CN102850988B - Epoxy resin pouring sealant and usage method - Google Patents
Epoxy resin pouring sealant and usage method Download PDFInfo
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- CN102850988B CN102850988B CN201210364115.XA CN201210364115A CN102850988B CN 102850988 B CN102850988 B CN 102850988B CN 201210364115 A CN201210364115 A CN 201210364115A CN 102850988 B CN102850988 B CN 102850988B
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Abstract
The invention relates to an epoxy resin pouring sealant and a usage method. The epoxy resin pouring sealant is composed of an o-cresol-formaldehude epoxy resin matrix, a methylhexahydrophthalic anhydride curing agent, an electronic grade torispherical silica micro powder filler, a diluent and an antifoaming agent, wherein the composition ratio of the epoxy resin matrix to the curing agent is 1: (0.6-1.4), and the composition ratio of the epoxy resin matrix to the filler is 1: (0.3-2.4). According to the epoxy resin pouring sealant, a curing process is that pre-curing is performed at the temperature of 90 DEG C for 0.5-1 hour, and curing is performed at the temperature of 150 DEG C for 2-3 hours. The epoxy resin pouring sealant has the advantages of being low in toxicity, density, thermal expansivity coefficient and water absorption rate, high in bending strength and compressive strength and good in application prospect and can be widely applied to electronic controllers, sensors, aerospace components and the like.
Description
Technical field
The present invention relates to epoxy resin embedding adhesive and the using method of a kind of epoxy resin embedding adhesive and using method, particularly low thermal coefficient of expansion, high bending resistance and ultimate compression strength.Belong to production of adhesive technical field.
Background technology
Joint sealant claims again electronic pastes, is an address widely.Be used for the bonding of electronic devices and components, sealing, embedding and coating protection.It is liquid that joint sealant belongs to before uncured, has mobility, and glue viscosity is distinguished to some extent according to the difference of the material of product, performance, production technique.Joint sealant could be realized its use value after solidifying completely, can play waterproof and dampproof, dustproof, insulation, heat conduction, secret, protection against corrosion, heatproof, shockproof effect after solidifying.Along with the expansion of range of application, the over-all properties of joint sealant material is had higher requirement.
Particularly abroad to the existing more report of epoxy resin embedding adhesive material, also there is more application example both at home and abroad.Application number is the preparation method that 200610150880.6 Chinese patent has been reported modified phenolic resins in low viscosity, fire resistant joint sealant and this glue, is mainly the application for high temperature resistant element.Application number is that 200710138788.2 Chinese patent has been reported acid resistance epoxy resin embedding adhesive and preparation method thereof, and what mainly solved that lead acid cell often occurs climbs acid, leaks the problems such as acid.Application number is that 200910059237.6 Chinese patent has been reported a kind of low density, high impact properties epoxy resin embedding adhesive and preparation method thereof, lay particular emphasis on the shock resistance of material, the material of its acquisition is applicable to the embedding of the electric elements under miniaturization, lightweight, shock resistance condition.Application number is that 200680018614.6 Chinese patent has been reported a kind of resin combination and goods prepared therefrom with low thermal coefficient of expansion, and the thermal expansivity of this material is about 10 ~ 50 × 10
-6/ ℃, but do not relate to the performance of the aspects such as bending strength or ultimate compression strength.Polymkeric substance in its chemical constitution is the resin combinations such as polyimide, polyester-imide, and packing material is graphite, and preparation method is powder compression, compression molding, basic molding etc., is mainly used in wear ring or packing ring.Above-mentioned patent special emphasis is separately all not identical.The epoxy resin encapsulated material that simultaneously meets low thermal coefficient of expansion, high bending resistance and ultimate compression strength not yet has report.
Summary of the invention
The object of the invention is to overcome the deficiency of prior art and provide a kind of reasonable mixture ratio of components, curing process simple, lower-cost low thermal coefficient of expansion, bending resistance, epoxy resin embedding adhesive and using method that ultimate compression strength is high.
A kind of epoxy resin embedding adhesive of the present invention, comprises that following component forms by weight:
Described epoxy resin is solid-state o-cresol formaldehyde epoxy resin, 200 mesh sieves; Described solidifying agent is liquid methylhexahydrophthalic anhydride; Described filler is SiO
2micro mist, described SiO
2micro mist is electronic-grade torispherical, SiO
2the SiO of content>=98.5%
2micro mist, crosses 400 mesh sieves.Described thinner is the one in dimethylbenzene, ethanol or acetone; Described defoamer is emulsion paint defoamer, and described emulsion paint is produced by Changzhou Jia Site Chemical Co., Ltd. with defoamer, and product type is: SPA-200 defoamer.
