CN206056832U - Pressure transducer - Google Patents
Pressure transducer Download PDFInfo
- Publication number
- CN206056832U CN206056832U CN201621009717.3U CN201621009717U CN206056832U CN 206056832 U CN206056832 U CN 206056832U CN 201621009717 U CN201621009717 U CN 201621009717U CN 206056832 U CN206056832 U CN 206056832U
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- CN
- China
- Prior art keywords
- pressure
- asic
- pcb
- mems
- nontransparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007789 sealing Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 238000012536 packaging technology Methods 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 101100163897 Caenorhabditis elegans asic-2 gene Proteins 0.000 description 32
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 26
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 26
- 239000000463 material Substances 0.000 description 7
- 239000008393 encapsulating agent Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 3
- 102100022094 Acid-sensing ion channel 2 Human genes 0.000 description 2
- 101710099902 Acid-sensing ion channel 2 Proteins 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000009131 signaling function Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- AGCPZMJBXSCWQY-UHFFFAOYSA-N 1,1,2,3,4-pentachlorobutane Chemical compound ClCC(Cl)C(Cl)C(Cl)Cl AGCPZMJBXSCWQY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Abstract
This utility model provides a kind of pressure transducer, including outer enclosure structure, and substrate, pressure ASIC, pressure MEMS and the nontransparent sealing medium being arranged in outer enclosure structure；Wherein, substrate is the PCB with cavity；Pressure ASIC is electrically connected with PCB by lead, and pressure MEMS is electrically connected with pressure ASIC by lead；Nontransparent sealing medium is filled in the cavity of PCB, for transmitting ambient pressure signal.Can be prevented effectively from by this utility model and the pressure MEMS and pressure ASIC in pressure transducer is caused to damage, protection effect is good and packaging cost is low, packaging technology is simple.
Description
Technical field
This utility model is related to sensor technical field, more specifically, is related to a kind of pressure transducer.
Background technology
Used as common electronics categories, which has extensively pressure transducer in fields such as various automobiles, industry, consumption
General application.However, with the fast development of electronic product, requirement of the electronic product to its internal component also more and more higher.
Based on the electronic product that MEMS (Micro Electro Mechanical Systems, MEMS) grows up, due to
Dimensional structure is small, therefore is in the industry cycle widely paid close attention to.
Include substrate (substrate generally adopt PCB), be fixed on the perforate of substrate based on the pressure transducer of MEMS technology
Shell, substrate constitute the outer enclosure structure of pressure transducer with shell.In outside encapsulating structure, pressure on substrate, is provided with
Sensor chip (usually pressure MEMS) and IC chip (usually pressure ASIC).However, externally-located encapsulation knot
Pressure sensor chip and IC chip in structure is vulnerable to ambient atmos, liquid and foreign materials away or corrosion, if can not
Pressure transducer is effectively encapsulated, when pressure media are in perishable, dirty and when having in the environment of steam, then easily
Build-up of pressure sensor reliability is poor, precision offset etc..
The existing outer enclosure structure to pressure transducer generally adopts substrate and becket bonding composition groove, then
Add fluid sealant in groove in the way of covering sensitive chip to realize encapsulation.However, this kind of packaged type exist material into
This height, poor waterproof properties, packaging technology are complicated and easily cause the problem that product size becomes big.
Utility model content
In view of the above problems, the purpose of this utility model is to provide a kind of pressure transducer, is passed with solving existing pressure
There is material cost height, poor waterproof properties, packaging technology complexity and easily cause product size change in the outer enclosure structure of sensor
Big problem.
This utility model provides a kind of pressure transducer, including outer enclosure structure, and is arranged on outer enclosure structure
Interior substrate, pressure ASIC, pressure MEMS and nontransparent sealing medium；Wherein, substrate is the PCB with cavity；Pressure ASIC leads to
Cross lead to electrically connect with PCB, pressure MEMS is electrically connected with pressure ASIC by lead；Nontransparent sealing medium is filled in PCB's
In cavity, for transmitting ambient pressure signal.
Furthermore it is preferred that structure be：Pressure ASIC is fixed on the pcb, and pressure MEMS is fixed on pressure ASIC；Its
In, pressure ASIC and PCB is by the pin being arranged on pressure ASIC and the pin being arranged on PCB electrical connection；Pressure ASIC
With pressure MEMS by the pin being arranged on pressure ASIC and the pin being arranged on pressure MEMS electrical connection.
Furthermore it is preferred that structure be：Pressure ASIC is fixed on PCB by way of bonding or welding；Pressure MEMS
Pressure ASIC is fixed on by way of bonding or welding.
