CN105838306A - LED (light-emitting diode) packaging adhesive - Google Patents

LED (light-emitting diode) packaging adhesive Download PDF

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Publication number
CN105838306A
CN105838306A CN201610263363.3A CN201610263363A CN105838306A CN 105838306 A CN105838306 A CN 105838306A CN 201610263363 A CN201610263363 A CN 201610263363A CN 105838306 A CN105838306 A CN 105838306A
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CN
China
Prior art keywords
component
led packaging
mixed
packaging plastic
parts
Prior art date
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Pending
Application number
CN201610263363.3A
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Chinese (zh)
Inventor
朱保瑞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUI KANGRUIXIN ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
ANHUI KANGRUIXIN ELECTRONIC TECHNOLOGY Co Ltd
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Application filed by ANHUI KANGRUIXIN ELECTRONIC TECHNOLOGY Co Ltd filed Critical ANHUI KANGRUIXIN ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201610263363.3A priority Critical patent/CN105838306A/en
Publication of CN105838306A publication Critical patent/CN105838306A/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention discloses an LED (light-emitting diode) packaging adhesive which is prepared an ethylene oxide ester epoxy resin, a modified acrylic resin, an ethylene oxide ester epoxy resin, mica powder, butyl epoxypropyl ether, diepoxypropane ethyl ether, aluminum hydroxide powder, aids, a triethylenetetramine-m-phenylenediamine mixture and silicon micropowder. By improving the production technique and formula, the prepared LED packaging adhesive has the advantages of lower viscosity, favorable impregnation property, favorable flowability, high dyeability, easy defoaming and long trial time. The LED packaging adhesive can not generate stratification in the curing process, can be cured at moderate temperature or high temperature, and has high curing speed. The LED packaging adhesive has the advantages of low curing heat release, small shrinkage and favorable moisture resistance. The curing product has the advantages of smooth surface, high brightness, high hardness, excellent insulating property, favorable mechanical properties, favorable heat resistance, low water absorptivity and low thermal expansion coefficient. The curing product satisfies the requirements for flame retardancy, heat conductivity, high/low temperature alternation resistance and weather resistance, and also has the characteristics of favorable mechanical properties, excellent electric properties and excellent atmospheric aging resistance.

