CN1958707A - Damp embedding glue of epoxy resin - Google Patents
Damp embedding glue of epoxy resin Download PDFInfo
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- CN1958707A CN1958707A CN 200610125011 CN200610125011A CN1958707A CN 1958707 A CN1958707 A CN 1958707A CN 200610125011 CN200610125011 CN 200610125011 CN 200610125011 A CN200610125011 A CN 200610125011A CN 1958707 A CN1958707 A CN 1958707A
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Abstract
This invention relates to a damping sealant, especially an epoxy resin damping sealant, which is composed of component A and component B (15-100 wt. % of component A). Component A is prepared from: rigid epoxy resin 100 parts, flexible epoxy 5-100 parts, active diluent 5-40 parts, and liquid nitrile butadiene rubber 5-25 parts. Component B is amino curing agent. The glass transition temperature of the epoxy resin damping sealant can be adjusted between -20-120 deg.C according to different requirements. The epoxy resin damping sealant has such advantages as wide damping temperature range, high loss factor (tanmax greater than 0.5), and easy operation.
Description
Technical field
The invention belongs to the polymer damping material field, be specifically related to a kind of damp embedding glue.
Background technology
Embedding is that each parts that constitute electron device or unicircuit requirement is in accordance with regulations realized reasonable Arrangement, assembling, bonding, connection, isolates with environment and operating procedures such as protection; reach and prevent the intrusion of moisture, dust and obnoxious flavour, slow down vibrations, prevent the external force damage and stablize the purpose of component parameter electron device or unicircuit.Resins, epoxy is the very fast class packaged material of development in recent years, and price is relatively cheap, moulding process is simple, be fit to scale operation, reliability is also higher.80%～90% (Japan is almost whole) of at present external semiconducter device are by epoxy encapsulation, and its development prospect is very good.Miniaturization, lightweight, precise treatment, high performance along with electron device, especially high-tech sector such as aerospace requires very high to stability, the accuracy of electron device, will reduce vibration and the impact influence to device performance as much as possible, therefore the vibration and noise reducing performance to packaged material is that damping capacity requires more and more strictness.But present epoxy resin embedding adhesive is only emphasized performances such as its formability, cohesiveness, wet fastness, thermotolerance, thermal stress property, low bulk, and its damping capacity is seldom mentioned; Though the minority product is arranged but its poor-performing, as can not satisfying the self-vulcanizing condition, thereby the solidification process thermal discharge causes thermal stresses big etc. greatly.
Summary of the invention
The object of the present invention is to provide a kind of damp embedding glue of epoxy resin, the glass transition temperature Tg of this damp embedding glue of epoxy resin can be adjusted in-20～120 ℃ of scopes according to actual needs, and has higher dissipation factor (tan δ
Max＞0.5) and good technological operation.
The technical solution adopted in the present invention is as follows: a kind of damp embedding glue of epoxy resin, it is characterized in that it is made up of component A, B component, and during use B component and component A are mixed, component B accounts for the 15-100% of component A quality; Wherein, component A is mainly formed by rigidity epoxy, flexible epoxy, reactive thinner and liquid acrylonitrile butadiene rubber feedstock production, the mass fraction of each raw material is: 100 parts of rigidity epoxies, flexible epoxy 5-100 part, reactive thinner 5-40 part, liquid acrylonitrile butadiene rubber 5-25 part, B component is an amine curing agent.
Mass fraction the best of described each raw material of component A is: 100 parts of rigidity epoxies, flexible epoxy 20-50 part, reactive thinner 10-25 part, liquid acrylonitrile butadiene rubber 10-20 part.
Described component B accounts for the component A 20-60% of being the best in quality.
The rigidity epoxy is any one or any one above mixing among E-44, E-51, E-39D, CYD-127, CYD-128, CYD-144, F-54, F-51, YECN-200, the YECN-195, is any proportioning during any one above mixing.
Flexible epoxy is any one or any one above mixing among glycidyl ether type snappiness Resins, epoxy, straight chain type aliphatics snappiness Resins, epoxy (DER-732, DER-736, DER755), the RZ-1021, is any proportioning during any one above mixing.
Reactive thinner is any one or any one above mixing in polypropylene glycol diglycidyl ether, neopentylglycol diglycidyl ether, β-Jia Jihuanyanglvbingwan (MECH), ethylene glycol diglycidylether, lauryl diglycidyl ether, epoxy propane butyl ether (BGE), propylene oxide phenyl ether, propylene oxide benzylic ether, the titanium dioxide vinyl cyclohexane (Unox206), is any proportioning during any one above mixing.
