JPS58174416A - Epoxy resin composition for sealing of semiconductor - Google Patents

Abstract

PURPOSE:To prepare the titled composition having lowered expansion coefficient and elastic modulus without lowering the glass transition point of the resin, by adding a polybutadiene-modified epoxy resin to a resin system composed of novolak-type epoxy resin, a phenol novolak resin hardener, etc. CONSTITUTION:The objective composition is prepared by compounding ( I ) a resin system containing (A) a novolak-type epoxy resin, (B) a phenol novolak resin hardener (preferably having a softening point of 70-110 deg.C), (C) a cure accelerator [e.g. 2-(dimethylaminomethyl)-phenol] and (D) an inorganic filler (e.g. crystalline silica powder, talc, etc.) with (II) a polybutadiene-modified epoxy resin (preferably the reaction product of a carboxyl-containing polybutadiene resin with a bisphenol A-type epoxy resin). The ratio of the component (II) to the sum of the component ( I ) and the component (II) is preferably 10-50wt%.

Description

Detailed Description of the Invention (Technical Field) The present invention provides an epoxy resin compound for semiconductor encapsulation that provides a cured product with a low elastic modulus and low expansion coefficient while increasing or maintaining the glass transition point of a phenol-cured epoxy resin. 62 related.

[Prior art and its problems]

In the case of sealing with resin, the semiconductor element is directly sealed, and as a result, the difference in linear expansion coefficient between the insert and the resin, thermal stress C; cracking of the element pellet 6, etc. Due to problems such as bonding lines being cut W1, it is desired to reduce the stress on the device, and as semiconductor devices have become larger in recent years, this demand has become stronger. The purpose is to have a low expansion coefficient and a low glass transition point in terms of elastic modulus, but it is necessary to have a high glass transition point in terms of moisture resistance and thermal shock resistance.

One possible way to lower the stress is through transformation using a flexibilizing agent C2, but even if conventional flexibilizers are effective in lowering the elastic modulus, the glass transition point drops sharply by 62, and at high temperatures. Electrical properties deteriorate and moisture resistance is greatly affected.

On the other hand, silicone resins are available as resins that have a low modulus of elasticity and a high glass transition point, but they have problems such as poor adhesion to metals and high moisture permeability, and are unreliable in terms of moisture resistance. In addition, when a phenol-curing epoxy resin is modified with a polybutadiene resin or AkuIJa nitrile resin that has a functional group at the end, the glass transition point decreases little, but the linear expansion coefficient increases and the amount added increases. 41, which has a low elastic modulus, low expansion coefficient, and high glass transition temperature.
1N is a good deal. ,,・
・1 [Object of the invention] The present invention has a high glass transition point (150°C or higher), a low elastic modulus (1a60't/- or less), and a low expansion coefficient (2,3xlO-
The purpose of this invention is to obtain a resin of 'dap-' or lower).

[Summary of the invention]

That is, the present invention includes: a) a novolak epoxy resin, a phenolic novolac resin curing agent, C) a curing accelerator, a) a resin system containing an inorganic filler as an essential component, and a) a polybutadiene-modified epoxy resin. In the present invention C2, which is an epoxy resin composition for semiconductor encapsulation characterized by:
Phenol novolac type epoxy resin, brominated phenol novolac type epoxy resin, etc. can be used for cresol novolac type epoxy resin, and one type or color of these compounds, four or more can be used.0 Phenol novolak as a curing agent used in the present invention 82 As resins, phenol, cresol, xylenol, resorcinol, chlorophenol, phenylphenol,
It is obtained by reacting one or more mixtures of bisphenol A and formaldehyde or paraformaldehyde with an acid as a catalyst, and is suitable for crosslinking of resin compositions and for use in semiconductor devices. Unreacted monomers to remove the negative effects of monomers! -Fi 0 in the phenolic resin
．． 5- or less C: It is desirable to hold down.

Note that the softening point is preferably 70°C to 11G'C. Therefore, in the combination of these epoxy resins and 7-enol resins, it is preferable to use them in a ratio such that the number of epoxy groups contained in the epoxy resin is 0.5 to 2.0. .

In the present invention, known catalysts can be used as the curing accelerator, such as tf2-(dimethylaminemethyl)phenol, 2.4.6-)lis(dimethylaminomethyl)phenol, and benzyldimethylamine.

Tertiary amide 7 such as α-methylbenzyldimethylamine
．． 2-methylimidazole, 2-phenylimidazole, 2-heptadecyl imidazole.

There are imidazoles such as 2-ethyl-4-methylimidazole and phosphines such as yatriphenylphosphine, and it is sufficient to add them to an Ik of 0.1 to 1.0% by weight of C2 in the molding material.

Examples of inorganic fillers which are essential components of the present invention include crystalline silica powder, quartz glass powder, calcium talc silicate powder, zirconium silicate powder, and aluminum powder. Calcium IL acid powder, clay, baricum sulfate powder, glass fiber, etc. can be used.The amount of these inorganic fillers added is u.
So~85
Depending on the type of inorganic filler, an amount sufficient to provide desired elastic modulus, linear expansion coefficient, and glass transition point is added within the range of s1 amount.

Furthermore, in Invention I, the polybutadiene-modified epoxy resin is, for example, 11iPB-1 manufactured by Nippon Ichisha.
4, IRFB-13, KPB-12B, FiPB
-17, Dainippon Ink Co., Ltd. Te5R-960, etc.
In addition, polybutadiene resins and bisphenol epoxy resins having terminal carboxyl groups are used at 130 to 150%.
These include polybutadiene-modified epoxy resins obtained by reaction for about 2 to 10 hours in a nitrogen atmosphere at °C. Examples of the polybutadiene having a terminal carboxyl group include FB-C-1000 and FB-(!-
2000, Hycar-c'rn manufactured by Gutdrich
, 0TBI.

