WO2022188524A1 - Module de mise en boîtier, procédé de mise en boîtier et dispositif électronique - Google Patents

Module de mise en boîtier, procédé de mise en boîtier et dispositif électronique Download PDF

Info

Publication number
WO2022188524A1
WO2022188524A1 PCT/CN2021/143213 CN2021143213W WO2022188524A1 WO 2022188524 A1 WO2022188524 A1 WO 2022188524A1 CN 2021143213 W CN2021143213 W CN 2021143213W WO 2022188524 A1 WO2022188524 A1 WO 2022188524A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
cavity
air hole
substrate
casing
Prior art date
Application number
PCT/CN2021/143213
Other languages
English (en)
Chinese (zh)
Inventor
李向光
田峻瑜
方华斌
Original Assignee
歌尔微电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔微电子股份有限公司 filed Critical 歌尔微电子股份有限公司
Publication of WO2022188524A1 publication Critical patent/WO2022188524A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L11/00—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Definitions

  • the present application relates to the technical field of packaging structures, and in particular, to a packaging module, a packaging process for the packaging module, and an electronic device using the packaging module.
  • Air pressure is a physical quantity closely related to people's daily life. Air pressure data can be used to detect vertical changes in altitude for motion monitoring, indoor navigation and auxiliary weather forecasting. Therefore, sensors based on the principle of air pressure are widely used in smart wearables and smart homes, etc. field.
  • the main purpose of this application is to provide a packaging module, packaging process and electronic equipment, aiming to provide a packaging module that effectively improves sealing performance when integrated with a terminal system.
  • the packaging module not only improves sealing performance, but also improves the user experience.
  • the packaging module includes:
  • the substrate is provided with a first air hole
  • the outer casing is arranged on the base plate, and is enclosed with the base plate to form a first cavity and a second cavity arranged at intervals, the first air hole is communicated with the first cavity, and the outer shell is provided with There is a second air hole communicated with the second cavity;
  • a chip assembly the chip assembly includes a first chip and a second chip, the first chip is disposed in the first cavity and spaced apart from the first air hole, and the second chip is disposed in the first cavity In the second cavity, the first chip and the second chip are electrically connected to the substrate through gold wires, respectively; and
  • a sealing gasket which is arranged on the casing and surrounds the second air hole, and is used for connecting with the terminal system.
  • the packaging module further includes a dustproof net disposed between the sealing gasket and the casing, and the dustproof net covers the second air hole.
  • the packaging module further includes a waterproof membrane disposed between the dustproof net and the housing, and the waterproof membrane covers the second air hole;
  • the packaging module further includes protective glue, and the protective glue is filled in the second cavity and covers the second chip.
  • the housing includes:
  • the surrounding plate is arranged on the periphery of the substrate and is arranged around the first chip, the second chip and the first air hole;
  • a spacer the spacer is arranged on the substrate and is located between the first chip and the second chip, and the spacer and the surrounding plate are enclosed to form first grooves and first grooves arranged at intervals. two grooves, so that the first chip is located in the first groove and is spaced apart from the first air hole, and the second chip is located in the second groove;
  • cover plate covers the notches of the first groove and the second groove, and encloses the first cavity and the second cavity, and the cover plate corresponds to
  • the second groove is provided with the second air hole, and the sealing gasket is disposed on the side of the cover plate facing away from the substrate through adhesive.
  • the cover plate, the enclosure plate and the partition plate are integrally formed
  • the material of the enclosure plate, the partition plate and the cover plate is metal material, FR4 material, BT material or ceramic material;
  • the substrate is FR4, BT or ceramic
  • the first chip and the second chip are ASIC chip+MEMS chip or integrated single chip;
  • the enclosure plate and the separator are connected to the substrate through solder paste, conductive glue or epoxy glue;
  • the cover plate is connected to the enclosure plate and the partition plate through solder paste, conductive glue or epoxy glue;
  • the back glue is hot pressing glue or pressure sensitive glue.
  • the present application also proposes a packaging process for the above-mentioned packaging module, and the packaging process includes the following steps:
  • a second air hole is made on the casing, the casing is mounted on the base plate, and the casing is enclosed with the base plate to form a first cavity and a second cavity arranged at intervals, so that the first air hole communicates with the first cavity a cavity, the second air hole communicates with the second cavity, the first chip is accommodated in the first cavity, and the second chip is accommodated in the second cavity;
  • a sealing gasket is attached to the casing and arranged around the second air hole.
  • the method before the step of attaching the sealing gasket to the casing and arranging around the second air hole, the method further includes:
  • a dust-proof net is pasted on the side of the adhesive tape away from the casing, so that the dust-proof net covers the second air hole;
  • a back glue is applied on the side of the dust-proof net facing away from the casing, so that the back glue is arranged around the second air hole.
  • the method before the step of pasting a dustproof net on the side of the adhesive that is away from the casing, so that the dustproof net covers the second air hole, the method further includes:
  • a waterproof film is pasted on the side of the back glue away from the casing, so that the waterproof film covers the second air hole;
  • a back glue is applied on the side of the waterproof membrane facing away from the casing, so that the back glue is arranged around the second air hole.
  • the outer shell includes a surrounding plate, a partition plate and a cover plate, the second air hole is formed on the outer shell, the outer shell is mounted on the substrate, and is enclosed with the A first cavity and a second cavity, so that the first air hole communicates with the first cavity, the second air hole communicates with the second cavity, and the first chip is accommodated in the first cavity
  • the step of accommodating the second chip in the second cavity includes:
