CN102533192A - Flame retardant high-heat-conductivity epoxy resin electronic adhesive glue - Google Patents
Flame retardant high-heat-conductivity epoxy resin electronic adhesive glue Download PDFInfo
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- CN102533192A CN102533192A CN2011104480748A CN201110448074A CN102533192A CN 102533192 A CN102533192 A CN 102533192A CN 2011104480748 A CN2011104480748 A CN 2011104480748A CN 201110448074 A CN201110448074 A CN 201110448074A CN 102533192 A CN102533192 A CN 102533192A
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Abstract
The invention relates to flame retardant high-heat-conductivity epoxy resin electronic adhesive glue, which is formed by mixing ingredients A with amine curing agents according to the weight ratio of 100:(5-12), wherein the ingredients A comprises the following ingredients in parts by weight: 50 to 60 parts of spherical alumina powder, 20 to 30 parts of flame retardant fillings, 10 to 20 parts of epoxy resin, 1.5 to 2.5 parts of reactive diluents, 2 to 3 parts of halogen-free liquid flame retardants, 2 to 3 parts of toughening agents, 0.2 to 0.8 parts of thixotropic agents and 0.1 to 0.5 parts of coupling agents. According to the adhesive glue provided by the invention, the adhesive glue filled by the spherical alumina has higher condensate heat conductivity when being compared with the adhesive glue filled by the non-spherical alumina, and the heat accumulation of heating devices can be fast dispersed.
Description
Technical field
The present invention relates to a kind of bonded adhesives, relate in particular to a kind of fire-retardant high-thermal-conductivity epoxy resin electronics bonded adhesives, belong to the bonded adhesives technical field.
Background technology
Thermal conductive adhesive is used for bonding and the encapsulation under the electrical isolation occasion of electronic apparatus components and parts more.Development along with unicircuit in the electronic industry and package technique; The volume trend miniaturized of electronic devices and components and logical circuit; It is to multifunction and integrated direction development; Certainly will cause the significantly increase of thermal value, this just proposes very high requirement to the heat conductivility of bonding and packaged material, and therefore improving thermal conductivity is the problem of demanding urgently day by day.
The approach that improves the polymkeric substance heat conductivility has two kinds: 1, synthetic structural polymer with high thermal conductivity coefficient; As have polyacetylene, polyaniline, polypyrrole of good heat conductive performance etc.; Main through electronics heat conduction mechanism realization heat conduction; Or have complete crystallinity, realize the polymkeric substance of heat conduction through phonon; 2, through adding high heat conduction inorganics polymkeric substance is filled preparation polymer/inorganic thing heat-conductive composite material.Because good heat conductive performance organic polymer costs an arm and a leg, filling heat conduction inorganic filler is the method that extensively adopts at present, adopts many inorganic heat conductive fillers to mainly contain aluminum oxide, SP 1, aluminium nitride AlN etc. at present.
SP 1 (BN) has high thermal conductivity; High disruptive strength is arranged, but because BN density less (2.25g/cm3), when the BN consumption surpass resin system 30% the time; Resin viscosity increase, skewness, mixed glue is difficulty very, and the complicated process of preparation cost is too high.
Aluminium nitride AlN (ALN) is as a kind of new packing, and domestic just the beginning in recent years produced in enormous quantities, and quality product and stability need to investigate, and price is more expensive, and use can make cost too high separately.
Non-ball-aluminium oxide (AL
2O
3) electrical insulation capability is good, ME is ripe, and low price is used the most general.But its thermal conductivity is too low, and not only high filling is limited for improving thermal conductivity, and high filling can cause negative impact, as has a strong impact on mechanical property.
So the kind of mineral filler, shape and usage quantity thereof are the key points of the high heat conductive electronic bonded adhesives of preparation.Therefore, through changing the kind of mineral filler, a kind of heat conductivility of invention design is high, and preparation technology is simple, and the bonded adhesives that cost is low becomes a kind of inexorable trend.
