CN106477512B - Pressure sensor and its packaging method - Google Patents
Pressure sensor and its packaging method Download PDFInfo
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- CN106477512B CN106477512B CN201611047735.5A CN201611047735A CN106477512B CN 106477512 B CN106477512 B CN 106477512B CN 201611047735 A CN201611047735 A CN 201611047735A CN 106477512 B CN106477512 B CN 106477512B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The present invention provides a kind of pressure sensor and its packaging methods, the pressure sensor includes the substrate and pressure sensor chip being stacked, the cavity and the sensitive membrane that is equipped with the cavity that the pressure sensor chip includes substrate, is formed in the substrate away from substrate side, the cavity is in flat, the first pad that the substrate is equipped with；The substrate is equipped with the second pad for being electrically connected to the first pad；The pressure sensor further includes along the periphery of the sensitive membrane the first box dam being arranged, the pressure-containing member that is set on substrate and is abutted against without departing from the hard sealant of first box dam and above the sensitive membrane and with first box dam, wherein, the first pad is located at the outside of the first box dam.Using pressure sensor of the present invention and its packaging method, sensitive membrane is avoided directly to bear extraneous stress, reduces damaged probability, while preferably protection is realized by hard sealant, prolong the service life.
Description
Technical field
The present invention relates to technical field of microelectronic mechanical systems more particularly to a kind of pressure sensor and its packaging methods.
Background technology
At this stage, various consumer electronics products such as mobile phone, tablet computer, toy, remote controler etc. increasingly focus on intelligence
Change development and Human-computer Interactive Design, also so that sensing the market demand of the human body especially pressure sensor of finger equal contact stress also
It is increasing.Meanwhile higher performance requirement also is proposed to such pressure sensor, it is necessary first to effectively pass extraneous stress
The sensitive membrane of pressure sensor chip is passed, the various pieces such as sensitive membrane, the lead on chip secondly also to be protected not to be damaged,
It is finally to meet the trend that portable consumer electronics product increasingly minimizes, it is also necessary to keep the same of pressure sensor performance
When, effectively control its overall package size.
Pressure sensor chip based on above-mentioned sensitive membrane when measuring contact stress for having following problems：First, sensitive
Film thickness is smaller, be usually arranged as it is tens microns even thinner, directly measure human contact's pressure that especially finger is bestowed when, should
Active force is directly delivered in sensitive membrane, be easy to cause sensitive membrane damage.Second is that pressure sensor chip needs lead when encapsulating
Realize electrical connection, and lead setting would generally exceed sensitive membrane, in the case of protection improperly, it is easy to damage lead.Currently,
Film is isolated though having proposed in the industry, and by encapsulate by extraneous stress indirectly-acting sensitive membrane technical solution.
If Chinese patent CN101337652 A disclose a kind of pressure sensor packaging structure, by being arranged in the soft of sensitizing range surface
Property material transmit extraneous stress, and protect pad and lead by stiff materials, but flexible material setting is in sensitive film surface, it is quick
Film is felt larger with the outer circumferential stress of flexible material faying face, it is difficult to sensitive membrane be effectively prevent not to be damaged；And its technique compared with
For complexity, volume is larger.
In consideration of it, it is necessary to provide a kind of new pressure sensors and its packaging method.
Invention content
The purpose of the present invention is to provide a kind of pressure sensors, and sensitive membrane can be avoided directly to bear extraneous stress, drop
Low damage probability, moreover it is possible to obtain better barrier propterty, prolong the service life.
For achieving the above object, the present invention provides a kind of pressure sensors, including the substrate and pressure being stacked
Sensor chip, the pressure sensor chip includes substrate, be formed in the substrate away from substrate side cavity and
The sensitive membrane being equipped with the cavity, the cavity be in flat, the first pad that the substrate is equipped with, described first
Pad is connected with the first lead；The substrate is equipped with the second pad for being electrically connected to the first pad；The pressure sensor
Further include along the sensitive membrane periphery be arranged the first box dam, be set on substrate and without departing from the hard of first box dam
Sealant and the pressure-containing member abutted against above the sensitive membrane and with first box dam, wherein the first pad position
In the outside of the first box dam；The pressure-containing member includes pressing on the smooth hard ball in the surface in the sensitive membrane, will be outer
Portion's stress is uniformly applied in the sensitive membrane, and the pressure sensor further includes second be formed on the hard sealant
Box dam, second box dam form internal diameter host cavity compatible with the hard ball.
