CN104694033A - Heat conducting adhesive tape with heat dissipating and heat storing functions, and making method thereof - Google Patents
Heat conducting adhesive tape with heat dissipating and heat storing functions, and making method thereof Download PDFInfo
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- CN104694033A CN104694033A CN201310645374.4A CN201310645374A CN104694033A CN 104694033 A CN104694033 A CN 104694033A CN 201310645374 A CN201310645374 A CN 201310645374A CN 104694033 A CN104694033 A CN 104694033A
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- heat
- adhesive tape
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- heat conduction
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Abstract
The invention discloses a heat conducting adhesive tape with heat dissipating and heat storing functions, and a making method thereof. The heat conducting adhesive tape comprises a metal film, a heat conducting adhesive layer and a release film, and has high heat conductivity of 10-25w/mk in the plane and thickness directions, and the heat conducting adhesive layer of the heat conducting adhesive tape is formed by compounding an adhesive, a graphite flake, a toughening agent, a curing agent, an accelerant and a solvent, wherein the graphite flake is obtained by graphitizing a polymer film, and the adhesive is at least one of an epoxy resin adhesive, an acrylate adhesive, a polyvinyl acetate adhesive, silica gel and a polyurethane adhesive. The heat conduction performance of materials used by the heat conducting adhesive tape is good, and a metal has high heat conductivity and large density, so the metal film has strong heat storing ability, thereby the heat dissipating and heat storing functions are greatly enhanced.
Description
Technical field
The present invention relates to heat-conducting glue band field, particularly relate to a kind of heat conduction adhesive tape and preparation method thereof with heat radiation heat storage function.
Background technology
In display and lighting field, in order to save energy, LED has replaced conventional display lighting device gradually.In liquid-crystal display, in order to reduce costs, the LED of lesser amt relatively high power is used to be the target that manufacturer is pursued.And in illumination, particularly public arena, the illumination of industrial and mineral factory building, uses more high-power LED to be indispensable condition.But increasing power also causes the thermal value of LED to increase, having its life-span affects significantly, and existing passive heat dissipating method effectively can not solve the heat dissipation problem of LED.
Consumer electronics develops rapidly in recent years, particularly smart mobile phone, has reached 700,000,000 the shipment amounts of 2012.In order to cater to the requirement of human consumer to function i ntegration, manufacturers brings into use the battery of more powerful chip and larger reserves on mobile phone, but also brings very high thermal value and the temperature of Geng Gao simultaneously.Consequently have impact on the operation stability of equipment, travelling speed, cell container and equipment life.
Metal has good heat conductivility, and therefore it is widely used in heat radiation, as silver, copper, gold, aluminium etc.Wherein the thermal conductivity of silver is the highest, but copper and aluminium are because price advantage, and application is the most general, as the copper radiating pipe in notebook computer, and the aluminum heat sink on LCD display.But, along with miniaturization day by day and the power increase of electronics, need filling or the bonding of adhesive tape at thermally conductive material and electron device, and this adhesive tape is generally macromolecular material, its low-down thermal conductivity (< 5 W/mK) will hinder the conduction of heat greatly.In addition, when the thermal value of electron device is larger time, in the conduction of heat in heat conduction adhesive tape can not meet cooling requirements, adhesive tape is just needed to have certain heat storage function.
Therefore how making heat conduction adhesive tape have heat radiation heat storage function is this area technical problem urgently to be resolved hurrily.
Summary of the invention
The object of the present invention is to provide a kind of heat conduction adhesive tape and preparation method thereof with heat radiation heat storage function, this heat conduction adhesive tape has the high thermal conductivity of 10-25w/mk simultaneously at plane and thickness direction, again because metal has higher thermal conductivity, and due to the density that it is larger, therefore metallic film has stronger heat storage capacity, thus, realize the quick conductive between thermal source and heat sink material, store certain heat when conduction can not meet cooling requirements.