Simultaneously the same with most of organic polymer materials, the curable epoxide thing is more inflammable, causes fire easily, and the whole world is annual so and caused huge loss of life and personal injury and property damage.Therefore people have carried out fire-retardant finish to the epoxy pouring sealant that is applied in electric field, have added fire retardant.What in recent decades, use was maximum is exactly halogenated flame retardant.Its advantage is a flame retardant resistance efficiently, adds in a small amount to reach higher fire-retardant rank, to less by the influence of ignition resistant substrate inherent physical and mechanical properties.Yet a large amount of hydrogen halide that halogenated flame retardant discharged in when burning are not only toxic but also be corrosive; Can produce carcinogenic substances such as dioxin simultaneously; Also can generate the material that damages the ozone layer in addition, so the healthy halogen flame with the destruction environment of harm humans is forbidden by countries in the world gradually in recent years.
So preparing a kind of fire-retardant high-thermal-conductivity epoxy resin electronics bonded adhesives, the fire retardant that has highly effective flame-retardant property and an environmental protection through introducing becomes a kind of inexorable trend.
Summary of the invention
It is high that technical problem to be solved by this invention provides a kind of heat conductivility, and flame retardant properties is good, environmental protection, and cost is low, the simple fire-retardant high-thermal-conductivity epoxy resin electronics bonded adhesives of preparation,
The technical scheme that the present invention solves the problems of the technologies described above is following: a kind of fire-retardant high-thermal-conductivity epoxy resin electronics bonded adhesives is mixed by 100: 5～12 weight proportion by A component and amine curing agent;
Wherein, said A component comprises each raw material of following parts by weight: 0.1～0.5 part of 50～60 parts in ball-aluminium oxide powder, 20～30 parts of fire-retardant fillers, 10～20 parts of epoxy resin, 1.5～2.5 parts of reactive thinners, 2～3 parts of halogen liquid flame retardants, 2～3 parts of toughner, 0.2～0.8 part of thixotropic agent and coupling agent.
The invention has the beneficial effects as follows: the bonded adhesives that ball-aluminium oxide of the present invention is filled contrasts the bonded adhesives that non-ball-aluminium oxide is filled, and the cured article thermal conductivity is high, can disperse the heat accumulation of heating components and parts rapidly; Price is cheap than SP 1 (BN), aluminium nitride AlN (ALN), and cost is low; Introduce halogen-free flame-retardant and when guaranteeing highly effective flame-retardant, do not produce harm humans health and the material that destroys environment, very environmental protection; Adopting two component systems is ambient temperature curable, can be heating and curing again, easy to operate.
On the basis of technique scheme, the present invention can also do following improvement.
Further, also containing parts by weight in the said A component is 0.2 part pigment.
Adopt the beneficial effect of above-mentioned further scheme to be, pigment is in order to satisfy the product appearance requirement.
Further, said pigment is carbon black.
Further, said amine curing agent is polyetheramine and/or polymeric amide.
Adopt the beneficial effect of above-mentioned further scheme to be, i.e. ambient temperature curable, heating curable is given good electric property of cured article and mechanical property again.
Further, the median size of said ball-aluminium oxide powder is 5～45 μ m, can adopt a kind of particle diameter to fill or two kinds of composite fillings of particle diameter.
Adopt the beneficial effect of above-mentioned further scheme to be, this ball-aluminium oxide powder diameter is neat, spherical rule, high filler loading capacity, high thermal conductivity.
Further, said fire-retardant filler is a white lake.
Adopt the beneficial effect of above-mentioned further scheme to be, absorb heat 1.96KJ/g when white lake decomposes, can reduce the temperature of burning surface, good flame retardation effect can reach the UL94-V0 grade standard; The water vapour that generates can be caught obnoxious flavour, reduces smog and poison gas, has the cigarette effect of pressing down; Do not produce toxic gas during decomposition, do not produce the corrodibility products of combustion yet.
Further, said epoxy resin is a kind of or any several kinds mixture in bisphenol A type epoxy resin, bisphenol f type epoxy resin, novolac epoxy, glycidyl amine type epoxy resin, the cycloaliphatic epoxy resin.
Adopt the beneficial effect of above-mentioned further scheme to be, give characteristics such as system low-shrinkage, weathering resistance, thermotolerance.
Further, said reactive thinner can be n-butyl glycidyl ether (BGE), glycidyl allyl ether (AGE), phenyl glycidyl ether (PGE), 1, a kind of or any several kinds mixture in the 4-butanediol diglycidyl ether (BDGE).
Adopt the beneficial effect of above-mentioned further scheme to be, reduce resin viscosity, improve wellability, increase amount of filler.
Further, said halogen liquid flame retardant is a phosphorus flame retardant, and like the Doher6200 of Dongguan Dao Er chemical industry, Qingdao joins FR-XS704, the FR-XS701 that beautifies the worker.
