CN106323540A - Pressure sensor and manufacturing method thereof - Google Patents
Pressure sensor and manufacturing method thereof Download PDFInfo
- Publication number
- CN106323540A CN106323540A CN201610701627.9A CN201610701627A CN106323540A CN 106323540 A CN106323540 A CN 106323540A CN 201610701627 A CN201610701627 A CN 201610701627A CN 106323540 A CN106323540 A CN 106323540A
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- Prior art keywords
- pressure sensor
- sensor chip
- soldered ball
- reading circuit
- pad
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a pressure sensor and a manufacturing method thereof. The pressure sensor comprises a PCB, first-kind pads and second-kind pads which are arranged at preset positions of the PCB. The pressure sensor further comprises a connecting wire which is fixedly arranged between the first-kind pads and the second-kind pads for electrically connecting the first-kind pads with the second-kind pads. Through arranging the connecting wire between the first-kind pads and the second-kind pads, in subsequent mounting of a pressure sensor chip and a reading circuit, the pressure sensor chip is electrically connected with the reading circuit through the connecting wire, thereby greatly reducing packaging areas of the pressure sensor and reducing complexity of the manufacturing process. Furthermore because the connecting wire is directly fixed on the PCB, single implement of a connecting wire bonding operation is not required, thereby greatly improving product efficiency. Furthermore because the connecting wire is fixed on the PCB, problems such as fracture and falling-off caused by punching on the connecting wire are prevented in a subsequent punching process, thereby improving yield of the pressure sensors.
Description
Technical field
The present embodiments relate to pressure/electricity conversion art, more particularly, to a kind of pressure transducer and manufacture method.
Background technology
MEMS (Micro-Electro-Mechanical System Micro Electro Mechanical System) sensor is based on MEMS technology
The sensor manufactured, vibrating diaphragm therein, doped resistor are the vitals in pressure transducer, and pressure transducer is logical on vibrating diaphragm
Overdoping making resistor stripe is to form Wheatstone bridge, and when the pressure change of vibrating diaphragm both sides, the shape of vibrating diaphragm can occur accordingly
Change, cause the change of resistance in Wheatstone bridge, such that it is able to according to resistance variations detect pressure change, it is achieved pressure/electricity
Conversion.
As it is shown in figure 1, the generalized section of existing pressure transducer, including PCB (Printed Circuit Board
Printed circuit board (PCB)) encapsulating structure that plate 1 ', shell 2 ' surround, include pressure sensor chip 3 ', reading circuit in encapsulating structure
4 ', wherein, pressure sensor chip 3 ' and reading circuit 4 ' are each attached on pcb board 1 ', pressure sensor chip 3 ' and reading
Being changed to realize the pressure/signal of telecommunication by gold thread 5 ' electrical connection between circuit 4 ', reading circuit 4 ' and pcb board pass through gold thread between ' 1
The signal of telecommunication that 5 ' electrical connections are mated with pressure signal with transmission.
In prior art, mostly gold thread 5 ' is to use wire bonding method to connect, first reading circuit 4 ' and pressure transducer
Be respectively provided with a headspace between chip 3 ', between reading circuit 4 ' and pcb board 1 ', then by pressure sensor chip 3 ' and
Reading circuit 4 ' is connected to pcb board by pad ' on, in headspace, complete gold thread 5 ' bonding stamping process to realize reading
Connection between circuit 4 ' and pressure sensor chip 3 ' and reading circuit 4 ' and pcb board 1 '.But use gold thread bonding pattern
There is a defect: i.e. because between reading circuit 4 ' and pcb board 1 ', setting respectively between reading circuit 4 ' and pressure sensor chip 3 '
Put a headspace and cause the pressure sensor package area after molding bigger than normal, simultaneously because gold thread bonding is by separator
Part (reading circuit 4 ', pressure sensor chip 3 ' relative separation) connects, and every gold thread 5 ' is required for individually being bonded (reading circuit
Gold thread 5 ' bonding between 4 ' and pcb board 1 ', the gold thread 5 ' between reading circuit 4 ' and pressure sensor chip 3 ' are bonded) and envelope
Dress, the packaging efficiency of pressure transducer is relatively low.Meanwhile, when pressure sensor chip 3 ', reading circuit 4 ' experience a shock, gold thread
5 ' because of vibration then there will be fracture, coming off etc. connects defect, increases the complexity of processing technology, greatly reduces pressure biography simultaneously
The yield rate of sensor.