Description

A kind of LED packaging plastic
Technical field
The present invention relates to packaging plastic field, particularly relate to a kind of LED packaging plastic.
Background technology
LED packaging plastic: the packaging plastic of large-power light-emitting diodes, has high index of refraction and high transmission rate, can increase the luminous flux of LED, and viscosity is little, easy deaeration, is suitable for embedding and compression molding, makes LED have preferable durability and reliability.
Summary of the invention
It is an object of the invention to provide a kind of LED packaging plastic.
The present invention is achieved through the following technical solutions:
A kind of LED packaging plastic, is mixed with B component by component A；Described component A is made up of following component by weight, glycidyl ester epoxy resin 80 parts, glycidyl ester type epoxy resin 20 parts, acrylic resin modified 3 parts, mica powder 0.4 part, epoxy propane butyl ether 5 parts, adjuvant 1 part；Time prepared by component A, being mixed by all the components, control temperature to 80-85 DEG C, pressure is 4-5MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,；Described B component is made up of following component by weight: glycidyl ester epoxy resin 20 parts, diepoxy propane ethylether 1.5 parts, aluminium-hydroxide powder 0.5 part, triethylene tetramine and 5 parts of m-phenylene diamine (MPD) mixture, SILICA FUME 0.8 part；Time prepared by B component, being mixed by all the components, control temperature to 65-68 DEG C, pressure is 5.5-6MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,.
Further, described acrylic resin modified preparation method is: by weight is acrylic resin 3.5% nano silicon mix with nano aluminium oxide mixture and acrylic resin after under 2.5MPa pressure, be heated to 180 DEG C, be incubated 30 minutes；Described nano silicon is mixed by 2:1 part by weight with nano aluminium oxide with nano silicon in nano aluminium oxide mixture, and the granularity of nano silicon is 18-22nm, and the granularity of nano aluminium oxide is 32-35nm.
Further, described mica powder is to be mixed by 2:1 mass ratio with without the mica powder of calcining by through low temperature calcination mica powder, it can improve heatproof and decay resistance, mica powder calcining heat through low temperature calcination is 150 DEG C, calcination time is 40 minutes, and the granularity of described mica powder is 450-480 mesh.
Further, the granularity of described aluminium-hydroxide powder is 450-480 mesh, and aluminium-hydroxide powder is through pretreatment, is put into by aluminium-hydroxide powder in the caprylic acid solution that mass fraction is 0.75%, after soaking 15 minutes, filters, is dried.
Further, described adjuvant is made up of following component in percentage terms: attapulgite modified 80%, isopropanol 20%, and the two is mixed under 4-8 DEG C of low temperature；Described attapulgite modified it is made up of following methods: first soak attapulgite 2-3 hour with 1.5% mass concentration sodium hydroxide solution, filter, be dried, then with 280 DEG C calcining 0.5 hour after, attapulgite is put in clear water soak 15 minutes, filter, placing into mass concentration is to soak after 10 minutes in 6.5% hydrogen peroxide solution, and filtration drying is crushed to 300-350 mesh,, the shock resistance flexibility after packaging plastic solidifies can be improved by adding adjuvant.
Further, described triethylene tetramine is mixed by 1:5 mass ratio with m-phenylene diamine (MPD) with triethylene tetramine in m-phenylene diamine (MPD) mixture.
Further, described SILICA FUME is to be mixed by 1:1 mass ratio with without the SILICA FUME of calcining by through high-temperature calcination SILICA FUME, SILICA FUME calcining heat through high-temperature calcination is 450 DEG C, and calcination time is 10 minutes, and the granularity of described SILICA FUME is 450-480 mesh.
Further, component A and B component, at 30 DEG C, are mixed by 2:1 mass ratio, obtain LED packaging plastic.
The invention has the beneficial effects as follows, compared with prior art:
