CN104332309A - Potting material of metallic film capacitor - Google Patents
Potting material of metallic film capacitor Download PDFInfo
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- CN104332309A CN104332309A CN201410651837.2A CN201410651837A CN104332309A CN 104332309 A CN104332309 A CN 104332309A CN 201410651837 A CN201410651837 A CN 201410651837A CN 104332309 A CN104332309 A CN 104332309A
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Abstract
The invention discloses a potting material of a metallic film capacitor. According to weight, the potting material contains 50-60 parts of epoxy resin base materials, 2-4 parts of accelerants, 5-8 parts of curing agents, 5-7 parts of coupling reagents, 1-2 parts of diluents, 20-25 parts of padding, 1-2 parts of defoaming agents and 1-2 parts of flexibilizers. The epoxy resin base materials are low-molecular-weight bisphenol A-type epoxy resin; the accelerants are benzyl diamine; the curing agents are anhydride curing agents; the coupling reagents are silane coupling agents; the diluents are reactive diluents; the padding is aluminium nitride; the defoaming agents are silicone emulsion emulgators; the flexibilizers are active flexibilizers. Therefore, the potting material of the metallic film capacitor has the advantages of good elasticity, small viscosity, strong permeability and good thermal conductivity; can improve the capacitor and electric strength of capacitors; can improve local discharge performance and heat resistance.
Description
Technical field
The present invention relates to electronic element device materials field, particularly relate to a kind of metallized membrane capacitance embedding material.
Background technology
During metallization film capacitor is produced, main medium and the hole between pole plate and main medium normally carry out embedding with a kind of material, to improve capacitance and insulation property, and improve partial discharge and heat resistance.Current Embedding Material is varied, but mainly various synthetic polymers with the most use, epoxy resin, organosilicon, organosilicon epoxy, polyimides, liquid crystal polymer, end hydroxy butadiene, all kinds of polyurethane etc., be wherein widely used because it has various good characteristic with epoxy resin encapsulated material.
But at present also there is many deficiencies in a lot of place in electronics epoxy fill-sealing materials performance, as: elasticity is inadequate, viscosity is large, solidification time have certain internal stress, easily ftracture, heatproof rushes the problems such as ability.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of metallized membrane capacitance embedding material, there is good electrical property, heat resistance and age stability performance, there is good springiness simultaneously, viscosity is little, the feature that permeability is strong, coefficient of linear expansion is little, thermal conductivity is good, capacitance and the electrical strength of capacitor can be improved, and partial discharge performance and thermal endurance can be improved.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of metallized membrane capacitance embedding material, comprise composition and components by weight percent is: epoxy resin base material 50-60 part, promoter 2-4 part, curing agent 5-8 part, coupling agent 5-7 part, diluent 1-2 part, filler 20-25 part, defoamer 1-2 part and flexibilizer 1-2 part, described epoxy resin base material is low molecule bisphenol A type epoxy resin, described promoter is benzyl diamines, described curing agent is acid anhydride type curing agent, described coupling agent is silane coupler, described diluent is reactive diluent, described filler is aluminium nitride, described defoamer is silicone emulsion class emulsifying agent, described flexibilizer is endurable active toughener.
In a preferred embodiment of the present invention, described low molecule bisphenol A type epoxy resin is E-51, E-44 or E-42.
In a preferred embodiment of the present invention, described acid anhydride type curing agent is liquid methyl tetrabydrophthalic anhydride.
In a preferred embodiment of the present invention, described silane coupler is anilinomethyl trimethoxy silane.
In a preferred embodiment of the present invention, described reactive diluent is the one in n-butyl glycidyl ether, allyl glycidyl ether, diethylhexyl glycidol ether or phenyl glycidyl ether.
The invention has the beneficial effects as follows: in low molecule bisphenol A type epoxy resin base, add the promoter of rational proportion, curing agent, coupling agent, diluent, filler, defoamer and flexibilizer obtained, there is good electrical property, heat resistance and age stability performance, there is good springiness simultaneously, viscosity is little, the feature that permeability is strong, coefficient of linear expansion is little, thermal conductivity is good, capacitance and the electrical strength of capacitor can be improved, and partial discharge performance and thermal endurance can be improved.