Summary of the invention
The present invention provides a kind of pressure transducer and manufacture method, it is intended to reduces the complexity of processing technology, improves simultaneously
The yield rate of pressure transducer.
First aspect, embodiments provides a kind of pressure transducer, wherein: include
One pcb board, and it is arranged at first kind pad and the Equations of The Second Kind pad in the precalculated position of described pcb board；
Also include, connecting line, be fixedly installed between described first kind pad and described Equations of The Second Kind pad, be used for so that institute
State first kind pad and electrically connect described Equations of The Second Kind pad.
Preferably, above-mentioned pressure transducer, wherein, also include pressure sensor chip, in described pressure sensor chip
Leads ends the first soldered ball is set, described first soldered ball connects described first kind pad so that described pressure sensor chip is fixed
It is arranged on described pcb board.
Preferably, above-mentioned pressure transducer, wherein, also include reading circuit, the leads ends of described reading circuit is arranged
The second soldered ball, described second soldered ball is had to connect described Equations of The Second Kind pad so that described reading circuit is fixedly installed on described pcb board
On.
Preferably, above-mentioned pressure transducer, wherein, also include the first encapsulated layer and the second encapsulated layer；
Described first encapsulated layer is arranged at described pressure sensor chip surface, is used for encapsulating described pressure transducer core
Sheet；
Described second encapsulated layer is arranged at described reading circuit surface, is used for encapsulating described reading circuit.
Preferably, above-mentioned pressure transducer, wherein, and described first encapsulated layer employing flexible glue material package, described second
Encapsulated layer uses ebonite material package.
Second aspect, the present embodiment also provides for the manufacture method of a kind of pressure sensor chip, wherein, including:
There is provided leads ends to be provided with the pressure sensor chip of the first soldered ball and leads ends is provided with the reading of the second soldered ball
Sense circuit；
It is provided with first kind pad and Equations of The Second Kind pad in the pre-position of described pcb board and connects described first pad
Connecting line with described second pad；
Described first soldered ball is connected described first kind pad so that described pressure sensor chip is fixedly installed on described
On pcb board, described second soldered ball is connected described Equations of The Second Kind pad so that described reading circuit is fixedly installed on described PCB simultaneously
On plate.
Preferably, the manufacture method of above-mentioned pressure sensor chip, wherein, also include,
Described pressure sensor chip is done encapsulation process to form the first encapsulated layer, described reading circuit is sealed simultaneously
Dress processes to form the second encapsulated layer.
Preferably, the manufacture method of above-mentioned pressure sensor chip, wherein, described first encapsulated layer uses flexible glue material
Encapsulation, described second encapsulated layer uses ebonite material package.
Preferably, the manufacture method of above-mentioned pressure sensor chip, wherein, described first soldered ball is connected described first
Class pad so that described pressure sensor chip is fixedly installed on described pcb board, including:
Described pressure sensor chip is inverted on described pcb board so that described first soldered ball mates the weldering of the described first kind
Dish；
Described pressure sensor chip is done reflow treatment so that described first soldered ball is fixing connects described first kind pad.
Preferably, the manufacture method of above-mentioned pressure sensor chip, wherein, described second soldered ball is connected described second
Class pad so that described reading circuit is fixedly installed on described pcb board, including:
Described reading circuit is inverted on described pcb board so that described second soldered ball mates described Equations of The Second Kind pad；
Described reading circuit chip is done reflow treatment so that described second soldered ball is fixing connects described Equations of The Second Kind pad.
The present invention is by arranging a connecting line, at subsequent installation pressure sensing between first kind pad and Equations of The Second Kind pad
When device chip and reading circuit, it is electrically connected with pressure sensor chip and reading circuit by connecting line, it is not necessary in reading circuit
And between pcb board, be respectively provided with headspace between reading circuit and pressure sensor chip, greatly reduce the encapsulation of MEMS
Area, reduces the complexity of processing technology, simultaneously because connecting line is directly to be fixedly installed on pcb board, it is not necessary to individually real
Execute connecting line bonding operation, be greatly improved production efficiency, and because connecting line is fixed on pcb board, in follow-up punching course,
Will not there is defect problems such as rupturing, come off because of punching press in connecting line, is conducive to improving the yield rate of pressure transducer.
