CN207046862U

CN207046862U - A kind of environmental sensor

Info

Publication number: CN207046862U
Application number: CN201720781397.1U
Authority: CN
Inventors: 端木鲁玉
Original assignee: Goertek Techology Co Ltd
Current assignee: Goertek Microelectronics Inc
Priority date: 2017-06-30
Filing date: 2017-06-30
Publication date: 2018-02-27
Anticipated expiration: 2027-06-30

Abstract

The utility model discloses a kind of environmental sensor, including substrate, shell and the sealing space being made up of the substrate and shell, the first MEMS chip, the first asic chip, the second MEMS chip, the second asic chip are provided with the sealing space, first MEMS chip and the second asic chip are fixed on the substrate, sealing platform is additionally provided with the sealing space, second asic chip is arranged at the sealing platform interior, and first asic chip and the second MEMS chip are fixed with the sealing platform.The encapsulating structure of environmental sensor of the present utility model, it is possible to reduce influence of the extraneous stress to chip, while effectively reduce size sensor.

Description

A kind of environmental sensor

Technical field

It the utility model is related to sensor technical field, more particularly to a kind of combination environmental sensor.

Background technology

In recent years, with the development of science and technology, the miniaturization of the device such as sensor is increasingly taken seriously.Environment passes Sensor, including microphone sensor, temperature sensor, humidity sensor, pressure sensor, are normally used in electronic product, The sizes of these sensors largely overall size of left and right product.

As shown in figure 1, combined environmental sensor often includes the closing space being made up of substrate 15 and shell 16, envelope at present Closing includes MEMS (Micro-Electro-Mechanical System, Micro Electro Mechanical System) chip 11, ASIC in space (Application Specific Integrated Circuit, application specific integrated circuit) chip 12, MEMS chip 13 and ASIC Chip 14, four chips are fixed in side by side on substrate 15, and MEMS chip 11 is connected with asic chip 12 using gold thread, MEMS chip 13 are connected with asic chip 14 by gold thread.It is such a design by multiple MEMS chips it is exposed in the environment, be advantageous to signal and pick up Take, but inconvenient product small size designs, and when the smaller or substrate of MEMS chip height is relatively thin, MEMS chip, which is subjected to, to be come from Encapsulation or the larger stress in the external world, have influence on properties of product.

Utility model content

For existing issue, technical problem to be solved in the utility model is：A kind of environmental sensor is provided, uses this Environmental sensor, it can effectively reduce stress suffered by chip and size sensor.

In order to solve the above technical problems, the technical solution of the utility model is：

A kind of environmental sensor, including substrate, shell and the sealing space being made up of the substrate and shell, described close Seal in space and be provided with the first MEMS chip, the first asic chip, the second MEMS chip, the second asic chip, described first MEMS chip and the second asic chip are fixed on the substrate, are additionally provided with sealing platform in the sealing space, and described second Asic chip is arranged at the sealing platform interior, and the sealing platform is fixed with the first ASIC away from the substrate side Chip and the second MEMS chip.

Preferred embodiment is that the sealing platform is formed by colloid and base plate seals.

Preferred embodiment is that the colloid modulus of elasticity is less than 10MPa.

Preferred embodiment is that first MEMS chip is connected with the first asic chip by gold thread, the 2nd MEMS cores Piece and the second asic chip are connected by gold thread with substrate respectively.

Preferred embodiment is that first MEMS chip is connected by gold thread with substrate respectively with the second asic chip, described Second MEMS chip and the first asic chip are connected by gold thread.

Preferred embodiment is that the second asic chip output end is by planting tin ball bonding in the circuit board.

Preferred embodiment is that the second MEMS chip thickness is 0.1mm-0.35mm.

Due to encapsulating structure of the present utility model, asic chip is fixed in the platform by colloid sealing, in fluid sealant Other chips are set on platform.By the design of closed glue platform, one side available buffer chip disposed thereon from encapsulation and Outside stress, improve the stability of product；On the other hand reduce encapsulated space necessary to product, effectively reduce product Size.

