CN216292035U

CN216292035U - Circuit board welding structure and packaging structure, shielding structure and shielding substrate thereof

Info

Publication number: CN216292035U
Application number: CN202122386602.3U
Authority: CN
Inventors: 郑玲慧; 王丽娜
Original assignee: Sky Chip Interconnection Technology Co Ltd
Current assignee: Sky Chip Interconnection Technology Co Ltd
Priority date: 2021-09-28
Filing date: 2021-09-28
Publication date: 2022-04-12
Anticipated expiration: 2031-09-28

Abstract

The application discloses circuit board welded structure and packaging structure, shielding base plate thereof, this shielding base plate is used for welding components and parts, and components and parts include treating shielding device, and the shielding base plate includes: a substrate main body, wherein one side of the substrate main body is provided with a containing groove along the direction towards the other side of the substrate main body; the shielding cover covers the opening of the containing groove and forms a mounting cavity with the inner wall of the containing groove, and the mounting cavity is used for containing a device to be shielded; the insulating layer is arranged on one side of the shielding cover far away from the bottom wall of the containing groove. The substrate main body is provided with the accommodating groove and the mounting cover to form the mounting cavity with a shielding effect, so that a device to be shielded can be accommodated and protected; one side of keeping away from the accepting groove diapire at the shield casing sets up the insulating layer, increases installation space, and the installation does not need shielded components and parts on the insulating layer, is favorable to realizing small-size encapsulation.

Description

Circuit board welding structure and packaging structure, shielding structure and shielding substrate thereof

Technical Field

The application relates to the technical field of chip packaging, in particular to a circuit board welding structure and a packaging structure, a shielding structure and a shielding substrate thereof.

Background

Along with the high-speed development of electronic packaging, the packaging technology is steadily improved, high-speed signals in the electronic packaging are indispensable, the unit area of a packaging substrate product is very small (generally below 10 x 10 mm), and if circuit signals of the product have shielding requirements and are limited by space, a shielding cover is adopted to protect all components in the traditional method of system-in-package, and the shielding method is not strong in pertinence on one hand and cannot isolate signals in the unit from each other; on the other hand, the increase of the shielding case reduces the space available for circuit design, which is not favorable for the circuit layout of small package.

SUMMERY OF THE UTILITY MODEL

The technical problem that this application mainly solved provides a circuit board welded structure and packaging structure, shielding base plate thereof, solves the little problem of installation space among the prior art.

In order to solve the above technical problem, the first technical solution adopted by the present application is: the utility model provides a shielding base plate, this shielding base plate is used for welding components and parts, and components and parts are including treating shielding device, and shielding base plate includes: a substrate main body, wherein one side of the substrate main body is provided with a containing groove along the direction towards the other side of the substrate main body; the shielding cover covers the opening of the containing groove and forms a mounting cavity with the inner wall of the containing groove, and the mounting cavity is used for containing a device to be shielded; the insulating layer is arranged on one side of the shielding cover far away from the bottom wall of the containing groove.

The outer side wall of the shielding cover is closely attached to the inner side wall of the accommodating groove, and the end part of the insulating layer is closely attached to the inner side wall of the accommodating groove.

Wherein, the shield cover is laminated with the insulating layer.

The shielding cover is in an Jiong-shaped structure, and the opening end of the shielding cover faces to the bottom wall of the containing groove.

The surface of the insulating layer far away from the shielding cover is flush with the surface of the substrate main body.

In order to solve the above technical problem, the second technical solution adopted by the present application is: there is provided a shielding structure including: a shield substrate such as the shield substrate described above; the device to be shielded is contained in the installation cavity and is fixedly connected with the bottom wall of the containing groove.

And the device to be shielded is connected with the bonding pad arranged on the bottom wall of the accommodating groove.

In order to solve the above technical problem, the third technical solution adopted by the present application is: there is provided a package structure, including: shielding structures, such as those described above; the component also comprises a first component which is arranged on the surface of the substrate body and/or the insulating layer; and the plastic packaging layer is arranged on the periphery of the first component and used for packaging the first component on the shielding substrate, and the plastic packaging layer is fixedly connected with the shielding substrate.

