CN112143426A - Double-component epoxy adhesive and preparation method and application thereof - Google Patents
Double-component epoxy adhesive and preparation method and application thereof Download PDFInfo
- Publication number
- CN112143426A CN112143426A CN202010576577.2A CN202010576577A CN112143426A CN 112143426 A CN112143426 A CN 112143426A CN 202010576577 A CN202010576577 A CN 202010576577A CN 112143426 A CN112143426 A CN 112143426A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- component
- weight
- adhesive
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a two-component epoxy adhesive and a preparation method and application thereof. The adhesive comprises the following components in percentage by weight of 1: 0.8-1.2 of component A and component B; the component A comprises the following raw materials in parts by weight: 5-15% of epoxy resin, 10-25% of polyurethane modified epoxy resin, 5-20% of toughening agent, 3-10% of epoxy diluent, 20-50% of halogen-free flame retardant filler, 20-50% of heat-conducting filler, 0.1-1% of defoaming agent and 1-3% of white carbon black, wherein the sum of the content percentages of the raw materials is 100%; the component B comprises the following raw materials in parts by weight: 5-15% of fatty amine, 2-10% of polyether amine, 8-16% of modified polyamide, 20-50% of halogen-free flame retardant filler, 20-50% of heat-conducting filler, 0.1-1% of defoaming agent and 1-3% of white carbon black, wherein the sum of the content percentages of the raw materials is 100%. The adhesive has the characteristics of environmental protection, flame retardance, heat conduction, high curing speed, high bonding strength, good toughness and vibration resistance, and is very suitable for heat conduction bonding between a power battery cell and a bottom water-cooled plate.
Description
Technical Field
The invention relates to a two-component epoxy adhesive and a preparation method and application thereof.
Background
The new energy automobile industry is developed rapidly at present, and the cruising ability and the safety of the new energy automobile industry are focused by people. The power battery is used as a core component of a new energy automobile, and the energy density, the charge and discharge speed and the heat dissipation capacity of the power battery are very important. The adhesive is more and more important as an auxiliary material of the power battery at present, and is mainly used for fixing, protecting, weight reducing, shock absorbing, noise reducing, heat transferring and the like. The fixing of the electric core and the bottom water-cooling plate of the square battery requires that the adhesive has good bonding and fixing effects, fatigue resistance, aging resistance, excellent dielectric property and certain heat transfer capacity.
Chinese patent applications 201911052237.3 and 201910742555.6 respectively adopt two-component polyurethane and two-component epoxy adhesive to realize the bonding of the battery core in the power battery, but the two-component polyurethane and the two-component epoxy adhesive do not have high heat-conducting performance and cannot be used between the battery core and the water cooling plate; in the Chinese patent application 201811227378.X, a MS-epoxy hybrid system is adopted to realize heat conduction bonding, but the time for reaching the final strength is 7 days, so that the efficiency of a production line is influenced to a certain extent; the Chinese patent application 201910624733.5 adopts two-component epoxy glue to realize heat conduction bonding, but the components of the two-component epoxy glue contain bromine, antimony and other components which are not environment-friendly; the chinese patent application 201610974942.9 adopts two-component epoxy glue to realize heat conduction bonding, but it does not reflect bonding strength indexes such as shear strength, toughness indexes such as elongation at break, and the epoxy glue cannot pass the anti-vibration test under the condition of insufficient bonding strength or poor toughness, and cannot ensure long-term vibration use.
In summary, although some adhesive products are applied to the power battery industry, a product with more excellent comprehensive performance is lacked.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a two-component epoxy adhesive with more excellent comprehensive performance, which has the advantages of good bonding performance, high elongation at break, excellent aging performance such as cold and hot shock resistance, humidity and heat resistance, fatigue resistance and the like, good manufacturability, high curing speed and the like.
