CN103320073A - Pouring type epoxy resin-based high-damping encapsulation material - Google Patents
Pouring type epoxy resin-based high-damping encapsulation material Download PDFInfo
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- CN103320073A CN103320073A CN2013102568965A CN201310256896A CN103320073A CN 103320073 A CN103320073 A CN 103320073A CN 2013102568965 A CN2013102568965 A CN 2013102568965A CN 201310256896 A CN201310256896 A CN 201310256896A CN 103320073 A CN103320073 A CN 103320073A
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Abstract
The invention relates to a pouring type epoxy resin-based high-damping encapsulation material which is characterized by being formed by uniformly mixing a component A and a component B at a mass part ratio of 100:(20-80), wherein the component A consists of 10-100 parts of bisphenol A epoxy resin, 0-65 parts of polyurethane epoxy resin, 10-80 parts of flexible epoxy resin and 0-25 parts of active diluent; and the component B consists of 5-35 parts of fatty amine, 0-35 parts of alicyclic amine, 0-80 parts of low-molecular polyamide and 0-5 parts of silane coupling agent. The encapsulation material provided by the invention has the advantages of heat resistance, cold resistance, dampness and heat resistance, high/low-temperature impact resistance, low viscosity, good fluidity, strong filling capacity, high performance in vibration reduction and noise reduction, gentle curing reaction, low heat release temperature and small heat release and internal stress, simple modulation and encapsulation processes, gentle curing reaction and easiness in cleaning, is applied to industrial production, realizes good encapsulation reliability, and can effectively reduce the encapsulation cost and prolong the service life of encapsulation devices.
Description
Technical field
The present invention relates to a kind of high polymer damping material, be specifically related to a kind of casting type Resins, epoxy base high-damping encapsulating compound.
Background technology
Casting type Resins, epoxy base high-damping encapsulating compound is along with the property of aerospace, Aeronautics and Astronautics, boats and ships, electronics, weapons and other machinery, equipment requires to grow up.Because people are more and more higher to vibration damping, the anti-acoustic capability requirement of related products, finally develop into packaging industry, the vibration and noise reducing industry of contemporary electronic machine and related industries equipment thereof.Development along with science and technology; people require to improve to work and the environmental quality level of living; thereby impel associated electrical components and parts, unicircuit, mechanical means all to develop rapidly towards miniaturization, lightweight, precise treatment, mass-producing, intensive, ultra-high speed, high-power, high precision, high-performance and multi-functional direction; therefore people require more and more highly to the high damping material with vibration and noise reducing performance, and its range of application is also more and more wider.Simultaneously, the progress with utilisation technology of improving constantly along with the epoxy resin base damping material property has promoted again the product performance of related industries further to improve.Already consisted of a kind of interdependence between them, the relation with tight blending of mutually promoting.Development along with science and technology, vibration damping, noise reduction to defence equipment, satellite airship, electronic chip and components and parts, instrument and mechanical means require also more and more higher, take electronics, electrical equipment and semicon industry as example, developing rapidly of it, already formed " design industry ", " coremaking industry ", " packaging industry " of modern product, this three industry is not only and is closely linked to each other and be separate industry.Encapsulation is exactly all parts that consists of electronic devices and components and unicircuit, carries out layout, assembling and bonding by design requirements.For example for the erosion of the particle, water vapor and other obnoxious flavour that prevent Pm2.5 in the air; And prevent plant and instrument because of external impacts, vibration injury, just must carry out to relevant product vibration damping, noise reduction encapsulation.In other words, encapsulation is exactly a kind of stable electronic product vibration damping, anti-acoustic capability parameter, a kind of highly effective guard method.This just needs, and a kind of damping capacity is good, reliability is high, stowing capacity is strong, moulding process is simple, vibration damping, the casting type epoxy resin base damping packaging material that anti-acoustic capability is good.
Summary of the invention
The objective of the invention is in order to improve stability and the reliability of electronic devices and components, parts product and other mechanical means, have good body mechanical property, cohesive force strong, heat-resisting, cold-resistant, heat-resisting wet, high-low temperature resistant impact, linear expansivity is low, the front viscosity of curing is low, good flowing properties, curing reaction is mild, a kind of casting type Resins, epoxy base high-damping encapsulating compound that thermal discharge is low.
