CN101921571B - High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof - Google Patents
High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof Download PDFInfo
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- CN101921571B CN101921571B CN201010252477.0A CN201010252477A CN101921571B CN 101921571 B CN101921571 B CN 101921571B CN 201010252477 A CN201010252477 A CN 201010252477A CN 101921571 B CN101921571 B CN 101921571B
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- Prior art keywords
- epoxy
- prepolymer
- solidifying agent
- modified silicone
- led lamp
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 239000000853 adhesive Substances 0.000 title claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 13
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 239000004593 Epoxy Substances 0.000 claims abstract description 53
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 26
- 239000002105 nanoparticle Substances 0.000 claims abstract description 15
- 238000003756 stirring Methods 0.000 claims abstract description 11
- 229920001296 polysiloxane Polymers 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229920000570 polyether Polymers 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 7
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 229910021529 ammonia Inorganic materials 0.000 claims description 4
- -1 polyoxyethylene Polymers 0.000 claims description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 claims description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- 238000007259 addition reaction Methods 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 3
- 150000004756 silanes Chemical class 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 125000005233 alkylalcohol group Chemical group 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 239000012752 auxiliary agent Substances 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a high-temperature resistant packaging adhesive for high-power LED lamp, which comprises the following components in percentage by mass: 10 to 60 percent of epoxy prepolymer, 20 to 85 percent of epoxy modified organic silicon prepolymer nano particles, 5 to 20 percent of curing agent, 0 to 1 percent of curing accelerator and 0 to 1 percent of other assistant. The invention also discloses a preparation method, which comprises: mixing the epoxy prepolymer, the epoxy modified organic silicon prepolymer nano particles and the curing agent in a mass ratio of 1:8.5:0.5-6.0:2:2, stirring at normal temperature, uniformly mixing, adding the curing agent, dispersing and uniformly mixing to obtain the packaging adhesive.
Description
Technical field
The present invention relates to a kind of epoxy encapsulation glue for charactron encapsulation.
Background technology
Along with science and technology development with rapid changepl. never-ending changes and improvements, electronic product packaging technology is also in development at high speed, for the epoxy encapsulation glue of components and parts encapsulation, because it is good to have anti-light decay ability, set time is short, and ageing resistance is good, the feature that operable time is long, is used more and more universal.
Summary of the invention
The object of this invention is to provide the epoxy encapsulation glue that a kind of consistency is good, resistance to elevated temperatures is excellent.
The technical solution adopted for the present invention to solve the technical problems is: a kind of high-temperature resistant packaging adhesive for high-power LED lamp, the mass percent of each composition is as follows: epoxy prepolymer 10-60%, epoxy modified silicone prepolymer nanoparticle 20-85%, solidifying agent 5-20%, curing catalyst 0-1%, other auxiliary agents 0-1%.
Wherein, described solidifying agent is nanostructure end amino and hydroxyl POSS.
The epoxy encapsulation glue that the object of this invention is to provide a kind of resistance to elevated temperatures.
The technical solution adopted for the present invention to solve the technical problems is: a kind of preparation method of high-temperature resistant packaging adhesive for high-power LED lamp, and step is:
A), choose silane containing hydrogen and end-vinyl polyoxyethylene, under Pt catalyst action, by hydrosilylation addition reaction, obtain polyether modified silicane;
B), choose silane containing hydrogen and epoxy hexyl ethene, under Pt catalyst action, reaction obtains the silica-based alkane of epoxy;
C), by synthetic above-mentioned polyether modified silicane and the silica-based alkane of epoxy, add two functional silanes and simple function group closure agent, under the effect of ammonia catalyzer, carry out cohydrolysis, obtain epoxy modified silicone prepolymer nanoparticle;
D), choose nano level end amino and terminal hydroxy group synthesizes and purifying, obtain solidifying agent;
E), choosing mass ratio is 1: 8.5: 0.5-6.0: the epoxy prepolymer of 2: 2, epoxy modified silicone prepolymer nanoparticle and solidifying agent, first epoxy prepolymer and epoxy modified silicone nanometer prepolymer particle are joined to stirring at normal temperature in batching kettle, after mixing, add solidifying agent, disperseing stirs obtains packaging plastic again.
Packaging plastic of the present invention utilizes organic silicon modified by polyether resin as the heat-proof modifier of epoxy resin, by different organosilane monomers cohydrolysis under different condition, prepare trapezoidal active organosilicon resin, utilize polyethers to carry out modification to silicone resin and obtain the prepolymer containing epoxide group, by the epoxy resin with different molecular weight, mix to prepare epoxy modified silicone nanoparticle, divide the poor difficult problem of two-phase consistency that can solve well organosilicon material and epoxy resin.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail.