Liquid acrylonitrile butadiene rubber properties-correcting agent be in liquid nbr carboxyl terminal, liquid end amido paracril, the liquid hydroxy'terminated butadiene nitrile rubber any one.
Amine curing agent is quadrol, diethylenetriamine, triethylene tetramine, tetraethylene pentamine, polyethylene polyamine, polyamide 6 50, polyamide 6 51, polyetheramine, methylimidazole (EMI-2), 2-ethyl-4-methylimidazole (EMI-2,4), any one or any one above mixing in the beta-hydroxyethyl diamines, benzene dimethylamine, diaminodiphenyl-methane, N-aminoethyl piperazine, T-31 solidifying agent, be any proportioning during any one above mixing.
Preparation method of the present invention is for one of following two kinds: (1) direct blending: the mass fraction by each raw material is: 100 parts of rigidity epoxies, flexible epoxy 5-100 part, reactive thinner 5-40 part, liquid acrylonitrile butadiene rubber 5-25 part are chosen rigidity epoxy, flexible epoxy, reactive thinner, liquid acrylonitrile butadiene rubber raw material, and liquid acrylonitrile butadiene rubber and rigidity epoxy, flexible epoxy, the direct blend of reactive thinner are obtained component A; B component is an amine curing agent, during use B component and component A is mixed, and component B accounts for the 15-100% of component A quality, gets product.(2) chemic modified method: the mass fraction by each raw material is: 100 parts of rigidity epoxies, flexible epoxy 5-100 part, reactive thinner 5-40 part, liquid acrylonitrile butadiene rubber 5-25 part are chosen rigidity epoxy, flexible epoxy, reactive thinner, liquid acrylonitrile butadiene rubber raw material, at first liquid acrylonitrile butadiene rubber and rigidity epoxy and flexible epoxy are pressed reaction conditions (60～120 ℃ of temperature of reaction, reaction times 1～12h, catalyzer) synthetic segmented copolymer or graft copolymer, and then adding reactive thinner regulation system performance obtains component A; B component is an amine curing agent, during use B component and component A is mixed, and component B accounts for the 15-100% of component A quality, gets product.
Principle of design of the present invention is: the rigidity epoxy helps improving intensity and damping temperature domain, and flexible epoxy helps improving the peak value of damping loss factor, and reactive thinner helps improving the ease for operation when using; Adjust three's ratio, can obtain the high damping glue that different use temperatures (20～120 ℃) require, the molecule segment length of solidifying agent is to the contribution difference of damping capacity in the B component, and the long chain molecule solidifying agent helps improving the damping capacity of glue.
The present invention compared with prior art has following major advantage:
One. joint sealant provided by the invention is formed by component A, B component biharmonic, and wherein component A is made up of rigidity epoxy/flexible epoxy/reactive thinner ternary system matrix resin and liquid acrylonitrile butadiene rubber properties-correcting agent, and B component is an amine curing agent; Have excellent damping capacity, have higher dissipation factor (tan δ
Max＞0.5), the temperature range of tan δ＞0.3 is greater than 40 ℃ (the damping temperature ranges with broad), and second-order transition temperature can be adjusted in-20～120 ℃ of scopes according to actual needs.
They are two years old. and the component A of the present invention's prescription is the complementary constituent element of quaternary, to improving whole damping capacity and improving operability and play complementary action.Wherein the rigidity epoxy helps improving intensity, and flexible epoxy helps improving the peak value of damping loss factor and plays toughening effect, and reactive thinner helps improving the ease for operation when using, and liquid acrylonitrile butadiene rubber plays an important role to the low temperature damping capacity of system.The consistency of each component is good, stable performance.
They are three years old. preparation of the present invention have technology simply, operate easily, be easy to promote and be suitable for plurality of advantages such as suitability for industrialized production.
Embodiment
In order to understand the present invention better, further illustrate content of the present invention below in conjunction with embodiment, but content of the present invention not only is confined to the following examples.
