CN113573220A - MEMS composite part with dustproof and sound-transmitting membrane component - Google Patents
MEMS composite part with dustproof and sound-transmitting membrane component Download PDFInfo
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- CN113573220A CN113573220A CN202110855161.9A CN202110855161A CN113573220A CN 113573220 A CN113573220 A CN 113573220A CN 202110855161 A CN202110855161 A CN 202110855161A CN 113573220 A CN113573220 A CN 113573220A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Abstract
The invention provides an MEMS composite part with a dustproof sound-transmitting membrane component, which comprises an MEMS-PCB and the dustproof sound-transmitting membrane component, wherein the dustproof sound-transmitting membrane component comprises a dustproof sound-transmitting membrane which plays a role in preventing dust and transmitting sound; the MEMS-PCB is provided with a plurality of grooves for placing the dustproof sound-transmitting membrane component, the width of each groove is larger than the outer diameter of the dustproof sound-transmitting membrane component, and the depth of each groove is 0.02-1mm larger than the thickness of the dustproof sound-transmitting membrane component; a spacer area for filling fixing glue is arranged in the groove, and the width of the spacer area is 0.05-0.4 mm; the viscosity of the fixing glue is 300cPs-5000cPs at 25 ℃; the bonding strength of the solidified fixing glue is 0.1MPa-30 MPa; the fixing glue used for bonding the dustproof sound-transmitting membrane component and the MEMS-PCB in the composite part has high fluidity, the whole glue dispensing area can be filled in a short time, the solidified fixing glue has good bonding strength, the dustproof sound-transmitting membrane component and the MEMS-PCB are bonded tightly, and the dustproof sound-transmitting membrane component and the MEMS-PCB are not easy to separate for a long time, so that the long-time normal work of electronic equipment is guaranteed.
Description
Technical Field
The invention relates to the technical field of dispensing and membrane materials, in particular to an MEMS composite part with a dustproof and sound-transmitting membrane component.
Background
With the progress of society, people have higher and higher requirements on electronic products such as mobile phones, notebook computers and the like, and the electronic products are expected to have higher and higher performance, meet various working requirements of people, have smaller and smaller volumes and are convenient for people to carry; the size of the electronic components associated therewith also needs to be reduced, while the performance and consistency needs to be improved.
In the background, MEMS, a kind of electronic component, is receiving attention, and MEMS is a micro-electromechanical system, also called a micro-electro-mechanical system, which refers to a high-tech device with a size of several millimeters or even smaller, and its internal structure is generally in the micrometer or even nanometer scale, and is an independent intelligent system. The device mainly comprises a sensor, an actuator and a micro-energy source. The micro electro mechanical system relates to various subjects and engineering technologies such as physics, semiconductor, optics, bioengineering and the like, and develops wide application for the fields of intelligent systems, consumer electronics, intelligent home furnishing and the like.
In order to meet the requirements of dust prevention, sound transmission and the like, corresponding dust-proof sound transmission membrane components are generally adhered to an MEMS-PCB (micro electro mechanical system-printed circuit board), at present, the most common method is to install and fix the dust-proof sound transmission membrane components on the MEMS-PCB through a glue dispensing device and a glue dispensing process, for example, a glue dispensing device and a glue dispensing method of Chinese patent with application number 201510247512.2 are improved through the glue dispensing device, so that the bonding effect between the dust-proof sound transmission membrane components and the MEMS-PCB is improved; however, in the actual use process, it is found that the adhesive is often only present in a part of the dispensing area due to the small width of the dispensing area, and the whole dispensing area cannot be filled, so that the bonding strength between the dustproof and sound-transmitting membrane assembly and the MEMS-PCB is still weak, the dustproof and sound-transmitting membrane assembly and the MEMS-PCB are easily separated within a short time, and the development of the MEMS is limited to a certain extent.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide an MEMS composite part with a dustproof sound-transmitting membrane component, wherein the fixing glue used for bonding the dustproof sound-transmitting membrane component and an MEMS-PCB board in the composite part has higher fluidity, the whole glue dispensing area can be filled in a short time, the solidified fixing glue has good bonding strength, and the dustproof sound-transmitting membrane component and the MEMS-PCB board are bonded very tightly and are not easy to separate for a long time.
In order to achieve the purpose, the invention provides the following technical scheme: an MEMS composite part with a dustproof sound-transmitting membrane component comprises an MEMS-PCB board and the dustproof sound-transmitting membrane component used for being attached to an MEMS, wherein the dustproof sound-transmitting membrane component comprises a dustproof sound-transmitting membrane; the MEMS-PCB is provided with a plurality of grooves for placing the dustproof sound-transmitting membrane component, the width of each groove is larger than the outer diameter of the dustproof sound-transmitting membrane component, and the depth of each groove is 0.02-1mm larger than the thickness of the dustproof sound-transmitting membrane component;
a spacer area for filling fixing glue is arranged in the groove, and the width of the spacer area is 0.05-0.4 mm; the fixing glue is a heat-sensitive glue; the distance between the glue surface formed after the fixing glue is solidified and the bottom of the groove is not more than the thickness of the dustproof sound-transmitting membrane component; the viscosity of the fixing glue is 300cPs-5000cPs at 25 ℃; the bonding strength of the cured fixing glue is 0.1MPa-30 MPa.