The technical scheme of the invention is as follows:
a double-component epoxy adhesive is characterized in that: the adhesive comprises the following components in percentage by weight of 1: 0.8-1.2 of component A and component B;
the component A comprises the following raw materials in parts by weight:
5-15% of epoxy resin, 10-25% of polyurethane modified epoxy resin, 5-20% of toughening agent, 3-10% of epoxy diluent, 20-50% of halogen-free flame retardant filler, 20-50% of heat-conducting filler, 0.1-1% of defoaming agent and 1-3% of white carbon black, wherein the sum of the content percentages of the raw materials is 100%;
the component B comprises the following raw materials in parts by weight:
5-10% of fatty amine, 5-15% of polyether amine, 10-20% of modified polyamide, 20-50% of halogen-free flame retardant filler, 20-50% of heat-conducting filler, 0.1-1% of defoaming agent and 1-3% of white carbon black, wherein the sum of the content percentages of the raw materials is 100%.
Further, the epoxy resin is one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, hydrogenated bisphenol A epoxy resin, hydrogenated bisphenol F epoxy resin, alicyclic epoxy resin, o-cresol epoxy resin, hydantoin epoxy resin, bisphenol S epoxy resin and bisphenol fluorenyl epoxy resin.
Further, the polyurethane modified epoxy resin is diepoxy-terminated polyurethane.
Further, the toughening agent is one or a mixture of more of nitrile rubber modified epoxy resin and a core-shell structure toughening agent.
Further, the epoxy diluent is one or more of dodecyl glycidyl ether, benzyl glycidyl ether, phenyl glycidyl ether, ethylene glycol diglycidyl ether, butanediol diglycidyl ether and polyhydroxy polyether.
Further, the aliphatic amine is one or a mixture of diethylenetriamine, triethylene tetramine, aminoethyl piperazine and m-xylylenediamine.
Further, the polyether amine is one or a mixture of D2000, T3000 and T5000.
Further, the modified polyamide is one or a mixture of polyether modified polyamide, polyurethane modified polyamide and dimer acid modified polyamide.
Further, the halogen-free flame retardant filler is one or a mixture of magnesium hydroxide, aluminum hydroxide, zinc phosphate, ammonium polyphosphate, melamine cyanurate salt and aluminum hypophosphite.
10. The two-part epoxy adhesive of claim 1, wherein: the heat conducting filler is one or a mixture of silicon dioxide, aluminum oxide, boron nitride and aluminum nitride.
Further, the defoaming agent is one or a mixture of more of a silicone defoaming agent, a polyether defoaming agent and a mineral oil defoaming agent.
Further, the white carbon black is one or a mixture of hydrophilic white carbon black and hydrophobic white carbon black.
The preparation method of the epoxy adhesive comprises the following steps:
(1) adding epoxy resin, polyurethane modified epoxy resin and a toughening agent into a reaction kettle, stirring at a high speed for 30 minutes, adding an epoxy diluent and a defoaming agent, continuing stirring at a high speed for 10 minutes, finally adding a halogen-free flame retardant filler, a heat-conducting filler and white carbon black, and stirring in vacuum for 1 hour to obtain a component A;
(2) adding the fatty amine, the polyether amine, the modified polyamide and the defoaming agent into a reaction kettle, stirring for 30 minutes, adding the halogen-free flame-retardant filler, the heat-conducting filler and the white carbon black, and stirring for 1 hour in vacuum to obtain the component B.
And further, the heat conduction adhesive is used for the heat conduction adhesion of the power battery core and the bottom water cooling plate.
The principle of the invention is as follows:
the double-component epoxy adhesive is compounded by adopting halogen-free flame-retardant filler and heat-conducting filler to obtain flame retardance and heat-conducting property; the high toughness, high bonding strength and anti-seismic performance are ensured by compounding the polyurethane modified epoxy resin with good toughness and excellent adhesive force, the toughening property, the polyether amine, the modified polyamide and the like; the introduction of fatty amines ensures the speed of curing.
By the scheme, the invention at least has the following advantages:
the technical scheme of the invention realizes good bonding performance, high elongation at break, excellent aging performances such as thermal shock resistance, humidity resistance, fatigue resistance and the like, good operability on manufacturability, high curing speed and the like.
The double-component epoxy adhesive provided by the invention has the advantages of good bonding performance to metal and a PET film, high elongation at break, excellent aging performances such as thermal shock resistance, humidity resistance, fatigue resistance and the like, good operability on manufacturability and high curing speed.
