CN109628039A - A kind of epoxy resin flexibility heat conduction adhesive and preparation method thereof - Google Patents
A kind of epoxy resin flexibility heat conduction adhesive and preparation method thereof Download PDFInfo
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- CN109628039A CN109628039A CN201811621123.1A CN201811621123A CN109628039A CN 109628039 A CN109628039 A CN 109628039A CN 201811621123 A CN201811621123 A CN 201811621123A CN 109628039 A CN109628039 A CN 109628039A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
Abstract
The invention belongs to electronics field of adhesive technology more particularly to a kind of epoxy resin flexibility heat conduction adhesive and preparation method thereof.Bi-component flexible-epoxy adhesive provided by the invention, mixture viscosity is ten thousand cps of 1.8-2.1, solidfied material thermal conductivity Wei≤1.0W/m.k, hardness 50-60A, tensile strength 4.5-4.8MPa, stress is small after solidification, and cold-and-heat resistent impact capacity is strong, not easy to crack after solidification, and heat-sinking capability is good, the particular/special requirement in electronic component encapsulation field to epoxyn can be met, electronic component encapsulation yield rate greatly improves, and the service life is longer.
Description
Technical field
The invention belongs to electronics field of adhesive technology more particularly to a kind of epoxy resin flexibility heat conduction adhesives and its system
Preparation Method.
Background technique
As science and technology is in development with rapid changepl. never-ending changes and improvements, electronic component encapsulation technology also proposed new requirement.Surface
The electronic components power such as attachment component, inductor, transformer are increasing, and volume is smaller and smaller.With the promotion of power,
Component is higher and higher to the technical requirements of heat dissipation and encapsulation.At this stage, encapsulation technology mostly uses greatly epoxy resin packaging technology,
After packaging, for epoxy resin cure at hard solid state, the internal stress generated in solidification process be easy to cause first device to electronic component
The rupture and damage of part, and heat cannot be drawn in time, lead to the reduced lifetime of electronic component.Have so inventing one kind
The certain flexibility and high epoxyn of thermal conductivity seems extremely important.
To solve the problems, such as that epoxy resin encapsulated packaging electronic parts, Chinese patent CN101805576A are proposed with soft
Property epoxy resin cure packaging electronic parts.But the soft epoxy glue hardness of this method production is still 50D or more, and product is hard
Stress is high, easy to crack, electronic component easy to damage；And thermal conductivity is less than 0.5W/m.k, it is difficult to meet hyundai electronics encapsulating products
Demand.
Under such technical background, researches and develops a electronic component that meets and encapsulate the flexible, not easy to crack and scattered of requirement
The high epoxyn of the thermal efficiency seems extremely important.
Summary of the invention
The present invention in view of the deficiency of the prior art, provides a kind of epoxy resin flexibility heat conduction adhesive and its system
Preparation Method.
The technical scheme to solve the above technical problems is that a kind of epoxy resin flexibility heat conduction adhesive, including
Weight ratio is 1:(0.8-1.2) component A and B component；
Wherein, component A includes following component, in percentage by weight: epoxy resin 15-20%, aqueous polyurethane 8-
10%, heat filling 55-75%, diluent 6-10%, coupling agent 0.1-1% and defoaming agent 0.1-1%；
B component includes following component, in percentage by weight: amine curing agent 10-20%, plasticizer 8-15%, being led
Hot filler 55-75%, curing accelerator 1-3%, coupling agent 0.1-1% and defoaming agent 0.1-1%.
Further, in component A, the epoxy resin is long flexible chain epoxy resin, epoxide number 0.25-0.30eq/
100g, viscosity 2500-3200cps；The preferably Epon resin 872 of national capital chemistry YD-171 or Hexion.