Adopt the beneficial effect of above-mentioned further scheme to be, have good flame retardant resistance, environmental protection, good with epoxy resin compatibility property, reduce resin viscosity, increase amount of filler.
Further, said toughner can be carboxyl end of the liquid acrylonitrile-butadiene rubber (CTBN), hydroxyl terminated butyl nitrile (HTBN) rubber (HTBN) or strange scholar's toughner.
Adopt the beneficial effect of above-mentioned further scheme to be, improve epoxy resin cured product fragility, improve the epoxy resin cured product anti-cracking performance.
Further, said thixotropic agent is an aerosil.
Adopt the beneficial effect of above-mentioned further scheme to be, increase the thixotropy and the viscosity of glue system, the system that makes is thixotropic glue cream, and antitrickle is convenient to construction, gives good physical mechanical stability.
Further, said aerosil is goldschmidt chemical corporation Aerosil R202 or Aerosil 200.
Further, said coupling agent is the organo silane coupling agent of trade mark KH560.
Adopt the beneficial effect of above-mentioned further scheme to be, be of value to the dispersion of filler, can strengthen the filling of filler; Guarantee more media-resistant, water-fast, ageing-resistant of splicing face simultaneously.
During use, the weight ratio by 100: 5～12 takes by weighing A component and amine curing agent, and is even in stirring at room, solidifies 24～48 hours or gets final product in 4 hours in 80 ℃ of curing in 25 ℃.
Embodiment
Below principle of the present invention and characteristic are described, institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
Embodiment 1
50 parts in ball-aluminium oxide powder (homemade median size is 40 μ m), 20 parts in white lake, 15 parts of bisphenol A type epoxy resins; 5 parts of bisphenol f type epoxy resins, 2.5 parts of glycidyl allyl ethers, Doher62003 part; 3 parts of hydroxyl terminated butyl nitrile (HTBN) rubber, KH5600.5 part, 0.8 part of aerosil AerosilR202; 0.2 part of carbon black at room temperature stirs, and makes the A component; Polyamide 6 51 and 1: 1 amine curing agent of polyetheramine D-400 weight ratio.A component and amine curing agent mixed by weight 100: 12, and at room temperature vacuum stirring is even, and mixture solidified survey cured article thermal conductivity 24 hours in 25 ℃.
Embodiment 2
55 parts in ball-aluminium oxide powder (homemade median size is 40 μ m), 22 parts in white lake, 12 parts of bisphenol A type epoxy resins; 3 parts of bisphenol f type epoxy resins, 2 parts of n-butyl glycidyl ethers, 2.5 parts of Doher6200; 2.5 parts of hydroxyl terminated butyl nitrile (HTBN) rubber, 0.3 part of KH560,0.5 part of aerosil Aerosil R202; 0.2 part of carbon black at room temperature stirs, and makes the A component; Polyamide 6 51 and 1: 1 amine curing agent of polyetheramine D-400 weight ratio.A component and amine curing agent mixed by weight 100: 8.5, and at room temperature vacuum stirring is even, and mixture solidified survey cured article thermal conductivity 36 hours in 25 ℃.
Embodiment 3
60 parts in ball-aluminium oxide powder (homemade median size is 40 μ m), 24 parts in white lake, 7 parts of bisphenol A type epoxy resins; 3 parts of bisphenol f type epoxy resins, 1.5 parts of phenyl glycidyl ethers, 62002 parts of Doher; 2 parts of hydroxyl terminated butyl nitrile (HTBN) rubber, KH5600.1 part, aerosil Aerosil R2020.2 part; 0.2 part of carbon black at room temperature stirs, and makes the A component; Polymeric amide Versamid 125 and 1: 1 amine curing agent of polyetheramine D-400 weight ratio.A component and amine curing agent mixed by weight 100: 5, and at room temperature vacuum stirring is even, and mixture solidified survey cured article thermal conductivity 48 hours in 25 ℃.
