CN106700997A - High temperature resistant packaging adhesive for large-power LED illuminating lamp and preparation method of high temperature resistant packaging adhesive - Google Patents
High temperature resistant packaging adhesive for large-power LED illuminating lamp and preparation method of high temperature resistant packaging adhesive Download PDFInfo
- Publication number
- CN106700997A CN106700997A CN201611223141.5A CN201611223141A CN106700997A CN 106700997 A CN106700997 A CN 106700997A CN 201611223141 A CN201611223141 A CN 201611223141A CN 106700997 A CN106700997 A CN 106700997A
- Authority
- CN
- China
- Prior art keywords
- packaging adhesive
- temperature resistant
- epoxy resin
- resistant packaging
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 239000000853 adhesive Substances 0.000 title claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 20
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000945 filler Substances 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 239000004033 plastic Substances 0.000 claims description 7
- 239000012745 toughening agent Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 229910000077 silane Inorganic materials 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical group NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 2
- 150000008065 acid anhydrides Chemical group 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 6
- 238000003754 machining Methods 0.000 abstract description 3
- 230000004048 modification Effects 0.000 abstract description 3
- 238000012986 modification Methods 0.000 abstract description 3
- 230000004913 activation Effects 0.000 abstract description 2
- 238000005336 cracking Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- 239000003085 diluting agent Substances 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 230000003116 impacting effect Effects 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011863 silicon-based powder Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a high temperature resistant packaging adhesive for a lager-power LED illuminating lamp and a preparation method of the high temperature resistant packaging adhesive. The high temperature resistant packaging adhesive is manufactured under certain process conditions by taking epoxy resin as a matrix material and adding active toughening diluents and active fillers. The high temperature resistant packaging adhesive comprises the epoxy resin, a curing agent and an accelerator, wherein the epoxy resin selects bisphenol A epoxy resin E-51 as main resin, and the epoxy resin F-44 is used for compounding with the E-51 for improving the high temperature and low temperature resistance of the product. Since more than two epoxy groups are contained in the F-44 molecular structure, the activity is high, and the cured product is large in crosslinking density, compact in structure and excellent in heat resistance, mechanical strength and chemical resistance. Meanwhile, a silane coupling agent and other materials are used for performing modification activation treatment on the surface of a silica powder particle, so that the prepared packaging adhesive is moderate in viscosity, long in operable time, excellent in machining performance, and free from cracking after high and low-temperature cyclic impacting.
Description
Technical field
The present invention relates to a kind of high-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof.
Background technology
With the development of electronic integration technology and printed-board technology, the density of Electronic Assemblies is greatly improved, electronics unit
Device reduces on thousands of times of ground, while arithmetic speed is also more and more faster.Under high-frequency work, the heat that electronic component is produced
The rapid accumulation of amount, increase, cause the hydraulic performance decline of material.Heat-conducting polymer material for high frequency microelectronic component radiating,
Precision is improved, the extension life-span has more and more important effect.But there is resistance to height in the material of encapsulation technology in the market
Warm poor performance, in preparation process the problems such as poor compatibility.
The content of the invention
It is an object of the invention to provide a kind of high-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof, adopt
Compounded with epoxy resin F-44 and E-51, while being modified activation to silicon powder particle surface using materials such as silane couplers
Treatment, obtained packaging plastic modest viscosity, operable time is long, and machining property is excellent, after high/low temperature circulation impact not
Cracking.
To achieve the above object, the technical scheme is that providing a kind of high-power LED illuminating lamp high temperature packaging
Glue and preparation method thereof, is made by the steps：
（1）, 100 parts of epoxy resin E-51,20-40 part epoxy resin F-44 is combined in proportion；
（2）, add 10-20 parts of endurable active toughener, 150-300 parts of active filler stir；
（3）, by three-roll grinder grind；
（4）, vacuum purifies and add after bubble 20-25 part curing agent and 1-2 accelerator is well mixed and pours after vacuum purifies bubble
Note in reactor；
（5）, carry out by 100 DEG C of conditions of cure solidification 30min after the packaging plastic is obtained.
Preferably, described endurable active toughener is epoxy resin D-410.
Preferably, described curing agent is diethylenetriamine.
Preferably, described accelerator is acid anhydrides accelerator.
Preferably, described active filler is silane coupler.