As a further improvement on the present invention, the pressure sensor further includes being set to the substrate and pressure sensor
IC chip between chip, the IC chip have front, the back side and are set to positive third pad, institute
It states third pad and is electrically connected to the first pad and the second pad.
As a further improvement on the present invention, the pressure sensor chip is being attached to the IC chip just
Face, the third pad are set to the outside of pressure sensor chip, and first lead is electrically connected first pad and the
Three pads；The pressure sensor further includes the second lead for being electrically connected second pad and third pad.
As a further improvement on the present invention, the pressure sensor chip is attached to the back of the body of the IC chip
Face, the third pad are set as metal soldered ball salient point, the metal soldered ball salient point be soldered to the substrate and with the second pad
Electrical connection, first lead are electrically connected first pad and the second pad.
As a further improvement on the present invention, the height of first box dam is beyond first pad and the first lead
Highly, so that the first pad and the first lead are embedded in completely in hard sealant.
As a further improvement on the present invention, the pressure-containing member further include be covered on first box dam it is soft every
Absciss layer, the hard ball are pressed on the surface on the soft separation layer and positioned at sensitive membrane, and the hard ball is higher than second
The height of box dam and second box dam exceeds the half of the hard ball.
As a further improvement on the present invention, the pressure sensor further include cover on the second box dam to prevent hard
The cover board that ball is fallen, the cover board form the through-hole that an aperture is less than the hard bulb diameter, and the hard ball is from the through-hole
Projection is beyond plane where the cover board.
The present invention also provides a kind of packaging method of above-mentioned pressure sensor, the packaging method includes mainly：
Pressure sensor chip is provided, with substrate, be formed in substrate surface and in flat cavity and with the chamber
The sensitive membrane that body is equipped with；
Make the first pad positioned at substrate surface；
The first box dam is made along the periphery of the sensitive membrane so that the first pad is located at the outside of the first box dam；
First lead is provided, one end of the first lead is electrically connected to by the first pad using lead key closing process；
Substrate is provided, the substrate has the second pad towards the side of pressure sensor chip, by the pressure sensing
Device chip is attached on substrate on one side away from sensitive membrane, and the first pad is electrically connected with the second pad；
Pressure-containing member is provided and is covered in the top of the first box dam, the pressure-containing member includes pressing on the sensitivity
The smooth hard ball in surface on film, and the second box dam is made on the hard sealant, second box dam is formed in one
Diameter host cavity compatible with the hard ball；
The cladding pressure sensor chip is made by Shooting Technique and without departing from the hard sealant of the first box dam, institute
It states hard sealant and wraps up the first pad, the second pad and the first lead.
As a further improvement on the present invention, IC chip is provided, and is stacked in the substrate and pressure
Between sensor chip, the IC chip has front, the back side and is set to positive third pad；
When the pressure sensor chip is attached to the front of IC chip, by the other end of first lead
It is electrically connected to third pad, and the second lead is provided, realization second pad is electrically connected with third pad；
When the pressure sensor chip is attached to the back side of IC chip, by the other end of first lead
It is electrically connected to the second pad, and by third pad solder to the substrate so that the third pad is electrically connected with the second pad.
The beneficial effects of the invention are as follows：Using pressure sensor of the present invention and packaging method, along the periphery of the sensitive membrane
The first box dam is made, overflow to sensitive membrane in hard sealant forming process is effectively avoided to influence its performance；And pass through pressure-bearing portion
Part avoids sensitive membrane from directly bearing extraneous stress, and sensitive membrane is protected not impacted directly by extraneous stress, and first box dam is also used
With pressure-containing member described in carrying or clamping, so that extraneous stress is equably transferred in sensitive membrane by pressure-containing member, more effectively
Protect sensitive membrane without damage；The hard sealant then enhances the integral protection performance of pressure sensor, extends pressure sensing
The service life of device.
