CN101921571A - High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof - Google Patents
High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof Download PDFInfo
- Publication number
- CN101921571A CN101921571A CN2010102524770A CN201010252477A CN101921571A CN 101921571 A CN101921571 A CN 101921571A CN 2010102524770 A CN2010102524770 A CN 2010102524770A CN 201010252477 A CN201010252477 A CN 201010252477A CN 101921571 A CN101921571 A CN 101921571A
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- Prior art keywords
- epoxy
- prepolymer
- solidifying agent
- modified silicone
- led lamp
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 239000000853 adhesive Substances 0.000 title claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 13
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 239000004593 Epoxy Substances 0.000 claims abstract description 63
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- 239000002105 nanoparticle Substances 0.000 claims abstract description 16
- 238000003756 stirring Methods 0.000 claims abstract description 11
- 229920001296 polysiloxane Polymers 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 10
- 229920000570 polyether Polymers 0.000 claims description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 8
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 239000012752 auxiliary agent Substances 0.000 claims description 4
- 239000002086 nanomaterial Substances 0.000 claims description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 claims description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- 238000007259 addition reaction Methods 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 3
- -1 polyoxyethylene Polymers 0.000 claims description 3
- 150000004756 silanes Chemical class 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 238000005538 encapsulation Methods 0.000 description 7
- 229920002050 silicone resin Polymers 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a high-temperature resistant packaging adhesive for high-power LED lamp, which comprises the following components in percentage by mass: 10 to 60 percent of epoxy prepolymer, 20 to 85 percent of epoxy modified organic silicon prepolymer nano particles, 5 to 20 percent of curing agent, 0 to 1 percent of curing accelerator and 0 to 1 percent of other assistant. The invention also discloses a preparation method, which comprises: mixing the epoxy prepolymer, the epoxy modified organic silicon prepolymer nano particles and the curing agent in a mass ratio of 1:8.5:0.5-6.0:2:2, stirring at normal temperature, uniformly mixing, adding the curing agent, dispersing and uniformly mixing to obtain the packaging adhesive.
Description
Technical field
The present invention relates to a kind of epoxy encapsulation glue that is used for the charactron encapsulation.
Background technology
Along with the development that science and technology is maked rapid progress, the electronic product encapsulation technology is used for the epoxy encapsulation glue of components and parts encapsulation also in development at high speed, because it is good to have anti-light decay ability, set time is short, and ageing resistance is good, the characteristics that operable time is long are used more and more universal.
Summary of the invention
The purpose of this invention is to provide the epoxy encapsulation glue that a kind of consistency is good, resistance to elevated temperatures is excellent.
The technical solution adopted for the present invention to solve the technical problems is: a kind of high-temperature resistant packaging adhesive for high-power LED lamp, the mass percent of each composition is as follows: epoxy prepolymer 10-60%, epoxy modified silicone prepolymer nanoparticle 20-85%, solidifying agent 5-20%, curing catalyst 0-1%, other auxiliary agents 0-1%.
Wherein, described solidifying agent is the amino and hydroxyl POSS of end of nanostructure.
The epoxy encapsulation glue that the purpose of this invention is to provide a kind of resistance to elevated temperatures.
The technical solution adopted for the present invention to solve the technical problems is: a kind of preparation method of high-temperature resistant packaging adhesive for high-power LED lamp, and step is:
A), choose silane containing hydrogen and end-vinyl polyoxyethylene, under the Pt catalyst action, obtain polyether modified silicane by hydrosilylation addition reaction;
B), choose silane containing hydrogen and epoxy hexyl ethene, reaction obtains the silica-based alkane of epoxy under the Pt catalyst action;
C), with above-mentioned polyether modified silicane of synthetic and the silica-based alkane of epoxy, add two functional silanes and simple function group closure agent, under the effect of ammonia catalyzer, carry out cohydrolysis, obtain epoxy modified silicone prepolymer nanoparticle;
D), choose nano level end amino and terminal hydroxy group synthesizes and purifying, obtain solidifying agent;
E), choosing mass ratio is 1: 8.5: 0.5-6.0: 2: 2 epoxy prepolymer, epoxy modified silicone prepolymer nanoparticle and solidifying agent, earlier epoxy prepolymer and epoxy modified silicone nanometer prepolymer particle are joined stirring at normal temperature in the batching still, add solidifying agent after mixing again, disperseing stirs promptly obtains packaging plastic.
Packaging plastic of the present invention utilizes the heat-proof modifier of organic silicon modified by polyether resin as Resins, epoxy, by different organosilane monomers cohydrolysis under different condition, prepare trapezoidal active organosilicon resin, utilize polyethers that silicone resin is carried out the prepolymer that modification obtains containing epoxide group, mix by the Resins, epoxy with different molecular weight and to prepare the epoxy modified silicone nanoparticle, branch can solve the difficult problem of the two-phase consistency difference of organosilicon material and Resins, epoxy well.
