CN104673160A - Filled surface modified silicon carbide isotropic thermal conduction adhesive and preparation method thereof - Google Patents
Filled surface modified silicon carbide isotropic thermal conduction adhesive and preparation method thereof Download PDFInfo
- Publication number
- CN104673160A CN104673160A CN201410309684.3A CN201410309684A CN104673160A CN 104673160 A CN104673160 A CN 104673160A CN 201410309684 A CN201410309684 A CN 201410309684A CN 104673160 A CN104673160 A CN 104673160A
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- silicon carbide
- sizing agent
- stirring
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a filled surface modified silicon carbide isotropic thermal conduction adhesive. The filled surface modified silicon carbide isotropic thermal conduction adhesive contains surface modified beta-silicon carbide which is prepared by the following steps: dispersing dry nanometer or micron silicon carbide in an ethanol solvent, adding into a mixed solution of a silane coupling agent and ethanol, regulating a pH value to be about 4, rising the temperature to 70-90 DEG C while stirring, reacting for 3-5h, then standing for more than 12h at room temperature, carrying out pumping filtration and drying. The invention also discloses a preparation method of the filled surface modified silicon carbide isotropic thermal conduction adhesive and the surface modified beta-silicon carbide. The filled surface modified silicon carbide isotropic thermal conduction adhesive has the advantages of high thermal conductivity, high adhesive strength, heat resistance and the like and has good cohesiveness to all high-energy surfaces of metals, ceramics, glasses and polymers.
Description
Technical field
The invention belongs to technical field of material, particularly one fills surperficial modified carbonize silicon isotropy heat conduction sizing agent and preparation method.
Background technology
The develop rapidly of integrated antenna package technology, causes the integrated level of electronic devices and components and packing density all improving constantly, and while providing power, result also in the sharply increase of its working loss and thermal value.High temperature can produce injurious effects to the stability of electronic devices and components, reliability and life-span.Therefore, guarantee that the heat that heating electronic component produces can be discharged timely, become an importance of microelectronic product system assembles, and for integrated level and all higher portable type electronic product of packing density, heat radiation even becomes the technical bottleneck problem of whole product.
Summary of the invention
The thermal conductivity that the object of the invention is to overcome existing heat-conducting glue is low, the shortcomings such as cohesive strength is low, the heat conduction sizing agent that a kind of mechanical strength is high, resistance toheat good, cohesive strength is high, thermal conductivity is high is provided, and the preparation method of described heat conduction sizing agent and contained surface modification silicon B-carbide thereof is provided.
The surperficial modified carbonize silicon isotropy heat conduction sizing agent of a kind of filling, surface modification silicon B-carbide containing obtaining in the following manner: the nano level of drying or micron order silicon carbide are dispersed in alcohol solvent, join in silane coupling agent and alcohol mixeding liquid, pH value is regulated to be about 4, warming while stirring is to 70-90 DEG C, reaction 3-5h, then room temperature leaves standstill more than 12h, dry after suction filtration.
Preferably, described silane coupling agent is KH-550.
Preferably, surface modification silicon B-carbide containing obtaining in the following manner: the silicon carbide of drying is dispersed in alcohol solvent, joined in KH-550 and alcohol mixeding liquid after stirring, pH value is regulated to be about 4, warming while stirring to 80 DEG C, reaction 4h, then room temperature leaves standstill 24h, by its dry more than 24h in vacuum drying oven after repeatedly suction filtration, wherein stirring velocity is preferably 1500r/min.
Silicon B-carbide (β-SiC) has that electroconductibility is excellent, thermal conductivity is good, hardness is high, toughness is strong, wearability closes well the various features such as high thermal resistance is good, but silicon B-carbide dispersiveness is in the epoxy poor, the present invention adopts silane coupling agent to carry out modification to surface of SiC, then joined to improve the thermal conductivity of material in epoxy resin, and casting moulding can be adopted to prepare isotropy heat conduction sizing agent.Described heat conduction sizing agent has the advantages such as thermal conductivity is high, cohesive strength is high, the transparency is good, has good cohesiveness to the high energy surface of metal, pottery, stripping and polymkeric substance.