Further, in component A, the aqueous polyurethane is polyether type aqueous polyurethane, molecular weight 1200-1500；
The Waterborne Polyurethane Prepolymer being preferably polymerized by polyetherdiol, chain extender BDO, aliphatic diisocyanate；Preferably
The waterborne polyurethane resin UME-305 or liquid rubber modified epoxy resin KR-202C of national capital chemistry；
Beneficial effect using above-mentioned further technical solution is the compatibility of waterborne polyurethane resin and epoxy resin
It is good, and be not precipitated after hardening, certain toughening effect and cold-and-heat resistent impact capacity are provided to adhesive.
Further, in component A and B component, the heat filling is ball-aluminium oxide, aluminium nitride, boron nitride, oxidation
The one or more of zinc, aluminium hydroxide or silicon powder；
Further, the heat filling by 10-15 μm of average grain diameter ball-aluminium oxide with and average grain diameter 15-25
μm aluminium hydroxide by weight 3:1 form；
Beneficial effect using above-mentioned further technical solution is to select heat filling, can satisfy in Process of Applying Glue
Operation require, viscosity is lower, but can meet solidify after high thermal conductivity, low thermal resistance requirement.
Further, in component A, the diluent is two dilute propyl glycidyl ethers, lauryl diglycidyl ether, second
The one or more of glycol glycidol ether, phenyl glycidyl ether or multi-hydroxy polyether；
Beneficial effect using above-mentioned further technical solution is to meet the low viscosity requirement of system, and provide solidfied material
Certain flexibility.
Further, in component A and B component, the coupling agent be KH560, KH550 or KH570 it is one or two kinds of with
On；
Beneficial effect using above-mentioned further technical solution is that coupling agent is capable of providing profit of the heat filling in resin
It is moist with it is dispersed.
Further, in component A and B component, the defoaming agent be BYK-066N, BYK-041 or BYK-053 one kind or
It is two or more；
Beneficial effect using above-mentioned further technical solution is the gas that elimination system generates during stirring operation
Bubble.
Further, in B component, the amine curing agent is modified fatty amine, polyetheramine or modified long-chain heterocyclic amine
It is one or more kinds of；
Further, the amine curing agent is the polyetheramine D230 and molecular weight 2000-2500 of molecular weight 200-300
Polyetheramine D2000 by weight 2:1 form.
Beneficial effect using above-mentioned further technical solution is that amine curing agent can satisfy flexible epoxy tree of the present invention
The flexibility and mechanical property requirements of rouge.
Further, in B component, the plasticizer is dioctyl phthalate DOP, diisooctyl phthalate
DIDP, dibutyl phthalate DBP, dioctyl azelate DOZ, dioctyl sebacate DOS, epoxidized soybean oil ESO, tricresyl phosphate
The one or more of toluene ester TCP, triphenyl phosphate TPP or trioctyl phosphate TDP；
Beneficial effect using above-mentioned further technical solution is to meet the low viscosity of flexible-epoxy thermal conductive adhesive
It is required that providing the flexibility heat-conducting glue certain flexibility.
Further, in B component, the curing accelerator is triethanolamine, loop coil amine DBU, 2- ethyl -4- methyl miaow
The one or more of azoles, N- (3- phenyl)-N-N dimethyl urea, nonyl phenol or benzyl alcohol.
Second object of the present invention is to provide the preparation method of above-mentioned epoxy resin flexibility heat conduction adhesive, and step is such as
Under:
(1) epoxy resin, aqueous polyurethane, diluent, coupling agent, defoaming agent are sequentially added in Scattered Kettle, mixing is stirred
Mix 30min, slewing rate 1000rpm；Heat filling is added in three times, 30min, velocity of rotation is mixed after being added every time
For 2000rpm；It discharges after vacuumizing, is stood in closed, dry, 5-25 DEG C of environment of temperature, obtain component A；
(2) amine curing agent, curing accelerator, plasticizer, coupling agent, defoaming agent are sequentially added in Scattered Kettle, is mixed
Stir 30min, slewing rate 1000rpm；Heat filling is added in three times, 30min is mixed every time, velocity of rotation is
2000rpm；It discharges after vacuumizing, is stood in closed, dry, 5-25 DEG C of environment of temperature, obtain B component；
By the B component of the component A of step (1) and step (2) by weight 1:(0.8-1.2) it is uniformly mixed, epoxy is made
Resin flexibility heat conduction adhesive.