Accompanying drawing explanation
Fig. 1 is the generalized section of pressure transducer in prior art；
Fig. 2 is the generalized section of the pressure transducer in the embodiment of the present invention one；
Fig. 3 is the manufacture method schematic flow sheet of the pressure sensor chip in the embodiment of the present invention two.
Detailed description of the invention
The present invention is described in further detail with embodiment below in conjunction with the accompanying drawings.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that, in order to just
Part related to the present invention is illustrate only rather than entire infrastructure in description, accompanying drawing.
Embodiment one
The generalized section of a kind of pressure transducer that Fig. 2 provides for the embodiment of the present invention one, wherein: include
One pcb board 1, and it is arranged at first kind pad 11 and the Equations of The Second Kind pad 12 in the precalculated position of described pcb board 1；
Also include, be fixedly installed on the connecting line 5 on described pcb board 1, be arranged at described first kind pad 11 and described the
Between two class pads 12, it is used for so that described first kind pad 11 electrically connects described Equations of The Second Kind pad 12.Further, connecting line
5 can be copper cash.
In the technical scheme of the present embodiment, by arranging a connecting line between first kind pad 11 and Equations of The Second Kind pad 12
5, when subsequent installation pressure sensor chip 3 and reading circuit 4, it is electrically connected with pressure sensor chip 3 He by connecting line 5
Reading circuit 4, it is not necessary between reading circuit 4 and pcb board 1, be respectively provided with between reading circuit 4 and pressure sensor chip 3
Headspace, greatly reduces the package area of MEMS, reduces the complexity of processing technology, simultaneously because connecting line 5 is straight
Connect and be fixedly installed on pcb board 1, it is not necessary to individually implement connecting line 5 bonding operation, be greatly improved production efficiency, and because of connecting line 5
Being fixed on pcb board 1, in follow-up punching course, will not there is defect problems such as rupturing, come off because of punching press in connecting line 5,
Be conducive to improving the yield rate of pressure transducer.
It addition, continue as it is shown in figure 1, because pressure sensor chip 3 ' comprises a resonance chamber 31 ', resonance chamber 31 '
Height (or cavity volume) determine pressure transducer and gather pressure or the precision of pressure, generally for the pressure of high accurancy and precision
Sensor chip 3 ', the volume of its resonance chamber 31 ' is relatively big, result in the height of pressure sensor chip 3 ' commonly greater than reading
Sense circuit 4 ', so cause pressure sensor chip 3 ' and reading circuit 4 ' between form a difference in height, because of depositing of difference in height
, and then need to increase the length of gold thread 5 ' so that the turning of pressure sensor chip 3 ' and reading circuit 4 ' data and/or signal
Changing, i.e. in prior art, gold thread 5 ' length is relatively long, and then production cost improves relatively.
As in figure 2 it is shown, in the embodiment of the present invention, pcb board 1 arranges one and is connected to first kind pad 11 and Equations of The Second Kind weldering
Connecting line 5 between dish 12, first kind pad 11 and Equations of The Second Kind pad 12 be in same level, then first kind pad 11 and the
Between two class pads 12, air line distance is the shortest, and the length being i.e. equivalent to connecting line 5 is the shortest, has saved the use of connecting line 5, generally
In order to reach the laser propagation effect of preferable data and/or signal, generally use the copper cash that electrical conductivity is higher as connecting line 5, subtract
The use length of few gold thread, i.e. reduces production cost.
As further preferred embodiment, above-mentioned pressure transducer, wherein, also include pressure sensor chip 3, in
The leads ends of described pressure sensor chip 3 arranges the first soldered ball 31, and described first soldered ball 31 connects described first kind pad 11
So that described pressure sensor chip 3 is fixedly installed on described pcb board 1.Further, above-mentioned pressure transducer, wherein,
Also including that reading circuit 4, the leads ends of described reading circuit 4 are provided with the second soldered ball 42, described second soldered ball 42 connects described
Equations of The Second Kind pad 12 is so that described reading circuit 4 is fixedly installed on described pcb board 1.