Preferably, by weight, described heat conduction sizing agent comprises following component:
Preferably, described epoxy resin is bisphenol f type epoxy resin.Show excellent machinery, chemistry, bonding and insulating property after the solidification of bisphenol-f type liquid epoxies, quality is highly stable, and purity is high, and color and luster is good; Preferred a kind of epoxy resin is D.E.R.354 (Dow Chemical).
Preferably, described toughner is one or more the mixture in nucleocapsid structure rubber, paracril, urethane, poly ether imide.Be preferably nucleocapsid structure rubber toughening agent, the epoxy adhesive second-order transition temperature after adopting nucleocapsid structure rubber toughened is not decreased significantly, to the resistance toheat of heat-conducting glue without any damage.More typically product is MX125 (Japanese KANEKA chemical company).
Preferably, described solidifying agent is methylhexahydrophthalic anhydride.Consider the room temperature staging life of sizing agent and curing speed and the problem such as color properties, be preferably methylhexahydrophthalic anhydride.
Preferably, described curing catalyst is phenyl-Dimethylurea, one or more the mixture in triethylamine, diethyl tetramethyl-imidazoles, methyl miaow, end tertiary amine hyperbranched polymer.Be preferably diethyl tetramethyl-imidazoles.
Preferably, described thinner is one or more the mixture in dipropylene glycol methyl ether, ethyl carbitol, diglyme, propenyl glycidyl ether, neopentylglycol diglycidyl ether, Isosorbide-5-Nitrae butanediol diglycidyl ether, butylglycidyl ether, ethyl acetate, dibutyl phthalate, Ethyl carbitol acetate ester, acetate of butyl carbitol, acetone, methylethylketone, pimelinketone, turps.Thinner is used in fact dissolving this resin system and the viscosity adjusting this sizing agent.Preferred thinner is dipropylene glycol methyl ether.
Preferably, described thixotropic agent comprises aerosil or hydrogenated castor oil.Thixotropic agent is used for controlling the rheological property of colloid, and make it can not occur to trickle or a kind of properties-correcting agent of drippage, the thixotropic agent that can adopt comprises aerosil or hydrogenated castor oil.Be preferably aerosil TS-720 (Cabot Co., Ltd's product).
Prepare a method for heat conduction sizing agent, be included in the step of adding described silicon B-carbide in the raw materials of described heat conduction sizing agent.A kind of method preparing surface modification silicon B-carbide, comprise and the nano level of drying or micron order silicon carbide are dispersed in alcohol solvent, join in silane coupling agent and alcohol mixeding liquid, pH value is regulated to be about 4, warming while stirring is to 70-90 DEG C, reaction 3-5h, then room temperature leaves standstill more than 12h, dry after suction filtration.
Preferably, wherein said silane coupling agent is KH-550.More preferably, wherein the silicon carbide of drying is dispersed in alcohol solvent, joined in KH-550 and alcohol mixeding liquid after stirring, pH value is regulated to be about 4, warming while stirring to 80 DEG C, reaction 4h, then room temperature leaves standstill 24h, by its dry more than 24h in vacuum drying oven after repeatedly suction filtration, wherein stirring velocity is preferably 1500r/min.
Embodiment
Below embodiments of the present invention are elaborated.It is emphasized that following explanation is only exemplary, instead of in order to limit the scope of the invention and apply.
Embodiment 1:
Be dispersed in alcohol solvent by the nanometer silicon carbide of drying, joined in KH-550 alcohol mixeding liquid after stirring, regulate pH value to be about 4, limit is stirred (1500r/min) limit and is warming up to 80 DEG C, reaction 4h; Then room temperature leaves standstill 24h, by its dry more than 24h in vacuum drying oven after repeatedly suction filtration.
