CN210110742U - Wafer carrying table for protecting welding wires - Google Patents
Wafer carrying table for protecting welding wires Download PDFInfo
- Publication number
- CN210110742U CN210110742U CN201921220546.2U CN201921220546U CN210110742U CN 210110742 U CN210110742 U CN 210110742U CN 201921220546 U CN201921220546 U CN 201921220546U CN 210110742 U CN210110742 U CN 210110742U
- Authority
- CN
- China
- Prior art keywords
- chip
- bonding wire
- resin layer
- slide holder
- protecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 title description 14
- 239000011347 resin Substances 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 37
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052709 silver Inorganic materials 0.000 claims abstract description 19
- 239000004332 silver Substances 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 8
- 238000005253 cladding Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005728 strengthening Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
Abstract
The utility model discloses a slide holder for protecting bonding wires, which comprises a slide holder body, silver paste, a chip and a bonding wire body, wherein the chip is arranged at the middle part of the top end of the slide holder body through the silver paste, and the bonding wire body is connected between the outer side of the slide holder body and the chip; the wafer carrying table body comprises a lead frame, a resin layer, a silver coating, a ring groove, a through hole and a fixing sleeve, the resin layer is fixed at the top end of the lead frame, the silver coating is coated on the outer side of the top end of the resin layer, the ring groove is formed in the outer side of the top end of the silver coating, which is positioned at one end of the bonding wire body, the through hole is formed in the positions, which are positioned at the outer sides of the chips, of the lead; the utility model discloses think about ingenious, reasonable in design, the inboard through-hole that increases of bonding wire has reduced the resin displacement volume, effectively prevents the fracture of bonding wire to increased the round groove again around the bonding wire afterbody, played the effect of location bonding wire when strengthening the cohesion of resin and slide holder.
Description
Technical Field
The utility model relates to a semiconductor package field specifically is a slide holder of protection bonding wire.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry.
The periphery of the existing slide holder is wrapped by resin, when the resin and a lead frame are layered, the tail of a welding wire is easy to pull and break due to resin displacement, and the existing slide holder has the problem that the welding wire is easy to pull and break.
SUMMERY OF THE UTILITY MODEL
To above not enough, the utility model aims at providing a slide holder of protection bonding wire, the inboard through-hole that increases of this slide holder bonding wire has reduced the resin displacement volume, effectively prevents the fracture of bonding wire to increased the round groove again around the bonding wire afterbody, played the effect of location bonding wire when strengthening the cohesion of resin and slide holder.
The utility model aims at providing a slide holder for protecting bonding wires, which comprises a slide holder body, silver paste, a chip and a bonding wire body, wherein the chip is arranged in the middle of the top end of the slide holder body through the silver paste, and the bonding wire body is connected between the outer side of the slide holder body and the chip;
the slide holder body is including lead frame, resin layer, silver-colored cladding material, circle groove, through-hole and fixed cover, and the lead frame top is fixed with the resin layer, and the resin layer top outside scribbles silver-colored cladding material, and the silver-colored cladding material top is located the bonding wire body one end outside and has seted up the circle groove, and lead frame and resin layer are located chip outside position department and have seted up the through-hole, and fixed cover has been cup jointed to the through-hole inside.
As a further technical scheme of the utility model, fixed cover is fixed with the boss including fixed frame and boss, fixed frame top.
As a further technical scheme of the utility model, the lead frame bottom scribbles the metal coating.
As a further technical scheme of the utility model, the bonding wire body is close to chip one end and installs the stationary blade.
As a further technical solution of the present invention, the chip outside is fixed with heat dissipation fins.
As a further technical scheme of the utility model, the circle groove is the rectangle shape.
Due to the adoption of the technical scheme, the utility model discloses following advantage has: use silver thick liquid to install the chip on the slide holder body, use this body coupling slide holder body of bonding wire and chip, when lead frame and resin layer take place the layering and arouse the resin layer displacement, because the through-hole has pinned the resin layer around the bonding wire body afterbody, the resin layer displacement volume has been reduced, thereby the fracture of bonding wire body afterbody has been prevented, secondly the circle groove has been increased again around bonding wire body afterbody, the cohesion of resin layer and slide holder body can be strengthened in the circle groove, can also play the effect of bonding wire location when the protection ground wire that can be better, bonding wire body afterbody position is at the circle inslot, insert the through-hole with fixed frame in, the boss card is in the through-hole upper portion outside, prevent that lead frame and resin layer from taking place.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
The drawings of the present invention are described below.
FIG. 1 is a schematic view of the overall structure of a stage for protecting bonding wires.
FIG. 2 is a schematic view of a stage body of the stage for protecting bonding wires.
FIG. 3 is a schematic view of a retaining sleeve of the stage for protecting the bonding wires.