Embodiment mono-
A kind of high-temperature resistant packaging adhesive for high-power LED lamp, the mass percent of each composition is as follows: epoxy prepolymer 10%, epoxy modified silicone prepolymer nanoparticle 80%, end amino and the hydroxyl POSS8% of nanostructure, curing catalyst 1%, other auxiliary agents 1%.
Embodiment bis-
A high-temperature resistant packaging adhesive for high-power LED lamp, the mass percent of each composition is as follows: epoxy prepolymer 60%, epoxy modified silicone prepolymer nanoparticle 20%, end amino and the hydroxyl POSS20% of nanostructure.
Embodiment tri-
A high-temperature resistant packaging adhesive for high-power LED lamp, the mass percent of each composition is as follows: epoxy prepolymer 50%, epoxy modified silicone prepolymer nanoparticle 34%, solidifying agent 15%, curing catalyst 0.5%, other auxiliary agents 0.5%.
Embodiment tetra-
A preparation method for high-temperature resistant packaging adhesive for high-power LED lamp, step is:
A), choose silane containing hydrogen and end-vinyl polyoxyethylene, under Pt catalyst action, by hydrosilylation addition reaction, obtain polyether modified silicane, reactive chemistry formula is as follows:
B), choose silane containing hydrogen and epoxy hexyl ethene, under Pt catalyst action reaction obtain the silica-based alkane of epoxy, as the raw material of synthesizing epoxy base silicone resin, reactive chemistry formula is as follows:
C), by synthetic above-mentioned polyether modified silicane and the silica-based alkane of epoxy, add two functional silanes and simple function group closure agent, under the effect of ammonia catalyzer, carry out cohydrolysis, obtain epoxy modified silicone prepolymer nanoparticle, owing to containing polyethers chain link and nano level structure, this resin and epoxy resin will have extraordinary consistency, and reactive chemistry formula is as follows:
D), choose nano level end amino and terminal hydroxy group synthesizes and purifying, obtain solidifying agent, reactive chemistry formula is as follows:
E), choosing mass ratio is epoxy prepolymer, epoxy modified silicone prepolymer nanoparticle and the solidifying agent of 1: 8.5: 0.5, first epoxy prepolymer and epoxy modified silicone nanometer prepolymer particle are joined to stirring at normal temperature in batching kettle, after mixing, add solidifying agent, disperseing stirs obtains packaging plastic again.
Embodiment five
A kind of preparation method of high-temperature resistant packaging adhesive for high-power LED lamp, according to the mass ratio of 6.0: 2: 2, choose epoxy prepolymer and above-mentioned epoxy modified silicone prepolymer nanoparticle, solidifying agent, first epoxy prepolymer and epoxy modified silicone nanometer prepolymer particle are joined to stirring at normal temperature in batching kettle, after mixing, add solidifying agent, disperseing stirs obtains packaging plastic again.
Embodiment six
A kind of preparation method of high-temperature resistant packaging adhesive for high-power LED lamp, according to the mass ratio of 3: 6: 1, choose epoxy prepolymer and above-mentioned epoxy modified silicone prepolymer nanoparticle, solidifying agent, first epoxy prepolymer and epoxy modified silicone nanometer prepolymer particle are joined to stirring at normal temperature in batching kettle, after mixing, add solidifying agent, disperseing stirs obtains packaging plastic again.
Preparation method of the present invention is by different organosilane monomers cohydrolysis under different condition, prepare trapezoidal active organosilicon resin, utilize polyethers to carry out modification to silicone resin and obtain containing the prepolymer of epoxide group nano level (50-100nm) as the heat-proof modifier of epoxy resin, the recycling heat-proof modifier of gained and the epoxy resin of different molecular weight are mixed to get epoxy modified silicone resin matrix, laboratory reaches 2 kilograms of/batch of scales, and the epoxy prepolymer that proves nano level epoxy modified silicone prepolymer particle and different molecular weight has good compatibility, can avoid the generally incompatible shortcoming of epoxy resin and silicone resin.Possess development and the application of the extraordinary solidifying agent of heat resistant structure
The present invention is the amino and alternative general polyamine compounds solidifying agent of terminal hydroxy group POSS solidifying agent with end, making epoxy resin and organosilicon material form chemical bond-linking is connected together, form reticulated structure, the detrimentally affect causing in the time of can avoiding common solidifying agent to solidify, highly beneficial to the resistance to elevated temperatures of raising resin.