Wherein the first component is fixedly connected to the substrate body and/or to the pads on the surface of the insulating layer.

In order to solve the above technical problem, a fourth technical solution adopted by the present application is: providing a circuit board welding structure, which comprises a packaging structure and a circuit board, wherein the packaging structure is as the packaging structure; the circuit board is arranged on one side of the shielding substrate far away from the first component, and the circuit board is welded with the shielding substrate.

The beneficial effect of this application is: be different from prior art's condition, the circuit board welded structure that this application provided and packaging structure, shielding base plate thereof, this shielding base plate is used for welding components and parts, and components and parts are including treating shielding device, and shielding base plate includes: a substrate main body, wherein one side of the substrate main body is provided with a containing groove along the direction towards the other side of the substrate main body; the shielding cover covers the opening of the containing groove and forms a mounting cavity with the inner wall of the containing groove, and the mounting cavity is used for containing a device to be shielded; the insulating layer is arranged on one side of the shielding cover far away from the bottom wall of the containing groove. The substrate main body is provided with the accommodating groove and the mounting cover to form the mounting cavity with a shielding effect, so that a device to be shielded can be accommodated and protected; one side of keeping away from the accepting groove diapire at the shield casing sets up the insulating layer, increases installation space, and the installation does not need shielded components and parts on the insulating layer, is favorable to realizing small-size encapsulation.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a shielding substrate according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of an embodiment of a shielding structure provided in the present invention;

FIG. 3 is a schematic structural diagram of an embodiment of a package structure provided in the present invention;

fig. 4 is a schematic structural diagram of an embodiment of a circuit board soldering structure provided by the present invention.

In the figure: a circuit board soldering structure 100; a package structure 1; a shielding structure 11; a shield substrate 111; a substrate main body 1111; a housing groove 1112; a mounting cavity 1113; a shield 1114; an insulating layer 1115; a device to be shielded 112; a first component 12; a plastic sealing layer 13; a circuit board 2; and (3) solder balls.

Detailed Description

The following describes in detail the embodiments of the present application with reference to the drawings attached hereto.

In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, interfaces, techniques, etc. in order to provide a thorough understanding of the present application.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of an embodiment of a shielding substrate provided in the present invention; fig. 2 is a schematic structural diagram of an embodiment of a shielding structure provided in the present invention.

The present embodiment provides a shielding structure 11, and the shielding structure 11 includes a shielding substrate 111 and a device to be shielded 112.

The shielding substrate 111 is used for soldering components including the component 112 to be shielded, and the shielding substrate 111 includes a substrate main body 1111, a shield cover 1114, and an insulating layer 1115.

A receiving groove 1112 is formed in one side of the substrate body 1111 in a direction toward the other side of the substrate body 1111. The bottom wall of the receiving groove 1112 may be a flat surface or an inclined surface, as long as the device to be shielded 112 can be fixed. The material of the substrate main body 1111 is at least one of organic materials such as epoxy resin, polyimide, and molding compound.

The shielding cover 1114 covers an opening of the receiving groove 1112, and forms a mounting cavity 1113 with an inner wall of the receiving groove 1112, and the mounting cavity 1113 is used for receiving the device 112 to be shielded. In an alternative embodiment, the shield 1114 has a plate-like structure, an end surface of the shield 1114 abuts against an inner sidewall of the receiving groove 1112, and the shield 1114 cooperates with a bottom wall and a portion of the inner sidewall of the receiving groove 1112 to form the mounting cavity 1113. In another alternative embodiment, the shield 1114 has an "Jiong" configuration, with the open end of the shield 1114 facing the bottom wall of the receiving cavity 1112. The outer sidewall of the shield 1114 may be spaced apart from the inner sidewall of the receiving groove 1112. In another preferred embodiment, in order to increase the receiving space of the mounting cavity 1113, the outer sidewall of the shielding case 1114 is closely attached to the inner sidewall of the receiving groove 1112. The material of the shield 1114 may be copper or aluminum, and may also be other materials having a shielding function, which is not limited herein.

