CN105802564A - Special prime glue for storage battery - Google Patents
Special prime glue for storage battery Download PDFInfo
- Publication number
- CN105802564A CN105802564A CN201610263357.8A CN201610263357A CN105802564A CN 105802564 A CN105802564 A CN 105802564A CN 201610263357 A CN201610263357 A CN 201610263357A CN 105802564 A CN105802564 A CN 105802564A
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- Prior art keywords
- component
- special
- glue
- mica powder
- epoxy resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a special prime glue for a storage battery. The special prime glue is prepared from the following components of polyphenol glycidyl ether epoxy resin, modified acrylic resin, double-phenol A-type epoxy resin, mica powder, dibutyl phthalate, polyglycidyl ether, aluminium hydroxide powder, and a succinic acid hydrazide and m-phenylenediamine mixture. The special prime glue for the storage battery has the advantages that by improving the production technology and prescription, the viscosity is lower, the infiltration property is good, the fluidity is better, the dyeing is easy, the defoaming is easy, and the trial use period is long; the glue layer is flat and bright; at the normal temperature, the use period is long, and the viscosity is moderate; the surface of a curing object is flat and smooth, the hardness is high, the compressive strength and bonding strength are high, the insulation property is excellent, the mechanical property is good, the heat-resistant property is good, the water-absorbing property and heat expansion coefficient are little, the mechanical property and electric property of the curing product are stable, and the influence to binding force and appearance under the strong acid environment is avoided; the glass transition temperature is higher than the glass transition temperature of common epoxy resin, the room-temperature curing is realized, and the heat-resistant and acid-resistant properties are excellent.
Description
Technical field
The present invention relates to packaging plastic field, particularly relate to a kind of special bottoming glue of accumulator.
Background technology
The special bottoming glue of accumulator is room temperature curing type epoxide resin material, is mainly used in acid resistance, adhesive strength and sealing property, heat resistance require the bottoming of higher polar post of lead acid batteries.It is widely used in storage battery shell and cover adhering and sealing.
Summary of the invention
It is an object of the invention to provide a kind of special bottoming glue of accumulator.
The present invention is achieved through the following technical solutions:
A kind of special bottoming glue of accumulator, is mixed by component A and B component；Described component A is made up of following component by weight, many phenolic tetraglycidel ether epoxy resin 78 parts, bisphenol A type epoxy resin 21 parts, acrylic resin modified 4 parts, mica powder 0.5 part, dibutyl phthalate 1 part, adjuvant 1 part；Time prepared by component A, being mixed by all the components, control temperature to 80-85 DEG C, pressure is 4-5MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,；Described B component is made up of following component by weight: many phenolic tetraglycidel ether epoxy resin 18 parts, polyglycidyl ether 1 part, aluminium-hydroxide powder 0.3 part, succinic acid hydrazides and 4 parts of m-diaminobenzene. mixture, SILICA FUME 0.8 part；Time prepared by B component, being mixed by all the components, control temperature to 65-68 DEG C, pressure is 5.5-6MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,.
Further, described acrylic resin modified preparation method is: by weight is acrylic resin 2% nano silicon mix with nano aluminium oxide mixture and acrylic resin after under 4.5MPa pressure, heating, to 180 DEG C, is incubated 30 minutes；Described nano silicon mixes by 1:3 part by weight with nano silicon in nano aluminium oxide mixture and nano aluminium oxide, and the granularity of nano silicon is 18-22nm, and the granularity of nano aluminium oxide is 32-35nm.
Further, described mica powder is to be mixed by 1:1 mass ratio with without the mica powder of calcining by through low temperature calcination mica powder, it can improve heatproof and decay resistance, mica powder calcining heat through low temperature calcination is 157 DEG C, calcination time is 40 minutes, and the granularity of described mica powder is 300-330 order.
Further, the granularity of described aluminium-hydroxide powder is 300-330 order, and aluminium-hydroxide powder is through pretreatment, is put into by aluminium-hydroxide powder in the caprylic acid solution that mass fraction is 0.15%, after soaking 15 minutes, filters, dry.
Further, described succinic acid hydrazides mixes by 1:8 mass ratio with succinic acid hydrazides in m-diaminobenzene. mixture and m-diaminobenzene..
Further, component A and B component, at 30 DEG C, mix by 2:1 mass ratio, obtain the special bottoming glue of accumulator.