To achieve the above object, the present invention adopts following technical scheme:
Have a heat conduction adhesive tape for heat radiation heat storage function, comprise metallic film, heat-conducting glue adhesion coating, release film, this heat conduction adhesive tape has the high thermal conductivity of 10-25w/mk simultaneously at plane and thickness direction.
Preferably, in above-mentioned heat conduction adhesive tape, described heat-conducting glue adhesion coating thickness, at 50-10000um, comprises following composition: tackiness agent 100 parts, and graphite flake is 50-500 part, toughner 0-10 part, solidifying agent 1-10 part, promotor 0.01-1 part, solvent 100-200 part.
Preferably, in above-mentioned heat conduction adhesive tape, described metal film surfaces did corona treatment or the coupling agent treatment of enhancing and adhesive layer cohesive force, in use used as one with heat-conducting glue adhesion coating.
Present invention also offers a kind of making method with the heat conduction adhesive tape of heat radiation heat storage function, described making method comprises the following steps:
The first step, by polymeric membrane in graphitizing furnace at 2200-3300
oat the temperature of C, greying forms graphite film, in pulverizer, be then ground into the graphite flake of 1-100um;
Second step, is dissolved in 100-200 part solvent by 1-10 part solidifying agent and 0.01-1 part promotor, fully stirs and mixes;
3rd step, by 0-10 part toughner, 0.1-10 part coupling agent, the graphite flake of 100 parts of tackiness agent and 50-500 part the first step gained is blended in the solution of second step gained, and through high speed agitator dispersion 4-8 hour, obtained tackiness agent mixed solution;
4th step, coats on metallic film by the thermal conductive adhesive mixed solution of the 3rd step gained, obtains heat-conducting glue/metal composite film through overbaking;
5th step, by the composite membrane of the 4th step gained and the rolling of release film compound, obtains the heat conduction adhesive tape with heat radiation heat storage function.
Preferably, in above-mentioned heat conduction adhesive tape, described tackiness agent is at least one in epoxyn, acrylic ester adhesive, Polyvinyl acetate adhesive, silica gel and polyurethane adhesive; Described graphite flake be by by polymeric membrane at 2200-3300
oat the temperature of C, greying is also pulverized and is obtained, and its mean diameter is at 1-100um; Described solidifying agent is one or more the combination in polyamine curing agent, phenolic curing agent, anhydride curing agent, Polymercaptan curing agent, polyisocyanate curing agent; Described toughner is one or more the combination in thiorubber, silicon rubber, acrylic elastomer, polyvinyl butyral acetal, urethane, Vinyl Acetate Copolymer; Described promotor is trolamine, triethylene diamine, DMA, methyl ethyl diketone, one or more the combination in benzyldimethylamine; Described solvent is acetone, ethyl acetate, dimethyl formamide, one or more combination of ethanol.
Preferably, in above-mentioned heat conduction adhesive tape, described polymeric membrane is one or more the combination in polyethersulfone ketone, polyhenylene vinylidene, polyimide, polyetherimide, resol, polyoxadiazole.
Preferably, in above-mentioned heat conduction adhesive tape, the material of described metallic film is copper, aluminium, gold, silver, one or more the combination in tin.
The invention discloses a kind of heat conduction adhesive tape and preparation method thereof with heat radiation heat storage function, this heat conduction adhesive tape comprises metallic film, heat-conducting glue adhesion coating, release film, this heat conduction adhesive tape has the high thermal conductivity of 10-25w/mk simultaneously at plane and thickness direction, the heat-conducting glue adhesion coating of described heat conduction adhesive tape is by gluing tackiness agent, graphite flake, toughner, solidifying agent, promotor, solvent is composited, wherein graphite flake is by by polymeric membrane greying gained, tackiness agent is epoxyn, acrylic ester adhesive, Polyvinyl acetate adhesive, at least one in silica gel and polyurethane adhesive, the material conducts heat performance used due to heat conduction adhesive tape is good, again because metal has higher thermal conductivity, and due to the density that it is larger, therefore metallic film has stronger heat storage capacity, thus greatly can increase its heat radiation and heat storage function.