Take epoxy resin 100g, toughner (MX125) 15g, it is also mixed by mechanical stirring by aerosil (TS-720) 2g, stir speed (S.S.) is 1000r/min, stir 10min, then under whipped state, in mixture, add the nano level silicon B-carbide 3.5g through surface modification successively, dipropylene glycol methyl ether 40g, add and terminate rear continuation stirring 10min, methylhexahydrophthalic anhydride 10g and diethyl tetramethyl-imidazoles 2g is added in even backward mixture to be mixed, after mechanical stirring 5min, mixture is proceeded in high shear mixers and mix, mixing rate is 2000r/min, time is 30s, repeat again the jelly that the mixing process in high shear mixers obtains mixing for 3 times and be heat conduction sizing agent.
The preparation of the test sample of heat-conducting glue cohesive strength is carried out according to standard GB7124-86, first the Copper base material ethyl acetate being used for testing is carried out scouring to deoil, then glue is applied to the surface needing bonding, two panels copper sheet is closed up, be put in curing oven after adopting metal holder to be fixed, condition of cure is 150 DEG C, 60min, on tension testing machine, carry out test after sample cooling after cured and obtain the concrete data of cohesive strength, the thermal conductivity test of heat-conducting glue is carried out according to standard GB11205-99, glue injected a degree of depth 2mm in the preparation of sample, in the mould of the tetrafluoroethylene of diameter 12mm, after solation is flat, mould is inserted in curing oven and be cured process, condition of cure is 150 DEG C, 60min.After sample cool to room temperature after cured, disk shaped samples is taken out and test.
Embodiment 2-5
According to table 1 ingredients listed and consumption, weigh epoxy resin, they also mix by thixotropic agent, the mode of mixing is mechanical stirring, stir speed (S.S.) is 1000r/min, time is 10min, then under whipped state, in mixture, load weighted Graphene is added successively, thinner, add and terminate rear continuation stirring 10min, solidifying agent and curing catalyst is added in even backward mixture to be mixed, after mechanical stirring 5min, mixture is proceeded in high shear mixers and mix, mixing rate is 2000r/min, time is 30s, the jelly that the mixing process of repetition in high shear mixers obtains mixing for 3 times is thermal conductive adhesive.Testing method is identical with embodiment 1.
Embodiment 6
Take epoxy resin 100g, toughner (MX125) 15g, it is also mixed by mechanical stirring by aerosil (TS-720) 2g, stir speed (S.S.) is 1000r/min, stir 10min, then under whipped state, in mixture, add the micron order silicon B-carbide 17.8g through surface modification successively, dipropylene glycol methyl ether 40g, add and terminate rear continuation stirring 10min, methylhexahydrophthalic anhydride 10g and diethyl tetramethyl-imidazoles 2g is added in even backward mixture to be mixed, after mechanical stirring 5min, mixture is proceeded in high shear mixers and mix, mixing rate is 2000r/min, time is 30s, repeat again the jelly that the mixing process in high shear mixers obtains mixing for 3 times and be heat conduction sizing agent.Testing method is identical with embodiment 1.
Comparative example 1
Take epoxy resin 100g, toughner (MX125) 15g, it is also mixed by mechanical stirring by aerosil (TS-720) 2g, stir speed (S.S.) is 1000r/min, stir 10min, then under whipped state, in mixture, add the silicon B-carbide 17.8g of non-surface modification successively, dipropylene glycol methyl ether 40g, add and terminate rear continuation stirring 10min, methylhexahydrophthalic anhydride 10g and diethyl tetramethyl-imidazoles 2g is added in even backward mixture to be mixed, after mechanical stirring 5min, mixture is proceeded in high shear mixers and mix, mixing rate is 2000r/min, time is 30s, repeat again the jelly that the mixing process in high shear mixers obtains mixing for 3 times and be heat conduction sizing agent.Testing method is identical with embodiment 1.