  • the spacer is mounted on the substrate and is located between the first chip and the second chip, so that the spacer and the surrounding plate are enclosed to form first grooves and first grooves arranged at intervals. two grooves, so that the first chip is located in the first groove and is spaced apart from the first air hole, and the second chip is located in the second groove;
  • the second air hole is formed on the cover plate, the cover plate is attached to the end of the enclosure plate and the partition plate away from the base plate, and the cover plate is covered on the first groove and the first
  • the notches of the two grooves make the cover plate, the enclosure plate, the partition plate and the base plate enclose the first cavity and the second cavity, and the second air hole communicates with each other.
  • the first air hole communicates with the first cavity.
  • the second air hole is formed in the cover plate, the cover plate is attached to the end of the enclosure plate and the partition plate away from the base plate, and the cover plate is sealed on the
  • the notches of the first groove and the second groove enable the cover plate, the enclosure plate, the partition plate and the base plate to enclose the first cavity and the second cavity , and the second air hole communicates with the second cavity, and before the step of connecting the first air hole with the first cavity, the method further includes:
  • the protective glue is degassed in the form of vacuuming
  • the protective adhesive is cured using a stepped heating process.
  • the step of mounting the first chip and the second chip on the substrate at intervals includes:
  • the first chip and the second chip are respectively connected to the substrate by wire bonding with gold wires.
  • the present application also proposes an electronic device, which includes a device housing and the above-mentioned packaging module, wherein the packaging module is arranged on the device housing.
  • a casing is arranged on the substrate, so that the casing and the substrate are enclosed to form a first cavity and a second cavity arranged at intervals, so that the first air hole on the substrate is connected with the first cavity, and the casing is The second air hole is communicated with the second cavity, and the first chip of the chip assembly is set in the first cavity, so that the first chip can detect the external environment data through the first air hole, and the second chip of the chip assembly is set in the first cavity.
  • the sealing gasket is integrated with the terminal system to effectively improve the sealing performance of the package module.
  • the packaging module proposed in the present application not only improves its own sealing performance, but also can be sealed and integrated with the terminal system through the sealing gasket, in addition to measuring the external atmospheric pressure, it also has the function of measuring the internal pressure value of the terminal, which effectively improves the user's sense of experience.
  • FIG. 1 is a schematic structural diagram of a packaging module in an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of a packaging module in another embodiment of the present application.
  • FIG. 3 is a schematic flowchart of a packaging process of a packaging module according to an embodiment of the application
  • FIG. 4 is a schematic flowchart of a packaging process of a packaging module according to another embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of the packaging module corresponding to steps 30 to 90 in FIG. 4;
  • FIG. 6 is a schematic flowchart of a packaging process for a packaging module in another embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of the packaging module corresponding to steps 31 to 33 in FIG. 6;
  • step S20 in FIGS. 4 and 6 is a schematic flowchart of an embodiment of step S20 in FIGS. 4 and 6;
  • FIG. 9 is a schematic structural diagram of the packaging module corresponding to steps 21 to 24 in FIG. 8 .
  • Air pressure is a physical quantity closely related to people's daily life. Air pressure data can be used to detect vertical changes in altitude for motion monitoring, indoor navigation and auxiliary weather forecasting. Therefore, sensors based on the principle of air pressure are widely used in smart wearables and smart homes, etc. field.
  • the present application proposes a package module 100 , and the package module 100 may be an air pressure sensor or other types of sensors, which are not limited herein. It can be understood that the packaging module 100 can be applied to an electronic device, and the electronic device can be a smart wearable device, which is not limited herein.
  • the packaging module 100 includes a substrate 1 , a housing 2 , a chip assembly 3 and a sealing gasket 5 , wherein the substrate 1 is provided with a first air hole 11; the casing 2 is provided on the base plate 1, and is enclosed with the base plate 1 to form a first cavity 232 and a second cavity 233 arranged at intervals, the first air hole 11 is communicated with the first cavity 232, and the shell 2 is provided with a second air hole 231 communicating with the second cavity 233; the chip assembly 3 includes a first chip 31 and a second chip 32, the first chip 31 is arranged in the first cavity 232 and is spaced from the first air hole 11 The second chip 32 is disposed in the second cavity 233 , the first chip 31 and the second chip 32 are respectively electrically connected to the substrate 1 through the gold wire 4 ; the sealing gasket 5 is disposed in the casing 2 and is disposed
  • the substrate 1 is configured to mount, fix and support components such as the casing 2 , the sealing pad 5 , and the chip assembly 3 , and the structure of the substrate 1 can be optionally a plate-like structure.
  • the substrate 1 can be selected as a circuit board.
  • the substrate 1 is a PCB board, and the PCB board is printed with circuits to realize corresponding electrical functions, and can be selected and designed according to actual needs.
  • the PCB board is composed of a multi-layer structure, such as a substrate layer, one or more copper foil layers, and one or more solder mask ink layers, which are selected according to the actual scene.
  • the substrate 1 can be selected from FR4, BT or ceramic, which is not limited herein.
  • one side surface of the substrate 1 is provided with There are pads. It can be understood that the pads are configured to be electrically connected to the chip component 3, and the pads may have structures such as exposed copper, contacts, pins, or solder pins, which are not limited herein.
  • a first cavity 232 and a second cavity 233 are formed by enclosing the casing 2 and the substrate 1 at intervals, so that the first chip 31 is disposed in the first cavity 232 and is connected with the first air hole.
  • 11 are arranged at intervals