The double-component epoxy adhesive provided by the invention integrates the characteristics of environmental protection, flame retardance, heat conduction, high curing speed, high bonding strength, good toughness, vibration resistance and the like, and particularly the vibration resistance meets GB/T31467.3-2015 lithium ion power storage battery packs for electric vehicles and part 3 of the system: the safety requirement and the test method are the test requirements of item 7.2, the flame retardant property conforms to UL94-V0, and the heat-conducting adhesive is very suitable for heat-conducting adhesion between a power battery cell and a bottom water-cooling plate.
The foregoing is a summary of the present invention, and in order to provide a clear understanding of the technical means of the present invention and to be implemented in accordance with the present specification, the following is a detailed description of the preferred embodiments of the present invention.
Detailed Description
The following examples are given to further illustrate the embodiments of the present invention. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The test method adopted by the invention is as follows:
viscosity: measured according to the standard GB/T2794.
The operation time is as follows: time for doubling the viscosity of 100g of the gum solution at 25 ℃.
Hardness: measured according to standard GB/T531.
Shear strength: the substrate was aluminum, as measured according to standard GB/T7124, and was not treated.
Tensile strength: measured according to the standard GB/T1040.
Elongation at break: measured according to the standard GB/T1040.
The embodiment of the invention adopts the following raw materials:
bisphenol a epoxy resin: hongchang electronic materials Ltd
Polyurethane modified epoxy resin: dow chemical Co Ltd
Nitrile rubber modified epoxy resin: CVC of USA
Core-shell structure toughener: kao-a-
Dodecyl glycidyl ether: new remote chemical Co Ltd of Anhui province, China
Butanediol diglycidyl ether: new remote chemical Co Ltd of Anhui province, China
Aminoethyl piperazine: henschel Inc. of USA
M-xylylenediamine: henschel Inc. of USA
Polyether amine D2000: henschel Inc. of USA
Modified polyamide: german winning and creating company
Aluminum hydroxide: jinan Taixing chemical Co Ltd
Magnesium hydroxide: jinan Taixing chemical Co Ltd
Alumina: dongguan gold Ge trihydrate Ltd
Silicon dioxide: dongguan gold Ge trihydrate Ltd
Defoaming agent BYK-550: bike chemical Co Ltd
White carbon H20: wake Germany Co
Example 1
Adding 10 parts by weight of bisphenol A epoxy resin (the viscosity at 25 ℃ is 11,000 mPas), 12.8 parts by weight of polyurethane modified epoxy resin (the viscosity at 25 ℃ is 20,000 mPas) and 10 parts by weight of nitrile rubber modified epoxy resin into a reaction kettle, stirring at high speed for 30 minutes, adding 6 parts by weight of dodecyl glycidyl ether and BYK-5500.2 parts by weight of defoaming agent, continuing stirring at high speed for 10 minutes, finally adding 30 parts by weight of aluminum hydroxide, 30 parts by weight of silicon dioxide and 201 parts by weight of white carbon black, and stirring in vacuum for 1 hour to obtain the component A.
Adding 10 parts by weight of aminoethyl piperazine, 20005 parts by weight of polyetheramine D, 15 parts by weight of modified polyamide and BYK-5500.2 parts by weight of defoaming agent into a reaction kettle, stirring for 30 minutes, adding 35 parts by weight of aluminum hydroxide, 33.8 parts by weight of silicon dioxide and 201 parts by weight of white carbon black, and stirring for 1 hour in vacuum to obtain a component B.
The weight ratio of the prepared epoxy glue is 1: 1, the viscosity of the component A is 100,000 mPa.s/25 ℃, the viscosity of the component B is 110,000 mPa.s/25 ℃, the operation time is 25 minutes, the hardness after curing is 24 hours is 70D, the shear strength is 16MPa, the tensile strength is 10.5MPa, the elongation at break is 40%, the flame resistance is UL-V0, and the thermal conductivity is 0.75W/(m.K).
Example 2
Adding 5 parts by weight of bisphenol A epoxy resin (the viscosity at 25 ℃ is 8,000 mPa.s), 20.6 parts by weight of polyurethane modified epoxy resin (the viscosity at 25 ℃ is 20,000 mPa.s) and 5 parts by weight of core-shell structure toughening agent into a reaction kettle, stirring at high speed for 30 minutes, adding 8 parts by weight of butanediol diglycidyl ether and 40 parts by weight of defoaming agent BYK-5500.4, continuing stirring at high speed for 10 minutes, finally adding 20 parts by weight of magnesium hydroxide, 40 parts by weight of aluminum oxide and 201 parts by weight of white carbon black, and stirring in vacuum for 1 hour to obtain a component A.