Description of the drawings
Fig. 1 is the planar structure schematic diagram of one better embodiment of pressure sensor of the present invention；
Fig. 2 is the structural schematic diagram of the pressure sensor chip of pressure sensor of the present invention；
Fig. 3 is the structural schematic diagram that pressure sensor chip makes after the first pad and the first box dam in Fig. 2；
Fig. 4 is the vertical view that Fig. 3 makes the pressure sensor chip for having the first box dam；
Fig. 5 is the vertical view that Fig. 3 makes the pressure sensor chip for having another first box dam；
Fig. 6 is the planar structure schematic diagram of the second better embodiment of pressure sensor of the present invention；
Fig. 7 is the planar structure schematic diagram of pressure sensor third better embodiment of the present invention；
Fig. 8 is to add the structural schematic diagram after a cover board in Fig. 7 on the hard ball of pressure sensor；
Fig. 9 is the planar structure schematic diagram of the 4th better embodiment of pressure sensor of the present invention；
Figure 10 is the planar structure schematic diagram of the 5th better embodiment of pressure sensor of the present invention；
Figure 11 is to add the structural schematic diagram after a cover board in Figure 10 on the hard ball of pressure sensor；
Figure 12 is the planar structure schematic diagram of the 6th better embodiment of pressure sensor of the present invention.
Specific implementation mode
Below with reference to embodiment shown in the drawings, the present invention will be described in detail.But the embodiment is not intended to limit
The present invention, structure that those skilled in the art are made according to the embodiment, method or transformation functionally are wrapped
Containing within the scope of the present invention.
It show 100 1 better embodiment of pressure sensor of the present invention referring to figs. 1 to Fig. 5.Pressure provided by the invention
Sensor 100 includes the pressure sensor chip 10 being stacked and substrate 20, and the pressure sensor chip 10 includes substrate
11,11 bottoms of the lining are formed in away from the cavity 12 of 20 side of substrate and the sensitive membrane 13 being equipped with the cavity 12.
The cavity 12 is in flat；The first pad 14 that the substrate 11 is equipped with.
Preferably, first pad 14 is made by using techniques such as deposit, photoetching, reactive ion etchings,
And first pad 14 and the surfacial pattern of pressure sensor chip 10 pass through polysilicon or heavy doping carrier line, institute
The heavy doping carrier stated can be dense boron.The substrate 20 can be that PCB or resin add lead frame to form.
The substrate 20 is equipped with the second pad 21 for being electrically connected to the first pad 14.The pressure sensor 100 further includes
The IC chip 30 being set between the substrate 20 and pressure sensor chip 10, the IC chip 30 have
Front 31, the back side 32 and the third pad 33 for being set to front 31, the third pad 33 are electrically connected to the first pad 14 and the
Two pads 21.
The substrate 11 is additionally provided with the first box dam 15 along the periphery of the sensitive membrane 13, wherein first pad 14
Positioned at the outside of the first box dam 15.The pressure sensor 100 further includes being set on substrate 20 and being enclosed without departing from described first
The hard sealant 40 on dam 15 and the pressure-bearing portion abutted against above the sensitive membrane 13 and with first box dam 15
Part.Wherein, the hard sealant 40 is set as hard resin.
In the present embodiment, silica gel is all made of between the pressure sensor chip 10, IC chip 30 and substrate 20
It is bonded.First pad 14 is connected with the first lead 51, and the pressure sensor chip 10 is attached to the collection
At the front 31 of circuit chip 30, the third pad 33 is set to the outside of pressure sensor chip 10, first lead
It is electrically connected first pad 14 and third pad 33；The pressure sensor 100 further includes being electrically connected second pad 21
With the second lead 52 of third pad 33.First lead, 51 and second lead is metal wire and is divided using lead key closing process
It is not connected to the first pad 14, the second pad 21 and third pad 33.