Embodiment
Below preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
The embodiment of the present invention comprises:
A kind of metallized membrane capacitance embedding material, comprise composition and components by weight percent is: epoxy resin base material 50-60 part, promoter 2-4 part, curing agent 5-8 part, coupling agent 5-7 part, diluent 1-2 part, filler 20-25 part, defoamer 1-2 part and flexibilizer 1-2 part, described epoxy resin base material is low molecule bisphenol A type epoxy resin, described promoter is benzyl diamines, described curing agent is acid anhydride type curing agent, described coupling agent is silane coupler, described diluent is reactive diluent, described filler is aluminium nitride, described defoamer is silicone emulsion class emulsifying agent, described flexibilizer is endurable active toughener.
Wherein, described low molecule bisphenol A type epoxy resin is E-51, E-44 or E-42, has viscosity less, the feature that epoxide number is high.
Described acid anhydride type curing agent is liquid methyl tetrabydrophthalic anhydride, has the advantages that viscosity is little, can play fixed line, dilution double action in potting compound formula.
Described silane coupler is anilinomethyl trimethoxy silane, can improve caking property and the moisture resistance of material.
Described reactive diluent is the one in n-butyl glycidyl ether, allyl glycidyl ether, diethylhexyl glycidol ether or phenyl glycidyl ether, to increase mobility and the permeability of potting compound, and extends life cycle.
Promoter is benzyl diamines: effectively reduce fixed line temperature, shorten curing time.
Filler is aluminium nitride: can not only reduce costs, and can also reduce the thermal coefficient of expansion of solidfied material, shrinkage and increase thermal conductivity, reducing internal stress when solidifying.
Defoamer is silicone emulsion class emulsifying agent: solve liquid encapsulation material assimilation rear surface and stay alveolate problem.
Flexibilizer is endurable active toughener: endurable active toughener can participate in reaction together with epoxy resin, increases the chain link of reactant, thus the toughness of increase solidfied material and heatproof rush ability.
Embodiment one: preparing metal membrane capacitance potting compound, gets E-51 55 parts, benzyl diamines 3 parts, liquid methyl tetrabydrophthalic anhydride 8 parts, anilinomethyl trimethoxy silane 6 parts, n-butyl glycidyl ether 1 part, aluminium nitride 25 parts, silicone emulsion class emulsifying agent 1 part and endurable active toughener 1 part mixing Post RDBMS and obtains.
Embodiment two: preparing metal membrane capacitance potting compound, gets E-44 58 parts, benzyl diamines 4 parts, liquid methyl tetrabydrophthalic anhydride 6 parts, anilinomethyl trimethoxy silane 7 parts, allyl glycidyl ether 1 part, aluminium nitride 22 parts, silicone emulsion class emulsifying agent 1 part and endurable active toughener 1 part mixing Post RDBMS and obtains.
Present invention is disclosed a kind of metallized membrane capacitance embedding material, the promoter of rational proportion, curing agent, coupling agent, diluent, filler, defoamer and flexibilizer is added obtained in low molecule bisphenol A type epoxy resin base, there is good electrical property, heat resistance and age stability performance, there is good springiness simultaneously, viscosity is little, the feature that permeability is strong, coefficient of linear expansion is little, thermal conductivity is good, can improve capacitance and the electrical strength of capacitor, and can improve partial discharge performance and thermal endurance.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (5)
1. a metallized membrane capacitance embedding material, it is characterized in that, comprise composition and components by weight percent is: epoxy resin base material 50-60 part, promoter 2-4 part, curing agent 5-8 part, coupling agent 5-7 part, diluent 1-2 part, filler 20-25 part, defoamer 1-2 part and flexibilizer 1-2 part, described epoxy resin base material is low molecule bisphenol A type epoxy resin, described promoter is benzyl diamines, described curing agent is acid anhydride type curing agent, described coupling agent is silane coupler, described diluent is reactive diluent, described filler is aluminium nitride, described defoamer is silicone emulsion class emulsifying agent, described flexibilizer is endurable active toughener.
2. metallized membrane capacitance embedding material according to claim 1, is characterized in that, described low molecule bisphenol A type epoxy resin is E-51, E-44 or E-42.