In use, be glued using dispensing or process for filling colloid in electronic component, 15h or 50 DEG C of solidification 2h of 20-30 DEG C of solidification,
Obtain cured product.
The features of the present invention and beneficial effect are:
Bi-component flexible-epoxy adhesive provided by the invention, mixture viscosity are ten thousand cps of 1.8-2.1, solidification
Object thermal conductivity Wei≤1.0W/m.k, hardness 50-60A, tensile strength 4.5-4.8MPa, stress is small after solidification, cold-and-heat resistent impact
Ability is strong, not easy to crack after solidification, and heat-sinking capability is good, can meet in electronic component encapsulation field to epoxyn
Particular/special requirement, electronic component encapsulation yield rate greatly improve, the service life is longer.
Specific embodiment
Principles and features of the present invention are described below in conjunction with example, the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the invention.
Embodiment 1
A kind of epoxy resin flexibility heat conduction adhesive, including 100g component A and 100g B component；
Wherein, component A includes following component, in percentage by weight: 160g flexible-epoxy YD-171,80g water
Property polyurethane resin UME-305,670g heat filling, 80g lauryl diglycidyl ether, 5g silane coupling agent KH560 and 5g
Defoaming agent BYK-550N；
B component includes following component, in percentage by weight: 180g amine curing agent, 120g phthalic acid two are different
Last of the ten Heavenly stems ester (DIDP), 670g heat filling, 20g nonyl phenol, 5g silane coupling agent KH560 and 5g defoaming agent BYK-550N；
Wherein, the ball-aluminium oxide and 20 μm of partial size of aluminium hydroxide powder that heat filling is 10 μm of partial size are by weight 3:
1 composition；
Amine curing agent is the polyetheramine D230 of molecular weight 230 and the polyetheramine D2000 of molecular weight 2000 by weight 2:1
Composition.
The preparation method of above-mentioned epoxy resin flexibility heat conduction adhesive, steps are as follows:
(1) by flexible-epoxy YD-171, waterborne polyurethane resin UME-305, lauryl diglycidyl ether, silane
Coupling agent KH560 and defoaming agent BYK-550N are sequentially added in Scattered Kettle, and 30min, slewing rate 1000rpm is mixed；
Heat filling is added in three times, 30min, velocity of rotation 2000rpm is mixed after being added every time；It discharges after vacuumizing,
It is stood in closed, dry, 10-25 DEG C of environment of temperature, obtains component A；
(2) by amine curing agent, diisooctyl phthalate (DIDP), nonyl phenol, silane coupling agent KH560 and defoaming
Agent BYK-550N is sequentially added in Scattered Kettle, and 30min, slewing rate 1000rpm is mixed；Thermally conductive fill out is added in three times
Material, is mixed 30min, velocity of rotation 2000rpm every time；It discharges after vacuumizing, in closed, dry, 10-25 DEG C of ring of temperature
It is stood in border, obtains B component；
The B component of the component A of 100g step (1) and 100g step (2) is uniformly mixed, after vacuum defoamation, 50 DEG C of solidifications
2h molding, is tested for the property obtained solidfied material, the results are shown in Table 1.
Embodiment 2
A kind of epoxy resin flexibility heat conduction adhesive, including 100g component A and 100g B component；
Wherein, component A includes following component, in percentage by weight: 160g flexible-epoxy E-26,80g is aqueous
Polyurethane resin KR-202C, 670g heat filling, the dilute propyl glycidyl ether of 80g bis-, 5g silane coupling agent KH560 and 5g disappear
Infusion BYK-550N；
B component includes following component, in percentage by weight: 180g amine curing agent, 120g dioctyl azelate
(DOZ), 670g heat filling, 20g nonyl phenol, 5g silane coupling agent KH560 and 5g defoaming agent BYK-550N；
Wherein, the ball-aluminium oxide and 20 μm of partial size of aluminium hydroxide powder that heat filling is 10 μm of partial size are by weight 3:
1 composition；
Amine curing agent is the polyetheramine D230 of molecular weight 230 and the polyetheramine D1000 of molecular weight 1000 by weight 2:1
Composition.