  • the second chip 32 is arranged in the second cavity 233, and is arranged at an interval with the second air hole 231, so that the first chip 31 and the second chip 32 are respectively installed in the two spaced spaces, so that the first chip 31
  • the first air hole 11 and the second air hole 231 respectively separate the environmental data of different regions from the second chip 32 , so as to avoid problems such as mutual interference and improve the detection accuracy of the packaging module 100 .
  • first chip 31 and the second chip 32 of the chip assembly 3 are integrated into one package module 100 , thereby improving the integration performance and multi-functionality of the package module 100 . It can be understood that the first chip 31 and the second chip 32 of the chip assembly 3 can be mounted on the surface of the substrate 1 by using the SMT process, which is not limited herein.
  • the first chip 31 and the second chip 32 of the chip assembly 3 can be an analysis chip or an integrated single chip, and for a discrete chip (ie, an ASIC chip + a MEMS chip), the ASIC chip and the MEMS chip can be placed side by side;
  • the ASIC chip and the MEMS chip may also be stacked, that is, the ASIC chip is first pasted on the substrate 1, and then the MEMS chip is pasted on the ASIC chip, which is not limited here.
  • the integrated single chip the chip only needs to be pasted on the substrate 1, which is not limited here.
  • the first chip 31 and the second chip 32 of the chip assembly 3 can use gold wires to realize the substrate 1 .
  • the first chip 31 and the second chip 32 are connected by wire bonding to realize the connection, and the first chip 31 and the second chip 32 can also be connected by wire bonding by using a gold wire, which is not limited herein.
  • the casing 2 can be made of metal material, plastic material or ceramic material, which is not limited herein.
  • the casing 2 is disposed on the substrate 1, so that the casing 2 and the substrate 1 enclose the first cavity 232 and the second cavity 233 arranged at intervals, so that the first air hole 11 on the substrate 1 and the The first cavity 232 is connected, the second air hole 231 on the housing 2 communicates with the second cavity 233, and the first chip 31 of the chip assembly 3 is set in the first cavity 232, so that the first chip 31 passes through the first cavity 232.
  • An air hole 11 detects the external environment data
  • the second chip 32 of the chip assembly 3 is arranged in the second cavity 233 , so that the second chip 32 detects the external environment data through the second air hole 231 , and further through the sealing of the casing 2
  • the gasket 5 is placed around the second air hole 231 , so that the gasket 5 is used to connect with the terminal system, so that the gasket 5 can be sealed and integrated with the terminal system, and the sealing performance of the packaging module 100 can be effectively improved.
  • the packaging module 100 proposed in the present application not only improves its own sealing performance, but also can be sealed and integrated with the terminal system through the sealing gasket 5 to measure the external atmospheric pressure and also have the function of measuring the internal pressure value of the terminal, which effectively improves the user experience. sense.
  • the packaging module 100 further includes a dustproof net 6 disposed between the sealing gasket 5 and the casing 2 , and the dustproof net 6 covers the second air hole 231 set up.
  • the dustproof net 6 can be fixedly connected to the housing 2 , for example, by welding or integral molding, so as to improve the connection stability of the dustproof net 6 .
  • the dustproof net 6 can also be disposed on the housing 2 by detachable connection methods such as snap connection, plug fit, screw connection or pin connection, so as to improve the convenience of disassembly and assembly of the dustproof net 6 .
  • the dustproof net 6 can be connected to the housing 2 through the adhesive 9.
  • the adhesive can be hot-pressed adhesive or pressure-sensitive adhesive, which is not limited here. It can be understood that the dust filter 6 can be arranged on the outer wall of the casing 2 facing away from the substrate 1, can also be arranged on the hole wall of the second air hole 231, and can also be arranged on the side of the casing 2 facing the substrate 1, and cover the second air hole. 231, which is not limited here.
  • a dust filter 6 may also be provided at the first air hole 11 to effectively prevent dust or debris from entering the first cavity 232 from the first air hole 11 and affect the performance of the first chip 31 .
  • the packaging module 100 further includes a waterproof membrane 7 disposed between the dustproof net 6 and the casing 2 , and the waterproof membrane 7 is disposed to cover the second air hole 231 .
  • the second air hole 231 is covered by the waterproof membrane 7 to effectively prevent water vapor and water droplets from entering the second cavity 233 from the second air hole 231 to affect the performance of the second chip 32.
  • the waterproof membrane 7 can be fixedly connected to the casing 2, for example, by welding or integral molding, so as to improve the connection stability of the waterproof membrane 7.
  • the waterproof membrane 7 can also be disposed on the housing 2 by detachable connection methods such as snap connection, plug fit, screw connection or pin connection, so as to improve the convenience of disassembly and assembly of the waterproof membrane 7 .
  • the waterproof membrane 7 can be connected to the housing 2 through a back glue 9.
  • the back glue 9 can be a hot-press glue or a pressure-sensitive glue, which is not limited here. It can be understood that the waterproof membrane 7 can be disposed on the outer wall of the casing 2 facing away from the substrate 1 , can also be disposed on the hole wall of the second air hole 231 , and can also be disposed on the side of the casing 2 facing the substrate 1 , and cover the second air hole 231 . , which is not limited here.
  • the waterproof membrane 7 is attached to the outer wall of the housing 2 through the adhesive 9, and covers the second air hole 231; And cover the second air hole 231; the gasket 5 is attached to the side of the dustproof net 6 facing away from the waterproof membrane 7 through the back glue 9, and is arranged around the second air hole 231, so that the gasket 5 is convenient to connect with the terminal system, so that the Through the second air hole 231, the packaging module 100 can check not only the environmental data of the external atmosphere, but also the environmental data inside the terminal system, which is not limited herein.
  • a waterproof membrane 7 can also be provided at the first air hole 11 to effectively prevent water vapor and water droplets from entering the first cavity 232 from the first air hole 11 and affect the performance of the first chip 31 .
