CN104694032A - Thermally conductive tape with high thermal conductivity, and preparation method thereof - Google Patents
Thermally conductive tape with high thermal conductivity, and preparation method thereof Download PDFInfo
- Publication number
- CN104694032A CN104694032A CN201310639572.XA CN201310639572A CN104694032A CN 104694032 A CN104694032 A CN 104694032A CN 201310639572 A CN201310639572 A CN 201310639572A CN 104694032 A CN104694032 A CN 104694032A
- Authority
- CN
- China
- Prior art keywords
- heat
- thermally conductive
- thermal conductivity
- adhesive tape
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a thermally conductive tape with high thermal conductivity, and a preparation method thereof. The thermally conductive tape comprises a PET thin film with a thickness of 5 to 50<mu>m, a thermally conductive adhesive layer, and a release film; thermal conductivity of the thermally conductive tape in the plane and thickness direction is as high as 10 to 25w/mk; the thermally conductive adhesive layer of the thermally conductive tape is formed via combination of an adhesive, graphite flake, a flexibilizer, a curing agent, an accelerant, and a solvent; the graphite flake is obtained via graphitization of a high molecular film; the adhesive is at least one selected from epoxy resin adhesive, acrylic ester adhesive, polyvinyl acetate adhesive, silica gel, and polyurethane adhesive; thermal conductivity of the raw materials of the thermally conductive tape is high, and PET thin film possesses excellent flexibility, so that hard and fragile problems of traditional thermally conductive materials caused by metal/metal oxide/ceramic filling materials are solved, and heat dispersion capacity and reliability of the thermally conductive tape are increased greatly.
Description
Technical field
The present invention relates to heat-conducting glue band field, particularly relate to a kind of heat conduction adhesive tape with high thermal conductivity and preparation method thereof.
Background technology
Along with the fast development of electronic apparatus technology in recent years, intelligent electronic device, as panel computer and smart mobile phone, function becomes from strength to strength, and volume is more and more less, more and more lighting.Therefore cause the temperature of thermal value that electronics is larger and Geng Gao, thus affect the operation stability of equipment, travelling speed, cell container, more can bring the reduction on equipment life.In illumination and display field, LED because its thermal losses significantly reduced, at the display lighting device of replacement routine gradually.And from the viewpoint of efficiency and cost, use more high-power LED become research and development and produce main.But for high-power LED, because the large and thermal value of the thermal resistance of its packaged material own is large, when therefore using, temperature is higher, cause thus efficiency and life-span significantly reduce.What early stage heat radiation adopted is active heat radiation, as fan, but is eliminated due to capacity issue.Metal is widely used as heat sink material because its higher thermal conductivity is high and heat storage capacity is strong, as silver (420 W/mK), copper (402 W/mK), gold (318W/mK), aluminium (237 W/mK) etc.But need filling or the bonding of adhesive tape at thermally conductive material and electron device, and this adhesive tape is generally macromolecular material, its low-down thermal conductivity (< 5 W/mK) will hinder the conduction of heat greatly.
Therefore the heat conduction adhesive tape how realizing having high thermal conductivity is this area technical problem urgently to be resolved hurrily.
Summary of the invention
The object of the present invention is to provide a kind of heat conduction adhesive tape with high thermal conductivity and preparation method thereof, this heat conduction adhesive tape has the high thermal conductivity of 10-25w/mk simultaneously at plane and thickness direction, again because metal has higher thermal conductivity, and due to the density that it is larger, therefore thickness is that the PET film of 5-50um has stronger heat storage capacity, thus, realize the quick conductive between thermal source and heat sink material, store certain heat when conduction can not meet cooling requirements.
To achieve the above object, the present invention adopts following technical scheme:
Have a heat conduction adhesive tape for high thermal conductivity, comprise PET film, heat-conducting glue adhesion coating, release film that thickness is 5-50um, this heat conduction adhesive tape has the high thermal conductivity of 10-25w/mk simultaneously at plane and thickness direction.
Preferably, have in the heat conduction adhesive tape of high thermal conductivity above-mentioned, described heat-conducting glue adhesion coating comprises following composition: tackiness agent 100 parts, and graphite flake is 50-500 part, toughner 0-10 part, solidifying agent 1-10 part, promotor 0.01-1 part, solvent 100-200 part.