Casting type Resins, epoxy base high-damping encapsulating compound of the present invention is characterized in that: described casting type Resins, epoxy base high-damping encapsulating compound is comprised of by even mixing of its mass fraction A:B=100:20～80 A component and B component;
Described A component is comprised of following mass fraction:
10～100 parts of bisphenol A epoxide resins,
0～65 part of polyurethane-epoxy resin,
10～80 parts of flexible-epoxies,
0～25 part of reactive thinner;
Described B component is comprised of following mass fraction:
5～35 parts of aliphatic amides,
0～35 part of aliphatic cyclic amine,
0～80 part of Versamid,
0～5 part of silane coupling agent;
The even mixing of raw material of above A, B two components is namely obtained casting type Resins, epoxy base high-damping encapsulating compound;
During use, encapsulating compound is cast on the packed components and parts,, got final product in 4 hours 60 ℃ of lower curing after 2 hours 20 ℃ of lower curing 48 hours or 20 ℃ of lower primary solidification again, the components and parts of encapsulation get final product censorship or come into operation.
Described bisphenol A epoxide resin is wherein any one of E-44, E-51, CYD-115, CYD-127, CYD-128 and CYD-128E.
Described polyurethane-epoxy resin is polyether(poly)urethane Resins, epoxy.
Described flexible-epoxy is tetraglycidel ether epoxy resin.
Described reactive thinner is one or more aliphatics or alicyclic epoxy group(ing) reactive thinner, such as glycidyl allyl ether, butylglycidyl ether, 2-ethylhexyl glycidyl ether, alicyclic cylohexanediol diglycidyl ether.
Described aliphatic amide is the condenses of diethylenetriamine, triethylene tetramine, diethylenetriamine and epoxy propane butyl ether or the reactant of diethylenetriamine and vinyl cyanide; Described Versamid is 650 or 651 Versamids; Described aliphatic cyclic amine be isophorone diamine, the Meng alkane diamines, modification isophorone diamine or 5618 modification aliphatic cyclic amines, or 5701 modification aliphatic cyclic amines; Any two kinds or any two or more amine curing agent in them, the mixing of carrying out with any proportioning.
Described silane coupling agent is γ-aminopropyl triethoxysilane, γ-(glycidoxy) propyl trimethoxy silicane, γ-mercaptopropyl trimethoxysilane or anilino Union carbide A-162 any one or two or more coupling agent wherein, the mixing of carrying out with any proportioning.
Principle of the present invention is: by material composition, molecular structure and the proportioning of optimizing and revising Resins, epoxy and solidifying agent, adopt the material of different molecular structures, different molecular weight to carry out blend; Under specific temperature and frequency, make it high dissipation factor tan δ
Max, wide temperature transition zone Δ T
0.7And appropriate storage modulus G
,Value.
Casting type Resins, epoxy base high-damping encapsulating compound of the present invention, heat-resisting, cold-resistant, wet-heat resisting, high-low temperature resistant impact, viscosity is low, good flowing properties, stowing capacity are strong, vibration damping, anti-acoustic capability are high, have also simultaneously that curing reaction is mild, exothermic temperature is low, thermal discharge is little, internal stress is low, do not affect reliability and the work-ing life of packaging electronic parts; Compare the damping material of rubber-type, have that smell is low, flowability and bounding force be good, the mechanical property of cured article is good, glueds joint the tensile shear strength 〉=10MPa of LY12CZ duralumin; High-low temperature resistant (54 ℃ * 4 hours～71 ℃ * 4 hours, through three cold cycling) impacts, flawless; Cured article is under damp and hot (71 ℃, R hour 100%) condition, and aging 7 days, package strength still met the requirements; It does not produce corrosion to LY12CZ duralumin, 30CrMnSiA steel alloy, H62 copper alloy and PVC plastics; The shrinking percentage of cured article＜1.5%, ratio of damping (tan δ max 〉=0.9); The operating temperature range of encapsulating compound-54～70 ℃, A, B two components mix by the mass fraction Direct Uniform, and modulation, packaging process is simple, curing reaction is mild, and cleaning container is easy; This encapsulating compound is used for suitability for industrialized production, can effectively reduce packaging cost, improves reliability and the package quality of encapsulation.