Furthermore it is preferred that structure be：Pressure ASIC and pressure MEMS are each attached on PCB；Wherein, pressure ASIC and PCB
By the pin being arranged on pressure ASIC and the pin being arranged on PCB electrical connection；Pressure ASIC and pressure MEMS is by setting
Put the pin on pressure ASIC and the pin electrical connection being arranged on pressure MEMS.
Furthermore it is preferred that structure be：Pressure ASIC and pressure MEMS are fixed on PCB by way of bonding or welding
On.
Furthermore it is preferred that structure be：Nontransparent sealing medium is that the nontransparent silica gel of low modulus or low modulus are nontransparent poly-
Urethane；Pressure MEMS and pressure ASIC is used to process the ambient pressure signal transmitted by nontransparent sealing medium, obtains extraneous pressure
The pressure value of force signal, and the pressure value of ambient pressure signal is exported via PCB.
Furthermore it is preferred that structure be：Lead is the wire rod with electric conductivity.
Furthermore it is preferred that structure be：Lead is spun gold or copper wire.
It is using above-mentioned according to pressure transducer of the present utility model, non-by filling low modulus in the PCB with cavity
Bright silica gel, can be prevented effectively from and the pressure MEMS and pressure ASIC in pressure transducer is caused to damage, and protection effect is good and seals
Dress low cost, packaging technology are simple.
Description of the drawings
By reference to the explanation below in conjunction with accompanying drawing and the content of claims, and with to it is of the present utility model more
Comprehensive understanding, other purposes of the present utility model and result will be more apparent and should be readily appreciated that.In the accompanying drawings：
Fig. 1 is the cross-sectional view of the pressure transducer according to this utility model embodiment one；
Fig. 2 is the overlooking the structure diagram of the pressure transducer according to this utility model embodiment one；
Fig. 3 is the cross-sectional view of the pressure transducer according to this utility model embodiment two；
Fig. 4 is the overlooking the structure diagram of the pressure transducer according to this utility model embodiment two.
Identical label indicates similar or corresponding feature or function in all of the figs.
In figure：PCB 1, pressure ASIC 2, pressure MEMS 3, nontransparent sealing medium 4, lead 5.
Specific embodiment
Specific embodiment of the utility model is described in detail below with reference to accompanying drawing.
There is asking for poor barrier propterty, packaging cost height and packaging technology complexity for aforementioned existing pressure transducer
Topic, this utility model can be prevented effectively to pressure transducer by the nontransparent silica gel of low modulus is filled in the PCB with cavity
Interior pressure MEMS and pressure ASIC cause to damage, and the protection effect of this kind of pressure transducer is good, packaging cost is low, encapsulation work
Skill is simple.
Wherein, the pressure transducer that this utility model is provided includes outer enclosure structure and is arranged on outer enclosure knot
Substrate, pressure ASIC, pressure MEMS and the nontransparent silica gel of low modulus in structure.Wherein, substrate is the PCB with cavity；Pressure
ASIC is electrically connected with PCB by lead, and pressure MEMS is electrically connected with pressure ASIC by lead；The nontransparent silicone filler of low modulus
In the cavity of PCB.
Specifically, it is in order to describe the pressure transducer of this utility model offer in detail, following to be distinguished with two embodiments
The pressure transducer that this utility model is provided is illustrated.Wherein, Fig. 1 shows the pressure according to this utility model embodiment one
The cross-section structure of force transducer, Fig. 2 show the plan structure of the pressure transducer according to this utility model embodiment one；Fig. 3
The cross-section structure of the pressure transducer according to this utility model embodiment two is shown, Fig. 4 is shown according to this utility model reality
Apply the plan structure of the pressure transducer of example two.
Embodiment one：
As Fig. 1 and Fig. 2 jointly shown in, be provided with the outer enclosure structure of pressure transducer the PCB 1 with cavity, pressure
Power ASIC 2, pressure MEMS 3 and the nontransparent sealing medium 4 for transmitting ambient pressure signal.Wherein, pressure ASIC 2 is solid
Be scheduled on PCB 1, pin be provided with pressure ASIC 2 and PCB, by lead 5, be arranged on drawing on pressure ASIC 2
Pressure ASIC 2 and PCB 1 are electrically connected by foot and the pin being arranged on PCB 1.Pressure MEMS 3 is fixed on pressure ASIC
On 2, pin is again provided with pressure MEMS 3, by lead 5, the pin being arranged on pressure ASIC 2 and be arranged on pressure
Pressure ASIC 2 and pressure MEMS 3 are electrically connected by the pin in power MEMS 3.