The preparation method of above-mentioned epoxy resin flexibility heat conduction adhesive, steps are as follows:
(1) flexible-epoxy E-26, waterborne polyurethane resin KR-202C, two dilute propyl glycidyl ethers, silane is even
Connection agent KH560 and defoaming agent BYK-550N is sequentially added in Scattered Kettle, and 30min, slewing rate 1000rpm is mixed；Point
Heat filling is added three times, 30min, velocity of rotation 2000rpm is mixed after being added every time；It discharges after vacuumizing, close
It closes, dry, being stood in 10-25 DEG C of environment of temperature, obtaining component A；
(2) by amine curing agent, dioctyl azelate (DOZ), nonyl phenol, silane coupling agent KH560 and defoaming agent BYK-
550N is sequentially added in Scattered Kettle, and 30min, slewing rate 1000rpm is mixed；Heat filling is added in three times, every time
30min, velocity of rotation 2000rpm is mixed；It discharges after vacuumizing, it is quiet in closed, dry, 10-25 DEG C of environment of temperature
It sets, obtains B component；
The B component of the component A of 100g step (1) and 100g step (2) is uniformly mixed, after vacuum defoamation, 50 DEG C of solidifications
2h molding, is tested for the property obtained solidfied material, the results are shown in Table 1.
Embodiment 3
A kind of epoxy resin flexibility heat conduction adhesive, including 100g component A and 100g B component；
Wherein, component A includes following component, in percentage by weight: 120g flexible-epoxy YD-171,100g water
Property polyurethane resin KR-202C, 670g heat filling, 100g lauryl diglycidyl ether, 5g silane coupling agent KH560 and 5g
Defoaming agent BYK-550N；
B component includes following component, in percentage by weight: 200g amine curing agent, 100g phthalic acid two are different
Last of the ten Heavenly stems ester (DIDP), 670g heat filling, 20g triethanolamine, 5g silane coupling agent KH560 and 5g defoaming agent BYK-550N；
Wherein, the ball-aluminium oxide and 20 μm of partial size of aluminium hydroxide powder that heat filling is 10 μm of partial size are by weight 3:
1 composition；
Amine curing agent is the polyetheramine D230 of molecular weight 230 and the polyetheramine D2000 of molecular weight 2000 by weight 2:1
Composition.
The preparation method of above-mentioned epoxy resin flexibility heat conduction adhesive, steps are as follows:
(1) by flexible-epoxy YD-171, waterborne polyurethane resin KR-202C, lauryl diglycidyl ether, silane
Coupling agent KH560 and defoaming agent BYK-550N are sequentially added in Scattered Kettle, and 30min, slewing rate 1000rpm is mixed；
Heat filling is added in three times, 30min, velocity of rotation 2000rpm is mixed after being added every time；It discharges after vacuumizing,
It is stood in closed, dry, 10-25 DEG C of environment of temperature, obtains component A；
(2) by amine curing agent, diisooctyl phthalate (DIDP), triethanolamine, silane coupling agent KH560 and disappear
Infusion BYK-550N is sequentially added in Scattered Kettle, and 30min, slewing rate 1000rpm is mixed；Thermally conductive fill out is added in three times
Material, is mixed 30min, velocity of rotation 2000rpm every time；It discharges after vacuumizing, in closed, dry, 10-25 DEG C of ring of temperature
It is stood in border, obtains B component；
The B component of the component A of 100g step (1) and 100g step (2) is uniformly mixed, after vacuum defoamation, 50 DEG C of solidifications
2h molding, is tested for the property obtained solidfied material, the results are shown in Table 1.