0TB11@, there is. It can also be used as a bisphenol A type epoxy resin (e.g. Ebiko manufactured by Shell Chemical Co., Ltd.).
827. 828. 834. 836. 10G1.
1004. 100? , Ciba Geigy Araldite 0Y-252, 250, 260280 and 6
071.608, 6097. Dow Chemical Company DI
R-330, 331, 337, 66L 664. Ebikuron 800.1010.10 manufactured by Dainippon Ink Chemical Industry Co., Ltd.
00.3010 Asahi Denka Kogyo Co., Ltd. 7 Dekaregi/IF-4
080,F! Examples include P-4000.

The admixture of these polybutadiene-modified epoxy resins is poting for novolac type epoxy resin (-).

Liptadiene modified epoxy resin □1. 〔・〕〔・〕4
゜〕＋〔. ] and is in the range of 55 to 60 weight, preferably 10 to 50 weight. It #i, below 5 weight, the elastic modulus decreases less%, and above 60 weight, Tt
A decrease in mechanical strength and high-temperature electrical properties were observed. In the range of 10 to 5o31, a glass transition point higher than that before metamorphosis can be obtained, and t
A peak is seen around 20% to 30%. Within this range, a well-balanced resin with low elastic modulus and low expansion coefficient can be obtained.

In the composition of the present invention, it is desirable that the amount of unreacted phenol in the curing phenol novolac resin, which is component tib), is 0.5 weight or less. Maku, Epoki/A and 7-1-
For the purpose of the present invention, the desired ratio of hydroxyl groups/phenolic hydroxyl groups (epoxy group/phenolic hydroxyl group) is preferably in the range of 0.5 to 2.0. If the above range is exceeded, the desired effect of the present invention cannot be obtained.

In the present invention, in addition, natural waxes, synthetic waxes, higher fatty acids and their metal salts, or release agents such as paraffin, coloring agents such as carbon, and coupling agents may be added. Flame retardants such as antimony trioxide, antimony pentoxide, phosphates and phosphorus compounds may also be added.

[Effects of the Invention] According to the present invention, the elastic modulus and expansion coefficient of the epoxy resin can be easily lowered without lowering the glass transition point of the epoxy resin.

[Embodiments of the invention]

Examples and Comparative Examples Using the following materials, epoxy resin compositions (Examples 1 to 12, Comparative Examples 1 to 5) having the compositions shown in Table 1 were mixed in an electric mixer 62 and heated in a P-ru I. : After kneading, cooling, and pulverizing, an epoxy resin composition for molding was prepared. These compositions were then cured at 170 DEG C. for 3 minutes to prepare test pieces, and after curing at 180 DEG C. for 8 hours, various properties of the bales were evaluated.The results are shown in Table 2.

Epoxy resin: Cresol novolac type epoxy resin (epoxy commercial amount 220) B: Brominated phenol novolac type epoxy resin
(Epoxy amount 270) Phenol llI4 fat phenol novolac hot resin (Suishun base amount 104) Hardening accelerator Heptadecylimidazole Modifying agent A: ]! 1PB-14 manufactured by Nippon Soda Co., Ltd. (epoxy equivalent: 475) B = TE8R-960 manufactured by Dainippon Ink Co., Ltd. (epoxy commercial volume: approximately 240) C: IFB-13 manufactured by Nippon Soda Co., Ltd. (epoxy equivalent: 850) D: PB- 0-2000 Made by a different company in Japan (molecular weight approx. 2
000, 11 valence 37.1)E:CτB)i-130
0X15 Gutdrich (butadiene/acrylonitrile molecular weight 3400.AM%10) F: PB-C-
2000100 parts and bisphenol A type epoxy resin
A polybutadiene-modified epoxy resin obtained by reacting 200 parts of Shell Chemical Co., Ltd. #1p-1001 at 140°C for 4 hours while blowing nitrogen.

Others: Fused silica (filler A) as an inorganic filler
), using crystalline silica (filler B) and antimony trioxide as flame retardant.

A-187 (Nihon Unicar) as a coupling agent, carbon black as a pigment, Hoechst M (
Hoechst Japan 1i was used.

If the amount of the enol-curing epoxy resin or polybutadiene-modified epoxy resin is within the range of 5 to 60% by weight from the above-mentioned coating-1 and Table-2, it is necessary to use a compound that lowers the glass transition point of the resin before modification. It can be seen that a low expansion coefficient and a low elastic modulus can be obtained, and particularly in range 8 of 10 to 50% by weight, a resin having a higher glass transition point than that before modification can be obtained.

Margin below □

Claims (1)

[Scope of Claims] (1) 6) Novolak type epoxy resin) Phenol novolac resin curing agent c) (il! conversion accelerator d) Inorganic filler. ) An epoxy resin composition for holding a hand conductor, characterized in that it consists of a polybutadiene-modified epoxy resin (2) The polybutadiene-modified epoxy resin of component e) is a reaction product of a carboxyl group-containing polybutadiene resin and a bisphenol AW epoxy resin. The amount of unreacted phenol in the curing phenol novolak resin of the epoxy resin composition for semiconductor stabbing described in section (3) (above component method) is 0.5.
The epoxy resin composition for semiconductor encapsulation according to claim 1, which is distributed at a price of tS or less. (4) An epoxy resin composition for semiconductor encapsulation as described in the epoxy group and phenol hydroxyl in the components.