The each material proportioning of table 1
Test result is as shown in table 2:
Table 2 test result
| Test | 1 | 2 | 3 | 4 | 5 | 6 | Comparative example 1 |
| Shock strength (kJm -2) | 12.4 | 13.6 | 15.2 | 18.0 | 14.8 | 16.5 | 13.9 |
| Thermal conductivity W/ (mK) | 0.2453 | 0.4122 | 0.7019 | 0.9546 | 1.1825 | 0.7146 | 0.6025 |
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, make some substituting or obvious modification without departing from the inventive concept of the premise, and performance or purposes identical, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. fill surperficial modified carbonize silicon isotropy heat conduction sizing agent for one kind, it is characterized in that, surface modification silicon B-carbide containing obtaining in the following manner: the nano level of drying or micron order silicon carbide are dispersed in alcohol solvent, join in silane coupling agent and alcohol mixeding liquid, regulate pH value to be about 4, warming while stirring, to 70-90 DEG C, reacts 3-5h, then room temperature leaves standstill more than 12h, dry after suction filtration.
2. heat conduction sizing agent as claimed in claim 1, it is characterized in that, described silane coupling agent is KH-550.
3. heat conduction sizing agent as claimed in claim 1, it is characterized in that, surface modification silicon B-carbide containing obtaining in the following manner: the silicon carbide of drying is dispersed in alcohol solvent, joined in KH-550 and alcohol mixeding liquid after stirring, regulate pH value to be about 4, warming while stirring to 80 DEG C, reaction 4h, then room temperature leaves standstill 24h, and by its dry more than 24h in vacuum drying oven after repeatedly suction filtration, wherein stirring velocity is preferably 1500r/min.
4. the heat conduction sizing agent as described in claim 1 or 2 or 3, is characterized in that, by weight, comprises following component:
5. the heat conduction sizing agent as described in claim 1 or 2 or 3, it is characterized in that, described epoxy resin is bisphenol f type epoxy resin, preferably, described toughner is one or more the mixture in nucleocapsid structure rubber, paracril, urethane, poly ether imide, preferably, described solidifying agent is methylhexahydrophthalic anhydride.
6. the heat conduction sizing agent as described in claim 1 or 2 or 3, is characterized in that, described curing catalyst is phenyl-Dimethylurea, one or more the mixture in triethylamine, diethyl tetramethyl-imidazoles, methyl miaow, end tertiary amine hyperbranched polymer.
7. the heat conduction sizing agent as described in claim 1 or 2 or 3, it is characterized in that, described thinner is one or more the mixture in dipropylene glycol methyl ether, ethyl carbitol, diglyme, propenyl glycidyl ether, neopentylglycol diglycidyl ether, Isosorbide-5-Nitrae butanediol diglycidyl ether, butylglycidyl ether, ethyl acetate, dibutyl phthalate, Ethyl carbitol acetate ester, acetate of butyl carbitol, acetone, methylethylketone, pimelinketone, turps.
8. the heat conduction sizing agent as described in claim 1 or 2 or 3, it is characterized in that, described thixotropic agent comprises aerosil or hydrogenated castor oil.
9. prepare a method for heat conduction sizing agent, it is characterized in that, be included in the step of adding described silicon B-carbide in the raw materials of the heat conduction sizing agent described in any one of claim 1-9.