Claims (1)
1. a preparation method for high-temperature resistant packaging adhesive for high-power LED lamp, is characterized in that, step is:
A), choose silane containing hydrogen and end-vinyl polyoxyethylene, under Pt catalyst action, by hydrosilylation addition reaction, obtain polyether modified silicane:,
B), choose silane containing hydrogen and epoxy hexyl ethene, under Pt catalyst action, reaction obtains the silica-based alkane of epoxy:
C), by synthetic above-mentioned polyether modified silicane and the silica-based alkane of epoxy, add two functional silanes and simple function group closure agent, under the effect of ammonia catalyzer, carry out cohydrolysis, obtain epoxy modified silicone prepolymer nanoparticle:
D), choose nano level alkyl ammonia and alkyl alcohol synthesizes and purifying, obtain solidifying agent:
E), choosing mass ratio is 1: 8.5: 0.5-6.0: the epoxy prepolymer of 2: 2, epoxy modified silicone prepolymer nanoparticle and solidifying agent, first epoxy prepolymer and epoxy modified silicone nanometer prepolymer particle are joined to stirring at normal temperature in batching kettle, after mixing, add solidifying agent, disperseing stirs obtains packaging plastic again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010252477.0A CN101921571B (en) | 2010-08-13 | 2010-08-13 | High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010252477.0A CN101921571B (en) | 2010-08-13 | 2010-08-13 | High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN101921571A CN101921571A (en) | 2010-12-22 |
| CN101921571B true CN101921571B (en) | 2014-11-05 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104745132B (en) * | 2015-03-17 | 2017-07-28 | 深圳市九晟光电通讯科技有限公司 | A kind of outdoor paster lamp bead epoxide-resin glue and preparation method thereof |
| CN106700997A (en) * | 2016-12-27 | 2017-05-24 | 苏州兴创源新材料科技有限公司 | High temperature resistant packaging adhesive for large-power LED illuminating lamp and preparation method of high temperature resistant packaging adhesive |
| CN106653983A (en) * | 2016-12-27 | 2017-05-10 | 苏州兴创源新材料科技有限公司 | High power LCD chip packaging protection material |
| CN106751915A (en) * | 2016-12-27 | 2017-05-31 | 苏州兴创源新材料科技有限公司 | A kind of nanoscale electric chip encapsulation material and preparation method |
| CN112552689B (en) * | 2020-12-10 | 2022-08-16 | 东莞市雄驰电子有限公司 | Heat-vulcanized silicone rubber composite material, rubber and preparation method thereof |
| CN114634784A (en) * | 2022-04-21 | 2022-06-17 | 苏州晶之电科技有限公司 | Organic silicon epoxy pouring sealant and preparation method thereof |
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|---|---|---|---|---|
| CN101016384A (en) * | 2007-02-09 | 2007-08-15 | 南京大学 | Method of preparing star-type multi-arm silicon oil |
| CN101085855A (en) * | 2006-06-05 | 2007-12-12 | 中国科学院化学研究所 | Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation |
| CN101463126A (en) * | 2008-12-09 | 2009-06-24 | 张家港科道化学有限公司 | Preparation of polyether silane |
| CN101654509A (en) * | 2009-09-25 | 2010-02-24 | 上海大学 | Preparation method of epoxy silsesquioxane/epoxy resin hybrid material for packaging large-power LED |
Family Cites Families (2)
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| CN201085855Y (en) * | 2007-05-26 | 2008-07-16 | 中国科学院近代物理研究所 | Rotation energy reduction device for treating middle Bragg peak expansion width with heavy ion and proton |
| CN101597385A (en) * | 2009-07-09 | 2009-12-09 | 华东理工大学 | A kind of preparation method based on the silsesquioxane modified ultra-thin fire-resistant coating polymer matrix |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101085855A (en) * | 2006-06-05 | 2007-12-12 | 中国科学院化学研究所 | Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation |
| CN101016384A (en) * | 2007-02-09 | 2007-08-15 | 南京大学 | Method of preparing star-type multi-arm silicon oil |
| CN101463126A (en) * | 2008-12-09 | 2009-06-24 | 张家港科道化学有限公司 | Preparation of polyether silane |
| CN101654509A (en) * | 2009-09-25 | 2010-02-24 | 上海大学 | Preparation method of epoxy silsesquioxane/epoxy resin hybrid material for packaging large-power LED |
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