Accompanying drawing explanation
Heat conduction adhesive tape and preparation method thereof with heat radiation heat storage function of the present invention is provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation with the heat conduction adhesive tape of heat radiation heat storage function of one embodiment of the invention.
In figure, 1-metallic film, 2-heat-conducting glue adhesion coating, 3-release film.
Embodiment
Be described in further detail to heat conduction adhesive tape and preparation method thereof with heat radiation heat storage function of the present invention below.
Below with reference to accompanying drawings the present invention is described in more detail, which show the preferred embodiments of the present invention, should be appreciated that those skilled in the art can revise the present invention described here and still realize beneficial effect of the present invention.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as limitation of the present invention.
In order to clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the present invention chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, a large amount of implementation detail must be made to realize the specific objective of developer, such as, according to regarding system or the restriction about business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
For making object of the present invention, feature becomes apparent, and is further described the specific embodiment of the present invention below in conjunction with accompanying drawing.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
As shown in Figure 1, the heat conduction adhesive tape with heat radiation heat storage function according to the present invention comprises metallic film 1, heat-conducting glue adhesion coating 2, release film 3.Described heat-conducting glue adhesion coating 2 thickness, at 50-10000um, comprises following composition: tackiness agent 100 parts, and graphite flake is 50-500 part, toughner 0-10 part, solidifying agent 1-10 part, promotor 0.01-1 part, solvent 100-200 part.
The preparation method of heat conduction adhesive tape with heat radiation heat storage function provided by the invention is as follows:
The first step, by polymeric membrane in graphitizing furnace at 2200-3300
oat the temperature of C, greying forms graphite film, and in pulverizer, be then ground into the graphite flake of 1-100um, the mean diameter of the present embodiment graphite flake is at 20um;
Second step, is dissolved in 100-200 part solvent by 1-10 part solidifying agent and 0.01-1 part promotor, fully stirs and mixes;
3rd step, by 0-10 part toughner, 0.1-10 part coupling agent, the graphite flake of 100 parts of tackiness agent and 50-500 part the first step gained is blended in the solution of second step gained, and through high speed agitator dispersion 4-8 hour, obtained tackiness agent mixed solution;
4th step, coats on metallic film by the thermal conductive adhesive mixed solution of the 3rd step gained, obtains heat-conducting glue/metal composite film through overbaking, and the copper thickness of the present embodiment is 50um, and rubberization thickness is 1mm;
5th step, by the composite membrane of the 4th step gained and the rolling of release film compound, obtains the heat conduction adhesive tape with heat radiation heat storage function.
Described tackiness agent is at least one in epoxyn, acrylic ester adhesive, Polyvinyl acetate adhesive, silica gel and polyurethane adhesive; Described graphite flake be by by polymeric membrane at 2200-3300
oat the temperature of C, greying is also pulverized and is obtained, and its mean diameter is at 1-100um; Described solidifying agent is one or more the combination in polyamine curing agent, phenolic curing agent, anhydride curing agent, Polymercaptan curing agent, polyisocyanate curing agent; Described toughner is one or more the combination in thiorubber, silicon rubber, acrylic elastomer, polyvinyl butyral acetal, urethane, Vinyl Acetate Copolymer; Described promotor is trolamine, triethylene diamine, DMA, methyl ethyl diketone, one or more the combination in benzyldimethylamine; Described solvent is acetone, ethyl acetate, dimethyl formamide, one or more combination of ethanol.
Described polymeric membrane is one or more the combination in polyethersulfone ketone, polyhenylene vinylidene, polyimide, polyetherimide, resol, polyoxadiazole.
The material of described metallic film is copper, aluminium, gold, silver, one or more the combination in tin.
Described metal film surfaces did corona treatment or the coupling agent treatment of enhancing and adhesive layer cohesive force, in use used as one with heat-conducting glue adhesion coating.
Finally, lamination is cooled, obtain the heat conduction adhesive tape with heat radiation heat storage function.