The external particles such as dust and impurities and foreign matters are easily introduced into accommodating cavities of acoustic components such as a microphone and a loudspeaker through the sound pickup holes, and the external particles and foreign matters can cause certain damage to components such as a chip assembly in the accommodating cavities, and finally influence the acoustic performance and the service life of the acoustic components such as the microphone and the loudspeaker; in order to improve the dustproof performance, a corresponding dustproof sound-transmitting membrane component with dustproof performance and high sound-transmitting performance is required to be attached to the MEMS; the MEMS composite part comprises a dustproof sound-transmitting membrane component and an MEMS-PCB, wherein a plurality of rectangular or annularly arranged MEMS are arranged on the MEMS-PCB; the dustproof sound-transmitting membrane component comprises a dustproof sound-transmitting membrane, and the dustproof sound-transmitting membrane has good dustproof sound-transmitting performance and can provide a dustproof effect for the MEMS, so that the MEMS is not influenced by foreign particles such as external dust and the like, and the MEMS can normally work for a long time; the MEMS-PCB board is provided with a groove, and the width of the groove is larger than the radius of the dustproof sound-transmitting membrane component; the groove is used for placing the dustproof sound-transmitting membrane assembly, the edge area around the groove is a spacer area (the area inside the groove, except the area for placing the dustproof sound-transmitting membrane assembly, other areas can be used as spacer areas), the spacer area is used for filling fixing glue, and the existence of the fixing glue ensures that the dustproof sound-transmitting membrane assembly is tightly bonded with the MEMS-PCB and is not easy to separate; firstly, placing the dustproof sound-transmitting membrane component at a proper position in a groove of the groove in a manner of a mechanical arm and the like, and carrying out corresponding dispensing treatment after placing; the depth of the groove is 0.02-1mm greater than the thickness of the dustproof sound-transmitting membrane component; if the difference between the two is too small (less than 0.02mm), the groove cannot play a role in mounting and limiting, and cannot play a role in protecting the dustproof and sound-transmitting membrane assembly, and if the difference between the two is too large (greater than 1mm), the influence degree of the Helmholtz effect is increased, and the sound permeability is damaged; the width of the spacer is 0.05-0.04mm, the width of the spacer is very small, the spacer has certain depth, the fluidity of common glue is poor, the glue is often only in a partial glue dispensing area after glue dispensing and cannot fill the whole glue dispensing area, so that the bonding strength of partial areas between the dustproof sound-transmitting membrane component and the MEMS-PCB is poor, and the separation is easy; the viscosity of the fixing glue used in the invention is 300cPs-5000cPs at the normal temperature of 25 ℃, the viscosity is the most direct expression reflecting the good and bad fluidity of the glue, the larger the viscosity of the glue is, the poorer the fluidity of the gelatin is, but the too low viscosity of the glue can cause the too low bonding strength of the glue, thus the requirement of practical application can not be met; the glue has proper viscosity, so that the good fluidity of the glue is ensured, and the fixed glue can be filled with a spacer area (the whole glue dispensing area) to be filled in a short time; the viscosity of the fixing glue is measured by a viscometer according to the standard of GB/T2794-2013; the fixing glue is a thermosensitive glue, is particularly suitable for being applied to MEMS, can resist high temperature and meets the requirements of reflow soldering process; the bonding strength of the solidified fixing glue is 0.1-30 MPa, and the fixing glue has strong bonding strength, so that each area between the dustproof sound-transmitting membrane component and the MEMS-PCB is bonded very tightly and is not easy to separate; the dustproof sound-transmitting membrane component can play a role in preventing dust and transmitting sound for a long time, and normal work of electronic equipment is guaranteed. In addition, the distance between the glue surface formed by the solidified fixing glue and the bottom of the groove at the bottom needs to be not more than the thickness of the dustproof sound-transmitting membrane component, and if the distance between the glue surface and the bottom of the groove at the bottom is more than the thickness of the dustproof sound-transmitting membrane component, the glue overflow phenomenon is equivalently generated, redundant fixing glue flows onto the dustproof sound-transmitting membrane, the redundant fixing glue can generate crossed influence on the sound-transmitting performance of the dustproof sound-transmitting membrane, the sound-transmitting performance of the dustproof sound-transmitting membrane is greatly reduced, and the requirement of practical application cannot be met; therefore, the amount of the fixing glue needs to be controlled, and if the amount of the fixing glue is too small, the dust-proof sound-transmitting membrane component can not be tightly bonded with the bottom and the side wall of the groove.
As a further improvement of the invention, the thickness of the dustproof sound-transmitting membrane component is 0.05-0.5 mm; the depth of the groove is 0.08mm-1.3 mm; the distance between the glue surface formed after the fixing glue is solidified and the bottom of the groove is 10-70um smaller than the thickness of the dustproof sound-transmitting membrane component.
Preferably, the thickness of the dustproof and sound-transmitting membrane component is 0.1-0.35 mm; the dustproof sound-transmitting membrane component has proper thickness, is beneficial to the convenience in mounting and processing of the dustproof sound-transmitting membrane component, has higher mechanical strength and can meet the requirement of actual processing and mounting; meanwhile, the dustproof sound-transmitting membrane component is ensured to have low sound loss and high sound-transmitting performance; the depth of the groove is 0.08mm-1.3mm, and the groove has proper depth, so that the dustproof sound-transmitting membrane component can be completely positioned in the groove, the side wall of the groove can play a role in protecting the dustproof sound-transmitting membrane component, and the dustproof sound-transmitting membrane component is prevented from being damaged in the subsequent processes of processing, mounting and the like to influence the sound-transmitting effect of the dustproof sound-transmitting membrane component; meanwhile, the depth of the groove cannot be too large, and the dustproof sound-transmitting membrane assembly cannot be conveniently installed in the groove after the depth of the groove is too large, so that the overall sound-transmitting performance is influenced;
after the dustproof sound-transmitting membrane component is placed in the groove through the manipulator, the dustproof sound-transmitting membrane component is stably fixed in the groove by filling the fixing glue in the spacing area, the distance between the glue surface formed after the fixing glue is solidified and the bottom of the groove is 10-70 mu m smaller than the thickness of the dustproof sound-transmitting membrane component, and the phenomenon of glue overflow is further ensured not to occur, namely, the phenomenon that redundant fixing glue flows onto the dustproof sound-transmitting membrane and the sound transmission performance of the dustproof sound-transmitting membrane is influenced; meanwhile, the amount of fixing glue can be ensured, and the dustproof sound-transmitting membrane assembly is ensured to be tightly bonded with the bottom and the side wall of the groove.
