CN109326202A - A kind of shielding special type heat dissipation polyimides electronic tag material and preparation method thereof - Google Patents
A kind of shielding special type heat dissipation polyimides electronic tag material and preparation method thereof Download PDFInfo
- Publication number
- CN109326202A CN109326202A CN201811045175.9A CN201811045175A CN109326202A CN 109326202 A CN109326202 A CN 109326202A CN 201811045175 A CN201811045175 A CN 201811045175A CN 109326202 A CN109326202 A CN 109326202A
- Authority
- CN
- China
- Prior art keywords
- organic
- electronic tag
- polyimides
- silicon
- special type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Abstract
The present invention provides a kind of shielding special type heat dissipation polyimides electronic tag material, from top to bottom includes polyimide film, black organic-silicon glue layer, the release base stock of polyester film；The black organic-silicon glue layer includes graphene, nanometer silicon carbide, organic silicon adhesive, ethyl acetate, mass ratio 10-15:2-3:60-65:25-30.The present invention, which provides, a kind of not only covered again special heat radiating type adhesive sticker electronic tag material and can reach 95% or more screening effect with preferable shielding, in addition can also auxiliary electron electric equipment products heat dissipation, the thermal diffusivity for improving 30%, is mainly used for electronics, battery product information labels.
Description
Technical field
The invention belongs to glue material fields, and in particular to a kind of shielding special type heat dissipation polyimides electronic tag material
And preparation method thereof.
Background technique
With electronic age is entered, the demand of electronic market is increasing, and electronic product requires to emerge one after another, wherein electronics
Product requires one of heat dissipation under a long-time use, and market much cannot be perfect well at present, makes for a long time
It is easy with lower electronic equipment hot, thermal diffusivity is bad, or even generates explosion.Graphene has good thermal diffusivity, most of electronics
There is this thing in product, the present invention mainly leads to the structure for changing graphene, and adds it in organic silicon adhesive, passes through
Uniform coating process makes thermal diffusivity reach balanced, large area heat dissipation, thus the case where reducing fever.
Inside previous electronics industry, common mobile phone, the internal structures such as computer label usually not radiates well
Property, charging uses or for a long time can be hot very serious using electronic product.To prevent explosive incident caused by high temperature, Wo Menkai
Begin to introduce the preferably some materials of thermal diffusivity and fire proofing etc., purpose is provided to make electronic product use more comfortable, more
Safety, the birth of this product are bound to largely introduce market, become mainstream.
Summary of the invention
The present invention provide it is a kind of not only covered special heat radiating type adhesive sticker electronic tag material again, have and preferably cover
Property, 95% or more screening effect can be reached, in addition can also the heat dissipation of auxiliary electron electric equipment products, improve 30% thermal diffusivity, it is main
Electronics, battery product information labels are used for, so that it is not hot to achieve the purpose that a long-time uses, it is long to solve electronic product
The function of the case where time uses thermal diffusivity.
In order to achieve the above-mentioned object of the invention, The technical solution adopted by the invention is as follows:
A kind of shielding special type heat dissipation polyimides electronic tag material, it is characterised in that: from top to bottom include that polyamides is sub-
Amine film, black organic-silicon glue layer, the release base stock of polyester film；The raw material of the black organic-silicon glue layer include graphene,
Nanometer silicon carbide, organic silicon adhesive, ethyl acetate, mass ratio 10-15:2-3:60-65:25-30.
Further, the particle diameter of the graphene is less than < 75 nanometers.
Further, the raw material of the black organic-silicon glue layer includes graphene, nanometer silicon carbide, organic silicone adhesive
Agent, ethyl acetate, mass ratio 12.5:2.5:62.5:27.5.
Further, the organic silicon adhesive is poly- mixed type organic silicon adhesive.