Embodiment
Umber in following examples all according to the mass fraction.
Embodiment 1
A kind of casting type Resins, epoxy base high-damping encapsulating compound is comprised of by mass fraction A:B=100:25 A, B two components.
The A component is comprised of following mass fraction:
20 parts of E-51 Resins, epoxy,
55 parts of tetraglycidel ether epoxy resins,
20 parts of polyurethane-epoxy resins,
5 parts of butylglycidyl ethers.
The B component is comprised of following mass fraction:
6 parts of diethylenetriamines,
13 parts of diethylenetriamine and epoxy propane butyl ethers,
The Meng 4 parts of alkane diamines,
2 parts of γ-aminopropyl triethoxysilanes.
The even mixing of raw material of above A, B two components is namely obtained casting type Resins, epoxy base high-damping encapsulating compound.
During use, encapsulating compound is cast on the packed components and parts,, got final product in 4 hours 60 ℃ of lower curing after 2 hours 20 ℃ of lower curing 48 hours or 20 ℃ of lower primary solidification again, the components and parts of encapsulation get final product censorship or come into operation.
Embodiment 2
A kind of casting type Resins, epoxy base high-damping encapsulating compound is comprised of by mass fraction A:B=100:50 A, B two components.
The A component is comprised of following mass fraction:
38 parts of CYD-128 Resins, epoxy,
52 parts of glycidyl ether type flexible-epoxies,
7 parts of polyurethane-epoxy resins,
3 parts of alicyclic cylohexanediol diglycidyl ethers.
The B component is comprised of following mass fraction:
6 parts of triethylene tetramines,
32 parts of 650 Versamids,
10 parts of 651 Versamids,
2 parts of γ-aminopropyl triethoxysilanes.
The even mixing of raw material of above A, B two components is namely obtained casting type Resins, epoxy base high-damping encapsulating compound.
During use, encapsulating compound is cast on the packed components and parts,, got final product in 4 hours 60 ℃ of lower curing after 2 hours 20 ℃ of lower curing 48 hours or 25 ℃ of lower primary solidification again, the components and parts of encapsulation get final product censorship or come into operation.
Embodiment 3
A kind of casting type Resins, epoxy base high-damping encapsulating compound is comprised of by mass fraction A:B=100:57 A, B two components.
The A component is comprised of following mass fraction:
60 parts of E-51 Resins, epoxy,
30 parts of glycidyl ether type flexible epoxies,
7 parts of polyurethane-epoxy resins,
3 parts of alicyclic cylohexanediol diglycidyl ethers.
The B component is comprised of following mass fraction:
40 parts of 650 Versamids,
15 parts of diethylenetriamine and epoxy propane butyl ethers,
2 parts of γ-aminopropyl triethoxysilanes.
The even mixing of raw material of above A, B two components is namely obtained casting type Resins, epoxy base high-damping encapsulating compound.
During use, encapsulating compound is cast on the packed components and parts,, got final product in 4 hours 60 ℃ of lower curing after 2 hours 22 ℃ of lower curing 48 hours or 25 ℃ of lower primary solidification again, the components and parts of encapsulation get final product censorship or come into operation.
Embodiment 4
A kind of casting type Resins, epoxy high damping encapsulating compound is comprised of by mass fraction A:B=100:26 A, B two components.
The A component is comprised of following mass fraction:
25 parts of CYD128 Resins, epoxy,
62 parts of glycidyl ether flexible-epoxies,
10 parts of polyurethane-epoxy resins,
3 parts of alicyclic cylohexanediol diglycidyl ethers.
The B component is comprised of following mass fraction:
10 parts of diethylenetriamine and epoxy propane butyl ethers,
10 parts of modification isophorone diamines,
5 parts of 650 Versamids,
0.5 part of γ-aminopropyl triethoxysilane,
0.5 part of γ-(glycidoxy) propyl trimethoxy silicane.
The even mixing of raw material of above A, B two components is namely obtained casting type Resins, epoxy base high-damping encapsulating compound.
