and the shell, the chip is connected to the pad through a gold wire, and the pad is covered with the protection adhesive layer;

the encapsulation product still including set up in the protection glue film with the separator between the articulamentum, the separator is including bonding glue film and isolation layer, the bonding glue film bond in the base plate, the isolation layer bond in the bonding glue film deviates from one side of base plate is with will the protection glue film with the articulamentum is kept apart.

In one embodiment, the connecting layer is a tin layer or a silver layer.

In one embodiment, the adhesive layer is a pressure sensitive adhesive layer.

In one embodiment, the isolation layer is one of a polyimide layer, a polyethylene terephthalate layer, and a polymethyl methacrylate layer.

In one embodiment, the height of the isolation layer is 30 μm to 100 μm.

In one embodiment, the width of the isolation layer is 10 μm to 30 μm.

In one embodiment, the spacer is an annular spacer disposed around an outer periphery of the pad.

In an embodiment, the number of the spacers is two, and the two spacers are spaced apart from each other, wherein one of the spacers is disposed near the solder ring, and the other spacer is disposed near the solder pad.

In an embodiment, the number of the isolation layers is two, the two isolation layers are arranged on the adhesive layer at intervals, one of the isolation layers is arranged close to the welding ring, and the other isolation layer is arranged close to the welding pad.

In an embodiment, the packaged product is a sensor.

In one embodiment, the housing is provided with a sound hole.

According to the utility model discloses an on the other hand, the utility model discloses still provide an electronic equipment, electronic equipment includes the aforesaid the encapsulation product.

In the scheme, the packaging product comprises a substrate, a connecting layer, a protective adhesive layer, a shell covering the substrate, a chip and a bonding pad, wherein the chip and the bonding pad are arranged on the substrate; still including setting up the separator between protection glue film and articulamentum, the separator includes bonding glue film and isolation layer, and the bonding glue film bonds in the base plate, and the isolation layer bonds in one side that the bonding glue film deviates from the base plate in order to keep apart protection glue film and articulamentum. This scheme is through setting up the isolation region between articulamentum and protection glue film, sets up the isolator on the base plate of isolation region, and the isolator is including installing in the bonding glue film of base plate to it is firm to bond the isolation layer through the bonding glue film, carries out physical isolation with articulamentum and protection glue film through the isolation layer, makes the articulamentum can not flow to the pad of circuit board and leads to the product short circuit, and the area corrosive glue of protection glue film also can not flow to the welding ring region and make the adhesion of shell reduce. Meanwhile, due to the arrangement of the spacer, the distance between the welding ring and the welding pad can be arranged to be relatively close, and a large area is not required to be designed between the welding pad and the welding ring in order to avoid the flow influence of the adhesive glue layer and the connecting layer in the prior art. The utility model has the advantages of small size of the packaged product, reduced adverse risk of the product, improved product yield and greatly improved product competitiveness; and the process is simple, the shell is firmly bonded, and short circuit of the product is avoided. The packaged product may be a sensor.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic cross-sectional view of a packaged product according to an embodiment of the present invention;

FIG. 2 is an enlarged schematic view of FIG. 1 at A;

FIG. 3 is a schematic cross-sectional view of a packaged product according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a spacer according to an embodiment of the present invention.

The reference numbers illustrate:

1. a housing; 2. a substrate; 3. a connecting layer; 4. a protective adhesive layer; 5. a chip; 6. a bonding pad; 7. welding a ring; 8. gold thread; 9. a spacer; 91. bonding the adhesive layer; 92. an isolation layer; 10. a sound hole; 11. a receiving cavity.

The purpose of the present invention, its functional features and advantages will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper and lower 8230; etc.) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature.

Moreover, the technical solutions of the present invention between the various embodiments can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are combined and contradictory or cannot be realized, it should be considered that the combination of the technical solutions does not exist, and the present invention is not within the protection scope of the present invention.

Referring to fig. 1 to 4, according to an aspect of the present invention, the present invention provides a packaged product, including a substrate 2, a connection layer 3, a protection adhesive layer 4, a housing 1 covering the substrate 2, and a chip 5 and a pad 6 respectively mounted on the substrate 2, wherein the substrate 2 is electrically connected to the housing 1 through a welding ring 7, the connection layer 3 bonds the substrate 2 and the housing 1, the chip 5 is connected to the pad 6 through a gold wire 8, and the pad 6 is covered with the protection adhesive layer 4; still including setting up the separator 9 between protection glue film 4 and articulamentum 3, separator 9 is including bonding glue film 91 and isolation layer 92, and bonding glue film 91 bonds in base plate 2, and isolation layer 92 bonds in the one side that bonding glue film 91 deviates from base plate 2 in order to keep apart protection glue film 4 and articulamentum 3.