Embodiment 1:
Take by weighing each component and mix by following mass fraction proportioning, at room temperature solidify 48h, or behind the room temperature gel again 80 ℃ solidify 2h, 120 ℃ solidify 2h, test its damping capacity with the dynamic mechanical analysis instrument.Tg is 28 ℃, tan δ
MaxBe 0.84, the warm territory of tan δ＞0.3 is 45 ℃.
100 parts of rigidity epoxy CYD-127,
150 parts of straight chain type aliphatics snappiness Resins, epoxy RZ-102,
15 parts of epoxy propane butyl ethers (BGE),
10 parts of liquid nbr carboxyl terminals,
35 parts of tetraethylene pentamine.
Embodiment 2:
Take by weighing each component and mix by following mass fraction proportioning.At room temperature solidify 48h, or behind the room temperature gel again 80 ℃ solidify 2h, 120 ℃ solidify 2h, test its damping capacity with the dynamic mechanical analysis instrument.Tg is 46 ℃, tan δ
MaxBe 0.95, the warm territory of tan δ＞0.3 is 52 ℃.
100 parts of rigidity epoxy F-51,
30 parts of straight chain type aliphatics snappiness Resins, epoxy DER-732,
25 parts of polypropylene glycol diglycidyl ethers,
15 parts of liquid hydroxy'terminated butadiene nitrile rubbers,
28 parts of polyethylene polyamines.
Embodiment 3:
By taking by weighing each component with proportioning under the mass fraction and mixing.At room temperature solidify 48h, or behind the room temperature gel again 80 ℃ solidify 2h, test its damping capacity with the dynamic mechanical analysis instrument.Tg is 69 ℃, tan δ
MaxBe 1.2, the warm territory of tan δ＞0.3 is 75 ℃.
100 parts of rigidity epoxy E-44,
20 parts of straight chain type aliphatics snappiness Resins, epoxy RZ-1021,
10 parts of ethylene glycol diglycidylethers,
40 parts of solidifying agent polyetheramines,
20 parts of liquid end amido paracrils,
15 parts of curing agent ethylene diamines.
Embodiment 4:
A kind of damp embedding glue of epoxy resin, it is made up of component A, B component, component A is mainly formed by rigidity epoxy, flexible epoxy, reactive thinner and liquid acrylonitrile butadiene rubber feedstock production, the mass fraction of each raw material is: 100 parts of rigidity epoxies, 5 parts of flexible epoxies, 5 parts of reactive thinners, 5 parts of liquid acrylonitrile butadiene rubber, and B component is an amine curing agent; During use B component and component A are mixed, component B accounts for 15% of component A quality.
Described rigidity epoxy is E-51 and E-39D, and E-51, E-39D respectively account for 50 parts; Flexible epoxy is a glycidyl ether type snappiness Resins, epoxy; Reactive thinner is neopentylglycol diglycidyl ether and β-Jia Jihuanyanglvbingwan (MECH), and neopentylglycol diglycidyl ether, β-Jia Jihuanyanglvbingwan (MECH) respectively account for 2.5 parts; Liquid acrylonitrile butadiene rubber properties-correcting agent is liquid nbr carboxyl terminal and liquid end amido paracril, and liquid nbr carboxyl terminal, liquid end amido paracril respectively account for 2.5 parts.
Used amine curing agent is triethylene tetramine and polyamide 6 50, and triethylene tetramine accounts for 12.25 parts, and polyamide 6 50 accounts for 5.0 parts (component B account for component A quality 15%).
The preparation of above-mentioned a kind of damp embedding glue of epoxy resin, 1) preparation of component A: the mass fraction by each raw material is: 100 parts of rigidity epoxies, 5 parts of flexible epoxies, 5 parts of reactive thinners, liquid acrylonitrile butadiene rubber are chosen rigidity epoxy, flexible epoxy, reactive thinner, liquid acrylonitrile butadiene rubber raw material for 5 parts, and liquid acrylonitrile butadiene rubber and rigidity epoxy, flexible epoxy, the direct blend of reactive thinner are obtained component A;
When 2) using B component and component A are mixed, get product.
Embodiment 5:
A kind of damp embedding glue of epoxy resin, it is made up of component A, B component, component A is mainly formed by rigidity epoxy, flexible epoxy, reactive thinner and liquid acrylonitrile butadiene rubber feedstock production, the mass fraction of each raw material is: 100 parts of rigidity epoxies, 100 parts of flexible epoxies, 40 parts of reactive thinners, 25 parts of liquid acrylonitrile butadiene rubber, and B component is an amine curing agent; During use B component and component A are mixed, component B accounts for 100% of component A quality.