Adding 10 parts by weight of aminoethyl piperazine, 200010 parts by weight of polyetheramine D, 10 parts by weight of modified polyamide and BYK-5500.4 parts by weight of defoaming agent into a reaction kettle, stirring for 30 minutes, adding 30 parts by weight of magnesium hydroxide, 38.6 parts by weight of aluminum oxide and 201 parts by weight of white carbon black, and stirring for 1 hour in vacuum to obtain the component B.
The weight ratio of the prepared epoxy glue is 1: 1, the viscosity of the component A is 950,000 mPa.s/25 ℃, the viscosity of the component B is 98,000 mPa.s/25 ℃, the operation time is 27 minutes, the hardness is 68D after curing for 24 hours, the shear strength is 17.4MPa, the tensile strength is 12.6MPa, the elongation at break is 35%, the flame resistance is UL-V0, and the thermal conductivity is 0.96W/(m.K).
Example 3
Adding 10.2 parts by weight of bisphenol A epoxy resin (the viscosity at 25 ℃ is 14,000 mPas), 6 parts by weight of polyurethane modified epoxy resin (the viscosity at 25 ℃ is 28,000 mPas) and 15 parts by weight of nitrile rubber modified epoxy resin into a reaction kettle, stirring at high speed for 30 minutes, adding 6 parts by weight of butanediol diglycidyl ether and 6 parts by weight of defoaming agent BYK-5500.8, continuing stirring at high speed for 10 minutes, finally adding 20 parts by weight of magnesium hydroxide, 20 parts by weight of silicon dioxide, 20 parts by weight of aluminum oxide and 202 parts by weight of white carbon black, and stirring in vacuum for 1 hour to obtain the component A.
Adding 5 parts by weight of aminoethyl piperazine, 20005 parts by weight of polyetheramine D, 20 parts by weight of modified polyamide and BYK-5500.5 parts by weight of defoaming agent into a reaction kettle, stirring for 30 minutes, adding 30 parts by weight of magnesium hydroxide, 15 parts by weight of silicon dioxide, 22.5 parts by weight of aluminum oxide and 202 parts by weight of white carbon black, and stirring for 1 hour in vacuum to obtain a component B.
The weight ratio of the prepared epoxy glue is 1: 1, the viscosity of the component A is 115,000 mPa.s/25 ℃, the viscosity of the component B is 108,000 mPa.s/25 ℃, the operation time is 35 minutes, the hardness after curing is 24 hours is 66D, the shear strength is 18.2MPa, the tensile strength is 11.1MPa, the elongation at break is 34%, the flame resistance is UL-V0, and the thermal conductivity is 0.84W/(m.K).
Example 4
5 parts by weight of bisphenol A epoxy resin (the viscosity at 25 ℃ is 11,000 mPas), 17.9 parts by weight of polyurethane modified epoxy resin (the viscosity at 25 ℃ is 28,000 mPas), and 10 parts by weight of nitrile rubber modified epoxy resin are added into a reaction kettle, stirred at high speed for 30 minutes, then added with 6 parts by weight of dodecyl glycidyl ether and BYK-5500.1 parts by weight of defoaming agent, stirred at high speed for 10 minutes, finally added with 10 parts by weight of magnesium hydroxide, 20 parts by weight of aluminum hydroxide, 30 parts by weight of aluminum oxide and 201 parts by weight of white carbon black, and stirred in vacuum for 1 hour to obtain the component A.
Adding 15 parts by weight of aminoethyl piperazine, 20005 parts by weight of polyetheramine D, 10 parts by weight of modified polyamide and BYK-5500.1 parts by weight of defoaming agent into a reaction kettle, stirring for 30 minutes, adding 10 parts by weight of magnesium hydroxide, 25 parts by weight of aluminum hydroxide, 33.8 parts by weight of aluminum oxide and 201 parts by weight of white carbon black, and stirring for 1 hour in vacuum to obtain a component B.