As a further improvement of the invention, after the solidified fixing glue is placed for 5min at the temperature of 280 ℃, the bonding strength is not lower than 90 percent of the initial bonding strength;
at 25 ℃, the contact angle between the fixing glue and the MEMS-PCB is 20-80 degrees, and the contact angle between the fixing glue and the dustproof and sound-transmitting film is 40-120 degrees.
After the fixing glue is cured, carrying out a bonding strength test, wherein the bonding strength is A; placing the cured fixing glue in a 280 ℃ oven for 5min, and testing the bonding strength of the fixing glue, wherein the bonding strength is B, and tests show that B is not lower than 90% of A, which shows that the fixing glue has stronger high temperature resistance, and the bonding strength is basically unchanged after the fixing glue is placed for a certain time at high temperature, so that the fixing glue is particularly suitable for being applied to MEMS and meets the reflow soldering process in the MEMS mounting treatment process;
the contact angle between the fixed glue and the MEMS-PCB and the contact angle between the fixed glue and the dustproof sound-transmitting film are measured by a contact angle measuring instrument according to standard GB/T30447 and 2013; the contact angle is an important parameter for measuring the wettability of the liquid on the surface of the material, and the smaller the contact angle is, the easier the liquid wets the material, and the better the liquidity of the liquid on the material is; the contact angle between the fixing glue and the MEMS-PCB is 20-80 degrees, the contact angle between the fixing glue and the MEMS-PCB is preferably 30-60 degrees, the contact angle is relatively small, the flowability of the fixing glue on the MEMS-PCB is further illustrated, after the fixing glue is added into the spacer area through a glue dispensing process, the fixing glue can rapidly flow in the spacer area, the whole area can be filled in a short time, and then the dustproof sound-transmitting membrane component and the MEMS-PCB are ensured to have higher bonding strength everywhere and are not easy to separate; the contact angle between the fixing glue and the dustproof sound-transmitting film is 40-120 degrees, and preferably is 60-110 degrees, so that the contact angle is relatively large, which indicates that the fixing glue is difficult to wet the dustproof sound-transmitting film, the sound transmission performance of the dustproof sound-transmitting film is not influenced, and the sound transmission performance of the dustproof sound-transmitting film is ensured.
As a further improvement of the invention, the water contact angle of the cured fixing glue is 70-130 degrees; the dust and sound protective film has an oil repellency rating of no less than 6 as determined according to the oil repellency standard test method specified in AATCC 118-; the dustproof sound-transmitting membrane assembly has a sound blocking amount of not more than 4dB in an audio frequency range of 100-10000 Hz.
The water contact angle of the solidified fixing glue is measured by a contact angle measuring instrument according to the standard of GB/T30693-2014, the water contact angle of the solidified fixing glue is 70-130 degrees, and the solidified fixing glue is mainly lipophilic (hydrophobic) and has stronger waterproof performance; if the lipophilicity of the surface of the membrane is stronger, the fixing glue can easily wet the dustproof sound-transmitting membrane (at least partially wet), so that the sound transmission performance of the dustproof sound-transmitting membrane can be greatly reduced, and the dustproof sound-transmitting membrane can not meet the requirement of practical application; the oil-repellent grade of the dustproof and sound-transmitting film is not lower than 6, so that the fixed glue cannot wet the film, the sound-transmitting performance of the film cannot be influenced, and meanwhile, the film has stronger waterproof and oilproof performance and can meet the requirements of practical application;
when sound penetrates through an object, certain loss occurs; the loss amount is actually the sound blocking amount of the object, the larger the sound blocking amount of the object is, the larger the sound loss is, and the smaller the sound blocking amount of the object is, the smaller the sound loss is; the method for testing the sound blocking quantity of the object comprises the following steps: punching an object to be tested into a wafer with the diameter of 5.0mm, concentrically stacking the punched material to be tested and an annular double-sided adhesive tape with the outer diameter of 5.0mm and the inner diameter of 1.7mm, wherein the thickness of the double-sided adhesive tape is 0.15mm, finally attaching the double-sided adhesive tape to a microphone test board with a sound outlet hole with the diameter of 1mm and the depth of 0.8mm, and selecting Lou's SPA1687LR5H as the simulation microphone. An artificial mouth is arranged 2cm away from the microphone tool. Both the analog microphone and the artificial mouth are connected to an Audio Precision x525 model Audio analyzer. The Audio testing software carried by the Audio preference is utilized to make the artificial mouth emit sound with the frequency of 100Hz-10000Hz and the sound pressure level of 94 dBSPL. Collecting and subtracting response signals of a microphone end under the condition that a test component is mounted on the surface of the microphone tool and a test component is not mounted on the surface of the microphone tool, and finally obtaining the sound blocking quantity of a corresponding object; the sound blocking amount of the dustproof sound-transmitting membrane component is not more than 4dB, namely the sound loss amount of sound is not more than 4dB when the sound penetrates through the dustproof sound-transmitting membrane component, so that the dustproof sound-transmitting membrane component has excellent sound-transmitting performance and a large application range.