3. metallized membrane capacitance embedding material according to claim 1, is characterized in that, described acid anhydride type curing agent is liquid methyl tetrabydrophthalic anhydride.
4. metallized membrane capacitance embedding material according to claim 1, is characterized in that, described silane coupler is anilinomethyl trimethoxy silane.
5. metallized membrane capacitance embedding material according to claim 1, is characterized in that, described reactive diluent is the one in n-butyl glycidyl ether, allyl glycidyl ether, diethylhexyl glycidol ether or phenyl glycidyl ether.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410651837.2A CN104332309A (en) | 2014-11-17 | 2014-11-17 | Potting material of metallic film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410651837.2A CN104332309A (en) | 2014-11-17 | 2014-11-17 | Potting material of metallic film capacitor |
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| CN104332309A true CN104332309A (en) | 2015-02-04 |
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| CN201410651837.2A Pending CN104332309A (en) | 2014-11-17 | 2014-11-17 | Potting material of metallic film capacitor |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105331120A (en) * | 2015-12-14 | 2016-02-17 | 苏州鑫德杰电子有限公司 | Encapsulating material for metalized film capacitor |
| CN105907346A (en) * | 2016-05-26 | 2016-08-31 | 张学健 | Epoxy electronic pouring sealant and preparation method thereof |
| CN107760169A (en) * | 2017-11-30 | 2018-03-06 | 苏州科茂电子材料科技有限公司 | A kind of use for electronic products coumarone indene resin heat-conductive coating and preparation method thereof |
| CN108831744A (en) * | 2018-05-24 | 2018-11-16 | 天津大学 | A kind of heat dissipating method improving polypropylene film |
| CN109370159A (en) * | 2018-10-31 | 2019-02-22 | 南阳师范学院 | A kind of polypropylene film capacitor filling glue and preparation method thereof |
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| KR20060071008A (en) * | 2004-12-21 | 2006-06-26 | 에스케이케미칼주식회사 | Epoxy resin encapsulant composition for preventing optical leakage |
| CN101362848A (en) * | 2008-09-24 | 2009-02-11 | 常熟佳发化学有限责任公司 | Filler resin composition for adjusting high backing plate by filling and preparation method |
| CN101508825A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Epoxy resin embedding glue and method for producing the same |
| CN102863936A (en) * | 2012-10-09 | 2013-01-09 | 株洲时代新材料科技股份有限公司 | Heating solidification type dual-component epoxy pouring sealant and preparation method thereof |
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2014
- 2014-11-17 CN CN201410651837.2A patent/CN104332309A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20030039804A (en) * | 2001-11-14 | 2003-05-22 | 정도화성 주식회사 | Weather-proof Epoxy Composition for Outdoor Insulator against Electricity |
| KR20060071008A (en) * | 2004-12-21 | 2006-06-26 | 에스케이케미칼주식회사 | Epoxy resin encapsulant composition for preventing optical leakage |
| CN101362848A (en) * | 2008-09-24 | 2009-02-11 | 常熟佳发化学有限责任公司 | Filler resin composition for adjusting high backing plate by filling and preparation method |
| CN101508825A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Epoxy resin embedding glue and method for producing the same |
| CN102863936A (en) * | 2012-10-09 | 2013-01-09 | 株洲时代新材料科技股份有限公司 | Heating solidification type dual-component epoxy pouring sealant and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105331120A (en) * | 2015-12-14 | 2016-02-17 | 苏州鑫德杰电子有限公司 | Encapsulating material for metalized film capacitor |
| CN105907346A (en) * | 2016-05-26 | 2016-08-31 | 张学健 | Epoxy electronic pouring sealant and preparation method thereof |
| CN107760169A (en) * | 2017-11-30 | 2018-03-06 | 苏州科茂电子材料科技有限公司 | A kind of use for electronic products coumarone indene resin heat-conductive coating and preparation method thereof |
| CN108831744A (en) * | 2018-05-24 | 2018-11-16 | 天津大学 | A kind of heat dissipating method improving polypropylene film |
| CN109370159A (en) * | 2018-10-31 | 2019-02-22 | 南阳师范学院 | A kind of polypropylene film capacitor filling glue and preparation method thereof |
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