Embodiment
Below in conjunction with embodiment the present invention is described in further detail.
Embodiment one
A kind of high-temperature resistant packaging adhesive for high-power LED lamp, the mass percent of each composition is as follows: epoxy prepolymer 10%, epoxy modified silicone prepolymer nanoparticle 80%, the amino and hydroxyl POSS8% of the end of nanostructure, curing catalyst 1%, other auxiliary agents 1%.
Embodiment two
A kind of high-temperature resistant packaging adhesive for high-power LED lamp, the mass percent of each composition is as follows: epoxy prepolymer 60%, epoxy modified silicone prepolymer nanoparticle 20%, the amino and hydroxyl POSS20% of the end of nanostructure.
Embodiment three
A kind of high-temperature resistant packaging adhesive for high-power LED lamp, the mass percent of each composition is as follows: epoxy prepolymer 50%, epoxy modified silicone prepolymer nanoparticle 34%, solidifying agent 15%, curing catalyst 0.5%, other auxiliary agents 0.5%.
Embodiment four
A kind of preparation method of high-temperature resistant packaging adhesive for high-power LED lamp, step is:
A), choose silane containing hydrogen and end-vinyl polyoxyethylene, under the Pt catalyst action, obtain polyether modified silicane by hydrosilylation addition reaction, the reactive chemistry formula is as follows:
B), choose silane containing hydrogen and epoxy hexyl ethene, under the Pt catalyst action reaction obtain the silica-based alkane of epoxy, as the raw material of synthesizing epoxy base silicone resin, the reactive chemistry formula is as follows:
C), with above-mentioned polyether modified silicane of synthetic and the silica-based alkane of epoxy, add two functional silanes and simple function group closure agent, under the effect of ammonia catalyzer, carry out cohydrolysis, obtain epoxy modified silicone prepolymer nanoparticle, owing to contain polyethers chain link and nano level structure, this resin and Resins, epoxy will have extraordinary consistency, and the reactive chemistry formula is as follows:
D), choose nano level end amino and terminal hydroxy group synthesizes and purifying, obtain solidifying agent, the reactive chemistry formula is as follows:
E), choosing mass ratio is 1: 8.5: 0.5 epoxy prepolymer, epoxy modified silicone prepolymer nanoparticle and solidifying agent, earlier epoxy prepolymer and epoxy modified silicone nanometer prepolymer particle are joined stirring at normal temperature in the batching still, add solidifying agent after mixing again, disperseing stirs promptly obtains packaging plastic.
Embodiment five
A kind of preparation method of high-temperature resistant packaging adhesive for high-power LED lamp, choose epoxy prepolymer and above-mentioned epoxy modified silicone prepolymer nanoparticle, solidifying agent according to 6.0: 2: 2 mass ratio, earlier epoxy prepolymer and epoxy modified silicone nanometer prepolymer particle are joined stirring at normal temperature in the batching still, add solidifying agent after mixing again, disperseing stirs promptly obtains packaging plastic.
Embodiment six
A kind of preparation method of high-temperature resistant packaging adhesive for high-power LED lamp, choose epoxy prepolymer and above-mentioned epoxy modified silicone prepolymer nanoparticle, solidifying agent according to 3: 6: 1 mass ratio, earlier epoxy prepolymer and epoxy modified silicone nanometer prepolymer particle are joined stirring at normal temperature in the batching still, add solidifying agent after mixing again, disperseing stirs promptly obtains packaging plastic.
Preparation method of the present invention is by different organosilane monomers cohydrolysis under different condition, prepare trapezoidal active organosilicon resin, utilize polyethers that silicone resin is carried out modification and obtain containing the heat-proof modifier of the prepolymer of epoxide group nano level (50-100nm) as Resins, epoxy, utilize the heat-proof modifier of gained and the Resins, epoxy mixing of different molecular weight to obtain the epoxy modified silicone resin matrix again, the laboratory reaches 2 kilograms of/batch scales, and the epoxy prepolymer that proves nano level epoxy modified silicone prepolymer particle and different molecular weight has good compatibility, can avoid generally Resins, epoxy and the incompatible shortcoming of silicone resin.Possess the development and the application of the extraordinary solidifying agent of heat resistant structure
The present invention is the amino and alternative general polyamine compounds solidifying agent of terminal hydroxy group POSS solidifying agent with end, making Resins, epoxy and organosilicon material form chemical bond-linking is connected together, form reticulated structure, the detrimentally affect that is caused in the time of can avoiding common solidifying agent to solidify, highly beneficial to the resistance to elevated temperatures that improves resin.
Claims (3)
1. high-temperature resistant packaging adhesive for high-power LED lamp, it is characterized in that: the mass percent of each composition is as follows
Epoxy prepolymer 10-60%
Epoxy modified silicone prepolymer nanoparticle 20-85%
Solidifying agent 5-20%
Curing catalyst 0-1%
Other auxiliary agents 0-1%.