  • the sealing gasket 5 can be selected from a structure such as a sealing ring, a sealing ring, and the like, and the sealing gasket 5 can be selected from an elastic rubber material, which is not limited herein. It can be understood that when the casing 2 is a metal casing, the casing 2 can be connected to the substrate 1 through solder paste or conductive glue; when the casing 2 is a plastic casing, the casing 2 can be connected to the substrate 1 through epoxy glue, which is not limited here.
  • the packaging module 100 further includes a protective glue 8 , and the protective glue 8 is filled in the second cavity 233 and covers the second chip 32 .
  • the protective glue 8 is filled in the second cavity 233 and covers the second chip 32, so that the second chip 32 is protected by the protective glue 8, thereby preventing the second chip 32 from being exposed to air. , humidity, and other external influences, thereby affecting its performance.
  • the protective glue 8 may be plastic sealing glue or waterproof glue, which is not limited herein.
  • the protective glue 8 can also be filled in the first cavity 232 , and the protective glue 8 covers the first chip 31 , which can effectively prevent air, humidity and other external factors from affecting the first chip 31 . Performance is not limited here.
  • the casing 2 can be selected as a cylindrical structure with two open ends, and one end of the casing 2 is connected to the substrate 1, so that the formed first cavity 232 and the second cavity 233 have an opening, which is convenient
  • the protective glue 8 is filled through the openings of the first cavity 232 and the second cavity 233 to improve convenience.
  • the casing 2 can also adopt a cover body or a cylindrical structure with one end open.
  • the first cavity 232 and the second cavity 233 enclosed by the casing 2 and the substrate 1 are sealed cavities.
  • the sealing cavity may be filled with protective glue 8 or not filled with protective glue 8, which is selected according to actual needs, which is not limited herein.
  • the housing 2 includes a surrounding plate 21 , a partition plate 22 and a cover plate 23 , wherein the surrounding plate 21 is provided on the periphery of the base plate 1 and surrounds the The first chip 31 , the second chip 32 and the first air hole 11 are arranged; the spacer 22 is arranged on the substrate 1 and is located between the first chip 31 and the second chip 32 , and the spacer 22 and the surrounding plate 21 are enclosed to form a spaced arrangement
  • the first groove 221 and the second groove 222 are formed, so that the first chip 31 is located in the first groove 221 and is spaced from the first air hole 11, and the second chip 32 is located in the second groove 222; the cover plate 23 Covering the notch of the first groove 221 and the second groove 222, and enclosing the first cavity 232 and the second cavity 233, the cover plate 23 is provided with a second air hole 231 corresponding to the second groove 222,
  • the enclosure plate 21 has a cylindrical structure with two open ends, and one end of the enclosure plate 21 is connected to the substrate 1 , so that the enclosure plate 21 surrounds the first chip 31 and the second chip 32 and the first air hole 11 are provided.
  • the spacer 22 can be optionally a plate-like structure.
  • the spacer 22 is arranged in the cavity formed by the enclosure plate 21 and the substrate 1 and is connected to the substrate 1.
  • the spacer 22 is located between the first chip 31 and the second chip 32 , so that the partition plate 22 and the enclosure plate 21 are enclosed to form a first groove 221 and a second groove 222 arranged at intervals.
  • the first chip 31 is located in the first groove 221 and is spaced from the first air hole 11.
  • the second chip 32 is located in the second groove 222 .
  • the cover plate 23 covers the notches of the first groove 221 and the second groove 222, and encloses the first cavity 232 and the second cavity 233, that is, the cover plate 23, the surrounding plate 21 and the partition plate 22 One end away from the substrate 1 is connected.
  • the material of the enclosure plate 21 is metal material, FR4 material, BT material or ceramic material.
  • the material of the separator 22 is metal material, FR4 material, BT material or ceramic material.
  • the material of the cover plate 23 is metal material, FR4 material, BT material or ceramic material.
  • the enclosure plate 21 when the enclosure plate 21 is made of metal material, the enclosure plate 21 is connected to the substrate 1 through solder paste or conductive adhesive, and when the enclosure plate 21 is made of non-metallic material, the enclosure plate 21 is connected to the substrate 1 through epoxy glue.
  • the spacer 22 is made of metal material, the spacer 22 is connected to the substrate 1 through solder paste or conductive adhesive, and when the spacer 22 is made of non-metallic material, the spacer 22 is connected to the substrate 1 through epoxy glue.
  • the enclosure plate 21, the partition plate 22 and the cover plate 23 are all made of metal, the cover plate 23 is connected to the enclosure plate 21 and the partition plate 22 through solder paste or conductive glue.
  • the cover plate 23 When made of metal, the cover plate 23 is connected to the enclosure plate 21 and the partition plate 22 through epoxy glue, which is not limited herein.
  • the cover plate 23 , the enclosure plate 21 and the partition plate 22 are integrally formed. It can be understood that, by setting in this way, the structural strength of the casing 2 is improved, and the processing steps of the casing 2 are simplified at the same time.
  • the present application also proposes a packaging process for the above-mentioned packaging module 100 , and the packaging process includes the following steps:
  • Step S10 forming the first air hole 11 on the substrate 1 ;
  • Step S20 mounting the first chip 31 and the second chip 32 on the substrate 1 at intervals, so that the first chip 31 and the second chip 32 are spaced apart from the first air hole 11 ;
  • Step S30 forming a second air hole 231 on the casing 2 , mounting the casing 2 on the substrate 1 , and enclosing the casing 2 with the substrate 1 to form a first cavity 232 and a second cavity 233 arranged at intervals, so that the first air hole 11
  • the first cavity 232 is communicated
  • the second air hole 231 is communicated with the second cavity 233
  • the first chip 31 is accommodated in the first cavity 232
  • the second chip 32 is accommodated in the second cavity 233;
  • Step S90 the sealing gasket 5 is mounted on the casing 2 and arranged around the second air hole 231 .
  • the structure of the substrate 1 can be optionally a plate-like structure, for example, the substrate 1 is FR4, BT or ceramic, which is not limited herein. It can be understood that the substrate 1 can be selected as a circuit board.