The weight ratio of the prepared epoxy glue is 1: 1, the viscosity of the component A is 106,000 mPa.s/25 ℃, the viscosity of the component B is 92,000 mPa.s/25 ℃, the operation time is 20 minutes, the hardness is 73D after curing for 24 hours, the shear strength is 19.6MPa, the tensile strength is 13.6MPa, the elongation at break is 30.5%, the flame resistance is UL-V0, and the thermal conductivity is 0.92W/(m.K).
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (14)
1. A double-component epoxy adhesive is characterized in that: the adhesive comprises the following components in percentage by weight of 1: 0.8-1.2 of component A and component B;
the component A comprises the following raw materials in parts by weight:
5-15% of epoxy resin, 10-25% of polyurethane modified epoxy resin, 5-20% of toughening agent, 3-10% of epoxy diluent, 20-50% of halogen-free flame retardant filler, 20-50% of heat-conducting filler, 0.1-1% of defoaming agent and 1-3% of white carbon black, wherein the sum of the content percentages of the raw materials is 100%;
the component B comprises the following raw materials in parts by weight:
5-10% of fatty amine, 5-15% of polyether amine, 10-20% of modified polyamide, 20-50% of halogen-free flame retardant filler, 20-50% of heat-conducting filler, 0.1-1% of defoaming agent and 1-3% of white carbon black, wherein the sum of the content percentages of the raw materials is 100%.
2. The two-part epoxy adhesive of claim 1, wherein: the epoxy resin is one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, hydrogenated bisphenol A epoxy resin, hydrogenated bisphenol F epoxy resin, alicyclic epoxy resin, o-cresol epoxy resin, hydantoin epoxy resin, bisphenol S epoxy resin and bisphenol fluorenyl epoxy resin.
3. The two-part epoxy adhesive of claim 1, wherein: the polyurethane modified epoxy resin is polyurethane terminated by a diepoxy group.
4. The two-part epoxy adhesive of claim 1, wherein: the toughening agent is one or a mixture of more of nitrile rubber modified epoxy resin and a core-shell structure toughening agent.
5. The two-part epoxy adhesive of claim 1, wherein: the epoxy diluent is one or more of dodecyl glycidyl ether, benzyl glycidyl ether, phenyl glycidyl ether, ethylene glycol diglycidyl ether, butanediol diglycidyl ether and polyhydroxy polyether.
6. The two-part epoxy adhesive of claim 1, wherein: the aliphatic amine is one or a mixture of diethylenetriamine, triethylene tetramine, aminoethyl piperazine and m-xylylenediamine.
7. The two-part epoxy adhesive of claim 1, wherein: the polyether amine is one or a mixture of D2000, T3000 and T5000.
8. The two-part epoxy adhesive of claim 1, wherein: the modified polyamide is one or a mixture of polyether modified polyamide, polyurethane modified polyamide and dimer acid modified polyamide.
9. The two-part epoxy adhesive of claim 1, wherein: the halogen-free flame-retardant filler is one or a mixture of magnesium hydroxide, aluminum hydroxide, zinc phosphate, ammonium polyphosphate, melamine cyanurate salt and aluminum hypophosphite.
10. The two-part epoxy adhesive of claim 1, wherein: the heat conducting filler is one or a mixture of silicon dioxide, aluminum oxide, boron nitride and aluminum nitride.
11. The two-part epoxy adhesive of claim 1, wherein: the defoaming agent is one or a mixture of more of a silicone defoaming agent, a polyether defoaming agent and a mineral oil defoaming agent.
12. The two-part epoxy adhesive of claim 1, wherein: the white carbon black is one or a mixture of hydrophilic white carbon black and hydrophobic white carbon black.
13. The two-component epoxy adhesive according to any one of claims 1 to 12, prepared by the following method:
(1) adding epoxy resin, polyurethane modified epoxy resin and a toughening agent into a reaction kettle, stirring at a high speed for 30 minutes, adding an epoxy diluent and a defoaming agent, continuing stirring at a high speed for 10 minutes, finally adding a halogen-free flame retardant filler, a heat-conducting filler and white carbon black, and stirring in vacuum for 1 hour to obtain a component A;
(2) adding the fatty amine, the polyether amine, the modified polyamide and the defoaming agent into a reaction kettle, stirring for 30 minutes, adding the halogen-free flame-retardant filler, the heat-conducting filler and the white carbon black, and stirring for 1 hour in vacuum to obtain the component B.