In above-described embodiment, the leads ends in described pressure sensor chip 3 arranges the first soldered ball 31, described first soldered ball
The 31 described first kind pads 11 of connection are so that described pressure sensor chip 3 is fixedly installed on described pcb board 1, to realize inciting somebody to action
Pressure sensor chip 3 is fixedly installed on described pcb board 1, and the leads ends of the most described reading circuit 4 is provided with the second soldered ball
42, described second soldered ball 42 connects described Equations of The Second Kind pad 12 so that described reading circuit 4 is fixedly installed on described pcb board 1,
To realize being fixedly installed on described pcb board 1 reading circuit 4, because of described first kind pad 11 and described Equations of The Second Kind pad 12
Between be provided with connecting line 5, be i.e. equivalent to, by connecting line 5 between described reading circuit 4 and described pressure sensor chip 3
Connect, and then achieve the data between described reading circuit 4 and described pressure sensor chip 3 and/or the transmission of signal.
As further preferred embodiment, above-mentioned pressure transducer, wherein, also include the first encapsulated layer and the second envelope
Dress layer.
Wherein, described first encapsulated layer is arranged at described pressure sensor chip 3 surface, is used for encapsulating described pressure sensing
Device chip 3；Being packaged processing to described pressure sensor chip 3 by described first encapsulated layer, described first encapsulated layer can
With fixing described pressure sensor chip 3, why can realize between described pressure sensor chip 3 and described reading circuit 4
The conversion of the pressure/signal of telecommunication and transmission, reason is that the first soldered ball 31 of described pressure sensor chip 3 leads ends connects described
One class pad 11 (the first soldered ball 31 is conductor with first kind pad 11), once makes described pressure transducer because of External Force Acting
First soldered ball of the leads ends of chip 3 offsets or departs from described first kind pad 11, and the most described pressure sensor chip 3 is with described
Between reading circuit 4, pressure/electricity conversion capability is substantially reduced, and even cannot realize pressure/electricity and convert.So that by the first encapsulation
The fixing described pressure sensor chip 3 of layer, it is intended to prevent from falling off between first kind pad 11 and the first soldered ball 31, affect institute
State the service behaviour of pressure transducer.
As further preferred embodiment, described first encapsulated layer uses flexible glue material package, and flexible glue material can be silicon
Glue.Pressure decay in flexible glue material is relatively small, it is possible to (pressure is by pressure to make vibrating diaphragm obtain pressure the most accurately
Producing, pressure loss is little, and pressure precision is higher).And ebonite material is usually stress absorbing material, pressure is in ebonite material
Decay relatively big, so using flexible glue material to be thought of as described first encapsulated layer.Ambient pressure is transmitted by the opening of package casing 2
To the first package surface, then it is delivered to the pressure sensitive film of sensor chip 3 by space from the first package surface, presser sensor
Film is affected by ambient pressure to be deformed, and causes the change of the signal of telecommunication.
Described second encapsulated layer is arranged at described reading circuit 4 surface, is used for encapsulating described reading circuit 4, further,
Described second encapsulated layer uses ebonite material package.On the one hand in order to protect described reading circuit 4 surface, it is to avoid because of External Force Acting
And make described reading circuit 4 that performance fault occur, and on the other hand in order to fixing described pressure sensor chip 3, described pressure
Why can realize conversion and the transmission of the pressure/signal of telecommunication between sensor chip 3 and described reading circuit 4, reason is described
Second soldered ball 42 of reading circuit 4 leads ends connects described Equations of The Second Kind pad 12, and (the second soldered ball 42 is with Equations of The Second Kind pad 12
Conductor), once because of External Force Acting, the Equations of The Second Kind soldered ball of the leads ends of described reading circuit 4 is come off described Equations of The Second Kind pad
12, conversion and the transmission of the pressure/signal of telecommunication cannot be realized between the most described pressure sensor chip 3 and described reading circuit 4.Thus
Need to fix described reading circuit 4 by the second encapsulated layer, it is intended to prevent from occurring between Equations of The Second Kind pad 12 and the second soldered ball 42
Come off, affect the service behaviour of described pressure transducer.
As further preferred embodiment, on the basis of the embodiment above, by described ebonite material to institute
Stating pressure sensor chip 3 to be packaged processing, ebonite material can be epoxy resin.The price relative reduction of epoxy resin, fall
The manufacturing cost of low-pressure sensor, on the other hand, ebonite material forms the second encapsulated layer to be intended to improve described reading circuit 4 and resists
Pressure energy power.