  • the substrate 1 is a PCB board, and the PCB board is printed with circuits to realize corresponding electrical functions, and can be selected and designed according to actual needs.
  • the PCB board is composed of a multi-layer structure, such as a substrate layer, one or more copper foil layers, and one or more solder mask ink layers, which are selected according to the actual scene.
  • the first air holes 11 are formed on the substrate 1 through a punching process. It can be understood that the first air hole 11 is a through hole, that is, the first air hole 11 is disposed through the substrate 1 . In this embodiment, by mounting the first chip 31 and the second chip 32 on the substrate 1 at intervals, both the first chip 31 and the second chip 32 are arranged at intervals from the first air hole 11 .
  • the first chip 31 and the second chip 32 can be mounted on the surface of the substrate 1 by using the SMT process, which is not limited herein.
  • the first chip 31 and the second chip 32 may be an analysis chip or an integrated single chip, and for a discrete chip (ie, an ASIC chip + a MEMS chip), the ASIC chip and the MEMS chip may be placed side by side; the ASIC chip and the MEMS chip
  • the chips can also be stacked, that is, the ASIC chip is first pasted on the substrate 1, and then the MEMS chip is pasted on the ASIC chip, which is not limited here.
  • the integrated single chip the chip only needs to be pasted on the substrate 1, which is not limited here.
  • step S20 the step of mounting the first chip 31 and the second chip 32 on the substrate 1 at intervals includes:
  • Step S21 coating adhesive on one side of the substrate 1;
  • Step S22 pasting the first chip 31 and the second chip 32 on the side of the adhesive facing away from the substrate 1, so that the first chip 31 and the second chip 32 are spaced apart;
  • Step S23 reflow the adhesive to solidify the adhesive
  • Step S24 the first chip 31 and the second chip 32 are respectively connected to the substrate 1 by wire bonding with gold wires 4 .
  • an adhesive is provided, and the adhesive can be coated on one side of the substrate 1 through a coating process or a dispensing process, and then the first chip 31 and the second chip 32 are attached to the adhesive facing away from the substrate 1 side, and the first chip 31 and the second chip 32 are arranged at intervals.
  • the adhesive can be an adhesive used to bond the substrate 1 and the first chip 31 and the second chip 32, and the adhesive can also be solder paste or conductive adhesive.
  • the adhesive is solder paste or conductive glue
  • the first chip 31 and the second chip 32 are electrically connected to the substrate 1 through the solder paste or conductive glue.
  • the adhesive is only used for bonding and fixing the first chip 31 and the second chip 32
  • the first chip 31 and the second chip 32 can be respectively bonded to the first chip 31 and the second chip 32 with the gold wire 4 by wire bonding.
  • the substrate 1 is connected, so that the first chip 31 and the second chip 32 can be electrically connected to the substrate 1 through the gold wires 4 respectively.
  • the adhesive can be cured by heating to play a reinforcing role.
  • the reflow method can also be used to solidify the adhesive to achieve reinforcement, which is not limited here.
  • holes are punched in the casing 2 through a punching process to manufacture the second air holes 231 .
  • the casing 2 is mounted on the substrate 1 through the SMT process, so that the casing 2 and the substrate 1 are enclosed to form a first cavity 232 and a second cavity 233 arranged at intervals.
  • An air hole 11 communicates with the first cavity 232
  • the second air hole 231 communicates with the second cavity 233
  • the first chip 31 is accommodated in the first cavity 232
  • the second chip 32 is accommodated in the second cavity 233 .
  • the housing 2 can be connected to the substrate 1 through solder paste or conductive glue, and at this time the housing 2 is a metal housing.
  • the casing 2 when the casing 2 is a plastic casing, the casing 2 is connected and fixed to the substrate 1 through epoxy glue.
  • two spaced groove structures are formed in the casing 2 , and the casing 2 is inverted on the substrate 1 so that the two groove structures cover the first chip 31 and the second chip 32 respectively.
  • the housing 2 includes a surrounding plate 21 , a partition plate 22 and a cover plate 23 .
  • step S30 forming a second air hole 231 on the casing 2 , attaching the casing 2 to the substrate 1 , and enclosing the casing 2 with the substrate 1 to form a first cavity 232 and a second cavity arranged at intervals
  • the cavity 233 allows the first air hole 11 to communicate with the first cavity 232, the second air hole 231 to communicate with the second cavity 233, the first chip 31 is accommodated in the first cavity 232, and the second chip 32 is accommodated in the second cavity 233.
  • Steps within chamber 233 include:
  • Step S31 attaching the enclosure plate 21 to the substrate 1 so that the enclosure plate 21 surrounds the first chip 31 , the second chip 32 and the first air hole 11 ;
  • Step S32 mount the spacer 22 on the substrate 1 between the first chip 31 and the second chip 32 , and enclose the spacer 22 and the surrounding plate 21 to form a first groove 221 and a second groove arranged at intervals. groove 222, so that the first chip 31 is located in the first groove 221, and is spaced from the first air hole 11, and the second chip 32 is located in the second groove 222;
  • Step S33 forming the second air hole 231 in the cover plate 23 , attaching the cover plate 23 to the end of the enclosure plate 21 and the partition plate 22 away from the substrate 1 , and covering the grooves of the first groove 221 and the second groove 222
  • the cover plate 23, the enclosure plate 21, the partition plate 22 and the base plate 1 are enclosed to form a first cavity 232 and a second cavity 233, and the second air hole 231 communicates with the second cavity 233, and the first air hole 11 communicates with the second cavity 233.
  • a cavity 232 .
  • the enclosure plate 21 , the partition plate 22 and the cover plate 23 of the housing 2 are arranged in separate parts, the enclosure plate 21 has a cylindrical structure with openings at both ends, and the enclosure plate 21 can be connected to the substrate through solder paste or conductive adhesive. 1
  • the enclosure plate 21 is made of metal at this time.
  • the enclosure plate 21 can be connected to the substrate 1 through epoxy glue. It can be understood that the surrounding plate 21 is arranged around the periphery of the substrate 1 to surround the first chip 31 , the second chip 32 and the first air hole 11 .
  • the spacer 22 can be optionally a plate-like structure, and the spacer 22 can be fixedly connected to the substrate 1 through solder paste or conductive adhesive, and at this time, the spacer 22 is made of metal material.