As a further improvement of the invention, the dustproof grade of the dustproof sound-transmitting film is IP6, and the interception efficiency of the dustproof sound-transmitting film on impurity particles with the diameter of 5-10 mu m is more than 80%;
the air permeability rate of the dustproof sound-transmitting membrane component is 100-2@7kPa。
The dustproof sound-transmitting film has the dustproof grade of IP6, and the interception efficiency of the dustproof sound-transmitting film on impurity particles with the diameter of 5-10 microns is more than 80%, which shows that the dustproof sound-transmitting film has strong dustproof effect on particles such as external dust, impurities and the like, and cannot enter the shell of the electronic equipment, so that acoustic parts such as a microphone and the like in the shell can normally work for a long time;
preferably, the ventilation rate of the dustproof and sound-transmitting membrane component is 500-5000ml/min/cm2@7 kPa; the dustproof sound-transmitting membrane component has a high ventilation rate, gas inside the shell can quickly permeate the dustproof sound-transmitting membrane to enter an external environment, the air pressure inside and outside the shell keeps balanced, the electronic equipment inside the shell can normally work for a long time, potential safety hazards do not exist, and the application range of the dustproof sound-transmitting membrane component is further expanded.
As a further improvement of the invention, the surface area of the dustproof sound-transmitting film is 0.5mm2-5mm2The thickness of the dustproof sound-transmitting film is 2-20 mu m; the dustproof sound-transmitting film is any one of a nylon film, a PE film, a PET film, a PP film, a PTFE film, a PU film and a PI film.
Preferably, the surface area of the dustproof and sound-transmitting film is 1mm2-4mm2The thickness of the dustproof sound-transmitting film is 5-15 mu m; the dustproof sound-transmitting film has proper surface area and thickness, is convenient to mount and process on one hand, and is convenient to mount and process on the other handThe material has good dustproof sound transmission performance, air permeability and high mechanical strength, and meets the requirements of practical application; the dustproof sound-transmitting membrane is any one of a nylon membrane, a PE membrane, a PET membrane, a PP membrane, a PTFE membrane, a PU membrane and a PI membrane, and the membrane material is very wide, convenient to obtain, cheap and good.
As a further improvement of the present invention, the dustproof and sound-transmitting membrane assembly further comprises a support layer located on the side of the dustproof and sound-transmitting membrane facing away from the external environment, and a first adhesive for bonding the support layer and the dustproof and sound-transmitting membrane.
The supporting layer is arranged, and can support the dustproof sound-transmitting membrane, so that the whole dustproof sound-transmitting membrane assembly has higher mechanical strength, and the application range of the dustproof sound-transmitting membrane assembly is improved; the supporting layer is not sticky, and the supporting layer and the dustproof sound-transmitting film are bonded through a first adhesive, so that the supporting layer and the dustproof sound-transmitting film are bonded tightly; the supporting layer is bonded with the bottom of the groove through fixing glue, and the whole dustproof sound-transmitting membrane assembly is stably fixed in the groove through the fixing glue and plays a role in preventing dust and transmitting sound all the time.
As a further improvement of the invention, the contact angle between the fixing glue and the supporting layer is 25-85 degrees at 25 ℃, and the contact angle between the fixing glue and the first adhesive is 25-90 degrees.
The contact angle between the fixing glue and the supporting layer is measured by a contact angle measuring instrument according to standard GB/T30447-2013; the contact angle is an important parameter for measuring the wettability of the liquid on the surface of the material, and the smaller the contact angle is, the easier the liquid wets the material, and the better the liquidity of the liquid on the material is; preferably, at 25 ℃, the contact angle between the fixing glue and the supporting layer is 30-70 degrees, the contact angle between the fixing glue and the first adhesive is 30-75 degrees, and the contact angle is relatively small, so that the flow of the fixing glue cannot be influenced by the supporting layer and the first adhesive, and the rapid flow of the fixing glue in the groove of the MEMS-PCB is further ensured; after the fixing glue is added into the spacer area through a glue dispensing process, the fixing glue can flow in the spacer area quickly, the whole area can be filled in a short time, and then the dustproof sound-transmitting membrane component and the MEMS-PCB are ensured to have high bonding strength everywhere and are not easy to separate.
As a further improvement of the invention, the thickness of the supporting layer is 20-100 μm, and the elastic modulus of the supporting layer is 5-200 MPa; the supporting layer is any one of a PI film, a PET film, a PEEK film, a PE film and a PU film.
Preferably, the thickness of the support layer is 30-80 μm, and the elastic modulus is 40-160 MPa; the supporting layer has proper thickness and elastic modulus, so that the whole dustproof sound-transmitting membrane assembly has proper thickness and is convenient to mount and process; on the other hand, the mechanical strength of the whole diaphragm can be improved, a larger supporting effect is improved for the diaphragm, the deformation of the diaphragm after being pressed is reduced, and the longer service life of the diaphragm is ensured; the supporting layer is any one of a PI film, a PET film, a PEEK film, a PE film and a PU film, the source is very wide, and the acquisition is convenient.
As a further improvement of the present invention, the bonding strength between the first adhesive and the support layer is 5 to 50N/cm; the bonding strength between the first adhesive and the dustproof and sound-transmitting film is 5-50N/cm.