10. prepare the method for surface modification silicon B-carbide for one kind, it is characterized in that, comprise: the nano level of drying or micron order silicon carbide are dispersed in alcohol solvent, join in silane coupling agent and alcohol mixeding liquid, regulate pH value to be about 4, warming while stirring, to 70-90 DEG C, reacts 3-5h, then room temperature leaves standstill more than 12h, dry after suction filtration;
Preferably, wherein said silane coupling agent is KH-550; More preferably, wherein the silicon carbide of drying is dispersed in alcohol solvent, joined in KH-550 and alcohol mixeding liquid after stirring, pH value is regulated to be about 4, warming while stirring to 80 DEG C, reaction 4h, then room temperature leaves standstill 24h, by its dry more than 24h in vacuum drying oven after repeatedly suction filtration, wherein stirring velocity is preferably 1500r/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410309684.3A CN104673160A (en) | 2014-06-30 | 2014-06-30 | Filled surface modified silicon carbide isotropic thermal conduction adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410309684.3A CN104673160A (en) | 2014-06-30 | 2014-06-30 | Filled surface modified silicon carbide isotropic thermal conduction adhesive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104673160A true CN104673160A (en) | 2015-06-03 |
Family
ID=53308765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410309684.3A Pending CN104673160A (en) | 2014-06-30 | 2014-06-30 | Filled surface modified silicon carbide isotropic thermal conduction adhesive and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104673160A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106356112A (en) * | 2016-10-31 | 2017-01-25 | 广东昭信照明科技有限公司 | Conductive silver paste with low silver content and preparation method thereof |
| CN107628823A (en) * | 2017-10-09 | 2018-01-26 | 河南冯氏电子科技有限公司 | One kind can vulcanize ceramic particle material and preparation method thereof |
| CN109326202A (en) * | 2018-09-07 | 2019-02-12 | 深汕特别合作区昌茂粘胶新材料有限公司 | A kind of shielding special type heat dissipation polyimides electronic tag material and preparation method thereof |
| CN109851996A (en) * | 2018-12-21 | 2019-06-07 | 江苏普泰克新材料科技有限公司 | A kind of preparation method of be carbonized silicon modified epoxy resin and its composite material |
| CN110776806A (en) * | 2019-10-21 | 2020-02-11 | 王利玲 | Hyperbranched polymer-SiO 2Modified epoxy resin insulating material and preparation method thereof |
| CN110980737A (en) * | 2019-12-23 | 2020-04-10 | 中国科学院长春光学精密机械与物理研究所 | Modification method for silanization of surface of silicon carbide micro powder and modified silicon carbide micro powder |
| CN111040587A (en) * | 2019-12-28 | 2020-04-21 | 西安博尔新材料有限责任公司 | Nano cubic silicon carbide heat-conducting coating and preparation method thereof |
| CN111848624A (en) * | 2019-04-30 | 2020-10-30 | 上海和辉光电有限公司 | Benzodiimidazole compound, hole injection material, OLED device and preparation method and application thereof |
| CN112961611A (en) * | 2020-12-23 | 2021-06-15 | 烟台德邦科技股份有限公司 | Acrylate structural adhesive with high thermal conductivity, high reliability and rapid curing |
| CN113462200A (en) * | 2021-07-01 | 2021-10-01 | 本时智能技术发展(上海)有限公司 | Amino polymerization-resistant modified heat-conducting particle and preparation method thereof |
| CN115323761A (en) * | 2022-08-25 | 2022-11-11 | 天门融祥服饰有限公司 | Antibacterial, wear-resistant and flame-retardant home textile fabric |
| CN115595104A (en) * | 2022-10-27 | 2023-01-13 | 佛山清立新材料科技有限公司（Cn） | Epoxy packaging adhesive and preparation method and application thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000712A1 (en) * | 2002-06-28 | 2004-01-01 | Lord Corporation | Interface adhesive |