It should be noted that in actual application, in order to ensure the integration of whole pressure transducer, globality,
Would generally be at pressure transducer surface configuration one shell 2, in order to protect the electrical equipment of pressure sensor inside.Outside preventing
Shell 2 is decayed pressure signal, and by arranging perforate on shell 2, perforate is arranged on the top of shell, it is possible to be arranged on shell side
Both sides, are not particularly limited the position of perforate herein.
Embodiment two
Second aspect, as it is shown on figure 3, the manufacture method flow process that the present embodiment two also provides for a kind of pressure sensor chip is shown
Being intended to, wherein, the method includes:
Step S1, leads ends is provided to be provided with the pressure sensor chip of the first soldered ball and leads ends is provided with second
The reading circuit of soldered ball；
Step S2, it is provided with first kind pad and Equations of The Second Kind pad in the pre-position of described pcb board and connects described
First pad and the connecting line of described second pad；
Step S3, by described first soldered ball connect described first kind pad so that described pressure sensor chip is fixedly installed
On described pcb board, described second soldered ball is connected described Equations of The Second Kind pad so that described reading circuit is fixedly installed on simultaneously
On described pcb board.
In the technical scheme of the present embodiment, first provide leads ends be provided with the first soldered ball pressure sensor chip, with
And leads ends is provided with the reading circuit of the second soldered ball；First kind pad and it is provided with in the pre-position of described pcb board
Two class pads and connect the connecting line of described first pad and described second pad；Secondly by described for described first soldered ball connection the
Described second soldered ball, so that described pressure sensor chip is fixedly installed on described pcb board, is connected institute by one class pad simultaneously
State Equations of The Second Kind pad so that described reading circuit is fixedly installed on described pcb board.
In the embodiment of the present invention, by arranging a connecting line between first kind pad and Equations of The Second Kind pad, in follow-up peace
When dress pressure sensor chip and reading circuit, it is electrically connected with pressure sensor chip and reading circuit by connecting line, it is not necessary to
Between reading circuit and pcb board, between reading circuit and pressure sensor chip, it is respectively provided with headspace, greatly reduces
The package area of pressure transducer, reduces the complexity of processing technology, simultaneously because connecting line is directly to be fixedly installed on PCB
On plate, it is not necessary to individually implement connecting line bonding operation, be greatly improved production efficiency, and because connecting line is fixed on pcb board, rear
In continuous punching course, will not there is defect problems such as rupturing, come off because of punching press in connecting line, is conducive to improving pressure transducer
Yield rate.
As further preferred embodiment, the manufacture method of above-mentioned pressure sensor chip, wherein, also include: right
Described pressure sensor chip does encapsulation process to form the first encapsulated layer, described reading circuit is done encapsulation process with shape simultaneously
Become the second encapsulated layer.
As further preferred embodiment, the manufacture method of above-mentioned pressure sensor chip, wherein, described first envelope
Dress layer uses flexible glue material package, described second encapsulated layer to use ebonite material package.Ambient pressure is opened by package casing
Oral instructions are delivered to the first package surface, then are delivered to the pressure sensitive film of sensor chip by space from the first package surface, pressure
Power sensitive membrane is affected by ambient pressure to be deformed, and causes the change of the signal of telecommunication.
As further preferred embodiment, above-mentioned pressure transducer, wherein, also include the first encapsulated layer and the second envelope
Dress layer.
Wherein, described first encapsulated layer is arranged at described pressure sensor chip surface, is used for encapsulating described pressure sensing
Device chip；Being packaged processing to described pressure sensor chip by described first encapsulated layer, described first encapsulated layer is permissible
Why fixing described pressure sensor chip, can realize pressure/electricity between described pressure sensor chip and described reading circuit
The conversion of signal and transmission, reason is that the first soldered ball of described pressure sensor chip leads ends connects described first kind pad
(the first soldered ball and first kind pad are conductor), once makes the leads ends of described pressure sensor chip because of External Force Acting
First soldered ball offsets or departs from described first kind pad, presses/electricity between the most described pressure sensor chip and described reading circuit
Conversion capability is substantially reduced, and even cannot realize pressure/electricity and convert.So that fix described pressure sensing by the first encapsulated layer
Device chip, it is intended to prevent from falling off between first kind pad and the first soldered ball, affect the service behaviour of described pressure transducer.