The using method of a kind of epoxy resin embedding adhesive of the present invention sketch under:
By the weight part of the epoxy resin embedding adhesive component of design, get each component, first, epoxy resin, filler, mixing diluents are stirred, then, add solidifying agent and be heated to 90 ℃ under whipped state, thing to be mixed dissolves into after liquid state, add defoamer, continue to stir 10-30 minute, after having stirred, can be coated in by embedding thing surface, after the standing 0.5-1 of room temperature hour Procuring, be placed in vacuum drying oven, 150 ℃, constant temperature 2 ~ 3 hours, fully curing.
The present invention has carried out the optimization of a large amount of Composition Design and curing process to epoxy resin encapsulated material, through comparison and screening repeatedly, prepared the epoxy resin encapsulated material of low thermal coefficient of expansion, high bending resistance and ultimate compression strength.
The present invention is owing to adopting said components proportioning, selecting the o-cresol formaldehyde epoxy resin that thermal expansivity is lower is matrix, selecting liquid heat-curing type anhydrides methyl hexahydrophthalic anhydride is solidifying agent, has that fusing point is low, low with the title complex viscosity of cycloaliphatic epoxy resin composition, working life long, the thermotolerance of cured article is high, electrical properties in high temperatures good; The torispherical silicon powder of introducing electronic-grade is weighting agent, and the internal friction of torispherical silicon powder in resin or colloidal sol is little, can reduce the viscosity of mixture systems, improves the filling ratio of silicon powder; And can improve dispersiveness and the mobility of mixture system, increase the intensity of material, thereby strengthen physical strength, Young's modulus, the ageing-resistant performance of cured product, corrosion resistance etc.The present invention is by the optimization design to main ingredient, and the density of the epoxy resin embedding adhesive material obtaining is lower, and thermal linear expansion coefficient is lower, between-10.04 ~ 35.24 (10
-6/ K) between, at the thermal expansivity of some temperature range, be even negative value, this result will be widened the range of application of epoxy resin embedding adhesive material greatly.The bending strength of material reaches as high as 187MPa, ultimate compression strength reaches as high as 683MPa, and (25 ℃ of lower water-intake rates, water-bath 48h), make the over-all properties of epoxy resin embedding adhesive material obtain larger improvement, over-all properties is far away higher than the epoxy resin embedding adhesive material of domestic and international similar system.The preparation method of this epoxy resin embedding adhesive material is simple, and curing process is simple, and production cost is lower.And this Embedding Material has the characteristic of low toxicity, low density, low thermal coefficient of expansion, low water absorption and high bending resistance and ultimate compression strength, can be widely used in electronic regulator, sensor, space flight element etc., application prospect is good.
Accompanying drawing explanation
Thermal expansivity curve after the epoxy resin embedding adhesive that accompanying drawing 1 is prepared for the embodiment of the present invention 3 solidifies.
Embodiment
Below in conjunction with embodiment, the invention will be further described, but should not limit the scope of the invention with this.
Embodiment 1:
The epoxy resin embedding adhesive of preparation, the content of each component is
Embodiment 2: the epoxy resin embedding adhesive material of the low thermal coefficient of expansion the present invention relates to, high bending resistance and ultimate compression strength, the content of each component is
Embodiment 3:
The epoxy resin embedding adhesive of preparation, the content of each component is
Embodiment 4:
The epoxy resin embedding adhesive of preparation, the content of each component is
Embodiment 5:
The epoxy resin embedding adhesive of preparation, the content of each component is
Embodiment 6:
The epoxy resin embedding adhesive of preparation, the content of each component is
Embodiment 7:
The epoxy resin embedding adhesive of preparation, the content of each component is
Embodiment 8:
The epoxy resin embedding adhesive of preparation, the content of each component is
The chemical constitution difference of epoxy resin embedding adhesive material prepared by each embodiment, but using method is close, detailed process is: by the weight part of the epoxy resin embedding adhesive component of design, get each component, first, by epoxy resin, filler, mixing diluents stirs, then, under whipped state, add solidifying agent and be heated to 90 ℃, thing to be mixed dissolves into after liquid state, add defoamer, continue to stir 10-30 minute, after stirring completes, can be coated in by embedding thing surface, after the standing 0.5-1 of room temperature hour Procuring, be placed in vacuum drying oven, 150 ℃, constant temperature 2 ~ 3 hours, fully solidify.