A kind of preparation method of shielding special type heat dissipation polyimides electronic tag material, it is characterised in that including walking as follows
It is rapid:
(1) graphene be ground to particle diameter less than < 75 nanometers, organic silicon adhesive is added to by solution
In, and sequentially by formula rate addition nanometer silicon carbide, ethyl acetate into organosilicon mixed glue, it carries out 20-25 minutes
Dispersion stirring, until become the black organic-silicon adhesive mixture with thermally conductive shielding function；
(2) knife type coater sets relevant parameter, by the above-mentioned organic silicon adhesive mixed by way of blade coating
It is coated on the release base stock of polyester film, by 160-180 DEG C of high temperature progress curing molding；It is pasted with the cooling wheel of 500KG
It closes, glue is transferred in the one side of polyimide film, winding sizing, product is completed.
Better thermal diffusivity and configured black is reached in the dispersion and structure for studying graphene and organic silicon coating liquid
The adhesion of color organic silicon adhesive and polyimide film, specific as follows:
1. first grinding graphene, accomplish nanoscale, organic silicon adhesive Silicone is added to by solution
In, and sequentially mixed by formula rate addition nanometer silicon carbide silicon carbide (CSi), ethyl acetate EAC to organosilicon
In adhesive, dispersion stirring in 20-25 minutes is carried out, until blackening；Since graphene is originally by carbon atom SP2Hybridized orbit group
It is in the two-dimentional carbon material of honeycomb lattice at hexangle type, so organic silicon adhesive polymer meeting blackening at this time, has centainly
Shielding；
2. knife type coater sets relevant parameter, the above-mentioned organic silicon adhesive mixed is applied by way of blade coating
Cloth is on the release base stock of polyester film, by 160-180 DEG C of high temperature progress curing molding；It is bonded with the cooling wheel of 500KG,
Glue is transferred in the one side of polyimide film, winding sizing, product is completed；
The beneficial effects of the present invention are: the present invention is by the nanostructure using graphene inside organic silicon adhesive
Excellent heat radiation and intermiscibility and dispersibility with certain shielding properties and graphene and organic silicon adhesive it is excellent
It is different and more preferable by the combination fastness of organic silicon adhesive and polyimides doped with graphene.
Specific embodiment
Present invention will be further explained below with reference to specific examples.It should be understood that these embodiments are merely to illustrate this hair
It is bright, rather than limit the scope of the invention.Under the premise of without departing substantially from technical solution of the invention, the present invention is made
Those of ordinary skill in the art's any change easy to accomplish fall within scope of the presently claimed invention.
Embodiment 1
A kind of shielding special type heat dissipation polyimides electronic tag material, has including polyimide film, black from top to bottom
Machine silica gel water layer, the release base stock of polyester film；The raw material of the black organic-silicon glue layer include graphene, nanometer silicon carbide,
Organic silicon adhesive, ethyl acetate, mass ratio 12.5:2.5:62.5:27.5.
A kind of preparation method of shielding special type heat dissipation polyimides electronic tag material, it is characterised in that including walking as follows
It is rapid:
(1) graphene be ground to particle diameter less than < 75 nanometers, organic silicon adhesive is added to by solution
In, and sequentially by formula rate addition nanometer silicon carbide, ethyl acetate into organosilicon mixed glue, it carries out 20-25 minutes
Dispersion stirring, until blackening；
(2) knife type coater sets relevant parameter, by the above-mentioned organic silicon adhesive mixed by way of blade coating
It is coated on the release base stock of polyester film, by 160-180 DEG C of high temperature progress curing molding；It is pasted with the cooling wheel of 500KG
It closes, glue is transferred in the one side of polyimide film, winding sizing, product is completed.
Embodiment 2
A kind of shielding special type heat dissipation polyimides electronic tag material, has including polyimide film, black from top to bottom
Machine silica gel water layer, the release base stock of polyester film；The raw material of the black organic-silicon glue layer include graphene, nanometer silicon carbide,
Organic silicon adhesive, ethyl acetate, mass ratio 10:3:60:30.The glue layer is poly- mixed type organic silicon adhesive.