| CN102127384A (en) * | 2010-12-27 | 2011-07-20 | 广东风华高新科技股份有限公司 | Impact and light decay-resistant die attach insulation paste and preparation method thereof |
| CN102295878A (en) * | 2011-07-06 | 2011-12-28 | 上海大学 | Fill-type thermal conductive insulation impregnating varnish |
| CN102344772A (en) * | 2011-08-03 | 2012-02-08 | 华烁科技股份有限公司 | High thermal conducting insulating epoxy resin adhesive and its application in flexible aluminum based copper-clad plate for LED |
| CN102660212A (en) * | 2012-06-08 | 2012-09-12 | 焦作市卓立烫印材料有限公司 | Single-component epoxy heat-conducting adhesive |
| CN103087556A (en) * | 2012-12-31 | 2013-05-08 | 东莞市万钧化工新材料科技有限公司 | Surface treatment method and application of heat-conducting packing |
| WO2014047932A1 (en) * | 2012-09-29 | 2014-04-03 | 3M Innovative Properties Company | Adhesive composition and adhesive tape |
-
2014
- 2014-06-30 CN CN201410309684.3A patent/CN104673160A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000712A1 (en) * | 2002-06-28 | 2004-01-01 | Lord Corporation | Interface adhesive |
| CN102127384A (en) * | 2010-12-27 | 2011-07-20 | 广东风华高新科技股份有限公司 | Impact and light decay-resistant die attach insulation paste and preparation method thereof |
| CN102295878A (en) * | 2011-07-06 | 2011-12-28 | 上海大学 | Fill-type thermal conductive insulation impregnating varnish |
| CN102344772A (en) * | 2011-08-03 | 2012-02-08 | 华烁科技股份有限公司 | High thermal conducting insulating epoxy resin adhesive and its application in flexible aluminum based copper-clad plate for LED |
| CN102660212A (en) * | 2012-06-08 | 2012-09-12 | 焦作市卓立烫印材料有限公司 | Single-component epoxy heat-conducting adhesive |
| WO2014047932A1 (en) * | 2012-09-29 | 2014-04-03 | 3M Innovative Properties Company | Adhesive composition and adhesive tape |
| CN103087556A (en) * | 2012-12-31 | 2013-05-08 | 东莞市万钧化工新材料科技有限公司 | Surface treatment method and application of heat-conducting packing |
Non-Patent Citations (1)
| Title |
|---|
| 顾军渭等: "碳化硅/环氧树脂导热复合材料的制备与性能", 《中国胶粘剂》 * |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106356112A (en) * | 2016-10-31 | 2017-01-25 | 广东昭信照明科技有限公司 | Conductive silver paste with low silver content and preparation method thereof |
| CN107628823A (en) * | 2017-10-09 | 2018-01-26 | 河南冯氏电子科技有限公司 | One kind can vulcanize ceramic particle material and preparation method thereof |
| CN109326202A (en) * | 2018-09-07 | 2019-02-12 | 深汕特别合作区昌茂粘胶新材料有限公司 | A kind of shielding special type heat dissipation polyimides electronic tag material and preparation method thereof |
| CN109851996A (en) * | 2018-12-21 | 2019-06-07 | 江苏普泰克新材料科技有限公司 | A kind of preparation method of be carbonized silicon modified epoxy resin and its composite material |
| CN111848624A (en) * | 2019-04-30 | 2020-10-30 | 上海和辉光电有限公司 | Benzodiimidazole compound, hole injection material, OLED device and preparation method and application thereof |
| CN110776806A (en) * | 2019-10-21 | 2020-02-11 | 王利玲 | Hyperbranched polymer-SiO 2Modified epoxy resin insulating material and preparation method thereof |
| CN110980737A (en) * | 2019-12-23 | 2020-04-10 | 中国科学院长春光学精密机械与物理研究所 | Modification method for silanization of surface of silicon carbide micro powder and modified silicon carbide micro powder |
| CN111040587A (en) * | 2019-12-28 | 2020-04-21 | 西安博尔新材料有限责任公司 | Nano cubic silicon carbide heat-conducting coating and preparation method thereof |
| CN112961611A (en) * | 2020-12-23 | 2021-06-15 | 烟台德邦科技股份有限公司 | Acrylate structural adhesive with high thermal conductivity, high reliability and rapid curing |
| CN112961611B (en) * | 2020-12-23 | 2023-02-03 | 烟台德邦科技股份有限公司 | Acrylate structural adhesive with high thermal conductivity, high reliability and rapid curing |