Performance index after epoxy resin embedding adhesive prepared by the each specific embodiment of the present invention solidifies are listed in table 1.
Table 1
Claims (2)
1. an epoxy resin embedding adhesive, comprises that following component forms by weight:
Described epoxy resin is solid-state o-cresol formaldehyde epoxy resin, crosses 200 mesh sieves;
Described solidifying agent is liquid methylhexahydrophthalic anhydride;
Described filler is SiO
2micro mist, described SiO
2micro mist is electronic-grade torispherical, SiO
2the SiO of content>=98.5%
2micro mist, crosses 400 mesh sieves;
Described thinner is the one in dimethylbenzene, ethanol or acetone;
Described defoamer is emulsion paint defoamer.
2. the using method of epoxy resin embedding adhesive according to claim 1, to get each component by the weight part of the epoxy resin embedding adhesive component of design, first, epoxy resin, filler, mixing diluents are stirred, then, under whipped state, add solidifying agent and be heated to 90 ℃, thing to be mixed dissolves into after liquid state, adds defoamer, continue to stir 10-30 minute, after stirring completes, can be coated in by embedding thing surface, after the standing 0.5-1 of room temperature hour Procuring, be placed in vacuum drying oven, 150 ℃, constant temperature 2～3 hours, fully curing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210364115.XA CN102850988B (en) | 2012-09-26 | 2012-09-26 | Epoxy resin pouring sealant and usage method |
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| CN201210364115.XA CN102850988B (en) | 2012-09-26 | 2012-09-26 | Epoxy resin pouring sealant and usage method |
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| CN102850988A CN102850988A (en) | 2013-01-02 |
| CN102850988B true CN102850988B (en) | 2014-05-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106867438A (en) * | 2017-03-06 | 2017-06-20 | 固德电材系统（苏州）股份有限公司 | A kind of epoxy resin embedding adhesive and its application method |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103468193B (en) * | 2013-09-17 | 2016-05-18 | 广州聚合新材料科技股份有限公司 | Epoxy resin embedding adhesive and the preparation technology thereof of the low smell of low halogen |
| CN106700997A (en) * | 2016-12-27 | 2017-05-24 | 苏州兴创源新材料科技有限公司 | High temperature resistant packaging adhesive for large-power LED illuminating lamp and preparation method of high temperature resistant packaging adhesive |
| CN107556701B (en) * | 2017-09-14 | 2020-04-03 | 江山海维科技有限公司 | Manufacturing process of epoxy resin for sensor |
| CN108165179A (en) * | 2017-12-27 | 2018-06-15 | 惠州市杜科新材料有限公司 | A kind of speaker voice coil high temperature resistant coating binder |
| CN108774382A (en) * | 2018-08-11 | 2018-11-09 | 甘肃恒路交通勘察设计院有限公司 | A kind of preparation of sensor package material and method for testing performance |
| CN109385240B (en) * | 2018-10-10 | 2021-05-28 | 广州聚合新材料科技股份有限公司 | Epoxy resin pouring sealant and preparation method and application thereof |
| WO2020113507A1 (en) * | 2018-12-06 | 2020-06-11 | 浙江华飞电子基材有限公司 | Liquid casting resin composition for ultra-high voltage device |
| CN113708002A (en) * | 2021-09-29 | 2021-11-26 | 远景能源有限公司 | Battery box and energy storage battery |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102559115A (en) * | 2011-12-22 | 2012-07-11 | 烟台德邦科技有限公司 | Chip-level bottom filling adhesive and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20070293603A1 (en) * | 2006-06-19 | 2007-12-20 | Ashland Licensing And Intellectual Property Llc | Epoxy adhesive composition and use thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102559115A (en) * | 2011-12-22 | 2012-07-11 | 烟台德邦科技有限公司 | Chip-level bottom filling adhesive and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106867438A (en) * | 2017-03-06 | 2017-06-20 | 固德电材系统（苏州）股份有限公司 | A kind of epoxy resin embedding adhesive and its application method |
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