CN109575873A - High-temperature-resistant organic silicon gel and preparation method thereof - Google Patents

High-temperature-resistant organic silicon gel and preparation method thereof Download PDF

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Publication number
CN109575873A
CN109575873A CN201811539229.7A CN201811539229A CN109575873A CN 109575873 A CN109575873 A CN 109575873A CN 201811539229 A CN201811539229 A CN 201811539229A CN 109575873 A CN109575873 A CN 109575873A
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parts
silicone oil
vinyl
viscosity
structural formula
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Chinese (zh)
Inventor
张丽娅
陈维
陈田安
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Yantai Darbond Technology Co Ltd
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Yantai Darbond Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention relates to a high-temperature-resistant organic silicon gel which comprises the following raw materials in parts by mass: the component A comprises: 77-91.35 parts of vinyl silicone oil, 8.0-20 parts of vinyl resin, 0.5-2.0 parts of adhesive, 0.1-0.5 part of high-temperature stabilizer and 0.05-0.5 part of catalyst, wherein the component B comprises the following components: 63.2 to 89.9 parts of vinyl silicone oil, 8.0 to 20 parts of vinyl resin, 1.0 to 8.0 parts of hydrogen-containing silicone oil, 1.0 to 8.0 parts of hydrogen-containing resin and 0.1 to 0.8 part of inhibitor. The invention provides a high-temperature resistant organic silicon gel: after aging for 1000 hours at 200 ℃, the hardness change is small, the paint is not aged, and the weather resistance is good.