Preferably, the bonding strength between the first adhesive and the dustproof and sound-transmitting film is 10-45N/cm; the bonding strength between the first adhesive and the supporting layer is 10-45N/cm;
the first adhesive is a double-sided adhesive tape which can be a heat-sensitive adhesive tape or other double-sided adhesive tapes in accordance with the type; the first adhesive has enough viscosity, so that the adhesion between the supporting layer and the dustproof sound-transmitting film is very tight, the separation is not easy to occur, and the supporting layer can provide a supporting effect for the dustproof sound-transmitting film for a long time, so that the service life of the dustproof sound-transmitting film is prolonged, and the normal work of electronic equipment is ensured.
The method for testing the adhesive strength can be appropriately adjusted according to the method of ASTM D-3330. The adhesive was die cut into a strip 24mm wide and 300mm long, and one side of the adhesive was attached to a stainless steel plate. And then the supporting layer is punched into strips with the width of 24mm and the length of 325mm, the strips of the supporting layer are aligned with one end of the adhesive strip and then are laminated and adhered, the length of 25mm of the strips of the supporting layer is in a non-adhesion state, the adhered part is rolled by a press roll, one end of a stainless steel plate is placed into a movable nip of a tensile machine, the end of a supporting layer without the adhesion part is placed into another nip, a clamp is operated to stretch towards two directions of 180 degrees at the speed of 5.0 +/-0.2 mm/s, the tensile value within the displacement distance range of 25mm-75mm is counted and averaged, and the value is calculated as the adhesion strength value.
The invention has the beneficial effects that: an MEMS composite part with a dustproof sound-transmitting membrane component comprises an MEMS-PCB board and the dustproof sound-transmitting membrane component which is used for being attached to an MEMS, wherein the dustproof sound-transmitting membrane component comprises a dustproof sound-transmitting membrane which provides a dustproof sound-transmitting effect for the MEMS; the MEMS-PCB is provided with a plurality of grooves for placing the dustproof sound-transmitting membrane component, and the width of each groove is larger than the outer diameter of the dustproof sound-transmitting membrane component; a spacer area for filling fixing glue is arranged in the groove, and the width of the spacer area is 0.05-0.4 mm; the fixing glue is a heat-sensitive glue and resists high temperature; at 25 ℃, the viscosity of the fixing glue is 300cPs-5000cPs, the viscosity is lower, and the flowing speed is higher; the bonding strength of the solidified fixing glue is 0.1MPa-30MPa, and the fixing glue has higher bonding strength; the fixing glue used for bonding the dustproof sound-transmitting membrane component and the MEMS-PCB in the composite part has high fluidity, the whole glue dispensing area can be filled in a short time, the solidified fixing glue has good bonding strength, the dustproof sound-transmitting membrane component and the MEMS-PCB are guaranteed to be bonded closely everywhere and are not easy to separate for a long time, and then the electronic components in the shell can work normally for a long time.
Drawings
FIG. 1 is a schematic structural view of a dust-proof sound-transmitting membrane module according to the present invention;
FIG. 2 is a schematic structural view of the dustproof and acoustically transparent membrane module of the present invention in a groove of a MEMS-PCB board;
FIG. 3 is a schematic structural view of a MEMS composite of the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3;
reference numerals: 1. a MEMS-PCB board; 11. a groove; 12. a spacer region; 2. a dust-proof sound-transmitting membrane assembly; 21. a dust-proof sound-transmitting membrane; 22. a support layer; 23. a first adhesive;
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Example 1
An MEMS composite part with a dustproof sound-transmitting membrane component comprises an MEMS-PCB (micro electro mechanical System) -board 1 and a dustproof sound-transmitting membrane component 2 used for being attached to an MEMS, wherein the dustproof sound-transmitting membrane component 2 comprises a dustproof sound-transmitting membrane 21; the MEMS-PCB board 1 is provided with a plurality of grooves 11 for placing the dustproof sound-transmitting membrane components 2, and the width of each groove 11 is larger than the outer diameter of each dustproof sound-transmitting membrane component 2; a spacer region 12 for filling fixing glue is arranged in the groove 11, and the width of the spacer region 12 is 0.20-0.30 mm;
the fixing glue is thermosensitive glue; the viscosity of the fixing glue is 2000cPs at 25 ℃; the bonding strength of the solidified fixing glue is 10 MPa; the water contact angle of the solidified fixing glue is 90 degrees;
the dust and sound protective film 21 has an oil repellency rating of no less than 6 as determined according to the oil repellency standard test method specified in AATCC 118-;
the sound blocking amount of the dustproof sound-transmitting membrane component 2 in the sound frequency range of 100-10000Hz is not more than 4 dB; the thickness of the dustproof sound-transmitting membrane component 2 is 0.06mm, and the depth of the groove 11 is 0.1 mm;
after the solidified fixing glue is placed for 5min at the temperature of 280 ℃, the bonding strength is not lower than 90% of the initial bonding strength; at 25 ℃, the contact angle between the fixing glue and the MEMS-PCB board 1 is 50 degrees, and the contact angle between the fixing glue and the dustproof sound-transmitting film 21 is 95 degrees;
the outer surface area of the dustproof sound-transmitting film 21 is 3mm2The thickness of the dustproof sound-transmitting film 21 is 10 μm, and the dustproof sound-transmitting film 21 is a PTFE film; the dustproof grade of the dustproof sound-transmitting membrane 21 is IP6, and the ventilation rate of the dustproof sound-transmitting membrane component 2 is 2000ml/min/cm2@7kPa。