Described rigidity epoxy is E-51 and E-39D, and E-51, E-39D respectively account for 50 parts; Flexible epoxy is a glycidyl ether type snappiness Resins, epoxy; Reactive thinner is neopentylglycol diglycidyl ether and β-Jia Jihuanyanglvbingwan (MECH), and neopentylglycol diglycidyl ether, β-Jia Jihuanyanglvbingwan (MECH) respectively account for 20 parts; Liquid acrylonitrile butadiene rubber properties-correcting agent is liquid nbr carboxyl terminal and liquid end amido paracril, and liquid nbr carboxyl terminal, liquid end amido paracril respectively account for 12.5 parts.
Used amine curing agent is triethylene tetramine and polyamide 6 50, and triethylene tetramine accounts for 65 parts, and polyamide 6 50 accounts for 200 parts (component B account for component A quality 100%).
The preparation of above-mentioned a kind of damp embedding glue of epoxy resin, 1) preparation of component A: the mass fraction by each raw material is: 100 parts of rigidity epoxies, 100 parts of flexible epoxies, 40 parts of reactive thinners, liquid acrylonitrile butadiene rubber are chosen rigidity epoxy, flexible epoxy, reactive thinner, liquid acrylonitrile butadiene rubber raw material for 25 parts, and liquid acrylonitrile butadiene rubber and rigidity epoxy, flexible epoxy, the direct blend of reactive thinner are obtained component A;
When 2) using B component and component A are mixed, get product.
Embodiment 6:
A kind of damp embedding glue of epoxy resin, it is made up of component A, B component, component A is mainly formed by rigidity epoxy, flexible epoxy, reactive thinner and liquid acrylonitrile butadiene rubber feedstock production, the mass fraction of each raw material is: 100 parts of rigidity epoxies, 40 parts of flexible epoxies, 20 parts of reactive thinners, 20 parts of liquid acrylonitrile butadiene rubber, and B component is an amine curing agent; During use B component and component A are mixed, component B accounts for 60% of component A quality.
Described rigidity epoxy is CYD-128, CYD-144 and F-54, and CYD-128, CYD-144 respectively account for 30 parts, and F-54 accounts for 40 parts; Described flexible epoxy is straight chain type aliphatics snappiness Resins, epoxy DER-736, DER755, and DER-736, DER755 respectively account for 20 parts; Reactive thinner is propylene oxide phenyl ether, propylene oxide benzylic ether and titanium dioxide vinyl cyclohexane (Unox206), and propylene oxide phenyl ether, propylene oxide benzylic ether respectively account for 6 parts, and titanium dioxide vinyl cyclohexane (Unox206) accounts for 8 parts; Liquid acrylonitrile butadiene rubber properties-correcting agent is liquid nbr carboxyl terminal, liquid end amido paracril and liquid hydroxy'terminated butadiene nitrile rubber, and liquid nbr carboxyl terminal, liquid end amido paracril respectively account for 6 parts, and the liquid hydroxy'terminated butadiene nitrile rubber accounts for 8 parts.
Amine curing agent is polyamide 6 50, polyamide 6 51, polyetheramine, and polyamide 6 50, polyamide 6 51 respectively account for 45 parts, and polyetheramine accounts for 18 parts (component B account for component A quality 60%).
The preparation of above-mentioned a kind of damp embedding glue of epoxy resin, 1) preparation of component A: the mass fraction by each raw material is: 100 parts of rigidity epoxies, 40 parts of flexible epoxies, 20 parts of reactive thinners, liquid acrylonitrile butadiene rubber are chosen rigidity epoxy, flexible epoxy, reactive thinner, liquid acrylonitrile butadiene rubber raw material for 20 parts, at first liquid acrylonitrile butadiene rubber and rigidity epoxy and flexible epoxy are pressed reaction conditions (60～120 ℃ of temperature of reaction, reaction times 1～12h, catalyzer) synthetic segmented copolymer or graft copolymer, and then adding reactive thinner regulation system performance obtains component A;
When 2) using B component and component A are mixed, get product.
The bound value and the interval value of component A of the present invention and B component can both be realized the present invention, and the bound value of the rigidity epoxy of component A, flexible epoxy, reactive thinner and liquid acrylonitrile butadiene rubber raw material and interval value can both be realized the present invention, cited rigidity epoxy, flexible epoxy, reactive thinner and liquid acrylonitrile butadiene rubber, each concrete raw material of amine curing agent can both be realized the present invention, just do not enumerate embodiment one by one at this.