  • the spacer 22 can be connected to the substrate 1 through epoxy glue.
  • the spacer 22 when the spacer 22 is mounted on the substrate 1 , the spacer 22 is located between the first chip 31 and the second chip 32 .
  • the groove 221 and the second groove 222 are such that the first chip 31 is located in the first groove 221 and is spaced apart from the first air hole 11 , and the second chip 32 is located in the second groove 222 .
  • the material of the cover plate 23 is metal material, FR4 material, BT material or ceramic material.
  • the cover plate 23 can be fixedly connected to the enclosure plate 21 and the partition plate 22 through solder paste or conductive glue. At this time, the cover plate 23 , the enclosure plate 21 and the partition plate 22 are all made of metal.
  • the cover plate 23 can be connected to the enclosure plate 21 and the partition plate 22 through epoxy glue.
  • the cover plate 23 and the base plate 1 are arranged opposite and parallel to each other, and the enclosure plate 21 and the partition plate 22 are located between the cover plate 23 and the base plate 1 .
  • step S90 before the step of attaching the sealing gasket 5 to the casing 2 and setting around the second air hole 231 , the packaging process further includes: :
  • Step S40 coating the back glue 9 on the outer wall of the casing 2, so that the back glue 9 is arranged around the second air hole 231;
  • Step S70 Paste the dustproof net 6 on the side of the adhesive 9 away from the casing 2, so that the dustproof net 6 covers the second air hole 231;
  • Step S80 coating the back glue 9 on the side of the dustproof net 6 facing away from the casing 2 , so that the back glue 9 is arranged around the second air hole 231 .
  • the back glue 9 can be coated on the side of the cover plate 23 of the housing 2 facing away from the substrate 1 through a coating process or a glue dispensing process, so that the back glue 9 is arranged around the second air hole 231 .
  • the adhesive 9 is a hot-pressed adhesive or a pressure-sensitive adhesive.
  • the dustproof net 6 is attached to the side of the adhesive 9 away from the casing 2 by the SMT process, so that the dustproof net 6 covers the second air hole 231, which can effectively avoid dust and other debris from the second air hole 231.
  • the air hole 231 entering the second cavity 233 affects the performance of the second chip 32 .
  • a coating process or a glue dispensing process can be used to coat a layer of back glue 9 on the side of the dust filter 6 facing away from the casing 2, so that the back glue 9 surrounds
  • the second air hole 231 is provided, that is, the back glue 9 is applied to the peripheral position of the dustproof net 6, so that the sealing gasket 5 is attached to the side of the back glue 9 away from the dustproof net 6 through the SMT process, so that the sealing gasket 5 surrounds
  • the second air hole 231 is provided to facilitate the sealing and integration of the sealing gasket 5 with the terminal device.
  • step S70 before the step of pasting the dustproof net 6 on the side of the adhesive 9 away from the casing 2 so that the dustproof net 6 covers the second air holes 231,
  • the packaging process also includes:
  • Step S50' paste the waterproof membrane 7 on the side of the adhesive 9 away from the casing 2, so that the waterproof membrane 7 covers the second air hole 231;
  • Step S60' coating the back glue 9 on the side of the waterproof membrane 7 facing away from the casing 2, so that the back glue 9 is arranged around the second air hole 231.
  • the waterproof membrane 7 is attached to the side of the adhesive 9 away from the casing 2 through the SMT process, so that the waterproof membrane 7 covers the second air hole 231 , which can effectively prevent water vapor, water droplets, etc. from passing through the second air hole 231 Entering the second cavity 233 affects the performance of the second chip 32 .
  • a coating process or a glue dispensing process can be used to apply a layer of back glue 9 on the side of the waterproof membrane 7 away from the casing 2, so that the back glue 9 surrounds the second layer.
  • the air holes 231 are provided, that is, the adhesive 9 is applied to the peripheral position of the waterproof membrane 7, so that the dustproof net 6 is attached to the side of the adhesive 9 away from the waterproof membrane 7 through the SMT process, so that the dustproof net 6 covers the first part.
  • Two air holes 231 are provided to facilitate the dustproof net 6 and the waterproof membrane 7 to cover the second air holes 231 at the same time, so as to prevent dust or water vapor from entering the second cavity 233 through the second air holes 231 and affecting the performance of the second chip 32 .
  • step S33 forming the second air hole 231 in the cover plate 23 , attaching the cover plate 23 to the end of the enclosure plate 21 and the partition plate 22 away from the substrate 1 , and Cover the slots of the first groove 221 and the second groove 222, so that the cover plate 23, the surrounding plate 21, the partition plate 22 and the base plate 1 are enclosed to form the first cavity 232 and the second cavity 233, and the first cavity 232 and the second cavity 233 are formed.
  • the packaging process further includes:
  • Step S51 filling the second groove 222 with protective glue 8 through a glue dispensing valve to cover the second chip 32 ;
  • Step S52 degassing the protective glue 8 by vacuuming
  • Step S53 curing the protective adhesive 8 by adopting a step-type heating process.
  • the cover plate 23 is attached to the end of the enclosure plate 21 and the partition plate 22 away from the substrate 1 , and seals the cover plate 23 .
  • the protective glue 8 is filled into the second groove 222 through a glue dispensing valve, so that the protective glue 8 covers the second chip 32 .
  • the dispensing valve adopts a piezoelectric ceramic valve, and a piezoelectric valve of an automatic dispensing machine can be selected for bottom filling.
  • the working principle of the piezoelectric valve of the automatic dispensing machine the high-speed piezoelectric ceramic is used to swing the striker to the valve seat (nozzle insert), the liquid (under pressure) flows into the cavity between the striker and the nozzle, and the striker strikes the nozzle to produce droplets.
  • the colloid fills the valve body channel, the upper part of the striker is pressed against the bottom of the nozzle by the weight of the colloid and seals the nozzle outlet, the piezoelectric brake is applied with a high level, and the piezoelectric brake extends laterally. long so that the piezo valve striker lifts up.
  • the nozzle of the piezoelectric valve of the automatic glue dispenser is opened, and the external air pressure drives the liquid to fill the gap of the valve body formed by the upward movement of the striker, and a certain amount of glue flows out of the nozzle.