14. The two-component epoxy adhesive according to claims 1-12, characterized in that: the heat-conducting adhesive is used for heat-conducting adhesion of the power battery core and the bottom water-cooling plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010576577.2A CN112143426A (en) | 2020-06-22 | 2020-06-22 | Double-component epoxy adhesive and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010576577.2A CN112143426A (en) | 2020-06-22 | 2020-06-22 | Double-component epoxy adhesive and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112143426A true CN112143426A (en) | 2020-12-29 |
Family
ID=73891935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010576577.2A Pending CN112143426A (en) | 2020-06-22 | 2020-06-22 | Double-component epoxy adhesive and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112143426A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112980371A (en) * | 2021-04-08 | 2021-06-18 | 湖北海星瑞新材料科技有限公司 | High-toughness glass fiber reinforced plastic adhesive and preparation method thereof |
| CN113025245A (en) * | 2021-02-25 | 2021-06-25 | 悦声纸业(中国)有限公司 | Preparation method of multi-toughening type epoxy structural adhesive |
| CN114181651A (en) * | 2021-12-20 | 2022-03-15 | 杭州之江有机硅化工有限公司 | Elastic easily-detachable epoxy floor glue and preparation method thereof |
| WO2022166825A1 (en) * | 2021-02-08 | 2022-08-11 | Sika技术股份公司 | Curable epoxy resin composition |
| CN115521746A (en) * | 2022-10-11 | 2022-12-27 | 深圳市郎搏万先进材料有限公司 | Epoxy resin composition, preparation method thereof and packaging adhesive for microelectronic components |
| CN116003888A (en) * | 2023-03-27 | 2023-04-25 | 趵突泉电缆集团有限公司 | Flame-retardant rubber cable sheath material and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0488949A2 (en) * | 1990-11-29 | 1992-06-03 | Ciba-Geigy Ag | High performance epoxy adhesive |
| CN102533192A (en) * | 2011-12-28 | 2012-07-04 | 烟台德邦电子材料有限公司 | Flame retardant high-heat-conductivity epoxy resin electronic adhesive glue |
| CN105062395A (en) * | 2015-08-21 | 2015-11-18 | 广州市白云化工实业有限公司 | Two-component epoxy glue and preparation method thereof |
| CN105255424A (en) * | 2015-11-17 | 2016-01-20 | 湖北回天新材料股份有限公司 | Waterproof adhesive agent with the adjustable tensile strength and elongation and preparation method thereof |
| CN107779148A (en) * | 2016-08-26 | 2018-03-09 | 上海海鹰粘接科技有限公司 | A kind of pre-buried glue of composite plate and preparation method thereof |
| CN110791242A (en) * | 2019-10-17 | 2020-02-14 | 广州化工研究设计院有限公司 | Bi-component epoxy seam beautifying agent and preparation method thereof |
| CN111040692A (en) * | 2019-12-04 | 2020-04-21 | 络合高新材料(上海)有限公司 | High-elasticity high-elongation epoxy adhesive special for PVC bonding |
-
2020
- 2020-06-22 CN CN202010576577.2A patent/CN112143426A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0488949A2 (en) * | 1990-11-29 | 1992-06-03 | Ciba-Geigy Ag | High performance epoxy adhesive |
| CN102533192A (en) * | 2011-12-28 | 2012-07-04 | 烟台德邦电子材料有限公司 | Flame retardant high-heat-conductivity epoxy resin electronic adhesive glue |
| CN105062395A (en) * | 2015-08-21 | 2015-11-18 | 广州市白云化工实业有限公司 | Two-component epoxy glue and preparation method thereof |
| CN105255424A (en) * | 2015-11-17 | 2016-01-20 | 湖北回天新材料股份有限公司 | Waterproof adhesive agent with the adjustable tensile strength and elongation and preparation method thereof |
| CN107779148A (en) * | 2016-08-26 | 2018-03-09 | 上海海鹰粘接科技有限公司 | A kind of pre-buried glue of composite plate and preparation method thereof |
| CN110791242A (en) * | 2019-10-17 | 2020-02-14 | 广州化工研究设计院有限公司 | Bi-component epoxy seam beautifying agent and preparation method thereof |
| CN111040692A (en) * | 2019-12-04 | 2020-04-21 | 络合高新材料(上海)有限公司 | High-elasticity high-elongation epoxy adhesive special for PVC bonding |
Non-Patent Citations (1)