As further preferred embodiment, described first encapsulated layer uses flexible glue material package, and flexible glue material can be silicon
Glue.Pressure decay in flexible glue material is relatively small, it is possible to (pressure is by pressure to make vibrating diaphragm obtain pressure the most accurately
Producing, pressure loss is little, and pressure precision is higher).And ebonite material is usually stress absorbing material, pressure is in ebonite material
Decay relatively big, so using flexible glue material to be thought of as described first encapsulated layer.
Described second encapsulated layer is arranged at described reading circuit surface, is used for encapsulating described reading circuit, further, institute
State the second encapsulated layer and use ebonite material package.On the one hand in order to protect described reading circuit surface, it is to avoid because of External Force Acting
Make described reading circuit that performance fault occur, on the other hand in order to fixing described pressure sensor chip, described pressure sensing
Why can realize conversion and the transmission of the pressure/signal of telecommunication between device chip and described reading circuit, reason is described reading electricity
Second soldered ball of pass foot connects described Equations of The Second Kind pad (the second soldered ball and Equations of The Second Kind pad are conductor), once because of external force
Effect makes the Equations of The Second Kind soldered ball of leads ends of described reading circuit come off described Equations of The Second Kind pad, the most described pressure transducer core
Conversion and the transmission of the pressure/signal of telecommunication why cannot be realized between sheet and described reading circuit.So that by the second encapsulation
The fixing described reading circuit of layer, it is intended to prevent from falling off between Equations of The Second Kind pad and the second soldered ball, affect described pressure sensing
The service behaviour of device.
As further preferred embodiment, on the basis of the embodiment above, by described ebonite material to institute
Stating pressure sensor chip to be packaged processing, ebonite material can be epoxy resin.The price relative reduction of epoxy resin, reduces
The manufacturing cost of pressure transducer, on the other hand, ebonite material forms the second encapsulated layer to be intended to improve described reading circuit resistance to compression
Ability.
As further preferred embodiment, the manufacture method of above-mentioned pressure sensor chip, wherein, by described first
Soldered ball connect described first kind pad so that described pressure sensor chip is fixedly installed on described pcb board, including:
Described pressure sensor chip is inverted on described pcb board so that described first soldered ball mates the weldering of the described first kind
Dish；
Described pressure sensor chip is done stamping process so that described first soldered ball is fixing connects described first kind pad.
In the present invention, described pressure sensor chip is inverted on described pcb board so that described first soldered ball mates institute
State first kind pad；Be of value to and described pressure sensor chip done stamping process so that described first soldered ball fixing connect
Described first kind pad.
As further preferred embodiment, the manufacture method of above-mentioned pressure sensor chip, wherein, by described second
Soldered ball connect described Equations of The Second Kind pad so that described reading circuit is fixedly installed on described pcb board, including:
Described reading circuit is inverted on described pcb board so that described second soldered ball mates described Equations of The Second Kind pad；
Described pressure sensor chip is done stamping process so that described second soldered ball is fixing connects described Equations of The Second Kind pad.
In the present invention, described reading circuit is inverted on described pcb board so that described second soldered ball mates described second
Class pad；Be of value to and described reading circuit done stamping process so that described second soldered ball fixing connect the weldering of described Equations of The Second Kind
Dish.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious change,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although by above example, the present invention is carried out
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
Other Equivalent embodiments more can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (10)
1. a pressure transducer, it is characterised in that: include
One pcb board, and it is arranged at first kind pad and the Equations of The Second Kind pad in the precalculated position of described pcb board；
Also include, connecting line, be fixedly installed between described first kind pad and described Equations of The Second Kind pad, be used for so that described
One class pad electrically connects described Equations of The Second Kind pad.
Pressure transducer the most according to claim 1, it is characterised in that also include pressure sensor chip, in described pressure
The leads ends of sensor chip arranges the first soldered ball, and described first soldered ball connects described first kind pad so that described pressure passes
Sensor chip is fixedly installed on described pcb board.