| CN113462200A (en) * | 2021-07-01 | 2021-10-01 | 本时智能技术发展(上海)有限公司 | Amino polymerization-resistant modified heat-conducting particle and preparation method thereof |
| CN115323761A (en) * | 2022-08-25 | 2022-11-11 | 天门融祥服饰有限公司 | Antibacterial, wear-resistant and flame-retardant home textile fabric |
| CN115323761B (en) * | 2022-08-25 | 2024-03-29 | 杭州道贤智能科技有限责任公司 | Antibacterial, wear-resistant and flame-retardant home textile fabric |
| CN115595104A (en) * | 2022-10-27 | 2023-01-13 | 佛山清立新材料科技有限公司（Cn） | Epoxy packaging adhesive and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104673160A (en) | Filled surface modified silicon carbide isotropic thermal conduction adhesive and preparation method thereof | |
| CN102433098B (en) | Graphene-filled isotropic high-performance heat-conducting adhesive and preparation method | |
| CN101831264B (en) | Isotropic high-performance thermal conductive adhesive for filling carbon nano tube | |
| CN102337033B (en) | Additive high-thermal-conductivity organic silicon electronic pouring sealant and preparation method thereof | |
| CN103421279B (en) | A kind of epoxy resin for electronic packaging compositions and preparation method thereof | |
| JP5895156B2 (en) | Thermosetting resin composition, sealing material and electronic component using them | |
| JP6000749B2 (en) | Thermosetting resin composition, method for producing thermally conductive resin sheet, thermally conductive resin sheet, and power semiconductor device | |
| CN101225156B (en) | Epoxide resin curing agent, epoxide resin embedding glue and confecting method thereof | |
| JP5002280B2 (en) | Resin molded product manufacturing method | |
| CN107636071B (en) | Epoxy molding compounds having high adhesion to nickel surfaces, method for the production thereof and use thereof | |
| CN110317562B (en) | Organic silicon modified epoxy pouring sealant | |
| JP5171798B2 (en) | Thermosetting resin composition, thermally conductive resin sheet, method for producing the same, and power module | |
| CN105331116A (en) | One-component heating-cured liquid silicone rubber and preparation method thereof | |
| CN106189087A (en) | Low dielectric poss type epoxy resin composite material and preparation method thereof | |
| CN106009530A (en) | Boron nitride-silver hybrid particle/epoxy resin composite material and preparation method thereof | |
| CN106700997A (en) | High temperature resistant packaging adhesive for large-power LED illuminating lamp and preparation method of high temperature resistant packaging adhesive | |
| CN102191003A (en) | Silver-plated carbon nanotube heat-conducting adhesive and preparation method thereof | |
| CN103408938B (en) | A kind of addition type liquid silicone rubber compound used for manufacturing pad printing rubber head and preparation method thereof | |
| JP2015196823A (en) | Thermosetting resin composition, thermally conductive resin sheet and method for producing the same, and power module | |
| CN105461963A (en) | Surface-organically-modified boron nitride powder, preparation method and applications thereof | |
| CN113416510B (en) | Epoxy resin pouring sealant and preparation method thereof | |
| CN106634812A (en) | Organic silicon resin pouring sealant with high thermal conductivity and low viscosity for PCB (Printed Circuit Board) | |
| CN106634814A (en) | Organic silicon electronic pouring sealant with good ultraviolet-resisting cooling performance for PCB (Printed Circuit Board) | |
| CN106753211A (en) | A kind of flame-retarded heat-conducting PCB organic silicon electronic potting adhesive | |
| CN106753212A (en) | A kind of good transparency of caking property PCB organic silicon electronic potting adhesive high |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150603 |