Example 2
An MEMS composite part with a dustproof sound-transmitting membrane component 2 comprises an MEMS-PCB (micro electro mechanical System-printed Circuit Board) 1 and the dustproof sound-transmitting membrane component 2 which is used for being attached to an MEMS, wherein the dustproof sound-transmitting membrane component 2 comprises a dustproof sound-transmitting membrane 21; the MEMS-PCB board 1 is provided with a plurality of grooves 11 for placing the dustproof sound-transmitting membrane components 2, and the width of each groove 11 is larger than the outer diameter of each dustproof sound-transmitting membrane component 2; a spacer region 12 for filling fixing glue is arranged in the groove 11, and the width of the spacer region 12 is 0.25-0.35 mm;
the fixing glue is thermosensitive glue; the viscosity of the fixing glue is 1000cPs at 25 ℃; the bonding strength of the solidified fixing glue is 5 MPa; the water contact angle of the solidified fixing glue is 100 degrees;
the dust and sound protective film 21 has an oil repellency rating of no less than 6 as determined according to the oil repellency standard test method specified in AATCC 118-;
the sound blocking amount of the dustproof sound-transmitting membrane component 2 in the sound frequency range of 100-10000Hz is not more than 4 dB; the thickness of the dustproof sound-transmitting membrane component 2 is 0.25mm, and the depth of the groove 11 is 0.35 mm;
after the solidified fixing glue is placed for 5min at the temperature of 280 ℃, the bonding strength is not lower than 90% of the initial bonding strength; at 25 ℃, the contact angle between the fixing glue and the MEMS-PCB board 1 is 55 degrees, and the contact angle between the fixing glue and the dustproof sound-transmitting film 21 is 105 degrees;
the outer surface area of the dustproof sound-transmitting film 21 is 4mm2The thickness of the dustproof sound-transmitting film 21 is 18 μm, and the dustproof sound-transmitting film 21 is a PET film; the dustproof grade of the dustproof sound-transmitting membrane 21 is IP6, and the ventilation rate of the dustproof sound-transmitting membrane component 2 is 3500ml/min/cm2@7kPa；
The dustproof and sound-transmitting membrane assembly 2 further comprises a supporting layer 22 and a first adhesive 23, wherein the supporting layer 22 is positioned on the side, facing away from the external environment, of the dustproof and sound-transmitting membrane 21, and the first adhesive 23 is used for bonding the supporting layer 22 and the dustproof and sound-transmitting membrane 21;
the thickness of the support layer 22 is 85 μm, and the elastic modulus of the support layer 22 is 40 MPa; the support layer 22 is a PI film; the bonding strength between the first adhesive 23 and the support layer 22 was 40N/cm; the bonding strength between the first adhesive 23 and the dustproof and sound-transmitting film 21 is 40N/cm;
at 25 ℃, the contact angle between the fixing glue and the support layer 22 is 65 °, and the contact angle between the fixing glue and the first adhesive 23 is 75 °.
Example 3
An MEMS composite part with a dustproof sound-transmitting membrane component 2 comprises an MEMS-PCB (micro electro mechanical System-printed Circuit Board) 1 and the dustproof sound-transmitting membrane component 2 which is used for being attached to an MEMS, wherein the dustproof sound-transmitting membrane component 2 comprises a dustproof sound-transmitting membrane 21; the MEMS-PCB board 1 is provided with a plurality of grooves 11 for placing the dustproof sound-transmitting membrane components 2, and the width of each groove 11 is larger than the outer diameter of each dustproof sound-transmitting membrane component 2; a spacer region 12 for filling fixing glue is arranged in the groove 11, and the width of the spacer region 12 is 0.15-0.25 mm;
the fixing glue is thermosensitive glue; the viscosity of the fixing glue is 3000cPs at 25 ℃; the bonding strength of the solidified fixing glue is 20 MPa; the water contact angle of the solidified fixing glue is 85 degrees;
the dust and sound protective film 21 has an oil repellency rating of no less than 6 as determined according to the oil repellency standard test method specified in AATCC 118-;
the sound blocking amount of the dustproof sound-transmitting membrane component 2 in the sound frequency range of 100-10000Hz is not more than 4 dB; the thickness of the dustproof sound-transmitting membrane component 2 is 0.14mm, and the depth of the groove 11 is 0.20 mm;
after the solidified fixing glue is placed for 5min at the temperature of 280 ℃, the bonding strength is not lower than 90% of the initial bonding strength; at 25 ℃, the contact angle between the fixing glue and the MEMS-PCB board 1 is 40 degrees, and the contact angle between the fixing glue and the dustproof sound-transmitting film 21 is 90 degrees;
the outer surface area of the dustproof sound-transmitting film 21 is 2mm2The thickness of the dustproof sound-transmitting film 21 is 12 μm, and the dustproof sound-transmitting film 21 is a PTFE film; the dustproof grade of the dustproof sound-transmitting membrane 21 is IP6, and the ventilation rate of the dustproof sound-transmitting membrane component 2 is 3000ml/min/cm2@7kPa；
The dustproof and sound-transmitting membrane assembly 2 further comprises a supporting layer 22 and a first adhesive 23, wherein the supporting layer 22 is positioned on the side, facing away from the external environment, of the dustproof and sound-transmitting membrane 21, and the first adhesive 23 is used for bonding the supporting layer 22 and the dustproof and sound-transmitting membrane 21;
the thickness of the support layer 22 is 60 μm, and the elastic modulus of the support layer 22 is 80 MPa; the support layer 22 is a PU film; the bonding strength between the first adhesive 23 and the support layer 22 was 22N/cm; the bonding strength between the first adhesive 23 and the dustproof and sound-transmitting film 21 is 22N/cm;
at 25 ℃, the contact angle between the fixing glue and the support layer 22 is 45 ° and the contact angle between the fixing glue and the first adhesive 23 is 55 °.