Brief description of the drawings

Fig. 1 is conventional environment sensor-packaging structure schematic diagram；

Fig. 2 is the environmental sensor encapsulating structure schematic diagram of the utility model embodiment one；

Fig. 3 is the environmental sensor encapsulating structure schematic diagram of the utility model embodiment two；

Embodiment

In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining The utility model, it is not used to limit the utility model.

Larger for existing environmental sensor package dimension and internal MEMS chip is easily influenceed by extraneous stress, this practicality New environmental sensor is fixed on sealing by the way that part asic chip is fixed on into sealing platform interior, by remainder chip On platform, such structure takes full advantage of sensor internal longitudinal space so that the package dimension of sensor reduces, simultaneously Influence of the extraneous stress to chip will also decrease.

Embodiment one：

As shown in Fig. 2 environmental sensor of the present utility model includes substrate 25, shell 26 and by the substrate and shell structure Into sealing space 28, MEMS chip 21 and asic chip 22, MEMS chip 23 and ASIC cores are provided with sealing space 28 Piece 24, MEMS chip 21 and asic chip 24 are fixed on substrate 25, and sealing space 28 also includes sealing platform 27, asic chip 24 are fixed on inside sealing platform 27, and asic chip 22 and MEMS chip 23 are fixed on sealing platform 27.Due to asic chip 22 and MEMS chip 23 be not directly fixed on substrate 25 so that influence of the extraneous stress to the two is smaller, improves biography The stability of sensor；Asic chip 24 is fixed on inside sealing platform 27 so that encapsulation longitudinal space is fully used, from And reduce the size of whole sensor.Platform 27 is sealed in the present embodiment to be formed by colloid and base plate seals.MEMS chip 21 Connected with asic chip 22 by gold thread, MEMS chip 23 and asic chip 24 are connected by gold thread and substrate 25 respectively.

Embodiment two：

The present embodiment is essentially identical with above-described embodiment.In the present embodiment, environmental sensor include substrate 35, shell 36 and The sealing space 38 being made up of the substrate and shell, is provided with MEMS chip 31 and asic chip 32 in sealing space 38, MEMS chip 33 and asic chip 34, MEMS chip 31 and asic chip 34 are fixed on substrate 35, and sealing space 38 also includes Platform 37 is sealed, asic chip 34 is fixed on inside sealing platform 37, and asic chip 32 and MEMS chip 33 are fixed on to seal and put down On platform 37.The asic chip unlike embodiment one is reverse mounted, and its output end is welded in the circuit board by planting tin ball 39. The structure of asic chip upside-down mounting make it that the package dimension of asic chip is smaller, so that whole sensor is smaller.

Preferred embodiment of the present utility model described above, it is all in this practicality not to limit the utility model Any modification made within new spirit and principle, should be included within the scope of protection of the utility model.

Claims

1. a kind of environmental sensor, including substrate, shell and the sealing space being made up of the substrate and shell, in the sealing The first MEMS chip, the first asic chip, the second MEMS chip, the second asic chip, the first MEMS are provided with space Chip and the second asic chip are fixed on the substrate, and sealing platform, the 2nd ASIC are additionally provided with the sealing space Chip is arranged at the sealing platform interior, and the sealing platform is fixed with first asic chip away from the substrate side With the second MEMS chip.

2. a kind of environmental sensor according to claim 1, it is characterised in that the sealing platform is close with substrate by colloid Envelope is formed.

3. a kind of environmental sensor according to claim 2, it is characterised in that the colloid modulus of elasticity is less than 10MPa.

4. a kind of environmental sensor according to claim 1, it is characterised in that first MEMS chip and the first ASIC Chip is connected by gold thread, and second MEMS chip and the second asic chip are connected by gold thread with substrate respectively.

5. a kind of environmental sensor according to claim 1, it is characterised in that first MEMS chip and the 2nd ASIC Chip is connected by gold thread with substrate respectively, and second MEMS chip and the first asic chip are connected by gold thread.

6. a kind of environmental sensor according to claim 1, it is characterised in that the second asic chip output end passes through Plant tin ball bonding in the circuit board.

7. a kind of environmental sensor according to claim 1, it is characterised in that the second MEMS chip thickness is 0.1mm-0.35mm。