It should be noted that above-mentioned pressure ASIC 2 can be fixed on PCB 1 by way of welding or bonding；
Likewise, above-mentioned MEMS3 can also be fixed on pressure ASIC 2 by way of bonding or welding.Additionally, above-mentioned draw
Line 5 is the wire rod with electric conductivity, for example, can be spun gold, copper wire or other electric wires.In addition, new to this practicality
When the pressure transducer that type is provided is packaged, first pressure ASIC 2 is fixed on PCB 1, the welding of line lead of going forward side by side,
To realize the electrical connection of pressure ASIC 2 and PCB 1, then again pressure MEMS 3 is fixed on pressure ASIC 2, and is drawn
The welding of line, to realize the electrical connection of pressure MEMS 3 and pressure ASIC 2.
Respectively pressure ASIC 2 is being electrically connected with PCB 1, after pressure MEMS 3 is electrically connected with pressure ASIC, will be non-
Bright sealing medium 4 is filled in the cavity of PCB 1.Wherein, nontransparent sealing medium 4 can be the nontransparent silica gel of low modulus,
It can be the easily stretchable and nontransparent encapsulant such as the nontransparent polyurethane of low modulus.Wherein, low modulus represent encapsulant
Characteristic with easily stretchable, easy deformation, and nontransparent encapsulant has the characteristic of noise reduction, therefore, will have simultaneously easy
The material of stretching and nontransparent characteristic reaches can the sealing property of pressure transducer as the sealing medium of pressure transducer
It is optimum.Pressure MEMS 3 and pressure ASIC 2 is used to process the ambient pressure signal transmitted by nontransparent sealing medium, obtains outer
The pressure value of boundary's pressure signal, and the pressure value of ambient pressure signal is exported by PCB 1.
Specifically, ambient pressure signal function causes nontransparent sealing medium 4 to produce shape to nontransparent sealing medium 4
Become, so that nontransparent sealing medium 4 is by ambient pressure signal transmission to pressure MEMS 3, pressure MEMS is by the ambient pressure
Signal is processed, and the signal after process is passed to pressure ASIC 2 by lead 5 is processed to obtain ambient pressure
The pressure value for obtaining is passed to PCB 1 by lead 5 by the pressure value of signal, pressure ASIC 2, exports the pressure via PCB 1
Value.
Embodiment two：
As Fig. 3 and Fig. 4 jointly shown in, be provided with the outer enclosure structure of pressure transducer the PCB 1 with cavity, pressure
Power ASIC 2, pressure MEMS 3 and nontransparent sealing medium 4.Wherein, pressure ASIC2 and pressure MEMS 3 are each attached to PCB 1
On, pin is provided with pressure ASIC 2, pressure MEMS 3 and PCB1, by lead 5, be arranged on pressure ASIC 2
Pressure ASIC 2 and PCB 1 are electrically connected by pin and the pin being arranged on PCB 1；By lead 5, it is arranged on pressure
Pressure ASIC 2 and pressure MEMS 3 are electrically connected by the pin and the pin being arranged on pressure MEMS 3 on ASIC2.
It should be noted that can be solid by above-mentioned pressure ASIC 2, pressure MEMS 3 by way of welding or bonding
It is scheduled on PCB 1.Additionally, above-mentioned lead 5 is the wire rod with electric conductivity, for example can for spun gold, copper wire or other lead
One kind in electric wire material.In addition, when being packaged to the pressure transducer that this utility model is provided, first by pressure ASIC 2
It is fixed on PCB 1, the welding of line lead of going forward side by side, to realize the electrical connection of pressure ASIC 2 and PCB 1, then again by pressure
MEMS 3 is fixed on PCB 1, then pressure MEMS 3 is electrically connected with pressure ASIC 2 by lead 5.
Respectively pressure ASIC 2 is being electrically connected with PCB 1, after pressure MEMS 3 is electrically connected with pressure ASIC 2, will be non-
Transparent sealing medium 4 is filled in the cavity of PCB 1.Wherein, nontransparent sealing medium 4 can be the nontransparent silica gel of low modulus,
It can also be the easily stretchable and nontransparent encapsulant such as the nontransparent polyurethane of low modulus.Wherein, low modulus represent sealing material
Characteristic of the material with easily stretchable, easy deformation, and nontransparent encapsulant has the characteristic of noise reduction, therefore, will have simultaneously
The material of easily stretchable and nontransparent characteristic reaches can the sealing property of pressure transducer as the sealing medium of pressure transducer
To optimum.Pressure MEMS 3 and pressure ASIC 2 is used to process the ambient pressure signal transmitted by nontransparent sealing medium, obtains
The pressure value of ambient pressure signal, and the pressure value of ambient pressure signal is exported by PCB 1.