Embodiment 4
51 parts in ball-aluminium oxide powder (Japanese median size is 25 μ m), 30 parts in white lake, 8 parts of bisphenol A type epoxy resins, 2 parts of cycloaliphatic epoxy resins; 2 parts of glycidyl amine type epoxy resins, 1,1.5 parts of 4-butanediol diglycidyl ethers, 2 parts of FR-XS704; 2 parts of carboxyl end of the liquid acrylonitrile-butadiene rubber, 0.5 part of KH560,200 0.8 parts of aerosil Aerosil; 0.2 part of carbon black at room temperature stirs, and makes the A component; Kymene 00 and 1: 1 amine curing agent of polyetheramine D-400 weight ratio.A component and amine curing agent mixed by weight 100: 6.6, and at room temperature vacuum stirring is even, and mixture solidified survey cured article thermal conductivity 4 hours in 80 ℃.
Embodiment 5
52 parts in ball-aluminium oxide powder (Japanese 45 μ m: 5 μ m=6: 4 (weight ratios)), 25 parts in white lake, 12 parts of bisphenol A type epoxy resins, 4 parts of novolac epoxys; 1,1.5 parts of 4-butanediol diglycidyl ethers, 2.5 parts of FR-XS704; 2 parts of carboxyl end of the liquid acrylonitrile-butadiene rubber, 0.3 part of KH560,200 0.5 parts of aerosil Aerosil; 0.2 part of carbon black at room temperature stirs, and makes the A component; Polyamide 6 51 and 1: 1 amine curing agent of polyetheramine D-400 weight ratio.A component and amine curing agent mixed by weight 100: 9.6, and at room temperature vacuum stirring is even, and mixture solidified survey cured article thermal conductivity 4 hours in 80 ℃.
Embodiment 6
53 parts in ball-aluminium oxide powder (Japanese 45 μ m: 5 μ m=6: 4 (weight ratios)), 20 parts in white lake, 16 parts of bisphenol A type epoxy resins; 3 parts of novolac epoxys, 2 parts of n-butyl glycidyl ethers, 3 parts of FR-XS701; 2 parts of strange scholar's toughner, 0.3 part of KH560,0.5 part of aerosil Aerosil200; 0.2 part of carbon black at room temperature stirs, and makes the A component; The amine curing agent of D-400.A component and amine curing agent mixed by weight 100: 10.5, and at room temperature vacuum stirring is even, and mixture solidified survey cured article thermal conductivity 4 hours in 80 ℃.
The comparative example 1
50 parts in non-ball-aluminium oxide powder (Japanese A-42-6), 20 parts in white lake, 17 parts of bisphenol A type epoxy resins; 3 parts of cycloaliphatic epoxy resins, 2.5 parts of n-butyl glycidyl ethers, FR-XS7043 part; 3 parts of strange scholar's toughner, 0.5 part of KH560,0.8 part of aerosil Aerosil R202; 0.2 part of carbon black at room temperature stirs, and makes the A component; Polyamide 6 51 and 1: 1 amine curing agent of polyetheramine D-400 weight ratio.A component and amine curing agent mixed by weight 100: 12, and at room temperature vacuum stirring is even, and mixture solidified survey cured article thermal conductivity 24 hours in 25 ℃.
The comparative example 2
60 parts in non-ball-aluminium oxide powder (Japanese A-42-6), 24 parts in white lake, 7 parts of bisphenol A type epoxy resins; 3 parts of cycloaliphatic epoxy resins, 1.5 parts of n-butyl glycidyl ethers, 2 parts of FR-XS701; 2 parts of strange scholar's toughner, 0.1 part of KH560,0.2 part of aerosil Aerosil R202; 0.2 part of carbon black at room temperature stirs, and makes the A component; Polymeric amide Versamid 125 and 1: 1 amine curing agent of polyetheramine D-400 weight ratio.A component and amine curing agent mixed by weight 100: 5, and at room temperature vacuum stirring is even, and mixture solidified survey cured article thermal conductivity 48 hours in 25 ℃.
Test the performance of epoxy resin electronics bonded adhesives of the present invention through following test experiments.
Test experiments 1: thermal conductivity test
Use the TPS 2500S type thermal conductivity measuring apparatus of Hot Disk company, the sample that sample that embodiment 1～6 is made according to ASTM E1530 and comparative example 1～2 make carries out the thermal conductivity test.
The result is as shown in table 1 for the test gained.
Table 1
Can find out that from The above results with the epoxy resin heat conductive electronic bonded adhesives that ball-aluminium oxide is filled, contrast the epoxy resin heat conductive electronic bonded adhesives that non-ball-aluminium oxide is filled, the cured article thermal conductivity is high.High thermal conductivity coefficient can satisfy the bonding requirements of the big electronic devices and components of thermal value, this be the non-ball-aluminium oxide epoxy resin heat conductive electronic joint sealant of filling can not accomplish.
