CN217442736U

CN217442736U - Pressure sensor's packaging structure

Info

Publication number: CN217442736U
Application number: CN202221268969.3U
Authority: CN
Inventors: 孙飞; 吴东辉; 肖滨; 李刚
Original assignee: Kunshan Lingke Sensing Technology Co ltd
Current assignee: Kunshan Lingke Sensing Technology Co ltd
Priority date: 2022-05-24
Filing date: 2022-05-24
Publication date: 2022-09-16
Anticipated expiration: 2032-05-24

Abstract

The utility model belongs to the technical field of the chip package, a pressure sensor's packaging structure is disclosed. The packaging structure of the pressure sensor comprises a substrate, a shell, a spacer, a sensor chip and a conditioning chip, wherein the shell is arranged on the substrate and encloses with the substrate to form an accommodating cavity; the spacing block is arranged in the containing cavity and fixed on the substrate; the sensor chip is arranged in the accommodating cavity and is fixed on the isolating sheet; the conditioning chip is arranged in the accommodating cavity and fixed on the substrate, the sensor chip is electrically connected with the conditioning chip, and the conditioning chip is electrically connected with the substrate. The utility model provides a pressure sensor's packaging structure through set up the spacer between base plate and sensor chip, has increased the distance between sensor chip and the base plate, has effectively avoided external stress to cause the influence to sensor chip, and compares with current increase substrate thickness, the cost is reduced.

Description

Pressure sensor's packaging structure

Technical Field

The utility model relates to a chip package technical field especially relates to a pressure sensor's packaging structure.

Background

The pressure sensor has wide application in various fields such as industrial production, medical care and health, environmental monitoring, scientific research and the like, and the basic principle of the pressure sensor is to convert a pressure change value into a change of an electric signal. The pressure sensor is utilized to integrate the acquisition, processing and execution of the pressure change information together to form a multifunctional composite micro intelligent system, which not only can reduce the cost of the whole electromechanical system, but also can complete the tasks which can not be completed by a large-size electromechanical system; in addition, the pressure sensor can be embedded into a large-size system, so that the automation, intelligence and reliability level of the system are greatly improved. The pressure sensor is a microminiaturization result on the traditional machinery and is an important component of the whole nanometer science and technology.

In the prior art, a sensor packaging technology is a key technology for realizing the practical application of a pressure sensor. The mutual transmission of electrical signals in different modules in the integrated circuit is realized through packaging, and the packaging needs to reduce the influence on the MEMS chip as much as possible and reduce the influence of the external environment on the MEMS chip. In a packaging module of an MEMS chip, a traditional chip fixing mode adopts an adhesive bonding mode, the larger the thickness of glue between the MEMS chip and a substrate is, the more the influence of the outside on the MEMS chip can be reduced, however, in the actual bonding process, the glue generally adopts silica gel with lower hardness, the thickness of the glue during packaging has limitation, the maximization cannot be reached, and the MEMS chip is easily influenced by the outside; alternatively, the influence of external stress on the MEMS chip can be reduced by increasing the thickness of the substrate.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a pressure sensor's packaging structure aims at increasing the distance between sensor chip and the base plate, effectively avoids external stress to cause the influence to sensor chip.

To achieve the purpose, the utility model adopts the following technical proposal:

a pressure sensor package structure comprising:

a substrate;

the shell is arranged on the substrate and forms an accommodating cavity with the substrate in an enclosing manner;

the spacer is arranged in the accommodating cavity and fixed on the substrate;

the sensor chip is arranged in the accommodating cavity and is fixed on the isolating sheet;

the conditioning chip is arranged in the accommodating cavity and fixed on the substrate, the sensor chip is electrically connected with the conditioning chip, and the conditioning chip is electrically connected with the substrate.

Optionally, the spacer is glued to the substrate by a first patch.

Optionally, one surface of the spacer, which is close to the substrate, is provided with a glue spreading groove.

Optionally, an air inlet is arranged on the upper surface of the casing, and the air inlet is used for communicating the accommodating cavity with the outside.

Optionally, an air inlet is formed in the substrate, a via hole is formed in the spacer, the air inlet is communicated with the via hole, and the sensor chip is arranged corresponding to the via hole.

Optionally, the sensor chip is glued to the spacer by a second patch.

Optionally, the conditioning chip is adhesively attached to the substrate by a third patch.

Optionally, the substrate is a ceramic substrate, a plastic substrate, or an FR-4 substrate.

Optionally, the housing is glued to the substrate by a fourth patch.

Optionally, the fourth patch adhesive is resin glue or solder paste.