During use, encapsulating compound is cast on the packed components and parts,, got final product in 4 hours 60 ℃ of lower curing after 2 hours 25 ℃ of lower curing 48 hours or 25 ℃ of lower primary solidification again, the components and parts of encapsulation get final product censorship or come into operation.
Embodiment 5
A kind of casting type Resins, epoxy high damping encapsulating compound is comprised of by mass fraction A:B=100:33 A, B two components.
The A component is comprised of following mass fraction:
30 parts of CYD128E Resins, epoxy,
50 parts of glycidyl ether flexible-epoxies,
15 parts of polyurethane-epoxy resins,
5 parts of alicyclic cylohexanediol diglycidyl ethers.
The B component is comprised of following mass fraction:
25 parts of diethylenetriamine and epoxy propane butyl ethers,
5 parts of modification isophorone diamines,
1 part of γ-aminopropyl triethoxysilane,
2 parts of γ-(glycidoxy) propyl trimethoxy silicane.
The even mixing of raw material of above A, B two components is namely obtained casting type Resins, epoxy base high-damping encapsulating compound.
During use, encapsulating compound is cast on the packed components and parts,, got final product in 4 hours 60 ℃ of lower curing after 2 hours 25 ℃ of lower curing 48 hours or 25 ℃ of lower primary solidification again, the components and parts of encapsulation get final product censorship or come into operation.
Claims (5)
1. casting type Resins, epoxy base high-damping encapsulating compound is characterized in that: described casting type Resins, epoxy base high-damping encapsulating compound, evenly mixed by its mass fraction A:B=100:20～80 by A component, B component and to form;
Described A component is comprised of following mass fraction:
10～100 parts of bisphenol A epoxide resins,
0～65 part of polyurethane-epoxy resin,
10～80 parts of flexible-epoxies,
0～25 part of reactive thinner;
Described B component is comprised of following mass fraction:
5～35 parts of aliphatic amides,
0～35 part of aliphatic cyclic amine,
0～80 part of Versamid,
0～5 part of silane coupling agent;
The even mixing of raw material of above A, B two components is namely obtained casting type Resins, epoxy base high-damping encapsulating compound;
During use, encapsulating compound is cast on the packed components and parts,, got final product in 4 hours 60 ℃ of lower curing after 2 hours 20 ℃ of lower curing 48 hours or 20 ℃ of lower primary solidification again, the components and parts of encapsulation get final product censorship or come into operation.
2. encapsulating compound according to claim 1 is characterized in that: described bisphenol A epoxide resin be E-44, E-51, CYD-115, CYD-127, CYD-128 and CYD-128E wherein any one.
3. encapsulating compound according to claim 1, it is characterized in that: described reactive thinner is one or more aliphatics or alicyclic epoxy group(ing) reactive thinner, such as glycidyl allyl ether, butylglycidyl ether, 2-ethylhexyl glycidyl ether, alicyclic cylohexanediol diglycidyl ether.
4. encapsulating compound according to claim 1, it is characterized in that: described aliphatic amide is the condenses of diethylenetriamine, triethylene tetramine, diethylenetriamine and epoxy propane butyl ether or the reactant of diethylenetriamine and vinyl cyanide; Described Versamid is 650 or 651 Versamids; Described aliphatic cyclic amine be isophorone diamine, the Meng alkane diamines, modification isophorone diamine or 5618 modification aliphatic cyclic amines, or 5701 modification aliphatic cyclic amines; Any two kinds or any two or more amine curing agent in them, the mixing of carrying out with any proportioning.
5. encapsulating compound according to claim 1, it is characterized in that: described silane coupling agent is γ-aminopropyl triethoxysilane, γ-(glycidoxy) propyl trimethoxy silicane, γ-mercaptopropyl trimethoxysilane or anilino Union carbide A-162 any one or two or more coupling agent wherein, the mixing of carrying out with any proportioning.