The height of first box dam 15 exceeds the height of first pad, 14 and first lead 51, so that the first weldering
Disk 14 and the first lead 15 are embedded in completely in hard sealant 40.Also, the hard sealant 40 also wraps up the second pad
21, third pad 33 and the second lead 52.Thereby, by hard sealant 40 to the circuit of pressure sensor 100 connection and whole
Body constructs to form preferable protection.
The pressure-containing member includes the soft separation layer 60 being covered on first box dam 15, the soft separation layer 60
A closed cavity 16 is formed with the sensitive membrane 13 of lower section and the first box dam 15.Pellosil can be used in the soft separation layer 60, when
It is deformed upon when above-mentioned pellosil pressure-bearing so that volume change occurs for the closed cavity 16, so that the sensitive membrane 13
Corresponding deformation is generated, to sense extraneous stress.Further, to ensure the air-tightness of closed cavity 16, the hard sealant
40 are set as the upper limb flush of first box dam 15, and the extension of soft separation layer 60 is covered in entire hard sealant 40
Top.
As shown in fig. 6, in the second better embodiment of the present invention, the pressure sensor chip 10 is attached to the collection
At the back side 32 of circuit chip 30, the third pad 33 is set as metal soldered ball salient point, and the metal soldered ball salient point is soldered to
The substrate 20 is simultaneously electrically connected with the second pad 21, and first lead 51 is electrically connected first pad, 14 and second pad
21.The dimensions of the IC chip 30 can further be reduced, and then reduce entire encapsulation volume, reduce cost.
Referring to Fig. 7 to Fig. 8, as the third better embodiment of the present invention, the pressure-containing member is described including pressing on
The smooth hard ball 70 in surface in sensitive membrane 13, external stress is uniformly applied in the sensitive membrane 13.The pressure
Sensor 100 further includes the second box dam 80 being formed on the hard sealant 40, and second box dam 80 forms an internal diameter
Host cavity 81 compatible with the hard ball 70, the hard ball 70 is higher than the second box dam 80 and the height of second box dam 80
Half of the degree beyond the hard ball 70.Second box dam 80 is made by hard material, with to hard ball 70 in the horizontal direction
Effective position-limiting action is played, hard resin or other organic polymers can be specifically selected, particularly, second box dam 80
Same hard material can be selected with hard sealant 40.Hard ball 70 experiences external pressure and transfers the pressure to sensitive membrane 13
On, generate corresponding signal.Pressure is transmitted using the hard ball 70, can effectively carry out stress transfer, obtains and more stablizes
Output signal.
It is also abutted against with the first box dam 15 while the hard ball 70 is pressed in sensitive membrane 13.First box dam 15
Flexible material can be used to be made, hard ball 70 is moved downward by external pressure while compress sensitive membrane 13, first box dam
15 bear partial pressure to generate corresponding elastic deformation, and it is impaired by ABNORMAL STRESS impact to further avoid sensitive membrane 13.
The pressure sensor 100 further includes covering in the cover board 90 to prevent hard ball 70 from falling on the second box dam 80.
The cover board 90 forms the through-hole 91 that an aperture is less than 70 diameter of the hard ball, and the hard ball 70 is from 91 projection of the through-hole
Beyond 90 place plane of the cover board.
It is the 4th better embodiment of the invention referring to Fig. 9, the pressure-containing member includes being covered in first box dam 15
On soft separation layer 60 and be pressed on the soft separation layer 60 and positioned at the hard ball 70 of the surface of sensitive membrane 13.Institute
It further includes the second box dam 80 for accommodating the hard ball 70 to state pressure sensor 100, and the hard ball 70 is enclosed higher than second
The height of dam 80 and second box dam 80 exceeds the half of the hard ball 70.The top of second box dam 80 be also equipped with to
Stop the cover board 90 that the hard ball 70 is fallen extremely.
Referring to Figure 10 to Figure 11, as the 5th better embodiment of the present invention, with aforementioned third better embodiment
Difference lies in the back sides 32 that the pressure sensor chip 10 is attached to the IC chip 30.It is as shown in figure 12 this
The 6th better embodiment is invented, is also that the pressure sensor chip 10 is attached with the difference of aforementioned 4th better embodiment
It at the back side of the IC chip 30 32.