The invention has the beneficial effects as follows, compared with prior art:
The present invention passes through improvement of production process and formula, the special bottoming glue of accumulator of preparation, and viscosity is relatively low, infiltration property is good, and mobility is good, easy dyeing, easy froth breaking, can try out the time long；Glue-line is smooth, bright.Room temperature can use the phase long, modest viscosity.Solidfied material surfacing, light, hardness height, solidfied material resistance to compression, adhesive strength height, excellent insulation performance, good mechanical performance, heat-resist, water absorption and thermal coefficient of expansion are little, cured product mechanical performance and electric performance stablity, be chronically under strong acid environment, does not affect adhesion and outward appearance；Having the vitrification point surmounting general epoxy resin, cold curing, heat-resisting Antacid effectiveness is outstanding；Curing rate is fast；Curing exotherm amount is low, and shrinkage factor is little, and moisture-proof is good；Solidfied material is fire-retardant, heat conduction, high-low temperature resistant alternation, weatherability requirement, resistance to weathering can be superior.
Detailed description of the invention
A kind of special bottoming glue of accumulator, is mixed by component A and B component；Described component A is made up of following component by weight, many phenolic tetraglycidel ether epoxy resin 78 parts, bisphenol A type epoxy resin 21 parts, acrylic resin modified 4 parts, mica powder 0.5 part, dibutyl phthalate 1 part, adjuvant 1 part；Time prepared by component A, being mixed by all the components, control temperature to 80-85 DEG C, pressure is 4-5MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,；Described B component is made up of following component by weight: many phenolic tetraglycidel ether epoxy resin 18 parts, polyglycidyl ether 1 part, aluminium-hydroxide powder 0.3 part, succinic acid hydrazides and 4 parts of m-diaminobenzene. mixture, SILICA FUME 0.8 part；Time prepared by B component, being mixed by all the components, control temperature to 65-68 DEG C, pressure is 5.5-6MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,.
Further, described acrylic resin modified preparation method is: by weight is acrylic resin 2% nano silicon mix with nano aluminium oxide mixture and acrylic resin after under 4.5MPa pressure, heating, to 180 DEG C, is incubated 30 minutes；Described nano silicon mixes by 1:3 part by weight with nano silicon in nano aluminium oxide mixture and nano aluminium oxide, and the granularity of nano silicon is 18-22nm, and the granularity of nano aluminium oxide is 32-35nm.
Further, described mica powder is to be mixed by 1:1 mass ratio with without the mica powder of calcining by through low temperature calcination mica powder, it can improve heatproof and decay resistance, mica powder calcining heat through low temperature calcination is 157 DEG C, calcination time is 40 minutes, and the granularity of described mica powder is 300-330 order.
Further, the granularity of described aluminium-hydroxide powder is 300-330 order, and aluminium-hydroxide powder is through pretreatment, is put into by aluminium-hydroxide powder in the caprylic acid solution that mass fraction is 0.15%, after soaking 15 minutes, filters, dry.
Further, described succinic acid hydrazides mixes by 1:8 mass ratio with succinic acid hydrazides in m-diaminobenzene. mixture and m-diaminobenzene..
Further, component A and B component, at 30 DEG C, mix by 2:1 mass ratio, obtain the special bottoming glue of accumulator.
The special bottoming glue performance parameter of accumulator of the present invention:
| Viscosity CP/S | Proportion g/cm3 | Pot-life (moon) |
| 6340 | 1.082 | 8 |
Table 1
Condensate performance parameter:
| Shore hardness (25 DEG C) shore-D | Water absorption rate %(24h) | Glass transition temperature DEG C | Proof voltage KV/mm | Dielectric constant |
| 96 | < 0.1 | 137 | 15 | 3-4 |
Table 2
As can be seen from Table 1 and Table 2, the special bottoming glue superior performance of this accumulator.
Claims (6)
1. the special bottoming glue of accumulator, it is characterised in that be mixed by component A and B component；Described component A is made up of following component by weight, many phenolic tetraglycidel ether epoxy resin 78 parts, bisphenol A type epoxy resin 21 parts, acrylic resin modified 4 parts, mica powder 0.5 part, dibutyl phthalate 1 part；Time prepared by component A, being mixed by all the components, control temperature to 80-85 DEG C, pressure is 4-5MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,；Described B component is made up of following component by weight: many phenolic tetraglycidel ether epoxy resin 18 parts, polyglycidyl ether 1 part, aluminium-hydroxide powder 0.3 part, succinic acid hydrazides and 4 parts of m-diaminobenzene. mixture；Time prepared by B component, being mixed by all the components, control temperature to 65-68 DEG C, pressure is 5.5-6MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,.