Example 4
An MEMS composite part with a dustproof sound-transmitting membrane component 2 comprises an MEMS-PCB (micro electro mechanical System-printed Circuit Board) 1 and the dustproof sound-transmitting membrane component 2 which is used for being attached to an MEMS, wherein the dustproof sound-transmitting membrane component 2 comprises a dustproof sound-transmitting membrane 21; the MEMS-PCB board 1 is provided with a plurality of grooves 11 for placing the dustproof sound-transmitting membrane components 2, and the width of each groove 11 is larger than the outer diameter of each dustproof sound-transmitting membrane component 2; a spacer region 12 for filling fixing glue is arranged in the groove 11, and the width of the spacer region 12 is 0.10-0.20 mm;
the fixing glue is thermosensitive glue; the viscosity of the fixing glue is 4000cPs at 25 ℃; the bonding strength of the solidified fixing glue is 25 MPa; the water contact angle of the solidified fixing glue is 80 degrees;
the dust and sound protective film 21 has an oil repellency rating of no less than 6 as determined according to the oil repellency standard test method specified in AATCC 118-;
the sound blocking amount of the dustproof sound-transmitting membrane component 2 in the sound frequency range of 100-10000Hz is not more than 4 dB; the thickness of the dustproof sound-transmitting membrane component 2 is 0.1mm, and the depth of the groove 11 is 0.18 mm;
after the solidified fixing glue is placed for 5min at the temperature of 280 ℃, the bonding strength is not lower than 90% of the initial bonding strength; at 25 ℃, the contact angle between the fixing glue and the MEMS-PCB board 1 is 30 degrees, and the contact angle between the fixing glue and the dustproof sound-transmitting film 21 is 85 degrees;
the outer surface area of the dustproof sound-transmitting film 21 is 1.5mm2The thickness of the dustproof sound-transmitting film 21 is 8 μm, and the dustproof sound-transmitting film 21 is a PE film; the dustproof sound-transmitting film 21 has a dustproof grade of IP 6; the ventilation rate of the dustproof sound-transmitting membrane component 2 is 2500ml/min/cm2@7kPa；
The dustproof and sound-transmitting membrane assembly 2 further comprises a supporting layer 22 and a first adhesive 23, wherein the supporting layer 22 is positioned on the side, facing away from the external environment, of the dustproof and sound-transmitting membrane 21, and the first adhesive 23 is used for bonding the supporting layer 22 and the dustproof and sound-transmitting membrane 21;
the thickness of the support layer 22 is 50 μm, and the elastic modulus of the support layer 22 is 90 MPa; the support layer 22 is a PEEK film; the bonding strength between the first adhesive 23 and the support layer 22 was 16N/cm; the bonding strength between the first adhesive 23 and the dustproof and sound-transmitting film 21 is 16N/cm;
at 25 ℃, the contact angle between the fixing glue and the support layer 22 is 35 °, and the contact angle between the fixing glue and the first adhesive 23 is 40 °.
Example 5
An MEMS composite part with a dustproof sound-transmitting membrane component 2 comprises an MEMS-PCB (micro electro mechanical System-printed Circuit Board) 1 and the dustproof sound-transmitting membrane component 2 which is used for being attached to an MEMS, wherein the dustproof sound-transmitting membrane component 2 comprises a dustproof sound-transmitting membrane 21; the MEMS-PCB board 1 is provided with a plurality of grooves 11 for placing the dustproof sound-transmitting membrane components 2, and the width of each groove 11 is larger than the outer diameter of each dustproof sound-transmitting membrane component 2; a spacer region 12 for filling fixing glue is arranged in the groove 11, and the width of the spacer region 12 is 0.20-0.30 mm;
the fixing glue is thermosensitive glue; the viscosity of the fixing glue is 2500cPs at 25 ℃; the bonding strength of the solidified fixing glue is 15 MPa; the water contact angle of the solidified fixing glue is 95 degrees;
the dust and sound protective film 21 has an oil repellency rating of no less than 6 as determined according to the oil repellency standard test method specified in AATCC 118-;
the sound blocking amount of the dustproof sound-transmitting membrane component 2 in the sound frequency range of 100-10000Hz is not more than 4 dB; the thickness of the dustproof sound-transmitting membrane component 2 is 0.18mm, and the depth of the groove 11 is 0.23 mm;
after the solidified fixing glue is placed for 5min at the temperature of 280 ℃, the bonding strength is not lower than 90% of the initial bonding strength; at 25 ℃, the contact angle between the fixing glue and the MEMS-PCB board 1 is 45 degrees, and the contact angle between the fixing glue and the dustproof sound-transmitting film 21 is 100 degrees;
the outer surface area of the dustproof sound-transmitting film 21 is 3.5mm2The thickness of the dustproof sound-transmitting film 21 is 15 μm, and the dustproof sound-transmitting film 21 is a PTFE film; the dustproof grade of the dustproof sound-transmitting membrane 21 is IP6, and the ventilation rate of the dustproof sound-transmitting membrane component 2 is 4000ml/min/cm2@7kPa；
The dustproof and sound-transmitting membrane assembly 2 further comprises a supporting layer 22 and a first adhesive 23, wherein the supporting layer 22 is positioned on the side, facing away from the external environment, of the dustproof and sound-transmitting membrane 21, and the first adhesive 23 is used for bonding the supporting layer 22 and the dustproof and sound-transmitting membrane 21;
the thickness of the support layer 22 is 70 μm, and the elastic modulus of the support layer 22 is 60 MPa; the support layer 22 is a PI film; the bonding strength between the first adhesive 23 and the support layer 22 was 30N/cm; the bonding strength between the first adhesive 23 and the dustproof and sound-transmitting film 21 is 30N/cm;
at 25 ℃, the contact angle between the fixing glue and the support layer 22 is 50 °, and the contact angle between the fixing glue and the first adhesive 23 is 65 °.