It should be noted that, in the manufacturing process, the housing 1 and the substrate 2 are connected by conductive glue, the conductive glue may be solder paste or silver paste, the connection layer 3 is finally formed after reflow soldering after the manufacturing of the packaged product is completed, and the connection layer 3 may be a silver layer or a tin layer. In the manufacturing process, the conductive glue and the protective glue layer 4 are both glue with certain fluidity, and the glue of the protective glue layer 4 has certain corrosivity. The substrate 2 and the shell are matched to form a containing cavity 11, and the chip 5, the pad 6 and the protective adhesive layer 4 are arranged in the containing cavity 11. This embodiment is through setting up isolator 9 on base plate 2, and isolator 9 is including installing in the bonding glue film 91 of base plate 2 to it is firm to bond isolation layer 92 through bonding glue film 91, carries out physical isolation with conducting resin water and protection glue layer 4 through isolation layer 92, makes conducting resin water can not flow to the pad 6 of base plate 2 and leads to the product short circuit, and the protection glue layer 4 of taking the corrosiveness of protection glue layer 4 also can not flow to weld ring 7 regional corrosion and cause the adhesion force of shell 1 to reduce. At the same time, because of the spacer 9, the distance between the solder ring 7 and the solder pad 6 can be set relatively close, without designing a large area between the solder pad 6 and the solder ring 7 in order to avoid the influence of the flow of the adhesive layer 91 and the conductive glue as in the prior art. Since the connection layer 3 is finally formed after the conductive glue is subjected to reflow soldering after the manufacture of the packaged product is completed, the conductive glue can be physically isolated by the isolation piece and the protective glue layer 4 after the connection layer 3 is formed, and therefore, the isolation piece 9 is described to be arranged between the connection layer 3 and the protective glue layer 4 in the description of the terminal product. The embodiment has the advantages of small size of the packaged product, simple process, firm bonding of the shell 1 and no short circuit of the product. Specifically, the protective adhesive layer 4 may be an epoxy adhesive or a silicon adhesive. The packaged product may be a sensor.

Certainly, the central area of the substrate 2 can be raised to prevent the conductive adhesive from flowing onto the bonding pad 6 of the substrate 2, but the design can not effectively prevent the adhesive of the protective adhesive layer 4 of the bonding pad 6 from flowing onto the welding ring 7, and the raised central area of the substrate 2 causes the height of the product to be increased, the size of the packaged product to be increased, and the manufacturing cost and difficulty are increased; a circle of glue layer can be drawn between the bonding pad 6 and the welding ring 7 to serve as a barrier, but the design needs to leave a larger space for the glue layer, and the size of a packaged product can be increased due to the fact that the glue layer is too narrow and the risk of glue breaking is high; and the processes of curing and the like are required after the glue scribing is finished, and the process is relatively complex.

In one embodiment, the adhesive layer 91 is a pressure sensitive adhesive layer, and the isolation layer 92 is one of a polyimide layer, a polyethylene terephthalate layer, and a polymethyl methacrylate layer. The adhesive layer 91 needs to be made of glue with better corrosion resistance to avoid corrosion of the protected adhesive layer 4. The isolation layer 92 needs to be made of a material that is resistant to high temperature and chemically stable, such as one of Polyimide (PI), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), or a composite material of a layered structure made of two of them. To prevent the glue on both sides from overflowing the isolation layer 92, the isolation layer 92 should have a certain height, which depends on the specific situation of the packaged product, and the height of the isolation layer 92 can be generally selected to be 30 μm-100 μm. Adopt the technical scheme of the utility model, the width that isolation layer 92 can be done is very narrow, generally can be 10 mu m-30 mu m, compares current technical scheme, has reduced and has welded ring 7 to pad 6 between 70-90% of distance, very big reduction the size of encapsulation product, also reduced the bad risk of product, improved the product yield, very big improvement the competitiveness of product.