The device to be shielded 112 is accommodated in the installation cavity 1113 and is fixedly connected to the bottom wall of the accommodating groove 1112. The device to be shielded 112 is soldered to the solder pad disposed on the bottom wall of the receiving groove 1112. Specifically, the device 112 to be shielded and the pad provided on the bottom wall of the accommodating groove 1112 are fixedly connected by soldering. The device to be shielded 112 may be a resistive, capacitive, inductive, or the like device. When the device 112 to be shielded is a bonding wire device, the device 112 to be shielded may be fixed on the bottom wall of the accommodating groove 1112 through an adhesive or a pasting film. When the device to be shielded 112 is a flip-chip device, the device to be shielded 112 may be soldered to a pad disposed on the bottom wall of the receiving groove 1112.

The insulating layer 1115 is disposed on a side of the shield 1114 away from the bottom wall of the receiving groove 1112. In an alternative embodiment, the insulating layer 1115 has a plate-like structure, and an end of the insulating layer 1115 is disposed in close contact with an inner sidewall of the receiving groove 1112. In another alternative embodiment, when the shield 1114 has an "Jiong" type structure, the insulating layer 1115 may also have a "Jiong" type structure, and the opening of the "Jiong" type structure of the insulating layer 1115 faces the bottom wall of the receiving groove 1112. Wherein the inner dimension of the "Jiong" type structure of the insulating layer 1115 is larger than the outer dimension of the "Jiong" type structure of the shield 1114. That is, the insulating layer 1115 is disposed on the outer wall of the shield 1114. The insulating layer 1115 is attached to the shield 1114. The insulating layer 1115 may also be spaced from the shield 1114. The surface of the insulating layer 1115 facing away from the shield 1114 may be lower than the surface of the substrate body 1111 or slightly higher than the surface of the substrate body 1111. In a preferred embodiment, the surface of the insulating layer 1115 away from the shield 1114 may be flush with the surface of the substrate body 1111. Regardless of whether the surface of the insulating layer 1115 is flush with the surface of the substrate body 1111, the surface of the insulating layer 1115 can carry devices that do not require shielding. Wherein the device not requiring shielding comprises a chip. The signal transmission between the device not to be shielded carried on the insulating layer 1115 and the device to be shielded 112 accommodated in the mounting cavity 1113 is realized by punching a hole in the substrate main body 1111. The insulating layer 1115 is made of an insulating material such as epoxy resin, polyimide, bismaleimide-triazine resin, or the like. The insulating layer 1115 can block the shield 1114 and increase the installation space for the substrate body 1111.

The shielding base plate in this embodiment is used for welding components and parts, and components and parts are including treating shielding device, and shielding base plate wherein is used for welding components and parts, and components and parts are including treating shielding device, and shielding base plate includes: a substrate main body, wherein one side of the substrate main body is provided with a containing groove along the direction towards the other side of the substrate main body; the shielding cover covers the opening of the containing groove and forms a mounting cavity with the inner wall of the containing groove, and the mounting cavity is used for containing a device to be shielded; the insulating layer is arranged on one side of the shielding cover far away from the bottom wall of the containing groove. The substrate main body is provided with the accommodating groove and the mounting cover to form the mounting cavity with a shielding effect, so that a device to be shielded can be accommodated and protected; one side of keeping away from the accepting groove diapire at the shield casing sets up the insulating layer, increases installation space, and the installation does not need shielded components and parts on the insulating layer, is favorable to realizing small-size encapsulation.

Referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of a package structure provided in the present invention. In the present embodiment, a package structure 1 is provided, where the package structure 1 includes: a shielding structure 11, a first component 12 and a molding layer 13. The shielding structure 11 in this embodiment is the shielding structure 11 in the above embodiment, and is not described herein again.

The components include the device to be shielded 112 and the first component 12, the first component 12 being a device that does not require shielding. For example, the first component 12 is a chip. The first component 12 is disposed on a surface of the substrate body 1111 and/or the insulating layer 1115. When the first component 12 is a bonding wire chip, the first component 12 may be fixed on the surface of the substrate body 1111 and/or the insulating layer 1115 through an adhesive or a pasting film. When the first component 12 is a flip chip, the first component 12 may be bonded to a pad provided on a surface of the substrate body 1111 and/or the insulating layer 1115.