A kind of preparation method of shielding special type heat dissipation polyimides electronic tag material, it is characterised in that including walking as follows
It is rapid:
(1) graphene be ground to particle diameter less than < 75 nanometers, organic silicon adhesive is added to by solution
In, and sequentially by formula rate addition nanometer silicon carbide, ethyl acetate into organosilicon mixed glue, it carries out 20-25 minutes
Dispersion stirring, until blackening；
(2) knife type coater sets relevant parameter, by the above-mentioned organic silicon adhesive mixed by way of blade coating
It is coated on the release base stock of polyester film, by 160-180 DEG C of high temperature progress curing molding；It is pasted with the cooling wheel of 500KG
It closes, glue is transferred in the one side of polyimide film, winding sizing, product is completed.
Embodiment 3
A kind of shielding special type heat dissipation polyimides electronic tag material, has including polyimide film, black from top to bottom
Machine silica gel water layer, the release base stock of polyester film；The raw material of the black organic-silicon glue layer include graphene, nanometer silicon carbide,
Organic silicon adhesive, ethyl acetate, mass ratio 15:2:65:25.The glue layer is poly- mixed type organic silicon adhesive.
A kind of preparation method of shielding special type heat dissipation polyimides electronic tag material, it is characterised in that including walking as follows
It is rapid:
(1) graphene be ground to particle diameter less than < 75 nanometers, organic silicon adhesive is added to by solution
In, and sequentially by formula rate addition nanometer silicon carbide, ethyl acetate into organosilicon mixed glue, it carries out 20-25 minutes
Dispersion stirring, until blackening；
(2) knife type coater sets relevant parameter, by the above-mentioned organic silicon adhesive mixed by way of blade coating
It is coated on the release base stock of polyester film, by 160-180 DEG C of high temperature progress curing molding；It is pasted with the cooling wheel of 500KG
It closes, glue is transferred in the one side of polyimide film, winding sizing, product is completed.
Comparative example 1
It is same as Example 1, in addition to not adding graphene in the raw material of the black organic-silicon glue layer.
Comparative example 2
It is same as Example 1, in addition to the raw material of the black organic-silicon glue layer does not add silicon carbide.
Comparative example 3
It is same as Example 1, in addition to the raw material of the black organic-silicon glue layer includes graphene, nanometer silicon carbide, has
Machine silicon adhesive, ethyl acetate, mass ratio 5:5:62.5:27.5.
Comparative example 4
It is same as Example 1, in addition to the raw material of the black organic-silicon glue layer includes graphene, nanometer silicon carbide, has
Machine silicon adhesive, ethyl acetate, mass ratio 20:1:62.5:27.5.
Surface volume resistivity measurement method:
Volume resistivity/surface resistivity tester (ASTM D257) is to measure the voltage V at resistance both ends simultaneously and flow through
The electric current I of resistance completes voltage divided by the calculating of electric current, then obtained result by internal large scale integrated circuit
Resistance value is shown with number after A/D is converted, the even voltage V at resistance both ends and to flow through the electric current I of resistance be simultaneously
The resistance value of variation, display becomes not as common megger because of the variation of measured voltage V or the change of electric current I.
Volume resistivity tester selects corresponding range, and glue surface is placed in upwards after tested sample is removed release base stock
Glass table top presses test test pencil simultaneously in glue surface, and testing test pencil pressing spacing is 1cm, touches volume resistivity tester
Test key is opened as tested and reading and recording surface volume resistivity data.
Thermal conductivity coefficient tests (ASTM D5470):
The test of ASTM D5470 thermal conductivity coefficient is the standard test method of the heat transfer characteristic of thermal conductance electrically insulating material, is adopted
With stable state heat-flow meter method, apply certain heat flow, pressure, the thickness of test sample and the temperature between hot plate/cold plate to sample
It is poor to spend, and obtains the thermal coefficient of sample.