For starting material not the thermal conductivity of heat conduction adhesive tape that draws of proportioning as following table:
| Content | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Scope |
| Epoxy resin adhesive | 100 | 100 | 100 | 100 | 100 |
| Graphite flake | 100 | 200 | 300 | 450 | 100-500 |
| Solidifying agent | 1 | 3 | 6 | 9 | 1-10 |
| Ethyl acetate | 100 | 120 | 130 | 150 | 100-150 |
| Toluene | 50 | 70 | 90 | 100 | 50-100 |
| Toughner | 5 | 6 | 8 | 10 | 5-10 |
| Coupling agent | 0.1 | 0.3 | 0.6 | 1 | 0.1-1 |
| Thermal conductivity (W/mk) | 10 | 14 | 18 | 25 | 10-25 |
In sum, provided by the invention have heat conduction adhesive tape of heat radiation heat storage function and preparation method thereof, comprise metallic film, heat-conducting glue adhesion coating, release film, this heat conduction adhesive tape has the high thermal conductivity of 10-25w/mk simultaneously at plane and thickness direction, again because metal has higher thermal conductivity, and due to the density that it is larger, therefore metallic film has stronger heat storage capacity, thus greatly can increase its heat radiation and heat storage function.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (8)
1. have a heat conduction adhesive tape for heat radiation heat storage function, it is characterized in that, comprise metallic film, heat-conducting glue adhesion coating, release film, this heat conduction adhesive tape has the high thermal conductivity of 10-25w/mk simultaneously at plane and thickness direction.
2. heat conduction adhesive tape according to claim 1, is characterized in that, described heat-conducting glue adhesion coating thickness is at 50-10000um, comprise following composition: tackiness agent 100 parts, graphite flake is 50-500 part, toughner 0-10 part, solidifying agent 1-10 part, promotor 0.01-1 part, solvent 100-200 part.
3. heat conduction adhesive tape according to claim 1, is characterized in that, described metal film surfaces did corona treatment or the coupling agent treatment of enhancing and adhesive layer cohesive force, in use uses as one with heat-conducting glue adhesion coating.
4. there is a making method for the heat conduction adhesive tape of heat radiation heat storage function, it is characterized in that, comprise the following steps:
The first step, by polymeric membrane in graphitizing furnace at 2200-3300
oat the temperature of C, greying forms graphite film, in pulverizer, be then ground into the graphite flake of 1-100um;
Second step, is dissolved in 100-200 part solvent by 1-10 part solidifying agent and 0.01-1 part promotor, fully stirs and mixes;
3rd step, by 0-10 part toughner, 0.1-10 part coupling agent, the graphite flake of 100 parts of tackiness agent and 50-500 part the first step gained is blended in the solution of second step gained, and through high speed agitator dispersion 4-8 hour, obtained tackiness agent mixed solution;
4th step, coats on metallic film by the thermal conductive adhesive mixed solution of the 3rd step gained, obtains heat-conducting glue/metal composite film through overbaking.
5. the 5th step, by the composite membrane of the 4th step gained and the rolling of release film compound, obtains the heat conduction adhesive tape with heat radiation heat storage function.
6. making method according to claim 4, is characterized in that: described tackiness agent is at least one in epoxyn, acrylic ester adhesive, Polyvinyl acetate adhesive, silica gel and polyurethane adhesive; Described graphite flake be by by polymeric membrane at 2200-3300
oat the temperature of C, greying is also pulverized and is obtained, and its mean diameter is at 1-100um; Described solidifying agent is one or more the combination in polyamine curing agent, phenolic curing agent, anhydride curing agent, Polymercaptan curing agent, polyisocyanate curing agent; Described toughner is one or more the combination in thiorubber, silicon rubber, acrylic elastomer, polyvinyl butyral acetal, urethane, Vinyl Acetate Copolymer; Described promotor is trolamine, triethylene diamine, DMA, methyl ethyl diketone, one or more the combination in benzyldimethylamine; Described solvent is acetone, ethyl acetate, dimethyl formamide, one or more combination of ethanol.