The present invention also provides a kind of packaging methods of above-mentioned pressure sensor 100, include mainly：
Pressure sensor chip 10 is provided, with substrate 11, be formed in 11 surface of substrate and in flat cavity 12 and
The sensitive membrane 13 being equipped with the cavity 12；
Make the first pad 14 positioned at 11 surface of substrate；
The first box dam 15 is made along the periphery of the sensitive membrane 13 so that the first pad 14 is located at the outer of the first box dam 15
Side；
First lead 51 is provided, one end of the first lead 51 is electrically connected to by the first pad 14 using lead key closing process；
Substrate 20 is provided, the substrate 20 has the second pad 21 towards the side of pressure sensor chip 10, will be described
Pressure sensor chip 10 is attached to away from sensitive membrane 13 on substrate 20 on one side, and makes the first pad 14 and the second pad 21
Electrical connection；
Pressure-containing member is provided and is covered in the top of the first box dam 15；
The cladding pressure sensor chip 10 is made by Shooting Technique and is sealed without departing from the hard of the first box dam 15
Layer 40, the hard sealant 40 wrap up the first pad 14, the second pad 21 and the first lead 51.
In the present embodiment, the packaging method further includes providing IC chip 30, and be stacked in institute
It states between substrate 20 and pressure sensor chip 10, the IC chip 30 has front 31, the back side 32 and is set to just
The third pad 33 in face 31；
When the pressure sensor chip 10 is attached to the front 31 of IC chip 30, by first lead 51
The other end be electrically connected to third pad 33, and provide the second lead 52, realize second pad 21 and third pad 33
Electrical connection；
When the pressure sensor chip 10 is attached to the back side 32 of IC chip 30, by first lead 51
The other end be electrically connected to the second pad 21, and third pad 33 is soldered to the substrate 20, and make the third pad
33 are electrically connected with the second pad 21, wherein third pad 33 is set as metal soldered ball salient point.
In conclusion pressure sensor 100 of the present invention and packaging method are used, along the periphery of the sensitive membrane 13 making the
One box dam 15 effectively avoids overflow to sensitive membrane 13 in 40 injection molding process of hard sealant from influencing its performance；And by holding
Splenium part avoids sensitive membrane 13 from directly bearing extraneous stress, and sensitive membrane 13 is protected not impacted directly by extraneous stress, and described first
Box dam 15 also to carry or clamping described in pressure-containing member so that extraneous stress is equably transferred to sensitive membrane by pressure-containing member
On, it is more effective to protect sensitive membrane without damage；The hard sealant 40 then enhances the integral protection of pressure sensor 100
Can, extend the service life of pressure sensor 100.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book
With the other embodiment of understanding.
The series of detailed descriptions listed above only for the present invention feasible embodiment specifically
Bright, they are all without departing from equivalent implementations made by technical spirit of the present invention not to limit the scope of the invention
Or change should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of pressure sensor, including the substrate and pressure sensor chip that are stacked, it is characterised in that：The pressure passes
The cavity and the sensitivity that is equipped with the cavity that sensor chip includes substrate, is formed in the substrate away from substrate side
Film, the cavity are in flat, and the first pad that the substrate is equipped with, first pad is connected with the first lead；
The substrate is equipped with the second pad for being electrically connected to the first pad；The pressure sensor further includes along the periphery of the sensitive membrane
The first box dam for being arranged is set on substrate and without departing from the hard sealant of first box dam and is located at the sensitivity
The pressure-containing member abutted against above film and with the first box dam, wherein the first pad is located at the outside of the first box dam；The pressure-bearing portion
Part includes pressing on the smooth hard ball in the surface in the sensitive membrane, and external stress is uniformly applied to the sensitive membrane
On, the pressure sensor further includes the second box dam being formed on the hard sealant, and second box dam is formed in one
Diameter host cavity compatible with the hard ball.
2. pressure sensor according to claim 1, it is characterised in that：The pressure sensor further include be set to it is described
IC chip between substrate and pressure sensor chip, the IC chip have front, the back side and are set to
Positive third pad, the third pad are electrically connected to the first pad and the second pad.