According to ASTM D5470 standard method, by certain thickness test sample be placed in two hot isothermals parallel surfaces it
Between, thermal gradient is applied on sample by the temperature difference of two contact surfaces, and hot-fluid is caused to pass through from sample.Hot-fluid is vertical and balanced
Pass through test surfaces, while ensuring no lateral heat transport.When its balance, its humidity and thermal resistance are tested and calculated, thermal resistance is used
Apparent thermal conductivity is calculated with sample thickness.
Table 1
Claims (5)
- The polyimides electronic tag material 1. a kind of shielding special type radiates, it is characterised in that: polyimide film, black organic-silicon The release base stock of glue layer, polyester film；The raw material of the black organic-silicon glue layer includes graphene, nanometer silicon carbide, organic Silicon adhesive, ethyl acetate, mass ratio 10-15:2-3:60-65:25-30.
- The polyimides electronic tag material 2. shielding special type according to claim 1 radiates, which is characterized in that the stone The particle diameter of black alkene is less than < 75 nanometers.
- The polyimides electronic tag material 3. shielding special type according to claim 1 radiates, it is characterised in that: described black The raw material of color organic silica gel water layer includes graphene, nanometer silicon carbide, organic silicon adhesive, ethyl acetate, mass ratio 12.5: 2.5:62.5:27.5。
- The polyimides electronic tag material 4. shielding special type according to claim 1 radiates, it is characterised in that: described to have Machine silicon adhesive is poly- mixed type organic silicon adhesive.
- 5. a kind of preparation method of shielding special type heat dissipation polyimides electronic tag material, it is characterised in that including walking as follows It is rapid:(1) graphene be ground to particle diameter less than < 75 nanometers, be added in organic silicon adhesive by solution, and Sequentially dispersion in 20-25 minutes is carried out into organosilicon mixed glue by formula rate addition nanometer silicon carbide, ethyl acetate Stirring, until becoming to have the black organic-silicon adhesive mixture of thermally conductive shielding function spare；(2) knife type coater sets relevant parameter, by the above-mentioned black organic-silicon gluing for having thermally conductive shielding function mixed Agent is coated on the release base stock of polyester film by way of blade coating, by 160-180 DEG C of high temperature progress curing molding；With The cooling wheel of 500KG is bonded, and glue is transferred in the one side of polyimide film, and winding sizing, product is completed.
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| CN201811045175.9A CN109326202A (en) | 2018-09-07 | 2018-09-07 | A kind of shielding special type heat dissipation polyimides electronic tag material and preparation method thereof |
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| CN201811045175.9A CN109326202A (en) | 2018-09-07 | 2018-09-07 | A kind of shielding special type heat dissipation polyimides electronic tag material and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110930860A (en) * | 2019-11-15 | 2020-03-27 | 深圳昌茂粘胶新材料有限公司 | Efficient heat-conducting temperature-resistant insulating carbon fiber label material and preparation method thereof |
| CN113370540A (en) * | 2021-06-09 | 2021-09-10 | 苏州天立达精密科技股份有限公司 | Method for manufacturing heat-conducting glue |
| IT202000006412A1 (en) * | 2020-03-26 | 2021-09-26 | Nanoprom Chemicals S R L | COATING COMPOSITION TO INCREASE HEAT DISSIPATION |
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Address after: 518000 No.1, west side of Industrial Road, e Bu Town, Shenzhen Shantou Special Cooperation Zone, Shenzhen City, Guangdong Province Applicant after: Shenzhen Shenshan special cooperation zone Changmao viscose New Material Co., Ltd Address before: 518000 A-69, 2nd Floor, 8th Building, Standard Industrial Plant, Ebu Town, Shenzhen-Shantou Special Cooperation Zone, Shenzhen, Guangdong Province Applicant before: SHENSHAN SPECIAL COOPERATION ZONE CHANGMAO VISCOSE NEW MATERIAL Co.,Ltd. |
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Application publication date: 20190212 |