The utility model has the advantages that: the utility model provides a pressure sensor's packaging structure through set up the spacer between base plate and sensor chip, has increased the distance between sensor chip and the base plate, has effectively avoided external stress to cause the influence to sensor chip, and compares with current increase substrate thickness, the cost is reduced.

Drawings

Fig. 1 is a schematic view of a single-inlet package of a package structure of a pressure sensor according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a dual air inlet package of a package structure of a pressure sensor according to an embodiment of the present invention.

In the figure:

1. a substrate; 2. a pin; 3. a lead substrate; 4. a first patch adhesive; 5. a second surface mount adhesive; 6. a separator; 7. third paster glue; 8. a sensor chip; 9. a sensing surface; 10. a fourth surface mount adhesive; 11. conditioning the chip; 12. a first bonding wire; 13. a housing; 14. a second bonding wire; 15. an air inlet; 16. a glue spreading groove; 17. an air inlet.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

As shown in fig. 1 and fig. 2, the present embodiment provides a package structure of a pressure sensor, which includes a substrate 1, a housing 13, a spacer 6, a sensor chip 8, and a conditioning chip 11.

Specifically, the housing 13 is arranged on the substrate 1 and encloses with the substrate 1 to form an accommodating cavity; the spacing block 6 is arranged in the containing cavity and fixed on the substrate 1; the sensor chip 8 is arranged in the accommodating cavity, and the sensor chip 8 is fixed on the spacer 6; the conditioning chip 11 is arranged in the accommodating cavity and fixed on the substrate 1, the sensor chip 8 is electrically connected with the conditioning chip 11, and the conditioning chip 11 is electrically connected with the substrate 1.

The utility model provides a pressure sensor's packaging structure through set up spacer 6 between base plate 1 and sensor chip 8, has increased the distance between sensor chip 8 and the base plate 1, has effectively avoided external stress to cause the influence to sensor chip 8, and compares with current increase base plate 1's thickness, the cost is reduced.

Optionally, the spacer 6 is bonded to the substrate 1 by the first patch adhesive 4. The arrangement is easy to operate, and the processing and manufacturing cost is reduced. In this embodiment, the first patch adhesive 4 is a silica gel. In other embodiments, the first patch adhesive 4 can be set to other low-stress glues by those skilled in the art according to actual needs.

Optionally, the sensor chip 8 is bonded to the spacer 6 by a second patch adhesive 5. The arrangement is easy to operate, and the processing and manufacturing cost is reduced. The upper surface of spacer 6 is equipped with the second paster and glues 5, and the lower surface of spacer 6 is equipped with first paster and glues 4, and the thickness of glue is for the obvious increase of prior art, has effectively avoided external stress to sensor chip 8's influence.

In this embodiment, the second patch adhesive 5 is a silica gel. In other embodiments, the second patch glue 5 can be set to other low-stress glues by those skilled in the art according to actual needs.

Furthermore, a glue spreading groove 16 is arranged on one surface of the isolation sheet 6 close to the substrate 1. Expand gluey groove 16 through the setting, can effectively increase the thickness that first paster glued 4, improve the fixed effect between spacing block 6 and the base plate 1, simultaneously, first paster glues 4 thickness and is big more, can effectively avoid external stress to pass spacing block 6 and cause the influence to sensor chip 8 more.

Optionally, the conditioning chip 11 is adhered to the substrate 1 by a third patch adhesive 7. The arrangement is easy to operate, and the processing and manufacturing cost is reduced. In this embodiment, the third patch adhesive 7 is an epoxy adhesive. In other embodiments, the third patch adhesive 7 may be other high hardness and high shear adhesives according to actual needs.

With continued reference to fig. 1 and 2, an air inlet 15 is disposed on the upper surface of the housing 13, and the air inlet 15 is used for communicating the accommodating cavity with the outside. During single air inlet packaging, the upper surface of the shell 13 is provided with an air inlet 15, so that the accommodating cavity is communicated with the outside, and the sensing surface 9 of the sensor chip 8 senses the change of outside pressure or gas, so that the sensor chip 8 generates the change of electrical properties and outputs an electric signal.

As shown in fig. 2, in the dual inlet package, the substrate 1 is provided with an inlet 17, the spacer 6 is provided with a via hole, the inlet 17 is communicated with the via hole, and the sensor chip 8 is disposed corresponding to the via hole. By the arrangement, the bottom surface of the sensor chip 8 can also sense the change of external pressure or gas, and double-gas-inlet packaging of the pressure sensor is realized.

Optionally, the housing 13 is adhered to the substrate 1 by a fourth patch adhesive 10. The arrangement is easy to operate, and the processing and manufacturing cost is reduced.