3. pressure sensor according to claim 2, it is characterised in that：The pressure sensor chip is attached to the collection
At the front of circuit chip, the third pad is set to the outside of pressure sensor chip, and first lead is electrically connected institute
State the first pad and third pad；The pressure sensor further includes that electrical connection second pad draws with the second of third pad
Line.
4. pressure sensor according to claim 2, it is characterised in that：The pressure sensor chip is attached to the collection
At the back side of circuit chip, the third pad is set as metal soldered ball salient point, and the metal soldered ball salient point is soldered to the base
Plate is simultaneously electrically connected with the second pad, and first lead is electrically connected first pad and the second pad.
5. pressure sensor according to claim 1, it is characterised in that：The height of first box dam exceeds described first
The height of pad and the first lead, so that the first pad and the first lead are embedded in completely in hard sealant.
6. pressure sensor according to claim 1, it is characterised in that：The pressure-containing member further includes being covered in described
Soft separation layer on one box dam, the hard ball are pressed on the surface on the soft separation layer and positioned at sensitive membrane, institute
State the half that hard ball exceeds the hard ball higher than the height of the second box dam and second box dam.
7. pressure sensor according to claim 1 or 6, it is characterised in that：The pressure sensor further include cover in
Cover board on second box dam to prevent hard ball from falling, the cover board form the through-hole that an aperture is less than the hard bulb diameter,
The hard ball is from the through-hole projection beyond plane where the cover board.
8. a kind of packaging method of such as claim 1-7 any one of them pressure sensors, which is characterized in that the encapsulation side
Method includes mainly：
Pressure sensor chip is provided, there is substrate, be formed in substrate surface and in flat cavity and matching with the cavity
Close the sensitive membrane of setting；
Make the first pad positioned at substrate surface；
The first box dam is made along the periphery of the sensitive membrane so that the first pad is located at the outside of the first box dam；
First lead is provided, one end of the first lead is electrically connected to by the first pad using lead key closing process；
Substrate is provided, the substrate has the second pad towards the side of pressure sensor chip, by the pressure sensor core
Piece is attached on substrate on one side away from sensitive membrane, and the first pad is electrically connected with the second pad；
Pressure-containing member is provided and is covered in the top of the first box dam, the pressure-containing member includes pressing in the sensitive membrane
The smooth hard ball in surface, and the second box dam is made on the hard sealant, second box dam formed an internal diameter with
The compatible host cavity of the hard ball；
It is described hard by the Shooting Technique obtained cladding pressure sensor chip and without departing from the hard sealant of the first box dam
Matter sealant wraps up the first pad, the second pad and the first lead.
9. packaging method according to claim 8, it is characterised in that：IC chip is provided, and is stacked
Between the substrate and pressure sensor chip, the IC chip has front, the back side and is set to positive the
Three pads；
When the pressure sensor chip is attached to the front of IC chip, the other end of first lead is electrically connected
It is connected to third pad, and the second lead is provided, realization second pad is electrically connected with third pad；
When the pressure sensor chip is attached to the back side of IC chip, the other end of first lead is electrically connected
It is connected to the second pad, and by third pad solder to the substrate so that the third pad is electrically connected with the second pad.
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| CN107892268B (en) * | 2017-11-13 | 2023-07-14 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor and method for manufacturing the same |
| CN108645548B (en) * | 2018-05-10 | 2022-04-01 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure, forming method thereof and touch device |
| CN110650604A (en) * | 2019-09-16 | 2020-01-03 | 上海交通大学 | Packaging structure and packaging method of miniature pressure sensor |
| CN110697648B (en) * | 2019-10-16 | 2022-03-04 | 中电国基南方集团有限公司 | Technological method for realizing microwave port of MEMS (micro-electromechanical system) laminated device |
| CN111115553B (en) * | 2019-12-25 | 2023-04-14 | 北京遥测技术研究所 | Double-cavity metal packaging shell based on energy storage welding mode and packaging method |
| CN114054330B (en) * | 2021-11-16 | 2022-09-16 | 中国科学院苏州纳米技术与纳米仿生研究所 | Piezoelectric micromechanical ultrasonic transducer packaging structure |
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