Embodiment 4
A kind of epoxy resin flexibility heat conduction adhesive, including 100g component A and 100g B component；
Wherein, component A includes following component, in percentage by weight: 140g flexible-epoxy E-26,100g is aqueous
Polyurethane resin UME-305,670g heat filling, 80g lauryl diglycidyl ether, 5g silane coupling agent KH560 and 5g disappear
Infusion BYK-550N；
B component includes following component, in percentage by weight: 150g amine curing agent, 150g dioctyl azelate
(DOZ), 670g heat filling, 20g nonyl phenol, 5g silane coupling agent KH560 and 5g defoaming agent BYK-550N；
Wherein, the ball-aluminium oxide and 20 μm of partial size of aluminium hydroxide powder that heat filling is 10 μm of partial size are by weight 3:
1 composition；
Amine curing agent is the polyetheramine D230 of molecular weight 230 and the polyetheramine D2000 of molecular weight 2000 by weight 2:1
Composition.
The preparation method of above-mentioned epoxy resin flexibility heat conduction adhesive, steps are as follows:
(1) flexible-epoxy E-26, waterborne polyurethane resin UME-305, lauryl diglycidyl ether, silane is even
Connection agent KH560 and defoaming agent BYK-550N is sequentially added in Scattered Kettle, and 30min, slewing rate 1000rpm is mixed；Point
Heat filling is added three times, 30min, velocity of rotation 2000rpm is mixed after being added every time；It discharges after vacuumizing, close
It closes, dry, being stood in 10-25 DEG C of environment of temperature, obtaining component A；
(2) by amine curing agent, dioctyl azelate (DOZ), nonyl phenol, silane coupling agent KH560 and defoaming agent BYK-
550N is sequentially added in Scattered Kettle, and 30min, slewing rate 1000rpm is mixed；Heat filling is added in three times, every time
30min, velocity of rotation 2000rpm is mixed；It discharges after vacuumizing, it is quiet in closed, dry, 10-25 DEG C of environment of temperature
It sets, obtains B component；
The B component of the component A of 100g step (1) and 100g step (2) is uniformly mixed, after vacuum defoamation, 50 DEG C of solidifications
2h molding, is tested for the property obtained solidfied material, the results are shown in Table 1.
Table 1
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (6)
1. a kind of epoxy resin flexibility heat conduction adhesive, which is characterized in that including weight ratio be 1:(0.8-1.2) component A and B
Component；
Wherein, component A includes following component, in percentage by weight: epoxy resin 15-20%, aqueous polyurethane 8-10%,
Heat filling 55-75%, diluent 6-10%, coupling agent 0.1-1% and defoaming agent 0.1-1%；
B component includes following component, in percentage by weight: amine curing agent 10-20%, plasticizer 8-15%, thermally conductive being filled out
Expect 55-75%, curing accelerator 1-3%, coupling agent 0.1-1% and defoaming agent 0.1-1%.
2. epoxy resin flexibility heat conduction adhesive according to claim 1, which is characterized in that in component A, the epoxy
Resin is long flexible chain epoxy resin, epoxide number 0.25-0.30eq/100g, viscosity 2500-3200cps；
The aqueous polyurethane is polyether type aqueous polyurethane, molecular weight 1200-1500；
The heat filling be ball-aluminium oxide, aluminium nitride, boron nitride, zinc oxide, aluminium hydroxide or silicon powder one kind or
It is two or more；
The diluent is two dilute propyl glycidyl ethers, lauryl diglycidyl ether, glycol glycidyl ethers, phenyl
The one or more of glycidol ether or multi-hydroxy polyether；
The coupling agent is the one or more of KH560, KH550 or KH570；
The defoaming agent is the one or more of BYK-066N, BYK-041 or BYK-053.