Description

A kind of high-temperature resistant silicone gel and preparation method thereof
Technical field
The present invention relates to a kind of Silica hydrogels, and in particular to a kind of high temperature resistant IGBT module encapsulation silicon gel belongs to Organosilicon adhesive technology field.
Background technique
Silica hydrogel is widely used for electronic field as a kind of high molecular material haveing excellent performance, play it is dust-proof, prevent Tide, etch-proof effect.With industrialized demand, Silica hydrogel using more and more extensive, country is also advocating energy conservation energetically Environmental protection, and in IGBT module encapsulation field, the needs as critical materials production domesticization are also more more and more intense.
Traditional IGBT module packaging plastic is organosilicon systems, can may be add-on type silicon for condensed type Silica hydrogel Gel, the solidification of condensed type Silica hydrogel need more than for 24 hours, and slow curing, low efficiency has by-product, and not environmentally, weatherability is poor, in height It cannot be guaranteed that certain insulating properties under warm super-humid conditions.It has been be eliminated that, add-on type Silica hydrogel quick solidifying, high-efficient, economic ring It protects, high-temperature insulating quality is good, solvent-free, no coupling product, good weatherability.Because its flexibility can form buffering, after aging also Its flexibility is kept, is not cracked, flexibility is good.
Current IGBT module Packaging Industry is all the system using organosilicon addition mostly, but traditional organosilicon Gel is not able to satisfy the needs in market, the Silica hydrogel resistant to high temperature that IGBT module Packaging Industry needs, and guarantees that its is good weather-proof Property, meet higher requirement.
It is encapsulated for IGBT module, effective silicon gel resistant to high temperature is temporarily not yet reported that, is applied in the field Adhesive must have more high requirement to be just able to satisfy and realize its various functions.Silica hydrogel produced herein has preferable High temperature resistant.
Summary of the invention
The present invention provides a kind of high temperature resistant IGBT module and encapsulates with organic for deficiency existing for existing silicon gel Silica hydrogel, which is characterized in that in parts by mass, contain following raw material:
Component A:
77~91.35 parts of vinyl silicone oil
8.0~20 parts of vinylite
0.5~2.0 part of bonding agent
0.1~0.5 part of high-temperature stabilizer
0.05~0.5 part of catalyst;
B component:
63.2~89.9 parts of vinyl silicone oil
8.0~20 parts of vinylite
1.0~8.0 parts of containing hydrogen silicone oil
1.0~8.0 parts of hydrogeneous resin
0.1~0.8 part of inhibitor
Based on the above technical solution, the present invention can also be improved as follows
Further, the vinyl silicone oil is vinyl-terminated silicone fluid, one of end side vinyl silicone oil or two kinds of mixing, second Amount vinyl content is 0.005-3wt%, viscosity 100-5000mPa.S.
Further, the vinylite is vinyl MQ resin, and one of vinyl MDT resin or two kinds mix It closes, contents of ethylene is 0.5-4.0wt %, viscosity 1000-30000mPa.S.
Further, the containing hydrogen silicone oil is end containing hydrogen silicone oil, end side containing hydrogen silicone oil, one of side containing hydrogen silicone oil or more Kind, hydrogen content 0.1-1.5wt%, viscosity 10-100mPa.S.
Further, the hydrogeneous resin is hydrogeneous MQ resin, and hydrogen content is 0.5-1.0 wt%, viscosity 100- 2000mPa.S。
Further, above-mentioned raw materials all remove the small molecules such as low-boiling-point substance, reduce the exudation of silicone oil, and treated solid content is >= 99.9。
Further, the structural formula of the bonding agent is as follows, specific such as structural formula (1): where 3≤X≤10,
Structural formula (1)
Beneficial effect using above-mentioned further scheme is: adding the bonding that glue can be improved to substrate in a certain amount of bonding agent Performance, IGBT bottom plate material are DBC ceramic wafer, are above copper material, and Silica hydrogel needs bonding to its, just can guarantee certain Resistance to pressure and insulating properties.
Further, the structural formula of the high-temperature stabilizer is as follows, specific such as structural formula (2): where and 1≤m≤3,1≤n≤ 3,2≤y≤5,
Structural formula (2)
Beneficial effect using above-mentioned further scheme is: improving the stability under high temperature, avoids aging.
Further, the catalyst is platinum catalyst, and platinum content is 3000~20000ppm.