The advantages of the present invention are：Epoxy resin D-410 endurable active tougheners are added, makes solidfied material cross-linked network
In network structure, ether network ratio is greatly increased, and substantially increases the mechanical mechanics property and electric insulating quality of cured product, is used
Silane coupler used as active filler, make by the effective cohesive force and interface hydrophobicity performance for improving resin and silica flour silicon powder
The packaging plastic modest viscosity for obtaining, operable time is long, and machining property is excellent, is not ftractureed after high/low temperature circulation impact.
Specific embodiment
With reference to embodiment, specific embodiment of the invention is further described.Following examples are only used for more
Plus technical scheme is clearly demonstrated, and can not be limited the scope of the invention with this.
The present invention specific implementation technical scheme be：
Embodiment 1：
100 parts of epoxy resin E-51,20-40 part epoxy resin F-44 are combined in proportion；10-20 parts of endurable active toughener of addition,
150-300 parts of active filler stirs；Ground by three-roll grinder；Vacuum adds 20-25 parts of curing agent after purifying bubble
It is well mixed after simultaneously vacuum purifies bubble with 1-2 accelerator and is poured into reactor；Condition of cure by 100 DEG C is solidified
The packaging plastic is obtained after 30min.
Embodiment 2：
130 parts of epoxy resin E-51,20-40 part epoxy resin F-44 are combined in proportion；Add 16 parts of endurable active tougheners, 180
Part active filler stirs；Ground by three-roll grinder；Vacuum adds 30 parts of curing agent and 2 accelerator mixed after purifying bubble
Close after uniform and vacuum purifies bubble and be poured into reactor；By 130 DEG C of conditions of cure be obtained after solidification 35min described
Packaging plastic.
Embodiment 3：
165 parts of epoxy resin E-51,20-40 part epoxy resin F-44 are combined in proportion；Add 18 parts of endurable active tougheners, 190
Part active filler stirs；Ground by three-roll grinder；Vacuum adds 35 parts of curing agent and 1 accelerator mixed after purifying bubble
Close after uniform and vacuum purifies bubble and be poured into reactor；By 140 DEG C of conditions of cure be obtained after solidification 40min described
Packaging plastic.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, on the premise of the technology of the present invention principle is not departed from, some improvements and modifications can also be made, these improvements and modifications
Also should be regarded as protection scope of the present invention.
Claims (6)
1. a kind of high-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof, it is characterised in that including epoxy resin E-
51st, epoxy resin F-44, endurable active toughener, active filler, curing agent and accelerator are according to 100:20-40:10-20:150-
300:20-25:The ratio of 1-2 is mixed to prepare.
2. high-temperature resistant packaging adhesive for high-power LED lamp according to claim 1 and preparation method thereof, its feature exists
In being made by the steps：
（1）, 100 parts of epoxy resin E-51,20-40 part epoxy resin F-44 is combined in proportion；
（2）, add 10-20 parts of endurable active toughener, 150-300 parts of active filler stir；
（3）, by three-roll grinder grind；
（4）, vacuum purifies and add after bubble 20-25 part curing agent and 1-2 accelerator is well mixed and pours after vacuum purifies bubble
Note in reactor；
（5）, carry out by 100 DEG C of conditions of cure solidification 30min after the packaging plastic is obtained.
3. high-temperature resistant packaging adhesive for high-power LED lamp according to claim 2 and preparation method thereof, its feature exists
In described endurable active toughener is epoxy resin D-410.
4. high-temperature resistant packaging adhesive for high-power LED lamp according to claim 2 and preparation method thereof, its feature exists
In described curing agent is diethylenetriamine.
5. high-temperature resistant packaging adhesive for high-power LED lamp according to claim 2 and preparation method thereof, its feature exists
In described accelerator is acid anhydrides accelerator.