In the dispensing process, observation shows that the whole dispensing area (namely the whole spacer area) can be filled in a short time due to the good fluidity of the fixing glue in the embodiments 1-5, and the solidified fixing glue has strong bonding strength, so that the dustproof and sound-transmitting membrane assembly and the MEMS-PCB in the embodiments 1-5 are bonded very tightly at places and are not easy to separate for a long time; and the electronic components in the shell can normally work for a long time, the service life is long, and the economic benefit is high.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (10)
1. The utility model provides a compound piece of MEMS with dustproof sound-transmitting membrane subassembly which characterized in that: the MEMS-PCB dustproof sound-transmitting membrane module comprises an MEMS-PCB and a dustproof sound-transmitting membrane module which is used for being attached to the MEMS, wherein the dustproof sound-transmitting membrane module comprises a dustproof sound-transmitting membrane; the MEMS-PCB is provided with a plurality of grooves for placing the dustproof sound-transmitting membrane component, the width of each groove is larger than the outer diameter of the dustproof sound-transmitting membrane component, and the depth of each groove is 0.02-1mm larger than the thickness of the dustproof sound-transmitting membrane component;
a spacer area for filling fixing glue is arranged in the groove, and the width of the spacer area is 0.05-0.4 mm; the fixing glue is a heat-sensitive glue; the distance between the glue surface formed after the fixing glue is solidified and the bottom of the groove is not more than the thickness of the dustproof sound-transmitting membrane component;
the viscosity of the fixing glue is 300cPs-5000cPs at 25 ℃;
the bonding strength of the cured fixing glue is 0.1MPa-30 MPa.
2. The MEMS composite with a dust and sound permeable membrane module of claim 1, wherein: the thickness of the dustproof sound-transmitting membrane component is 0.05-0.5 mm; the depth of the groove is 0.08mm-1.3 mm; the distance between the glue surface formed after the fixing glue is solidified and the bottom of the groove is 10-70um smaller than the thickness of the dustproof sound-transmitting membrane component.
3. The MEMS composite with a dust and sound permeable membrane module of claim 1, wherein: after the solidified fixing glue is placed for 5min at the temperature of 280 ℃, the bonding strength is not lower than 90% of the initial bonding strength;
at 25 ℃, the contact angle between the fixing glue and the MEMS-PCB is 20-80 degrees, and the contact angle between the fixing glue and the dustproof and sound-transmitting film is 40-120 degrees.
4. The MEMS composite with a dust and sound permeable membrane module of claim 1, wherein: the water contact angle of the solidified fixing glue is 70-130 degrees;
the dust and sound protective film has an oil repellency rating of no less than 6 as determined according to the oil repellency standard test method specified in AATCC 118-;
the dustproof sound-transmitting membrane assembly has a sound blocking amount of not more than 4dB in an audio frequency range of 100-10000 Hz.
5. The MEMS composite with a dust and sound permeable membrane module of claim 1, wherein:
the dustproof grade of the dustproof sound-transmitting film is IP6, and the interception efficiency of the dustproof sound-transmitting film on impurity particles with the diameter of 5-10 mu m is more than 80%;
the air permeability rate of the dustproof sound-transmitting membrane component is 100-2@7kPa。
6. The MEMS composite with a dust and sound permeable membrane module of claim 1, wherein: the surface area of the dustproof sound-transmitting film is 0.5mm2-5mm2The thickness of the dustproof sound-transmitting film is 2-20 mu m; the dustproof sound-transmitting film is any one of a nylon film, a PE film, a PET film, a PP film, a PTFE film, a PU film and a PI film.
7. The MEMS composite with a dust and sound permeable membrane module of claim 1, wherein: the dustproof sound-transmitting membrane assembly further comprises a supporting layer and a first adhesive, the supporting layer is located on one side, away from the external environment, of the dustproof sound-transmitting membrane, and the first adhesive is used for bonding the supporting layer and the dustproof sound-transmitting membrane.
8. The MEMS composite with a dust and sound permeable membrane module of claim 7, wherein: at 25 ℃, the contact angle between the fixing glue and the support layer is 25-85 degrees, and the contact angle between the fixing glue and the first adhesive is 25-90 degrees.
9. The MEMS composite with a dust and sound permeable membrane module of claim 7, wherein: the thickness of the supporting layer is 20-100 μm, and the elastic modulus of the supporting layer is 5-200 MPa; the supporting layer is any one of a PI film, a PET film, a PEEK film, a PE film and a PU film.
10. The MEMS composite with a dust and sound permeable membrane module of claim 7, wherein: the bonding strength between the first adhesive and the support layer is 5-50N/cm; the bonding strength between the first adhesive and the dustproof and sound-transmitting film is 5-50N/cm.
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