Claims (8)
1. damp embedding glue of epoxy resin is characterized in that it is made up of component A, B component, during use B component and component A is mixed, and component B accounts for the 15-100% of component A quality; Wherein, component A is mainly formed by rigidity epoxy, flexible epoxy, reactive thinner and liquid acrylonitrile butadiene rubber feedstock production, the mass fraction of each raw material is: 100 parts of rigidity epoxies, flexible epoxy 5-100 part, reactive thinner 5-40 part, liquid acrylonitrile butadiene rubber 5-25 part, B component is an amine curing agent.
2. a kind of damp embedding glue of epoxy resin according to claim 1 is characterized in that: the mass fraction of described each raw material of component A is: 100 parts of rigidity epoxies, flexible epoxy 20-50 part, reactive thinner 10-25 part, liquid acrylonitrile butadiene rubber 10-20 part.
3. a kind of damp embedding glue of epoxy resin according to claim 1 is characterized in that: it is 20-60% that described component B accounts for component A quality.
4. a kind of damp embedding glue of epoxy resin according to claim 1, it is characterized in that: the rigidity epoxy is any one or any one above mixing among E-44, E-51, E-39D, CYD-127, CYD-128, CYD-144, F-54, F-51, YECN-200, the YECN-195, is any proportioning during any one above mixing.
5. a kind of damp embedding glue of epoxy resin according to claim 1, it is characterized in that: flexible epoxy is any one or any one above mixing among glycidyl ether type snappiness Resins, epoxy, straight chain type aliphatics snappiness Resins, epoxy, the RZ-1021, is any proportioning during any one above mixing.
6. a kind of damp embedding glue of epoxy resin according to claim 1, it is characterized in that: reactive thinner is any one or any one above mixing in polypropylene glycol diglycidyl ether, neopentylglycol diglycidyl ether, β-Jia Jihuanyanglvbingwan, ethylene glycol diglycidylether, lauryl diglycidyl ether, epoxy propane butyl ether, propylene oxide phenyl ether, propylene oxide benzylic ether, the titanium dioxide vinyl cyclohexane, is any proportioning during any one above mixing.
7. a kind of damp embedding glue of epoxy resin according to claim 1 is characterized in that: liquid acrylonitrile butadiene rubber properties-correcting agent be in liquid nbr carboxyl terminal, liquid end amido paracril, the liquid hydroxy'terminated butadiene nitrile rubber any one.
8. a kind of damp embedding glue of epoxy resin according to claim 1, it is characterized in that: amine curing agent is quadrol, diethylenetriamine, triethylene tetramine, tetraethylene pentamine, polyethylene polyamine, polyamide 6 50, polyamide 6 51, polyetheramine, methylimidazole (EMI-2), 2-ethyl-4-methylimidazole (EMI-2,4), any one or any one above mixing in the beta-hydroxyethyl diamines, benzene dimethylamine, diaminodiphenyl-methane, N-aminoethyl piperazine, T-31 solidifying agent, be any proportioning during any one above mixing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101250118A CN100506940C (en) | 2006-11-13 | 2006-11-13 | Damp embedding glue of epoxy resin |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101250118A CN100506940C (en) | 2006-11-13 | 2006-11-13 | Damp embedding glue of epoxy resin |
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| CN1958707A true CN1958707A (en) | 2007-05-09 |
| CN100506940C CN100506940C (en) | 2009-07-01 |
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| CNB2006101250118A Expired - Fee Related CN100506940C (en) | 2006-11-13 | 2006-11-13 | Damp embedding glue of epoxy resin |
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| CN109533260A (en) * | 2018-11-19 | 2019-03-29 | 中国舰船研究设计中心 | Screw shaft of ship commitments beam isolation structure device |
| CN109817821A (en) * | 2019-01-03 | 2019-05-28 | 福建华佳彩有限公司 | A kind of UV glue encapsulating structure and its packaging method |
| CN109817821B (en) * | 2019-01-03 | 2021-10-01 | 福建华佳彩有限公司 | UV (ultraviolet) adhesive packaging structure and packaging method thereof |
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| CN100506940C (en) | 2009-07-01 |
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