Further, the inhibitor is alkynol substance, any one in olefin-containing base cyclic siloxane oligomer, 3- Methyl-1-butine-3- alcohol, 3,5- dimethyl-1- hexin-3- alcohol, 1- hexin base-1- cyclohexanol, 3- phenyl-1- butine-3- Alcohol, 2- methyl -3- butyne-2-alcohol, t etram-ethyltetravinylcyclotetrasiloxane.
The beneficial effects of the present invention are:
IGBT module encapsulation provided by the invention is good with silicon gel high-temperature resistant result, can resistance to 200 DEG C of the high temperature of long-time.
A kind of high temperature resistant IGBT module encapsulation silicon gel of the present invention and preparation method thereof, it is characterised in that specific packet It includes: the preparation of component A and the preparation of B component；
The preparation step of component A is as follows: under the conditions of 25 DEG C, weighing each raw material in following weight percentage ranges, second respectively 77~91.35 parts of alkenyl silicone oil, 8.0~20 parts of vinylite, 0.5~2.0 part of bonding agent, high-temperature stabilizer 0.1~0.5 Part, 0.05~0.5 part of catalyst sequentially adds in double-planet high-speed mixer, is uniformly mixed it, vacuum defoamation is filling and close Envelope, which saves, obtains the component A of the silicon gel；
The preparation step of B component is as follows: under the conditions of 25 DEG C, weighing each raw material in following weight percentage ranges, second respectively 63.2~89.9 parts of alkenyl silicone oil, 8.0~20 parts of vinylite, 1.0~8.0 parts of containing hydrogen silicone oil, hydrogeneous resin 1.0~8.0 Part, 0.1~0.8 part of inhibitor sequentially adds in double-planet high-speed mixer, is uniformly mixed it, vacuum defoamation is filling and close Envelope, which saves, obtains the B component of the silicon gel;
A kind of high temperature resistant IGBT module encapsulation preparation method of silicon gel
Under the conditions of 25 DEG C, according to A:B=1:1(weight ratio) precise component A and B component, make it using high velocity dispersators It is uniformly mixed, the condition of cure of vacuum defoamation, Silica hydrogel is: 125 DEG C, 1h.
Technical solution provided by the invention is to provide a kind of high temperature resistant IGBT module encapsulation silicon gel: passing through 200 DEG C 1000 hours experiment firmness changes of aging are small, not aging, good weatherability.
Specific embodiment
Below in conjunction with specific embodiment, the present invention is specifically described, it is necessary to it is pointed out here that following embodiment is only used In invention is further explained, it should not be understood as limiting the scope of the invention, the people that is skilled in technique in the field Member still falls within protection scope of the present invention to the modifications and adaptations for some essence that the present invention makes according to aforementioned present invention content.
Embodiment 1:
The preparation step of component A is as follows: under the conditions of 25 DEG C, weigh each raw material of following parts by weight respectively, vinyl-terminated silicone fluid, Contents of ethylene is 0.045wt%, and viscosity 800mPa.S, 78.2 parts, vinyl MQ resin, contents of ethylene 2.0wt% glues Degree is 1000mPa.S, 10.0 parts, vinyl MDT resin, and contents of ethylene 1.5wt%, viscosity 5000mPa.S, 10.0 parts, Bonding agent, it is specific such as structural formula (1), wherein X=10,1.0 parts, high-temperature stabilizer, specifically such as structural formula (2), m=1, n=3, Y=5,0.3 part, platinum catalyst, platinum content 3000ppm, 0.5 part sequentially adds in double-planet high-speed mixer, keeps it mixed It closes uniformly, vacuum defoamation is filling and be sealed the component A for obtaining the silicon gel；
The preparation step of B component is as follows: under the conditions of 25 DEG C, weigh each raw material of following parts by weight respectively, vinyl-terminated silicone fluid, Contents of ethylene is 0.01wt%, viscosity 1000mPa.S, 50.9 parts, end side vinyl silicone oil, and contents of ethylene 0.3wt%, Viscosity is 300mPa.S, and 20 parts, vinyl MQ resin, contents of ethylene 0.5wt%, viscosity 1000mPa.S, are held by 20.0 parts Containing hydrogen silicone oil, hydrogen content 0.1wt%, viscosity 10mPa.S, 0.2 part, side containing hydrogen silicone oil, hydrogen content 1.5wt%, viscosity is 30mPa.S, 0.8 part, hydrogeneous MQ resin, hydrogen content 0.5wt%, viscosity 100mPa.S, 8.0 parts, 3,5- dimethyl -1- oneself 0.1 part of alkynes -3- alcohol sequentially adds in double-planet high-speed mixer, is uniformly mixed it, and vacuum defoamation is filling and be sealed i.e. Obtain the B component of the silicon gel;
A kind of high temperature resistant IGBT module encapsulation preparation method of silicon gel
Under the conditions of 25 DEG C, according to A:B=1:1(weight ratio) precise component A and B component, made using high velocity dispersators It is uniformly mixed, and the condition of cure of vacuum defoamation, Silica hydrogel is: 125 DEG C, 1h.