The present invention is by improving production technology and formula, and the LED packaging plastic of preparation, viscosity is relatively low, infiltration property is good, and mobility is good, easy dyeing, easy froth breaking, can try out the time long；In solidification process, layering will not be produced, can middle temperature or hot setting, curing rate is fast；Curing exotherm amount is low, and shrinkage factor is little, and moisture-proof is good；Solidfied material surfacing, light, hardness height, solidfied material excellent insulation performance, good mechanical performance, heat-resist, water imbibition and thermal coefficient of expansion are little；Solidfied material is fire-retardant, heat conduction, high-low temperature resistant alternation, weatherability requirement, solidfied material mechanical performance is good, and electrical characteristic is excellent, resistance to atmospheric aging.
Detailed description of the invention
A kind of LED packaging plastic, is mixed with B component by component A；Described component A is made up of following component by weight, glycidyl ester epoxy resin 80 parts, glycidyl ester type epoxy resin 20 parts, acrylic resin modified 3 parts, mica powder 0.4 part, epoxy propane butyl ether 5 parts, adjuvant 1 part；Time prepared by component A, being mixed by all the components, control temperature to 80-85 DEG C, pressure is 4-5MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,；Described B component is made up of following component by weight: glycidyl ester epoxy resin 20 parts, diepoxy propane ethylether 1.5 parts, aluminium-hydroxide powder 0.5 part, triethylene tetramine and 5 parts of m-phenylene diamine (MPD) mixture, SILICA FUME 0.8 part；Time prepared by B component, being mixed by all the components, control temperature to 65-68 DEG C, pressure is 5.5-6MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,.
Further, described acrylic resin modified preparation method is: by weight is acrylic resin 3.5% nano silicon mix with nano aluminium oxide mixture and acrylic resin after under 2.5MPa pressure, be heated to 180 DEG C, be incubated 30 minutes；Described nano silicon is mixed by 2:1 part by weight with nano aluminium oxide with nano silicon in nano aluminium oxide mixture, and the granularity of nano silicon is 18-22nm, and the granularity of nano aluminium oxide is 32-35nm.
Further, described mica powder is to be mixed by 2:1 mass ratio with without the mica powder of calcining by through low temperature calcination mica powder, it can improve heatproof and decay resistance, mica powder calcining heat through low temperature calcination is 150 DEG C, calcination time is 40 minutes, and the granularity of described mica powder is 450-480 mesh.
Further, the granularity of described aluminium-hydroxide powder is 450-480 mesh, and aluminium-hydroxide powder is through pretreatment, is put into by aluminium-hydroxide powder in the caprylic acid solution that mass fraction is 0.75%, after soaking 15 minutes, filters, is dried.
Further, described adjuvant is made up of following component in percentage terms: attapulgite modified 80%, isopropanol 20%, and the two is mixed under 4-8 DEG C of low temperature；Described attapulgite modified it is made up of following methods: first soak attapulgite 2-3 hour with 1.5% mass concentration sodium hydroxide solution, filter, be dried, then with 280 DEG C calcining 0.5 hour after, attapulgite is put in clear water soak 15 minutes, filter, placing into mass concentration is to soak after 10 minutes in 6.5% hydrogen peroxide solution, and filtration drying is crushed to 300-350 mesh,, the shock resistance flexibility after packaging plastic solidifies can be improved by adding adjuvant.
Further, described triethylene tetramine is mixed by 1:5 mass ratio with m-phenylene diamine (MPD) with triethylene tetramine in m-phenylene diamine (MPD) mixture.
Further, described SILICA FUME is to be mixed by 1:1 mass ratio with without the SILICA FUME of calcining by through high-temperature calcination SILICA FUME, SILICA FUME calcining heat through high-temperature calcination is 450 DEG C, and calcination time is 10 minutes, and the granularity of described SILICA FUME is 450-480 mesh.
Further, component A and B component, at 30 DEG C, are mixed by 2:1 mass ratio, obtain LED packaging plastic.
LED packaging plastic performance parameter of the present invention:
Viscosity CP/S Proportion g/cm Pot-life (moon)
8500 1.042 8
Table 1
Condensate performance parameter:
Shore hardness (25 DEG C) shore-D Water absorption rate %(24h) Glass transition temperature DEG C Proof voltage KV/mm Linear expansion coefficient cm/cm/ DEG C
98 ＜ 0.1 140 28 6.0×10^-5
Table 2
As can be seen from Table 1 and Table 2, this LED packaging plastic superior performance.