7. making method according to claim 4, is characterized in that, described polymeric membrane is one or more the combination in polyethersulfone ketone, polyhenylene vinylidene, polyimide, polyetherimide, resol, polyoxadiazole.
8. making method according to claim 4, is characterized in that, the material of described metallic film is one or more the combination in copper, aluminium, gold and silver, tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310645374.4A CN104694033A (en) | 2013-12-04 | 2013-12-04 | Heat conducting adhesive tape with heat dissipating and heat storing functions, and making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310645374.4A CN104694033A (en) | 2013-12-04 | 2013-12-04 | Heat conducting adhesive tape with heat dissipating and heat storing functions, and making method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN104694033A true CN104694033A (en) | 2015-06-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310645374.4A Pending CN104694033A (en) | 2013-12-04 | 2013-12-04 | Heat conducting adhesive tape with heat dissipating and heat storing functions, and making method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107828347A (en) * | 2017-12-15 | 2018-03-23 | 常熟市长江胶带有限公司 | A kind of multifunctional heat insulating protective rubber band |
| CN108269754A (en) * | 2018-02-01 | 2018-07-10 | 京东方科技集团股份有限公司 | Film carrier platform, film sticking equipment, method for adhering film and treat pad pasting for display panel |
| CN108800079A (en) * | 2017-04-27 | 2018-11-13 | 神华集团有限责任公司 | A kind of radiator |
| CN109181626A (en) * | 2018-09-28 | 2019-01-11 | 黄旭东 | A kind of cell sealant |
| CN109326202A (en) * | 2018-09-07 | 2019-02-12 | 深汕特别合作区昌茂粘胶新材料有限公司 | A kind of shielding special type heat dissipation polyimides electronic tag material and preparation method thereof |
| CN109777316A (en) * | 2019-01-28 | 2019-05-21 | 东莞市澳中电子材料有限公司 | A kind of high thermal conductivity graphite glue band and preparation method thereof |
| CN114479580A (en) * | 2022-03-10 | 2022-05-13 | 桂林清研皓隆新材料有限公司 | Graphene composite heat dissipation coating and preparation method thereof, and heat dissipation adhesive tape and preparation method thereof |
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- 2013-12-04 CN CN201310645374.4A patent/CN104694033A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108800079A (en) * | 2017-04-27 | 2018-11-13 | 神华集团有限责任公司 | A kind of radiator |
| CN108800079B (en) * | 2017-04-27 | 2024-04-02 | 国家能源投资集团有限责任公司 | Radiator |
| CN107828347A (en) * | 2017-12-15 | 2018-03-23 | 常熟市长江胶带有限公司 | A kind of multifunctional heat insulating protective rubber band |
| CN108269754A (en) * | 2018-02-01 | 2018-07-10 | 京东方科技集团股份有限公司 | Film carrier platform, film sticking equipment, method for adhering film and treat pad pasting for display panel |
| CN108269754B (en) * | 2018-02-01 | 2021-09-14 | 京东方科技集团股份有限公司 | Film carrying table, film pasting equipment, film pasting method and film to be pasted for display panel |
| CN109326202A (en) * | 2018-09-07 | 2019-02-12 | 深汕特别合作区昌茂粘胶新材料有限公司 | A kind of shielding special type heat dissipation polyimides electronic tag material and preparation method thereof |
| CN109181626A (en) * | 2018-09-28 | 2019-01-11 | 黄旭东 | A kind of cell sealant |
| CN109777316A (en) * | 2019-01-28 | 2019-05-21 | 东莞市澳中电子材料有限公司 | A kind of high thermal conductivity graphite glue band and preparation method thereof |
| CN114479580A (en) * | 2022-03-10 | 2022-05-13 | 桂林清研皓隆新材料有限公司 | Graphene composite heat dissipation coating and preparation method thereof, and heat dissipation adhesive tape and preparation method thereof |
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Application publication date: 20150610 |