Specifically, ambient pressure signal function causes nontransparent sealing medium 4 to produce shape to nontransparent sealing medium 4
Become, so that nontransparent sealing medium 4 is by ambient pressure signal transmission to pressure MEMS 3, pressure MEMS is by the ambient pressure
Signal is processed, and the signal after process is passed to pressure ASIC 2 by lead 5 is processed to obtain ambient pressure
The pressure value for obtaining is passed to PCB 1 by lead 5 by the pressure value of signal, pressure ASIC 2, exports the pressure via PCB 1
Value.
Described according to pressure transducer of the present utility model in an illustrative manner above with reference to accompanying drawing.But, this area
It will be appreciated by the skilled person that the pressure transducer proposed by above-mentioned this utility model, can be with new without departing from this practicality
Various improvement are made on the basis of type content.Therefore, protection domain of the present utility model should be by appending claims
Content determines.
Claims (8)
1. a kind of pressure transducer, including outer enclosure structure, and be arranged in the outer enclosure structure substrate, pressure
ASIC and pressure MEMS；Characterized in that, also including nontransparent sealing medium；Wherein,
The substrate is the PCB with cavity；
The pressure ASIC is electrically connected with the PCB by lead, and the pressure MEMS is electric with the pressure ASIC by lead
Connection；
The nontransparent sealing medium is filled in the cavity of the PCB, for transmitting ambient pressure signal.
2. pressure transducer as claimed in claim 1, it is characterised in that
The pressure ASIC is fixed on the pcb, and the pressure MEMS is fixed on the pressure ASIC；Wherein,
The pressure ASIC and PCB is by the pin that is arranged on the pressure ASIC and arranges drawing on the pcb
Foot is electrically connected；
The pressure ASIC and pressure MEMS is by the pin that is arranged on the pressure ASIC and is arranged on the pressure
Pin electrical connection on MEMS.
3. pressure transducer as claimed in claim 2, it is characterised in that
The pressure ASIC is fixed on the pcb by way of bonding or welding；
The pressure MEMS is fixed on the pressure ASIC by way of bonding or welding.
4. pressure transducer as claimed in claim 1, it is characterised in that
The pressure ASIC and the pressure MEMS are each attached on the PCB；Wherein,
The pressure ASIC and PCB is by the pin that is arranged on the pressure ASIC and arranges drawing on the pcb
Foot is electrically connected；
The pressure ASIC and pressure MEMS is by the pin that is arranged on the pressure ASIC and is arranged on the pressure
Pin electrical connection on MEMS.
5. pressure transducer as claimed in claim 4, it is characterised in that
The pressure ASIC and the pressure MEMS are fixed on the pcb by way of bonding or welding.
6. the pressure transducer as described in any one in Claims 1 to 5, it is characterised in that
The nontransparent sealing medium is the nontransparent silica gel of low modulus or the nontransparent polyurethane of low modulus；
The pressure MEMS and pressure ASIC is used to process the ambient pressure signal transmitted by the nontransparent sealing medium,
The pressure value of the ambient pressure signal is obtained, and the pressure value of the ambient pressure signal is exported via the PCB.
7. pressure transducer as claimed in claim 1, it is characterised in that
The lead is the wire rod with electric conductivity.
8. pressure transducer as claimed in claim 7, it is characterised in that
The lead is spun gold or copper wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621009717.3U CN206056832U (en) | 2016-08-31 | 2016-08-31 | Pressure transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621009717.3U CN206056832U (en) | 2016-08-31 | 2016-08-31 | Pressure transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206056832U true CN206056832U (en) | 2017-03-29 |
Family
ID=58373496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621009717.3U Active CN206056832U (en) | 2016-08-31 | 2016-08-31 | Pressure transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206056832U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111751044A (en) * | 2019-03-29 | 2020-10-09 | 霍尼韦尔国际公司 | Pressure sensor and method for producing a pressure sensor |
| CN113573220A (en) * | 2021-07-28 | 2021-10-29 | 杭州安普鲁薄膜科技有限公司 | MEMS composite part with dustproof and sound-transmitting membrane component |
-
2016
- 2016-08-31 CN CN201621009717.3U patent/CN206056832U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111751044A (en) * | 2019-03-29 | 2020-10-09 | 霍尼韦尔国际公司 | Pressure sensor and method for producing a pressure sensor |
| US11860055B2 (en) | 2019-03-29 | 2024-01-02 | Honeywell International Inc. | Pressure sensors having a hermatically sealed component compartment with a pressure housing and the method of manufacturing thereof |
| CN113573220A (en) * | 2021-07-28 | 2021-10-29 | 杭州安普鲁薄膜科技有限公司 | MEMS composite part with dustproof and sound-transmitting membrane component |
| CN113573220B (en) * | 2021-07-28 | 2023-01-03 | 杭州安普鲁薄膜科技有限公司 | MEMS composite part with dustproof and sound-transmitting membrane component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200611 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right |