2. a kind of special bottoming glue of accumulator according to claim 1, it is characterized in that, described acrylic resin modified preparation method is: by weight is acrylic resin 2% nano silicon mix with nano aluminium oxide mixture and acrylic resin after under 4.5MPa pressure, heating, to 180 DEG C, is incubated 30 minutes；Described nano silicon mixes by 1:3 part by weight with nano silicon in nano aluminium oxide mixture and nano aluminium oxide, and the granularity of nano silicon is 18-22nm, and the granularity of nano aluminium oxide is 32-35nm.
3. a kind of special bottoming glue of accumulator according to claim 1, it is characterized in that, described mica powder is to be mixed by 1:1 mass ratio with without the mica powder of calcining by through low temperature calcination mica powder, mica powder calcining heat through low temperature calcination is 157 DEG C, calcination time is 40 minutes, and the granularity of described mica powder is 300-330 order.
4. a kind of special bottoming glue of accumulator according to claim 1, it is characterized in that, the granularity of described aluminium-hydroxide powder is 300-330 order, and aluminium-hydroxide powder is through pretreatment, aluminium-hydroxide powder is put in the caprylic acid solution that mass fraction is 0.15%, after soaking 15 minutes, filter, dry.
5. a kind of special bottoming glue of accumulator according to claim 1, it is characterised in that described succinic acid hydrazides mixes by 1:8 mass ratio with succinic acid hydrazides in m-diaminobenzene. mixture and m-diaminobenzene..
6. a kind of special bottoming glue of accumulator according to claim 1, it is characterised in that component A and B component, at 30 DEG C, mix by 2:1 mass ratio, obtain the special bottoming glue of accumulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610263357.8A CN105802564A (en) | 2016-04-26 | 2016-04-26 | Special prime glue for storage battery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610263357.8A CN105802564A (en) | 2016-04-26 | 2016-04-26 | Special prime glue for storage battery |
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| Publication Number | Publication Date |
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| CN105802564A true CN105802564A (en) | 2016-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610263357.8A Pending CN105802564A (en) | 2016-04-26 | 2016-04-26 | Special prime glue for storage battery |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573220A (en) * | 2021-07-28 | 2021-10-29 | 杭州安普鲁薄膜科技有限公司 | MEMS composite part with dustproof and sound-transmitting membrane component |
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| CN101851480A (en) * | 2010-05-11 | 2010-10-06 | 华烁科技股份有限公司 | Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate |
| CN102533192A (en) * | 2011-12-28 | 2012-07-04 | 烟台德邦电子材料有限公司 | Flame retardant high-heat-conductivity epoxy resin electronic adhesive glue |
| CN103361019A (en) * | 2013-08-05 | 2013-10-23 | 安徽康瑞鑫电子科技有限公司 | Epoxy resin pouring sealant |
| CN103468191A (en) * | 2013-09-17 | 2013-12-25 | 广州聚合电子材料有限公司 | Bottoming-free identifying glue for storage battery and preparation method thereof |
| CN104152093A (en) * | 2014-08-16 | 2014-11-19 | 烟台德邦科技有限公司 | Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof |
-
2016
- 2016-04-26 CN CN201610263357.8A patent/CN105802564A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101851480A (en) * | 2010-05-11 | 2010-10-06 | 华烁科技股份有限公司 | Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate |
| CN102533192A (en) * | 2011-12-28 | 2012-07-04 | 烟台德邦电子材料有限公司 | Flame retardant high-heat-conductivity epoxy resin electronic adhesive glue |
| CN103361019A (en) * | 2013-08-05 | 2013-10-23 | 安徽康瑞鑫电子科技有限公司 | Epoxy resin pouring sealant |
| CN103468191A (en) * | 2013-09-17 | 2013-12-25 | 广州聚合电子材料有限公司 | Bottoming-free identifying glue for storage battery and preparation method thereof |
| CN104152093A (en) * | 2014-08-16 | 2014-11-19 | 烟台德邦科技有限公司 | Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573220A (en) * | 2021-07-28 | 2021-10-29 | 杭州安普鲁薄膜科技有限公司 | MEMS composite part with dustproof and sound-transmitting membrane component |
| CN113573220B (en) * | 2021-07-28 | 2023-01-03 | 杭州安普鲁薄膜科技有限公司 | MEMS composite part with dustproof and sound-transmitting membrane component |
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