Embodiment 2:
The preparation step of component A is as follows: under the conditions of 25 DEG C, weigh each raw material of following parts by weight respectively, vinyl-terminated silicone fluid, Contents of ethylene is 0.04wt%, viscosity 1000mPa.S, 91.35 parts, vinyl MQ resin, and contents of ethylene 1.0wt%, Viscosity is 2000mPa.S, and 8.0 parts, bonding agent is specific such as structural formula (1), wherein X=3,0.5 part, and high-temperature stabilizer, specifically Such as structural formula (2), m=3, n=1, y=2,0.1 part, platinum catalyst, platinum content 20000ppm, 0.05 part sequentially adds duplicate rows In star high-speed mixer, it is uniformly mixed it, vacuum defoamation is filling and be sealed the A group for obtaining the silicon gel Point；
The preparation step of B component is as follows: under the conditions of 25 DEG C, weigh each raw material of following parts by weight respectively, vinyl-terminated silicone fluid, Contents of ethylene is 0.005wt%, viscosity 5000mPa.S, 82.2 parts, vinyl MDT resin, and contents of ethylene 4.0wt%, Viscosity is 30000mPa.S, and 8.0 parts, end side containing hydrogen silicone oil hydrogen content is 0.8wt%, and viscosity 60mPa.S, 4.0 parts, side is hydrogeneous Silicone oil, hydrogen content 0.5wt%, viscosity 100mPa.S, 4.0 parts, hydrogeneous MQ resin, hydrogen content 1.0wt%, viscosity is 2000mPa.S, 1.0 parts, 0.8 part of 3-Phenyl-1-butyn-3-ol sequentially adds in double-planet high-speed mixer, keeps its mixing equal Even, vacuum defoamation is filling and be sealed the B component for obtaining the silicon gel;
A kind of high temperature resistant IGBT module encapsulation preparation method of silicon gel
Under the conditions of 25 DEG C, according to A:B=1:1(weight ratio) precise component A and B component, make it using high velocity dispersators It is uniformly mixed, the condition of cure of vacuum defoamation, Silica hydrogel is: 125 DEG C, 1h.
Embodiment 3:
The preparation step of component A is as follows: under the conditions of 25 DEG C, weighing each raw material of following parts by weight, vinyl-terminated silicone fluid, second respectively Amount vinyl content is 0.06%, and viscosity 300mPa.S, 82.2 parts, vinyl MDT resin, contents of ethylene is 3.0wt %, viscosity For 20000mPa.S, 15.0 parts, bonding agent is specific such as structural formula (1), wherein X=5,2.0 parts, and high-temperature stabilizer, specifically such as Structural formula (2), m=2, n=2, y=4,0.5 part, platinum catalyst, platinum content 5000ppm, 0.3 part sequentially adds double-planet height In fast blender, it is uniformly mixed it, vacuum defoamation is filling and be sealed the component A for obtaining the silicon gel；
The preparation step of B component is as follows: under the conditions of 25 DEG C, weigh each raw material of following parts by weight respectively, vinyl-terminated silicone fluid, Contents of ethylene is 0.3wt%, and viscosity 100mPa.S, 65.5 parts, end side vinyl silicone oil, contents of ethylene 3.0wt% glues Degree is 3000mPa.S, 10 parts, vinyl MQ resin, and contents of ethylene 1.0wt%, viscosity 2000mPa.S, 7.0 parts, ethylene Base MDT resin, contents of ethylene 2.0wt%, viscosity 10000mPa.S, 7.0 parts, end containing hydrogen silicone oil hydrogen content is 0.2wt%, Viscosity is 30mPa.S, 2.0 parts, end side containing hydrogen silicone oil, and hydrogen content 0.6wt%, viscosity 70mPa.S, 3.0 parts, hydrogeneous MQ tree Rouge, hydrogen content 0.8wt%, viscosity 800mPa.S, 5.0 parts, 0.5 part of t etram-ethyltetravinylcyclotetrasiloxane sequentially adds In double-planet high-speed mixer, it is uniformly mixed it, vacuum defoamation is filling and be sealed and obtain the silicon gel B component;
A kind of high temperature resistant IGBT module encapsulation preparation method of silicon gel
Under the conditions of 25 DEG C, according to A:B=1:1(weight ratio) precise component A and B component, make it using high velocity dispersators It is uniformly mixed, the condition of cure of vacuum defoamation, Silica hydrogel is: 125 DEG C, 1h.
Comparative example 1: it is to be not added with bonding agent in place of the difference of embodiment 1.
Comparative example 2: it is to be not added with high-temperature stabilizer in place of the difference of embodiment 2.
In order to verify the technical effect of Silica hydrogel provided by the invention, a series of tests are carried out, the results are shown in Table 1:
Table 1: the performance test data of sample obtained by embodiment 1-3 and comparative example 1-2
1 performance indicator of table
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, all in the spirit and principles in the present invention Within, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.