2. packaging plastic according to claim 1 is characterized in that, described solidifying agent is the amino and hydroxyl POSS of the end of nanostructure.
3. preparation method of packaging plastic according to claim 1 is characterized in that step is:
A), choose silane containing hydrogen and end-vinyl polyoxyethylene, under the Pt catalyst action, obtain polyether modified silicane by hydrosilylation addition reaction:
B), choose silane containing hydrogen and epoxy hexyl ethene, reaction obtains the silica-based alkane of epoxy under the Pt catalyst action:
C), with above-mentioned polyether modified silicane of synthetic and the silica-based alkane of epoxy, add two functional silanes and simple function group closure agent, under the effect of ammonia catalyzer, carry out cohydrolysis, obtain epoxy modified silicone prepolymer nanoparticle:
D), choose nano level end amino and terminal hydroxy group synthesizes and purifying, obtain solidifying agent:
E), choosing mass ratio is 1: 8.5: 0.5-6.0: 2: 2 epoxy prepolymer, epoxy modified silicone prepolymer nanoparticle and solidifying agent, earlier epoxy prepolymer and epoxy modified silicone nanometer prepolymer particle are joined stirring at normal temperature in the batching still, add solidifying agent after mixing again, disperseing stirs promptly obtains packaging plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010252477.0A CN101921571B (en) | 2010-08-13 | 2010-08-13 | High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010252477.0A CN101921571B (en) | 2010-08-13 | 2010-08-13 | High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101921571A true CN101921571A (en) | 2010-12-22 |
| CN101921571B CN101921571B (en) | 2014-11-05 |
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| CN201010252477.0A Active CN101921571B (en) | 2010-08-13 | 2010-08-13 | High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104745132A (en) * | 2015-03-17 | 2015-07-01 | 深圳市九晟光电通讯科技有限公司 | Epoxy resin adhesive for outdoor patch light beads and method for preparing epoxy resin adhesive for outdoor patch light beads |
| CN106653983A (en) * | 2016-12-27 | 2017-05-10 | 苏州兴创源新材料科技有限公司 | High power LCD chip packaging protection material |
| CN106700997A (en) * | 2016-12-27 | 2017-05-24 | 苏州兴创源新材料科技有限公司 | High temperature resistant packaging adhesive for large-power LED illuminating lamp and preparation method of high temperature resistant packaging adhesive |
| CN106751915A (en) * | 2016-12-27 | 2017-05-31 | 苏州兴创源新材料科技有限公司 | A kind of nanoscale electric chip encapsulation material and preparation method |
| CN112552689A (en) * | 2020-12-10 | 2021-03-26 | 东莞市雄驰电子有限公司 | Heat-vulcanized silicone rubber composite material, rubber and preparation method thereof |
| CN114634784A (en) * | 2022-04-21 | 2022-06-17 | 苏州晶之电科技有限公司 | Organic silicon epoxy pouring sealant and preparation method thereof |
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| CN101016384A (en) * | 2007-02-09 | 2007-08-15 | 南京大学 | Method of preparing star-type multi-arm silicon oil |
| CN101085855A (en) * | 2006-06-05 | 2007-12-12 | 中国科学院化学研究所 | Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation |
| CN201085855Y (en) * | 2007-05-26 | 2008-07-16 | 中国科学院近代物理研究所 | Rotation energy reduction device for treating middle Bragg peak expansion width with heavy ion and proton |
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| CN101085855A (en) * | 2006-06-05 | 2007-12-12 | 中国科学院化学研究所 | Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104745132A (en) * | 2015-03-17 | 2015-07-01 | 深圳市九晟光电通讯科技有限公司 | Epoxy resin adhesive for outdoor patch light beads and method for preparing epoxy resin adhesive for outdoor patch light beads |
| CN106653983A (en) * | 2016-12-27 | 2017-05-10 | 苏州兴创源新材料科技有限公司 | High power LCD chip packaging protection material |
| CN106700997A (en) * | 2016-12-27 | 2017-05-24 | 苏州兴创源新材料科技有限公司 | High temperature resistant packaging adhesive for large-power LED illuminating lamp and preparation method of high temperature resistant packaging adhesive |
| CN106751915A (en) * | 2016-12-27 | 2017-05-31 | 苏州兴创源新材料科技有限公司 | A kind of nanoscale electric chip encapsulation material and preparation method |
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| CN112552689A (en) * | 2020-12-10 | 2021-03-26 | 东莞市雄驰电子有限公司 | Heat-vulcanized silicone rubber composite material, rubber and preparation method thereof |
| CN112552689B (en) * | 2020-12-10 | 2022-08-16 | 东莞市雄驰电子有限公司 | Heat-vulcanized silicone rubber composite material, rubber and preparation method thereof |
| CN114634784A (en) * | 2022-04-21 | 2022-06-17 | 苏州晶之电科技有限公司 | Organic silicon epoxy pouring sealant and preparation method thereof |
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| Publication number | Publication date |
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| CN101921571B (en) | 2014-11-05 |
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