Test experiments 2: flame retardant rating test
Embodiment is solidified in the mould of the wide * thickness=125*13*13mm of long *, pouring into the epoxy resin electronics bonded adhesives that has mixed, obtains the strip sample of the wide * thickness=125*13*13mm of long *.Normal beam technique according to GB/T 2408-1996 prescribed by standard carries out the test of flame retardant rating to the sample that embodiment 1～6 makes.
The result is as shown in table 2 for the test gained.
Table 2
| For the first time during residual flame | For the second time during residual flame | Twice residual flame time |
| Between t1 (s) | Between t2 (s) | Sum t1+t2 (S) | |
| The sample of embodiment 1 | 0 | 3 | 3 |
| The sample of embodiment 2 | 0 | 3 | 3 |
| The sample of embodiment 3 | 0 | 2 | 2 |
| The sample of embodiment 4 | 0 | 2 | 2 |
| The sample of embodiment 5 | 0 | 3 | 3 |
| The sample of embodiment 6 | 0 | 3 | 3 |
Can find out that from The above results 6 embodiment can both reach the UL94-V0 flame retardant rating of 13mm thickness, this explanation epoxy resin electronics bonded adhesives of the present invention is one type of epoxy resin electronics bonded adhesives that flame retardant properties is good.
Fire-retardant high-thermal-conductivity epoxy resin electronics bonded adhesives of the present invention is mainly used in the bonding of the electronic devices and components that need heat conduction and heat radiation; Its thermal conductivity is 1.0～1.1W/mK; Thermal expansivity is＜40ppm/ ℃, and volumetric shrinkage＜0.5%, volume specific resistance＞10
15Ω cm; With its bonding radiator element and components and parts, can play be adhesively fixed, the effect of heat conduction, heat-resisting, insulation, cold-resistant thermal shocking.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a fire-retardant high-thermal-conductivity epoxy resin electronics bonded adhesives is characterized in that, is mixed by A component and the amine curing agent weight proportion by 100:5～12;
Wherein, said A component comprises each raw material of following parts by weight: 0.1～0.5 part of 50～60 parts in ball-aluminium oxide powder, 20～30 parts of fire-retardant fillers, 10～20 parts of epoxy resin, 1.5～2.5 parts of reactive thinners, 2～3 parts of halogen liquid flame retardants, 2～3 parts of toughner, 0.2～0.8 part of thixotropic agent and coupling agent.
2. bonded adhesives according to claim 1 is characterized in that, said A component comprises that also parts by weight are 0.2 part pigment.
3. bonded adhesives according to claim 2 is characterized in that, said pigment is carbon black.
4. according to each described bonded adhesives of claim 1 to 3, it is characterized in that: said amine curing agent is polyetheramine and/or polymeric amide.
5. according to each described bonded adhesives of claim 1 to 3, it is characterized in that the median size of said ball-aluminium oxide powder is 5～45 μ m, its filling mode adopts a kind of particle diameter to fill or any two kinds of composite fillings of particle diameter.
6. according to each described bonded adhesives of claim 1 to 3, it is characterized in that said fire-retardant filler is a white lake.
7. according to each described bonded adhesives of claim 1 to 3; It is characterized in that said epoxy resin is a kind of or any several kinds mixture in bisphenol A type epoxy resin, bisphenol f type epoxy resin, novolac epoxy, glycidyl amine type epoxy resin, the cycloaliphatic epoxy resin.
8. according to each described bonded adhesives of claim 1 to 3; It is characterized in that; Said reactive thinner is n-butyl glycidyl ether, glycidyl allyl ether, phenyl glycidyl ether, 1, a kind of or any several kinds mixture in the 4-butanediol diglycidyl ether.
9. according to each described bonded adhesives of claim 1 to 3, it is characterized in that said halogen liquid flame retardant is a phosphorus flame retardant; Said toughner is any one in carboxyl end of the liquid acrylonitrile-butadiene rubber, hydroxyl terminated butyl nitrile (HTBN) rubber or the strange scholar's toughner.
10. according to each described bonded adhesives of claim 1 to 3, it is characterized in that said thixotropic agent is an aerosil; Said coupling agent is an organo silane coupling agent.
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