  • the piezoelectric brake is applied with low power Flat, piezo brake and rhombus zoom mechanism retract.
  • the striker hits the inner cavity of the nozzle at a high speed and seals the nozzle.
  • the colloid is squeezed into the cavity in the nozzle and under the action of the inertial force, the striker continuously vibrates up and down, so as to realize fully automatic
  • the high-speed spray dispensing of the glue dispenser can adjust the amplitude and frequency of the striker by changing the driving voltage amplitude, frequency, duty cycle, etc., and then realize the control of the spray performance of the glue drop.
  • the valve of the automatic glue dispenser adopts non-contact spray dispensing, which has high precision and powerful function, and can spray glue in narrow gaps.
  • the air bubbles float to the upper surface of the protective glue 8 when the protective glue 8 is cured, thereby forming Defects affect the performance and aesthetics of the protective adhesive 8 .
  • the filled protective glue 8 is degassed by means of vacuuming, so that all the air bubbles in the protective glue 8 are discharged. It can be understood that the protective adhesive 8 is further cured by a stepped heating method, so as to ensure that the protective adhesive 8 completely covers the second chip 32 .
  • the packaging process of the packaging module 100 proposed in the present application mounts the first chip 31 and the second chip 32 on the substrate 1 by mounting chips.
  • wire bonding is used to connect the first chip 31 and the second chip 32 to the substrate 1 with the gold wire 4, and the enclosure plate 21 and the spacer 22 are mounted on the substrate 1, so that the first chip 31 is located on the spacer 22 In the first groove 221 formed by the enclosure plate 21, the second chip 32 is located in the second groove 222 formed by the partition plate 22 and the enclosure plate 21, and the protective glue 8 is poured into the In the second groove 222, the second chip 32 and the gold wire 4 are protected.
  • the protective glue 8 Before the protective glue 8 is cured, it can be degassed by vacuuming, and during the curing process, a stepped heating process can be used. . Then, the cover plate 23 is pasted on the end of the enclosure plate 21 and the partition plate 22 away from the base plate 1 to cover the notches of the first groove 221 and the second groove 222, and enclose the first cavity 232 and the second cavity 232. Cavity 233. Then, the dustproof net 6 is attached to the side of the cover plate 23 facing away from the substrate 1 through the adhesive 9, and the second air hole 231 is covered, and the sealing gasket 5 is attached to the cover of the dustproof net 6 through the adhesive 9. One side of the board 23 and surrounds the second air hole 231, so that the sealing gasket 5 is convenient for connecting with the terminal equipment.
  • the packaging process of the packaging module 100 proposed in the present application mounts the first chip 31 and the second chip 32 on the substrate 1 by mounting chips.
  • wire bonding is used to connect the first chip 31 and the second chip 32 to the substrate 1 with the gold wire 4
  • the shell 2 is mounted on the substrate 1, and is enclosed with the substrate 1 to form a first container arranged at intervals.
  • cavity 232 and the second cavity 233 so that the first chip 31 is located in the first cavity 232, so that the second chip 32 is located in the second cavity 233, and then the waterproof film 7 is attached to the casing 2 through the adhesive 9.
  • the cover plate 23 faces the side of the base plate 1 and covers the second air hole 231.
  • the dustproof net 6 is attached to the side of the waterproof membrane 7 that faces away from the cover plate 23 of the housing 2 through the adhesive 9, and covers the second air hole 231.
  • the sealing gasket 5 is attached to the side of the dust filter 6 facing away from the cover plate 23 through the adhesive 9, and surrounds the second air hole 231, so that the sealing gasket 5 is convenient for connecting with the terminal device.
  • the package module 100 manufactured by the above two methods not only improves its own waterproof performance, but also can be sealed and integrated with the terminal system through the sealing gasket 5 to measure the external atmospheric pressure and also measure the internal pressure value of the terminal. function. Using this function in this way, a high-pressure air-tightness test process can be added outside the terminal before it leaves the factory, and whether the air-tightness of the whole machine is good can be judged by reading the change of the air pressure value inside the terminal.
  • the present application also provides an electronic device, the electronic device includes a device casing and an encapsulation module 100 , and the encapsulation module 100 is provided in the device casing.
  • the specific structure of the packaging module 100 refers to the foregoing embodiments. Since the electronic device adopts all the technical solutions of the foregoing embodiments, it at least has all the functions brought by the technical solutions of the foregoing embodiments, which will not be described here. Repeat.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Module de mise en boîtier (100), procédé de mise en boîtier et dispositif électronique. Le module de mise en boîtier (100) comprend un substrat (1), un logement (2), un ensemble puce (3) et un tampon d'étanchéité (5). Le substrat (1) comporte un premier trou d'air (11) ; le logement (2) est disposé sur le substrat (1), et le logement (2) et le substrat (1) définissent ensemble une première cavité de réception (232) et une seconde cavité de réception (233) qui sont espacées l'une de l'autre ; le premier trou d'air (11) est en communication avec la première cavité de réception (232) ; le logement (2) comporte un second trou d'air (231) en communication avec la seconde cavité de réception (233) ; l'ensemble puce (3) comprend une première puce (31) et une seconde puce (32) ; la première puce (31) est disposée dans la première cavité de réception (232) et est espacée du premier trou d'air (11) ; la seconde puce (32) est disposée dans la seconde cavité de réception (233) ; la première puce (31) et la seconde puce (32) sont électriquement reliées au substrat (1) au moyen de fils d'or (4), respectivement ; le tampon d'étanchéité (5) est disposé sur le logement (2) et entoure le second trou d'air (231), et le tampon d'étanchéité (5) est adapté pour être relié à un système de terminal.
PCT/CN2021/143213 2021-03-09 2021-12-30 Module de mise en boîtier, procédé de mise en boîtier et dispositif électronique WO2022188524A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110257461.7 2021-03-09
CN202110257461.7A CN113053861A (zh) 2021-03-09 2021-03-09 封装模组、封装工艺及电子设备