3. epoxy resin flexibility heat conduction adhesive according to claim 1, which is characterized in that in B component, the amine
Curing agent is the one or more of modified fatty amine, polyetheramine or modified long-chain heterocyclic amine；
The plasticizer is dioctyl phthalate DOP, diisooctyl phthalate D I DP, two fourth of phthalic acid
Ester DBP, dioctyl azelate DOZ, dioctyl sebacate DOS, epoxidized soybean oil ESO, tricresyl phosphate TCP, phosphoric acid triphen
The one or more of ester TPP or trioctyl phosphate TDP；
The heat filling be ball-aluminium oxide, aluminium nitride, boron nitride, zinc oxide, aluminium hydroxide or silicon powder one kind or
It is two or more；
The curing accelerator is triethanolamine, loop coil amine DBU, 2-ethyl-4-methylimidazole, N- (3- phenyl)-N-N diformazan
The one or more of base urea, nonyl phenol or benzyl alcohol；
The coupling agent is the one or more of KH560, KH550 or KH570；
The defoaming agent is the one or more of BYK-066N, BYK-041 or BYK-053.
4. epoxy resin flexibility heat conduction adhesive according to claim 2 or 3, which is characterized in that the heat filling
By 10-15 μm of average grain diameter of ball-aluminium oxide with and 15-25 μm of average grain diameter of aluminium hydroxide formed by weight 3:1.
5. epoxy resin flexibility heat conduction adhesive according to claim 3, which is characterized in that the amine curing agent is
The polyetheramine D2000 of the polyetheramine D230 and molecular weight 2000-2500 of molecular weight 200-300 are formed by weight 2:1.
6. the preparation method of epoxy resin flexibility heat conduction adhesive described in a kind of claim 1, which is characterized in that steps are as follows:
(1) epoxy resin, aqueous polyurethane, diluent, coupling agent, defoaming agent are sequentially added in Scattered Kettle, is mixed
30min, slewing rate 1000rpm；Heat filling is added in three times, 30min is mixed after being added every time, velocity of rotation is
2000rpm；It discharges after vacuumizing, is stood in closed, dry, 5-25 DEG C of environment of temperature, obtain component A；
(2) amine curing agent, curing accelerator, plasticizer, coupling agent, defoaming agent are sequentially added in Scattered Kettle, is mixed
30min, slewing rate 1000rpm；Heat filling is added in three times, 30min is mixed every time, velocity of rotation is
2000rpm；It discharges after vacuumizing, is stood in closed, dry, 5-25 DEG C of environment of temperature, obtain B component；
By the B component of the component A of step (1) and step (2) by weight 1:(0.8-1.2) it is uniformly mixed, epoxy resin is made
Flexible heat conduction adhesive.
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| CN110628371A (en) * | 2019-11-05 | 2019-12-31 | 江苏耐克斯特高分子材料有限公司 | Special pouring sealant for waterborne photovoltaic system |
| CN111675989A (en) * | 2019-12-26 | 2020-09-18 | 上海多迪高分子材料有限公司 | Low-stress epoxy pouring sealant and preparation method and use method thereof |
| CN112852103A (en) * | 2021-01-11 | 2021-05-28 | 山东泰特尔新材料科技有限公司 | Flexible epoxy composition for outdoor composite insulator |
| CN112852305A (en) * | 2021-01-07 | 2021-05-28 | 东莞市新懿电子材料技术有限公司 | High-performance polyurethane solid filling adhesive and preparation method thereof |
| CN114854350A (en) * | 2019-07-17 | 2022-08-05 | 池州科成新材料开发有限公司 | Low-viscosity high-thixotropy epoxy resin sealant and preparation method and application thereof |
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| CN112852305A (en) * | 2021-01-07 | 2021-05-28 | 东莞市新懿电子材料技术有限公司 | High-performance polyurethane solid filling adhesive and preparation method thereof |
| CN112852103A (en) * | 2021-01-11 | 2021-05-28 | 山东泰特尔新材料科技有限公司 | Flexible epoxy composition for outdoor composite insulator |
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