Claims (4)

1. a kind of high-temperature resistant silicone gel, which is characterized in that in parts by mass, contain following raw material:
Component A:
77~91.35 parts of vinyl silicone oil
8.0~20 parts of vinylite
0.5~2.0 part of bonding agent
0.1~0.5 part of high-temperature stabilizer
0.05~0.5 part of catalyst;
B component:
63.2~89.9 parts of vinyl silicone oil
8.0~20 parts of vinylite
1.0~8.0 parts of containing hydrogen silicone oil
1.0~8.0 parts of hydrogeneous resin
0.1~0.8 part of inhibitor
The high-temperature stabilizer structural formula is as follows, specific such as structural formula (2): where 1≤m≤3,1≤n≤3,2≤y≤5
Structural formula (2).
2. silicon gel according to claim 1, which is characterized in that the vinyl silicone oil is vinyl-terminated silicone fluid, The mixing of one or both of end side vinyl silicone oil, contents of ethylene 0.005-3wt%, viscosity 100-5000mPa.S; The vinylite is vinyl MQ resin, the mixing of one or both of vinyl MDT resin, contents of ethylene 0.5- 4.0wt%, viscosity 1000-30000mPa.S；The containing hydrogen silicone oil is end containing hydrogen silicone oil, end side containing hydrogen silicone oil, side containing hydrogen silicone oil One or more of, hydrogen content 0.1-1.5wt%, viscosity 10-100mPa.S；The hydrogeneous resin is hydrogeneous MQ tree Rouge, hydrogen content 0.5-1.0wt%, viscosity 100-2000mPa.S.
3. silicon gel according to claim 1, which is characterized in that the structural formula of the bonding agent is as follows, specifically such as Structural formula (1): where 3≤X≤10,
Structural formula (1).
4. silicon gel according to claim 1, which is characterized in that the catalyst is platinum catalyst, and platinum contains Amount is 3000~20000ppm；The inhibitor is 3- methyl-1-butine-3- alcohol, 3,5- dimethyl-1- hexin-3- alcohol, 1- Hexin base -1- cyclohexanol, 3-Phenyl-1-butyn-3-ol, 2- methyl -3- butyne-2-alcohol, four silicon oxygen of tetramethyl tetravinyl ring One of alkane.
CN201811539229.7A 2018-12-17 2018-12-17 High-temperature-resistant organic silicon gel and preparation method thereof Pending CN109575873A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111748315A (en) * 2020-07-10 2020-10-09 浙江鑫钰新材料有限公司 High-adhesion boiling-resistant organosilicon insulating sealant and preparation method thereof
CN112225853A (en) * 2020-10-13 2021-01-15 广州市白云化工实业有限公司 High-heat-resistance silica gel and preparation method thereof
CN112724927A (en) * 2020-12-25 2021-04-30 浙江中特化工有限公司 UV curing silicone gel for lead sealing
CN115505268A (en) * 2022-09-30 2022-12-23 江苏至昕新材料有限公司 Organic silicon insulating gel for packaging semiconductor module and preparation process thereof

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CN107955582A (en) * 2017-12-26 2018-04-24 烟台德邦先进硅材料有限公司 A kind of high bonding high tenacity organosilicon conductive adhesive of photovoltaic solar
CN108264883A (en) * 2016-12-29 2018-07-10 比亚迪股份有限公司 Optics of liquids silica-gel composition, optics silica gel and double glass photovoltaic modulies and preparation method thereof
CN108913089A (en) * 2018-07-23 2018-11-30 深圳天鼎新材料有限公司 Two-component packaging plastic, preparation method and application method and application

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105368380A (en) * 2015-11-12 2016-03-02 烟台德邦先进硅材料有限公司 PDC special-purpose high-strength high-viscosity packaging silica gel
CN108264883A (en) * 2016-12-29 2018-07-10 比亚迪股份有限公司 Optics of liquids silica-gel composition, optics silica gel and double glass photovoltaic modulies and preparation method thereof
CN107955582A (en) * 2017-12-26 2018-04-24 烟台德邦先进硅材料有限公司 A kind of high bonding high tenacity organosilicon conductive adhesive of photovoltaic solar
CN108913089A (en) * 2018-07-23 2018-11-30 深圳天鼎新材料有限公司 Two-component packaging plastic, preparation method and application method and application

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111748315A (en) * 2020-07-10 2020-10-09 浙江鑫钰新材料有限公司 High-adhesion boiling-resistant organosilicon insulating sealant and preparation method thereof
CN111748315B (en) * 2020-07-10 2022-04-05 浙江鑫钰新材料有限公司 High-adhesion boiling-resistant organosilicon insulating sealant and preparation method thereof
CN112225853A (en) * 2020-10-13 2021-01-15 广州市白云化工实业有限公司 High-heat-resistance silica gel and preparation method thereof
CN112225853B (en) * 2020-10-13 2022-12-23 广州市白云化工实业有限公司 High-heat-resistance silica gel and preparation method thereof
CN112724927A (en) * 2020-12-25 2021-04-30 浙江中特化工有限公司 UV curing silicone gel for lead sealing
CN115505268A (en) * 2022-09-30 2022-12-23 江苏至昕新材料有限公司 Organic silicon insulating gel for packaging semiconductor module and preparation process thereof
CN115505268B (en) * 2022-09-30 2024-02-06 江苏至昕新材料有限公司 Organic silicon insulating gel for packaging semiconductor module and preparation process thereof

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