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|---|---|---|---|
| CN2013102568965A CN103320073A (en) | 2013-06-26 | 2013-06-26 | Pouring type epoxy resin-based high-damping encapsulation material |
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| CN2013102568965A CN103320073A (en) | 2013-06-26 | 2013-06-26 | Pouring type epoxy resin-based high-damping encapsulation material |
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| CN104804691A (en) * | 2015-05-04 | 2015-07-29 | 上海都为电子有限公司 | Room temperature curing high-temperature-resistant high-tenacity epoxy adhesive and preparation method thereof |
| CN104817931A (en) * | 2015-05-06 | 2015-08-05 | 上海都伟光伏科技有限公司 | Adhesive used for bonding automobile plastic pasts and preparation method thereof |
| CN104845045A (en) * | 2015-04-30 | 2015-08-19 | 中国船舶重工集团公司第七二五研究所 | Room-temperature curable epoxy resin based high damping material and preparation method thereof |
| CN105140026A (en) * | 2015-09-18 | 2015-12-09 | 中国西电电气股份有限公司 | Mute power capacitor |
| CN105255418A (en) * | 2015-11-04 | 2016-01-20 | 无锡嘉联电子材料有限公司 | Preparation method of high-transparency flexible epoxy resin adhesive |
| CN106520045A (en) * | 2016-11-05 | 2017-03-22 | 上海大学 | An epoxy damping adhesive curable at room temperature and a preparing method thereof |
| CN107118725A (en) * | 2017-03-30 | 2017-09-01 | 湖北绿色家园材料技术股份有限公司 | A kind of dry glue is fast, toughness is high, color inhibition electron pouring sealant and preparation method thereof |
| CN111087959A (en) * | 2019-12-26 | 2020-05-01 | 上海复合材料科技有限公司 | Antistatic high-strength adhesive for aerospace and preparation method thereof |
| CN113754345A (en) * | 2021-09-22 | 2021-12-07 | 山东硕果新材料科技有限公司 | High-damping resin-based mineral composite material and preparation method and application thereof |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104845045A (en) * | 2015-04-30 | 2015-08-19 | 中国船舶重工集团公司第七二五研究所 | Room-temperature curable epoxy resin based high damping material and preparation method thereof |
| CN104804691A (en) * | 2015-05-04 | 2015-07-29 | 上海都为电子有限公司 | Room temperature curing high-temperature-resistant high-tenacity epoxy adhesive and preparation method thereof |
| CN104817931A (en) * | 2015-05-06 | 2015-08-05 | 上海都伟光伏科技有限公司 | Adhesive used for bonding automobile plastic pasts and preparation method thereof |
| CN105140026B (en) * | 2015-09-18 | 2017-09-26 | 中国西电电气股份有限公司 | A kind of Jing Yin power capacitor |
| CN105140026A (en) * | 2015-09-18 | 2015-12-09 | 中国西电电气股份有限公司 | Mute power capacitor |
| CN105255418A (en) * | 2015-11-04 | 2016-01-20 | 无锡嘉联电子材料有限公司 | Preparation method of high-transparency flexible epoxy resin adhesive |
| CN105255418B (en) * | 2015-11-04 | 2018-09-25 | 无锡嘉联电子材料有限公司 | A kind of preparation method of high transparency flexible-epoxy adhesive |
| CN106520045B (en) * | 2016-11-05 | 2019-06-25 | 上海大学 | A kind of epoxy damping glue of room-temperature-curable and preparation method thereof |
| CN106520045A (en) * | 2016-11-05 | 2017-03-22 | 上海大学 | An epoxy damping adhesive curable at room temperature and a preparing method thereof |
| CN107118725A (en) * | 2017-03-30 | 2017-09-01 | 湖北绿色家园材料技术股份有限公司 | A kind of dry glue is fast, toughness is high, color inhibition electron pouring sealant and preparation method thereof |
| CN107118725B (en) * | 2017-03-30 | 2020-07-10 | 湖北绿色家园材料技术股份有限公司 | Electronic pouring sealant with fast dry glue, high toughness and yellowing resistance and preparation method thereof |
| CN111087959A (en) * | 2019-12-26 | 2020-05-01 | 上海复合材料科技有限公司 | Antistatic high-strength adhesive for aerospace and preparation method thereof |
| CN113754345A (en) * | 2021-09-22 | 2021-12-07 | 山东硕果新材料科技有限公司 | High-damping resin-based mineral composite material and preparation method and application thereof |
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Application publication date: 20130925 |