In this embodiment, the fourth patch adhesive 10 is resin glue or solder paste. The resin glue or the solder paste can effectively ensure the bonding effect of the shell 13 and the substrate 1, so that the shell 13 and the substrate 1 are fully sealed. In other embodiments, one skilled in the art can set the fourth patch adhesive 10 to other high hardness and high shear adhesives according to actual needs.

In this embodiment, the substrate 1 is a ceramic substrate, a plastic substrate or an FR-4 substrate. The substrate 1 is used to fix the sensor chip 8, the conditioning chip 11, and the case 13. Further, the bottom surface of the substrate 1 is provided with pins 2, and the pins 2 are used for connecting the substrate 1 with an external application circuit.

Optionally, the sensor chip 8 and the conditioning chip 11 are electrically connected by a first bonding wire 12; the conditioning chip 11 and the substrate 1 are electrically connected through a second bonding wire 14, and both the first bonding wire 12 and the second bonding wire 14 function as electrical signal connection. Illustratively, the first and

second bonding wires

12 and 14 may each be one of gold wire, aluminum wire, copper wire, and alloy wire.

Specifically, the base plate 1 is provided with a lead substrate 3, one end of the second bonding wire 14 is connected with the conditioning chip 11, and the other end of the second bonding wire 14 is connected with the base plate 1. The lead substrate 3 plays a role of bonding, and ensures that the second bonding wire 14 is fully connected with the base plate 1.

In this embodiment, the sensor chip 8 is an MEMS chip, which is used to sense the change of the external environment and can generate the change of the electrical property itself; the conditioning chip 11 is an ASIC chip, and the ASIC chip is used to calibrate the signal output by the MEMS and convert the signal into an electrical characteristic parameter meeting the requirement.

Optionally, during packaging, the sensor chip 8 may be bonded to the conditioning chip 11, and the conditioning chip 11 functions as the spacer 6, so as to reduce the manufacturing cost of the packaging structure of the pressure sensor.

The utility model provides a pressure sensor's packaging structure's packaging process includes: sequentially adhering the spacer 6 to the substrate 1, and adhering the sensor chip 8 to the spacer 6; the conditioning chip 11 is adhered to the substrate 1; the sensor chip 8 and the conditioning chip 11 are connected through a first bonding wire 12, and the conditioning chip 11 is connected with the substrate 1 through a second bonding wire 14; finally, the case 13 is bonded to the substrate 1.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements, and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A pressure sensor package, comprising:

a substrate (1);

the shell (13) is arranged on the substrate (1), and the shell (13) and the substrate (1) enclose to form an accommodating cavity;

the isolating sheet (6) is arranged in the accommodating cavity, and the isolating sheet (6) is fixed on the substrate (1);

the sensor chip (8) is arranged in the accommodating cavity, and the sensor chip (8) is fixed on the isolating sheet (6);

the conditioning chip (11) is arranged in the accommodating cavity and fixed on the substrate (1), the sensor chip (8) is electrically connected with the conditioning chip (11), and the conditioning chip (11) is electrically connected with the substrate (1).

2. The pressure sensor package structure of claim 1, wherein the spacer (6) is bonded to the substrate (1) by a first patch adhesive (4).

3. The packaging structure of the pressure sensor according to claim 2, wherein a glue spreading groove (16) is formed on one surface of the spacer (6) close to the substrate (1).

4. The packaging structure of the pressure sensor according to claim 1, wherein an air inlet (15) is formed on the upper surface of the housing (13), and the air inlet (15) is used for communicating the accommodating cavity with the outside.

5. The package structure of the pressure sensor according to claim 4, wherein an air inlet (17) is disposed on the substrate (1), a via hole is disposed on the spacer (6), the air inlet (17) is communicated with the via hole, and the sensor chip (8) is disposed corresponding to the via hole.

6. The pressure sensor package of claim 1, wherein the sensor chip (8) is bonded to the spacer (6) by a second patch adhesive (5).

7. The pressure sensor package structure of claim 1, wherein the conditioning chip (11) is bonded to the substrate (1) by a third patch adhesive (7).

8. The package structure of a pressure sensor according to claim 1, wherein the substrate (1) is a ceramic substrate, a plastic substrate, or an FR-4 substrate.

9. The package structure of a pressure sensor according to claim 1, wherein the housing (13) is bonded to the substrate (1) by a fourth patch adhesive (10).

10. The package structure of a pressure sensor according to claim 9, wherein the fourth patch adhesive (10) is a resin glue or a solder paste.