Claims (8)

1. a LED packaging plastic, it is characterised in that be mixed with B component by component A；Described component A is made up of following component by weight, glycidyl ester epoxy resin 80 parts, glycidyl ester type epoxy resin 20 parts, acrylic resin modified 3 parts, mica powder 0.4 part, epoxy propane butyl ether 5 parts, adjuvant 1 part；Time prepared by component A, being mixed by all the components, control temperature to 80-85 DEG C, pressure is 4-5MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,；Described B component is made up of following component by weight: glycidyl ester epoxy resin 20 parts, diepoxy propane ethylether 1.5 parts, aluminium-hydroxide powder 0.5 part, triethylene tetramine and 5 parts of m-phenylene diamine (MPD) mixture, SILICA FUME 0.8 part；Time prepared by B component, being mixed by all the components, control temperature to 65-68 DEG C, pressure is 5.5-6MPa, and is stirred, and mixing speed is 450-500r/min, keeps 4-5 hour,.
A kind of LED packaging plastic the most according to claim 1, it is characterized in that, described acrylic resin modified preparation method is: by weight is acrylic resin 3.5% nano silicon mix with nano aluminium oxide mixture and acrylic resin after under 2.5MPa pressure, it is heated to 180 DEG C, is incubated 30 minutes；Described nano silicon is mixed by 2:1 part by weight with nano aluminium oxide with nano silicon in nano aluminium oxide mixture, and the granularity of nano silicon is 18-22nm, and the granularity of nano aluminium oxide is 32-35nm.
A kind of LED packaging plastic the most according to claim 1, it is characterized in that, described mica powder is to be mixed by 2:1 mass ratio with without the mica powder of calcining by through low temperature calcination mica powder, mica powder calcining heat through low temperature calcination is 150 DEG C, calcination time is 40 minutes, and the granularity of described mica powder is 450-480 mesh.
A kind of LED packaging plastic the most according to claim 1, it is characterised in that the granularity of described aluminium-hydroxide powder is 450-480 mesh, and aluminium-hydroxide powder is through pretreatment, is put into by aluminium-hydroxide powder in the caprylic acid solution that mass fraction is 0.75%, after soaking 15 minutes, filter, be dried.
A kind of LED packaging plastic the most according to claim 1, it is characterised in that described adjuvant is made up of following component in percentage terms: attapulgite modified 80%, isopropanol 20%, and the two is mixed under 4-8 DEG C of low temperature；Described attapulgite modified it is made up of following methods: first soak attapulgite 2-3 hour with 1.5% mass concentration sodium hydroxide solution, filter, it is dried, after again with 280 DEG C of calcinings 0.5 hour, attapulgite is put in clear water and soak 15 minutes, filter, placing into mass concentration is to soak after 10 minutes in 6.5% hydrogen peroxide solution, filtration drying, is crushed to 300-350 mesh,.
A kind of LED packaging plastic the most according to claim 1, it is characterised in that described triethylene tetramine is mixed by 1:5 mass ratio with m-phenylene diamine (MPD) with triethylene tetramine in m-phenylene diamine (MPD) mixture.
A kind of LED packaging plastic the most according to claim 1, it is characterized in that, described SILICA FUME is to be mixed by 1:1 mass ratio with without the SILICA FUME of calcining by through high-temperature calcination SILICA FUME, SILICA FUME calcining heat through high-temperature calcination is 450 DEG C, calcination time is 10 minutes, and the granularity of described SILICA FUME is 450-480 mesh.
A kind of LED packaging plastic the most according to claim 1, it is characterised in that component A and B component, at 30 DEG C, are mixed by 2:1 mass ratio, obtain LED packaging plastic.
CN201610263363.3A 2016-04-26 2016-04-26 LED (light-emitting diode) packaging adhesive Pending CN105838306A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610263363.3A CN105838306A (en) 2016-04-26 2016-04-26 LED (light-emitting diode) packaging adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610263363.3A CN105838306A (en) 2016-04-26 2016-04-26 LED (light-emitting diode) packaging adhesive

Publications (1)

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CN105838306A true CN105838306A (en) 2016-08-10

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114360390A (en) * 2021-09-30 2022-04-15 深圳市聚飞光电股份有限公司 Manufacturing method of LED display module for splicing
CN114933783A (en) * 2022-05-31 2022-08-23 江苏恒烽显示科技有限公司 Resin material for LED packaging and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101851480A (en) * 2010-05-11 2010-10-06 华烁科技股份有限公司 Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate
CN103361019A (en) * 2013-08-05 2013-10-23 安徽康瑞鑫电子科技有限公司 Epoxy resin pouring sealant
CN103694644A (en) * 2013-12-30 2014-04-02 景旺电子科技(龙川)有限公司 Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof
CN104152093A (en) * 2014-08-16 2014-11-19 烟台德邦科技有限公司 Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof
CN104178040A (en) * 2014-09-07 2014-12-03 尹红 Sealant for photovoltaic module and preparation method of sealant

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101851480A (en) * 2010-05-11 2010-10-06 华烁科技股份有限公司 Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate
CN103361019A (en) * 2013-08-05 2013-10-23 安徽康瑞鑫电子科技有限公司 Epoxy resin pouring sealant
CN103694644A (en) * 2013-12-30 2014-04-02 景旺电子科技(龙川)有限公司 Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof
CN104152093A (en) * 2014-08-16 2014-11-19 烟台德邦科技有限公司 Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof
CN104178040A (en) * 2014-09-07 2014-12-03 尹红 Sealant for photovoltaic module and preparation method of sealant

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114360390A (en) * 2021-09-30 2022-04-15 深圳市聚飞光电股份有限公司 Manufacturing method of LED display module for splicing
CN114933783A (en) * 2022-05-31 2022-08-23 江苏恒烽显示科技有限公司 Resin material for LED packaging and preparation method thereof
CN114933783B (en) * 2022-05-31 2023-08-25 江苏恒烽显示科技有限公司 Resin material for LED packaging and preparation method thereof

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Application publication date: 20160810