Reference numbers in the figures: 1. a slide stage body; 2. silver paste; 3. a chip; 4. a bonding wire body; 5. a fixing sheet; 11. a lead frame; 12. a resin layer; 13. silver plating; 14. a ring groove; 15. a through hole; 16. fixing a sleeve; 161. a fixing frame; 162. a boss; 17. and (5) plating a metal layer.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
As shown in fig. 1 to 3, the utility model discloses a slide holder for protecting bonding wires, which comprises a slide holder body 1, silver paste 2, a chip 3 and a bonding wire body 4, wherein the chip 3 is installed at the middle part of the top end of the slide holder body 1 through the silver paste 2, the bonding wire body 4 is connected between the outer side of the slide holder body 1 and the chip 3, the chip 3 is installed on the slide holder body 1 through the silver paste 2, and the slide holder body 1 and the chip 3 are connected through the bonding wire body 4;
the slide holder body 1 comprises a lead frame 11, a resin layer 12, a silver coating 13, a circular groove 14, a through hole 15 and a fixing sleeve 16, wherein the resin layer 12 is fixed at the top end of the lead frame 11, the silver coating 13 is coated on the outer side of the top end of the resin layer 12, the circular groove 14 is formed in the top end of the silver coating 13, which is positioned at the outer side of one end of the bonding wire body 4, the through hole 15 is formed in the positions of the lead frame 11 and the resin layer 12, which are positioned at the outer sides of the chip 3, the fixing sleeve 16 is sleeved inside the through hole 15, the through hole 15 is additionally formed in the inner side of the slide holder body 1, namely the outer side of the chip 3 and the inner side of the tail of the bonding wire body 4, the fixing sleeve 16 is installed in the through hole 15, when the resin layer 12 is displaced due to the, and secondly, a ring groove 14 is additionally arranged around the tail part of the welding wire body 4, the ring groove 14 can strengthen the bonding force between the resin layer 12 and the slide holder body 1, the ground wire can be better protected, meanwhile, the welding wire positioning effect can be realized, and the tail part of the welding wire body 4 is positioned in the ring groove 14.
The fixing sleeve 16 comprises a fixing frame 161 and a boss 162, the boss 162 is fixed at the top end of the fixing frame 161, the fixing frame 161 is inserted into the through hole 15, and the boss 162 is clamped at the outer side of the upper part of the through hole 15 to prevent the lead frame 11 and the resin layer 12 from being layered.
The bottom end of the lead frame 11 is coated with the metal coating 17, and the bottom end of the lead frame 11 is coated with the metal coating 17, so that the production cost of the slide holder body 1 is reduced.
The bonding wire body 4 is close to 3 one ends of chip and installs stationary blade 5, and stationary blade 5 is used for fixing bonding wire body 4 is close to 3 one ends of chip on chip 3, strengthens the stability of being connected between bonding wire body 4 and the chip 3.
And heat dissipation fins are fixed on the outer side of the chip 3 and used for enhancing the heat dissipation capacity of the chip 3.
The ring groove 14 is rectangular, and the tail part of the welding wire body 4 is arranged in the rectangular ring groove 14.
The use method and the working principle thereof are as follows: the chip 3 is arranged on the body of the slide holder body 1 by silver paste 2, the slide holder body 1 is connected with the chip 3 by the welding wire body 4, when the lead frame 11 and the resin layer 12 are layered to cause the displacement of the resin layer 12, because the through hole 15 locks the resin layer 12 around the tail part of the welding wire body 4, the displacement of the resin layer 12 is reduced, thereby preventing the fracture of the tail part of the welding wire body 4, secondly, a ring groove 14 is additionally arranged around the tail part of the welding wire body 4, the ring groove 14 can strengthen the bonding force of the resin layer 12 and the slide holder body 1, can better protect the ground wire and simultaneously play a role of positioning the welding wire, the tail part of the welding wire body 4 is positioned in the ring groove 14, the fixing frame 161 is inserted into the through hole 15, the boss 162 is clamped at the outer side of the upper part of the through hole 15, thereby preventing the lead frame 11 and, the production cost of the wafer carrying table body 1 is reduced, and the fixing sheet 5 is used for fixing one end, close to the chip 3, of the bonding wire body 4 on the chip 3, so that the connection stability between the bonding wire body 4 and the chip 3 is enhanced.
Finally, the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the present invention.
Claims (6)
1. A wafer carrying table for protecting bonding wires is characterized in that: the chip bonding device comprises a chip carrying table body, silver paste, a chip and a bonding wire body, wherein the chip is mounted in the middle of the top end of the chip carrying table body through the silver paste, and the bonding wire body is connected between the outer side of the chip carrying table body and the chip;
the slide holder body is including lead frame, resin layer, silver-colored cladding material, circle groove, through-hole and fixed cover, and the lead frame top is fixed with the resin layer, and the resin layer top outside scribbles silver-colored cladding material, and the silver-colored cladding material top is located the bonding wire body one end outside and has seted up the circle groove, and lead frame and resin layer are located chip outside position department and have seted up the through-hole, and fixed cover has been cup jointed to the through-hole inside.
2. The stage for protecting a wire bond of claim 1 wherein: the fixed cover comprises a fixed frame and a boss, and the boss is fixed at the top end of the fixed frame.
3. The stage for protecting a wire bond of claim 1 wherein: and the bottom end of the lead frame is coated with a metal coating.
4. The stage for protecting a wire bond of claim 1 wherein: and one end of the bonding wire body, which is close to the chip, is provided with a fixing sheet.
5. The stage for protecting a wire bond of claim 1 wherein: and heat dissipation fins are fixed on the outer side of the chip.
6. The stage for protecting a wire bond of claim 1 wherein: the ring groove is rectangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921220546.2U CN210110742U (en) | 2019-07-30 | 2019-07-30 | Wafer carrying table for protecting welding wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921220546.2U CN210110742U (en) | 2019-07-30 | 2019-07-30 | Wafer carrying table for protecting welding wires |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210110742U true CN210110742U (en) | 2020-02-21 |
Family
ID=69567139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921220546.2U Expired - Fee Related CN210110742U (en) | 2019-07-30 | 2019-07-30 | Wafer carrying table for protecting welding wires |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210110742U (en) |
-
2019
- 2019-07-30 CN CN201921220546.2U patent/CN210110742U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200221 |