Pressure sensor chip the most according to claim 1, it is characterised in that also include reading circuit, described reading electricity
The leads ends on road is provided with the second soldered ball, and described second soldered ball connects described Equations of The Second Kind pad so that described reading circuit is fixing sets
It is placed on described pcb board.
Pressure sensor chip the most according to claim 2, it is characterised in that also include the first encapsulated layer and the second encapsulation
Layer；
Described first encapsulated layer is arranged at described pressure sensor chip surface, is used for encapsulating described pressure sensor chip；
Described second encapsulated layer is arranged at described reading circuit surface, is used for encapsulating described reading circuit.
Pressure sensor chip the most according to claim 4, it is characterised in that described first encapsulated layer uses flexible glue material
Encapsulation, described second encapsulated layer uses ebonite material package.
6. the manufacture method of a pressure sensor chip, it is characterised in that including:
There is provided leads ends to be provided with the pressure sensor chip of the first soldered ball and leads ends is provided with the reading electricity of the second soldered ball
Road；
It is provided with first kind pad and Equations of The Second Kind pad in the pre-position of described pcb board and connects described first pad and institute
State the connecting line of the second pad；
Described first soldered ball is connected described first kind pad so that described pressure sensor chip is fixedly installed on described pcb board
On, described second soldered ball is connected described Equations of The Second Kind pad so that described reading circuit is fixedly installed on described pcb board simultaneously.
The manufacture method of pressure sensor chip the most according to claim 6, it is characterised in that also include,
Described pressure sensor chip is done encapsulation process to form the first encapsulated layer, described reading circuit is done at encapsulation simultaneously
Reason is to form the second encapsulated layer.
The manufacture method of pressure sensor chip the most according to claim 7, it is characterised in that described first encapsulated layer is adopted
Flexible glue material package, described second encapsulated layer is used to use ebonite material package.
The manufacture method of pressure sensor chip the most according to claim 6, it is characterised in that by described first soldered ball even
Connect described first kind pad so that described pressure sensor chip is fixedly installed on described pcb board, including:
Described pressure sensor chip is inverted on described pcb board so that described first soldered ball mates described first kind pad；
Described pressure sensor chip is done stamping process so that described first soldered ball is fixing connects described first kind pad.
The manufacture method of pressure sensor chip the most according to claim 6, it is characterised in that by described second soldered ball
Connect described Equations of The Second Kind pad so that described reading circuit is fixedly installed on described pcb board, including:
Described reading circuit is inverted on described pcb board so that described second soldered ball mates described Equations of The Second Kind pad；
Described pressure sensor chip is done stamping process so that described second soldered ball is fixing connects described Equations of The Second Kind pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610701627.9A CN106323540A (en) | 2016-08-22 | 2016-08-22 | Pressure sensor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610701627.9A CN106323540A (en) | 2016-08-22 | 2016-08-22 | Pressure sensor and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN106323540A true CN106323540A (en) | 2017-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610701627.9A Pending CN106323540A (en) | 2016-08-22 | 2016-08-22 | Pressure sensor and manufacturing method thereof |
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Cited By (4)
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| CN107255543A (en) * | 2017-07-19 | 2017-10-17 | 无锡威孚高科技集团股份有限公司 | Differential pressure pickup and preparation method |
| CN108534924A (en) * | 2017-03-03 | 2018-09-14 | 英属开曼群岛商智动全球股份有限公司 | Force sensing device |
| CN109743856A (en) * | 2018-12-29 | 2019-05-10 | 积高电子(无锡)有限公司 | A kind of packaging technology of sensor |
| CN109936685A (en) * | 2017-12-18 | 2019-06-25 | 格科微电子（上海）有限公司 | Method based on pre- focusing optimization camera module assembly |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108534924A (en) * | 2017-03-03 | 2018-09-14 | 英属开曼群岛商智动全球股份有限公司 | Force sensing device |
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| CN109936685A (en) * | 2017-12-18 | 2019-06-25 | 格科微电子（上海）有限公司 | Method based on pre- focusing optimization camera module assembly |
| CN109936685B (en) * | 2017-12-18 | 2021-02-26 | 格科微电子（上海）有限公司 | Camera module assembly optimizing method based on pre-focusing |
| CN109743856A (en) * | 2018-12-29 | 2019-05-10 | 积高电子(无锡)有限公司 | A kind of packaging technology of sensor |
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Application publication date: 20170111 |