The molding layer 13 is disposed on the periphery of the first component 12. In a specific embodiment, the molding compound layer 13 is disposed on the surface of the substrate body 1111 where the first component 12 is disposed, the molding compound layer 13 covers the surface of the first component 12 for encapsulating the first component 12 on the substrate body 1111, and the molding compound layer 13 is fixedly connected to the substrate body 1111.

In the package structure in this embodiment, the package structure includes a shielding structure, a first component, and a molding layer. The first component is arranged on the surface of the substrate body 1111 and/or the insulating layer; the plastic packaging layer is arranged on the periphery of the first component and used for packaging the first component on the shielding substrate, and the plastic packaging layer is fixedly connected with the shielding substrate. The substrate main body is provided with the accommodating groove and the mounting cover to form the mounting cavity with a shielding effect, so that a device to be shielded can be accommodated and protected; one side of keeping away from the accepting groove diapire at the shield casing sets up the insulating layer, increases installation space, and the installation does not need shielded components and parts on the insulating layer, is favorable to realizing small-size encapsulation.

Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of a circuit board soldering structure provided in the present invention. The present embodiment provides a circuit board soldering structure 100, and the circuit board soldering structure 100 includes a package structure 1 and a circuit board 2. Here, the package structure 1 is the package structure 1 provided in the above embodiments, and details are not repeated herein. The circuit board 2 is disposed on a side of the shielding substrate 111 away from the first component 12, and the circuit board 2 and the shielding substrate 111 are soldered by solder balls 3.

In the circuit board welding structure provided by the embodiment, the accommodating groove is formed in the substrate main body and forms the mounting cavity with the shielding effect with the mounting cover, so that a device to be shielded can be accommodated and protected; one side of keeping away from the accepting groove diapire at the shield casing sets up the insulating layer, increases installation space, and the installation does not need shielded components and parts on the insulating layer, is favorable to realizing small-size encapsulation.

The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings are included in the scope of the present disclosure.

Claims

1. The utility model provides a shielding base plate, its characterized in that, shielding base plate is used for welding components and parts, components and parts are including waiting to shield the device, shielding base plate includes:

the substrate comprises a substrate main body, wherein one side of the substrate main body is provided with a containing groove along the direction towards the other side of the substrate main body;

the shielding cover covers the opening of the accommodating groove, and forms a mounting cavity with the inner wall of the accommodating groove, and the mounting cavity is used for accommodating the device to be shielded;

the insulating layer is arranged on one side, far away from the bottom wall of the containing groove, of the shielding cover.

2. The shield substrate according to claim 1, wherein an outer wall of the shield case is closely attached to an inner wall of the housing groove, and an end of the insulating layer is closely attached to the inner wall of the housing groove.

3. The shielding substrate of claim 1, wherein the shielding can is attached to the insulating layer.

4. The shielding substrate of claim 1, wherein the shielding can has an "Jiong" shape, and an open end of the shielding can faces the bottom wall of the receiving slot.

5. The shield substrate according to claim 1, wherein a surface of the insulating layer remote from the shield case is flush with a surface of the substrate body.

6. A shielding structure, characterized in that the shielding structure comprises:

a shield substrate according to any one of claims 1 to 5;

the device to be shielded is contained in the installation cavity and is fixedly connected with the bottom wall of the containing groove.

7. The shielding structure of claim 6, wherein the device to be shielded is connected to a pad disposed on the bottom wall of the receiving slot.

8. A package structure, comprising:

a shielding structure as claimed in claim 6 or 7;

the component also comprises a first component, and the first component is arranged on the surface of the substrate body and/or the insulating layer;

and the plastic packaging layer is arranged on the periphery of the first component and used for packaging the first component on the shielding substrate, and the plastic packaging layer is fixedly connected with the shielding substrate.

9. The package structure of claim 8, wherein the first component is fixedly connected to a pad on a surface of the substrate body and/or the insulating layer.

10. A circuit board soldering structure comprising an encapsulation structure and a circuit board, wherein the encapsulation structure is as claimed in claim 8 or 9; the circuit board is arranged on one side, far away from the first component, of the shielding substrate, and the circuit board is welded with the shielding substrate.