In one embodiment, the spacer 9 is disposed between the solder ring 7 and the pad 6, and the spacer 9 is an annular spacer disposed around the pad 6. Since the housing 1 is generally circular in shape, the solder ring 7 is generally circular and therefore the spacer 9 is also circular to ensure full separation of the solder pad 6 and the solder ring 7. Of course, the shape of the spacer 9 can be set according to actual needs, and can be, for example, a rectangle, a square, a ring or other irregular shape, as long as the separation between the protective adhesive layer 4 and the connection layer 3 is ensured.

In one embodiment, the number of the spacers 9 is two, and two spacers 9 are spaced apart, wherein one spacer 9 is disposed adjacent to the solder ring 7 and the other spacer 9 is disposed adjacent to the solder pad 6. Of course, two spacers 9 may be provided at intervals, such as two annular spacers, and a gap is provided between the two spacers 9, so that during the manufacturing process, when the glue on the side of the spacer 9 passes over one spacer 9, the glue flows into the gap between the two spacers 9, and this design can further perform the isolation function.

In one embodiment, the number of the isolation layers 92 is two, and two isolation layers 92 are disposed on the adhesive layer 91 at intervals, wherein one isolation layer 92 is disposed near the bonding ring 7, and the other isolation layer 92 is disposed near the bonding pad 6. This embodiment has similar effect to the previous embodiment, and during the manufacturing process, when the glue on the side of the isolation layer 92 passes over one isolation layer 92, the glue will flow into the gap between the two isolation layers 92, so that the design can further play the role of isolation.

In one embodiment, the housing 1 is made of steel material, and the static electricity of the housing 1 is led out through the connecting layer 3 and the welding ring 7. The substrate 2 may be a printed circuit board or a ceramic substrate 2.

In an embodiment, the housing 1 is provided with a sound hole 10 corresponding to a top-feeding packaged product, but the substrate 2 may also be provided with a sound hole 10 corresponding to a bottom-feeding packaged product.

According to the utility model discloses an on the other hand, the utility model discloses still provide an electronic equipment, electronic equipment includes foretell encapsulation product. Since the electronic device includes all technical solutions of all embodiments of the above-mentioned packaged product, at least all beneficial effects brought by all the technical solutions are obtained, and are not described in detail herein. The electronic equipment can be a smart phone, a smart bracelet, a smart headset, a smart watch or an IPAD and the like.

The above is only the optional embodiment of the present invention, and therefore the patent scope of the present invention is not limited, all of which are under the technical conception of the present invention, the equivalent structure transformation made by the contents of the specification and the attached drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.

Claims

1. A packaged product is characterized by comprising a substrate, a connecting layer, a protective adhesive layer, a shell covering the substrate, a chip and a bonding pad, wherein the chip and the bonding pad are arranged on the substrate;

the encapsulation product still including set up in the protection glue film with isolator between the articulamentum, the isolator includes bonding glue film and isolation layer, the bonding glue film bond in the base plate, the isolation layer bond in the bonding glue film deviates from one side of base plate is in order to incite somebody to action the protection glue film with the articulamentum is kept apart.

2. The packaged product of claim 1, wherein the connecting layer is a tin or silver layer.

3. A packaged product according to claim 1, wherein said adhesive layer is a pressure sensitive adhesive layer.

4. The packaged product according to claim 1, wherein the isolation layer is one of a polyimide layer, a polyethylene terephthalate layer, and a polymethylmethacrylate layer.

5. The packaged product according to claim 4, wherein the height of the isolation layer is 30 μm to 100 μm.

6. The packaged product according to claim 4, wherein the width of the isolation layer is 10 μm to 30 μm.

7. The packaged product of claim 1, wherein the spacer is an annular spacer disposed around a periphery of the land.

8. The packaged product according to any one of claims 1 to 7, wherein the number of the spacers is two, and two spacers are arranged at intervals, one of the spacers is arranged near the solder ring, and the other spacer is arranged near the solder pad.

9. The packaged product according to any one of claims 1 to 7, wherein the number of the isolation layers is two, and two isolation layers are disposed at an interval on the adhesive layer, one of the isolation layers is disposed adjacent to the solder ring, and the other isolation layer is disposed adjacent to the solder pad.

10. Packaged product according to any of claims 1-7, wherein the casing is provided with sound holes.

11. Packaged product according to any of claims 1 to 7, wherein the packaged product is a sensor.

12. An electronic device characterized in that it comprises the packaged product of any one of claims 1 to 11.