6. high-temperature resistant packaging adhesive for high-power LED lamp according to claim 2 and preparation method thereof, its feature exists
In described active filler is silane coupler.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611223141.5A CN106700997A (en) | 2016-12-27 | 2016-12-27 | High temperature resistant packaging adhesive for large-power LED illuminating lamp and preparation method of high temperature resistant packaging adhesive |
| PCT/CN2017/109033 WO2018121048A1 (en) | 2016-12-27 | 2017-11-02 | Heat-resistant packaging adhesive for high-power led and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611223141.5A CN106700997A (en) | 2016-12-27 | 2016-12-27 | High temperature resistant packaging adhesive for large-power LED illuminating lamp and preparation method of high temperature resistant packaging adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106700997A true CN106700997A (en) | 2017-05-24 |
Family
ID=58896233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611223141.5A Pending CN106700997A (en) | 2016-12-27 | 2016-12-27 | High temperature resistant packaging adhesive for large-power LED illuminating lamp and preparation method of high temperature resistant packaging adhesive |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106700997A (en) |
| WO (1) | WO2018121048A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018121048A1 (en) * | 2016-12-27 | 2018-07-05 | 苏州兴创源新材料科技有限公司 | Heat-resistant packaging adhesive for high-power led and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112373149A (en) * | 2020-11-12 | 2021-02-19 | 西安航天三沃化学有限公司 | Preparation method of flexible aluminum substrate |
| CN114196358A (en) * | 2021-12-24 | 2022-03-18 | 山东工业陶瓷研究设计院有限公司 | Epoxy resin binder and preparation method and application thereof |
| CN114196360A (en) * | 2021-12-28 | 2022-03-18 | 句容协鑫光伏科技有限公司 | Quick-drying iron plate adhesive capable of improving bonding efficiency and preparation method thereof |
| CN114773963A (en) * | 2022-04-01 | 2022-07-22 | 广州市雷曼兄弟电子科技有限公司 | Anti-static two-liquid mixed hardened adhesive suitable for mobile phone film and preparation process thereof |
| CN115160967B (en) * | 2022-07-29 | 2023-03-21 | 六和电子（江西）有限公司 | Preparation method and preparation device of epoxy resin pouring sealant |
| CN115260958A (en) * | 2022-08-29 | 2022-11-01 | 厦门理工学院 | Preparation process of packaging adhesive for Micro-LED |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101921571A (en) * | 2010-08-13 | 2010-12-22 | 东莞市英迈新能源材料有限公司 | High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof |
| CN102702682A (en) * | 2012-05-25 | 2012-10-03 | 嘉兴市嘉港合成材料有限公司 | Liquid epoxy resin composition for packaging LED (Light Emitting Diode) |
| CN106047276A (en) * | 2016-08-05 | 2016-10-26 | 合肥毅创钣金科技有限公司 | High-hardness high-adhesion modified high-heat conduction LED organosilicon package glue and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101974302A (en) * | 2010-10-19 | 2011-02-16 | 烟台德邦电子材料有限公司 | Low-viscosity and high-heat conduction epoxy resin electronic potting adhesive |
| CN102031081A (en) * | 2010-11-26 | 2011-04-27 | 烟台德邦电子材料有限公司 | Liquid epoxy encapsulating material and preparation method thereof |
| CN102850988B (en) * | 2012-09-26 | 2014-05-07 | 中南大学 | Epoxy resin pouring sealant and usage method |
| CN104672785B (en) * | 2014-06-30 | 2019-04-09 | 广东丹邦科技有限公司 | A kind of epoxy-plastic packaging material and preparation method thereof |
| CN105969277A (en) * | 2016-05-31 | 2016-09-28 | 苏州市奎克力电子科技有限公司 | Heat-dissipating pouring sealant for packaging electronic devices |
| CN106010399A (en) * | 2016-05-31 | 2016-10-12 | 苏州市奎克力电子科技有限公司 | Halogen-free flame retardation electronic pouring sealant |
| CN106700997A (en) * | 2016-12-27 | 2017-05-24 | 苏州兴创源新材料科技有限公司 | High temperature resistant packaging adhesive for large-power LED illuminating lamp and preparation method of high temperature resistant packaging adhesive |
-
2016
- 2016-12-27 CN CN201611223141.5A patent/CN106700997A/en active Pending
-
2017
- 2017-11-02 WO PCT/CN2017/109033 patent/WO2018121048A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101921571A (en) * | 2010-08-13 | 2010-12-22 | 东莞市英迈新能源材料有限公司 | High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof |
| CN102702682A (en) * | 2012-05-25 | 2012-10-03 | 嘉兴市嘉港合成材料有限公司 | Liquid epoxy resin composition for packaging LED (Light Emitting Diode) |
| CN106047276A (en) * | 2016-08-05 | 2016-10-26 | 合肥毅创钣金科技有限公司 | High-hardness high-adhesion modified high-heat conduction LED organosilicon package glue and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018121048A1 (en) * | 2016-12-27 | 2018-07-05 | 苏州兴创源新材料科技有限公司 | Heat-resistant packaging adhesive for high-power led and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018121048A1 (en) | 2018-07-05 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170524 |
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| RJ01 | Rejection of invention patent application after publication |