Publications (1)

Publication Number Publication Date
WO2022188524A1 true WO2022188524A1 (fr) 2022-09-15

Family

ID=76511082

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/143213 WO2022188524A1 (fr) 2021-03-09 2021-12-30 Module de mise en boîtier, procédé de mise en boîtier et dispositif électronique

Country Status (2)

Country Link
CN (1) CN113053861A (fr)
WO (1) WO2022188524A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115767989A (zh) * 2022-11-21 2023-03-07 无锡美科微电子技术有限公司 芯片驱动模组和电子装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113053861A (zh) * 2021-03-09 2021-06-29 歌尔微电子股份有限公司 封装模组、封装工艺及电子设备
CN113865757A (zh) * 2021-09-16 2021-12-31 歌尔微电子股份有限公司 压阻式压力传感器的检测电路、检测方法和电子设备
CN114105084A (zh) * 2021-11-15 2022-03-01 歌尔微电子股份有限公司 Mems共腔分膜的soc芯片及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105721998A (zh) * 2016-04-27 2016-06-29 歌尔声学股份有限公司 一种集成传感器的分腔封装结构
US20180313709A1 (en) * 2017-04-27 2018-11-01 Continental Automotive Systems, Inc. Mems pressure sensor with through-hole cap
EP3492895A1 (fr) * 2016-08-01 2019-06-05 Alps Alpine Co., Ltd. Capteur de pression et module de capteur de pression
US20200103302A1 (en) * 2018-09-28 2020-04-02 Apple Inc. Dual Pressure Sensing Module with a Shared Electrical Substrate
CN113053861A (zh) * 2021-03-09 2021-06-29 歌尔微电子股份有限公司 封装模组、封装工艺及电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8804982B2 (en) * 2011-04-02 2014-08-12 Harman International Industries, Inc. Dual cell MEMS assembly
CN204442602U (zh) * 2015-02-15 2015-07-01 歌尔声学股份有限公司 一种mems传感器
CN105679685A (zh) * 2016-03-23 2016-06-15 广东合微集成电路技术有限公司 一种传感器模块及其制作方法
ITUA20162959A1 (it) * 2016-04-28 2017-10-28 St Microelectronics Srl Modulo di trasduzione multi-camera, apparecchiatura includente il modulo di trasduzione multi-camera e metodo di fabbricazione del modulo di trasduzione multi-camera
CN210670557U (zh) * 2019-12-25 2020-06-02 歌尔科技有限公司 一种多功能传感器及包括其的电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105721998A (zh) * 2016-04-27 2016-06-29 歌尔声学股份有限公司 一种集成传感器的分腔封装结构
EP3492895A1 (fr) * 2016-08-01 2019-06-05 Alps Alpine Co., Ltd. Capteur de pression et module de capteur de pression
US20180313709A1 (en) * 2017-04-27 2018-11-01 Continental Automotive Systems, Inc. Mems pressure sensor with through-hole cap
US20200103302A1 (en) * 2018-09-28 2020-04-02 Apple Inc. Dual Pressure Sensing Module with a Shared Electrical Substrate
CN113053861A (zh) * 2021-03-09 2021-06-29 歌尔微电子股份有限公司 封装模组、封装工艺及电子设备

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115767989A (zh) * 2022-11-21 2023-03-07 无锡美科微电子技术有限公司 芯片驱动模组和电子装置
CN115767989B (zh) * 2022-11-21 2023-11-24 无锡美科微电子技术有限公司 芯片驱动模组和电子装置

Also Published As

Publication number Publication date
CN113053861A (zh) 2021-06-29

Similar Documents

Publication Publication Date Title
WO2022188524A1 (fr) Module de mise en boîtier, procédé de mise en boîtier et dispositif électronique
US8314485B2 (en) Electronic component
US9337354B2 (en) Top port MEMS cavity package and method of manufacture thereof
US9986354B2 (en) Pre-mold for a microphone assembly and method of producing the same
US20140210019A1 (en) Low-cost package for integrated mems sensors
US8999757B2 (en) Top port MEMS cavity package and method of manufacture thereof
US10843918B2 (en) Semiconductor package with multiple compartments
CN111422819B (zh) 传感器封装结构及其封装方法、以及电子设备
US20130105952A1 (en) Shielded encapsulating structure and manufacturing method thereof
CN208924506U (zh) 传感器的封装结构及mems麦克风
JP6536474B2 (ja) センサ装置
US10985131B2 (en) Microelectronic device having protected connections and manufacturing process thereof
CN112995866A (zh) 传感器封装结构和电子设备
CN109748234B (zh) 压力测量模块及其封装方法
CN115767404A (zh) Mems扬声器制备工艺及mems扬声器
JP4859016B2 (ja) 半導体パッケージ
KR101981831B1 (ko) 공동 패키지 디자인
EP3456682A1 (fr) Système de capteur, agencement de capteur et procédé d'assemblage faisant appel à la soudure pour l'étanchéité
CN112897451B (zh) 传感器封装结构及其制作方法和电子设备
CN214224430U (zh) 封装模组和电子设备
JP2000019042A (ja) 半導体センサ及び実装構造
US20150177028A1 (en) Sensor package and portable terminal having the same
CN219064737U (zh) 一种防水传感器和电子设备
JP6476036B2 (ja) 圧力センサ
CN216978116U (zh) 骨声纹传感器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21929986

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21929986

Country of ref document: EP

Kind code of ref document: A1