| Title |
|---|
| 贺曼罗等: "《环氧树脂胶粘剂》", 30 April 2004, 中国石化出版社 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022166825A1 (en) * | 2021-02-08 | 2022-08-11 | Sika技术股份公司 | Curable epoxy resin composition |
| CN113025245A (en) * | 2021-02-25 | 2021-06-25 | 悦声纸业(中国)有限公司 | Preparation method of multi-toughening type epoxy structural adhesive |
| CN113025245B (en) * | 2021-02-25 | 2023-03-10 | 悦声纸业(中国)有限公司 | Preparation method of multi-toughening epoxy structural adhesive |
| CN112980371A (en) * | 2021-04-08 | 2021-06-18 | 湖北海星瑞新材料科技有限公司 | High-toughness glass fiber reinforced plastic adhesive and preparation method thereof |
| CN114181651A (en) * | 2021-12-20 | 2022-03-15 | 杭州之江有机硅化工有限公司 | Elastic easily-detachable epoxy floor glue and preparation method thereof |
| CN114181651B (en) * | 2021-12-20 | 2023-02-28 | 杭州之江有机硅化工有限公司 | Elastic easily-detachable epoxy floor glue and preparation method thereof |
| CN115521746A (en) * | 2022-10-11 | 2022-12-27 | 深圳市郎搏万先进材料有限公司 | Epoxy resin composition, preparation method thereof and packaging adhesive for microelectronic components |
| CN115521746B (en) * | 2022-10-11 | 2023-08-29 | 深圳市郎搏万先进材料有限公司 | Epoxy resin composition, preparation method thereof and packaging adhesive for microelectronic components |
| CN116003888A (en) * | 2023-03-27 | 2023-04-25 | 趵突泉电缆集团有限公司 | Flame-retardant rubber cable sheath material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112143426A (en) | Double-component epoxy adhesive and preparation method and application thereof | |
| CN111040698B (en) | Epoxy resin pouring sealant, preparation method and novel electric drive motor | |
| JP5558885B2 (en) | Resin composite composition and use thereof | |
| CN103305170B (en) | Bi-component adhesive composition and preparation method thereof | |
| US20130115442A1 (en) | Structural adhesive and bonding application thereof | |
| CA2681184C (en) | Polythioether amine resins and compositions comprising same | |
| TWI755402B (en) | Semiconductor device, method of manufacturing semiconductor device, epoxy resin composition for encapsulating semiconductor device, and resin composition set | |
| JP2011231196A (en) | Resin composite composition and application thereof | |
| US20230058263A1 (en) | Two-part thermal conductive epoxy adhesive composition | |
| CN111876111B (en) | Underfill with high thermal conductivity and preparation method thereof | |
| CN115029093B (en) | Epoxy resin pouring sealant for automobile film capacitor and preparation method thereof | |
| JP6981794B2 (en) | Epoxy adhesive | |
| JPS58174416A (en) | Epoxy resin composition for sealing of semiconductor | |
| CN114058278A (en) | High-temperature-resistant insulating adhesive film and preparation method and application thereof | |
| CN110746741A (en) | Resin composite material and preparation method and application thereof | |
| KR102644123B1 (en) | Thermally conductive potting composition | |
| CN104629259B (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device | |
| CN115651402B (en) | Epoxy resin toughening modified cyanate resin powder encapsulating material, preparation method and application | |
| WO2024035866A1 (en) | Epoxy-based composition for thermal interface materials | |
| KR102349081B1 (en) | Structural adhesive composition, and structural adhesive film, interior and exterior materials for automobile using the same | |
| CN116875250A (en) | Quick-curing heat-conducting flame-retardant epoxy adhesive and preparation method thereof | |
| KR20210061822A (en) | Curable Composition | |
| JP5480006B2 (en) | Structural adhesive | |
| CN117024707A (en) | Preparation method of hyperbranched epoxy resin and pouring sealant containing hyperbranched epoxy resin | |
| JP2012012518A (en) | Epoxy resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201229 |