Preferably, have in the heat conduction adhesive tape of high thermal conductivity above-mentioned, described graphite flake be by by polymeric membrane at 2200-3300
oat the temperature of C, greying is also pulverized and is obtained, and its mean diameter is at 1-100um.
Preferably, have in the heat conduction adhesive tape of high thermal conductivity above-mentioned, corona treatment or the coupling agent treatment of enhancing and adhesive layer cohesive force were done in described PET film surface, in use use as one with heat-conducting glue adhesion coating, or the release process reducing cohesive force was done on PET film surface, make it can peel off from adhesive layer, heat-conducting glue adhesion coating is used alone.
Preferably, have in the heat conduction adhesive tape of high thermal conductivity above-mentioned, described heat-conducting glue adhesion coating thickness is at 50-10000um.
Present invention also offers a kind of making method with the heat conduction adhesive tape of high thermal conductivity, said method comprising the steps of:
The first step, by polymeric membrane in graphitizing furnace at 2200-3300
oat the temperature of C, greying forms graphite film, in pulverizer, be then ground into the graphite flake of 1-100um;
Second step, is dissolved in 100-200 part solvent by 1-10 part solidifying agent and 0.01-1 part promotor, fully stirs and mixes;
3rd step, by 0-10 part toughner, 0.1-10 part coupling agent, the graphite flake of 100 parts of tackiness agent and 50-500 part the first step gained is blended in the solution of second step gained, and through high speed agitator dispersion 4-8 hour, obtained tackiness agent mixed solution;
4th step, PET film surface is done and strengthens and the corona treatment of adhesive layer cohesive force or coupling agent treatment, in use use as one with heat-conducting glue adhesion coating, or the release process reducing cohesive force is done to PET film surface, make it can peel off from adhesive layer, heat-conducting glue adhesion coating is used alone, the thermal conductive adhesive mixed solution of the 3rd step gained is coated in the PET film that thickness is 5-50um, obtain heat-conducting glue through overbaking or be called PET composite membrane;
5th step, by the composite membrane of the 4th step gained and the rolling of release film compound, obtains the heat conduction adhesive tape with high thermal conductivity.
Preferably, have in the heat conduction adhesive tape of high thermal conductivity above-mentioned, described tackiness agent is epoxyn, acrylic ester adhesive, Polyvinyl acetate adhesive, one or more the combination in silica gel and polyurethane adhesive; Described solidifying agent is polyamine curing agent, phenolic curing agent, anhydride curing agent, Polymercaptan curing agent, one or more the combination in polyisocyanate curing agent; Described toughner is thiorubber, silicon rubber, acrylic elastomer, polyvinyl butyral acetal, urethane, one or more the combination in Vinyl Acetate Copolymer.; Described promotor is trolamine, triethylene diamine, DMA, methyl ethyl diketone, one or more the combination in benzyldimethylamine; Described solvent is acetone, ethyl acetate, dimethyl formamide, one or more combination of ethanol.
Preferably, have in the heat conduction adhesive tape of high thermal conductivity above-mentioned, described polymeric membrane is polyethersulfone ketone, polyhenylene vinylidene, polyimide, polyetherimide, resol, one or more the combination in polyoxadiazole.
The invention discloses a kind of heat conduction adhesive tape with high thermal conductivity and preparation method thereof, comprise the PET film that thickness is 5-50um, heat-conducting glue adhesion coating, release film, this heat conduction adhesive tape has the high thermal conductivity of 10-25w/mk simultaneously at plane and thickness direction, the heat-conducting glue adhesion coating of described heat conduction adhesive tape is by tackiness agent, graphite flake, toughner, solidifying agent, promotor, solvent is composited, wherein graphite flake is by by polymeric membrane greying gained, tackiness agent is epoxyn, acrylic ester adhesive, Polyvinyl acetate adhesive, at least one in silica gel and polyurethane adhesive, the material conducts heat performance used due to heat conduction adhesive tape is good, again because PET film has good snappiness, solve conventional thermal conductive material due to metal/metal oxide/ceramic packing cause hard crisp problem, thus greatly can increase its heat radiation and reliability.
Accompanying drawing explanation
Heat conduction adhesive tape with high thermal conductivity of the present invention and preparation method thereof is provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation of the heat conduction adhesive tape with high thermal conductivity of one embodiment of the invention and preparation method thereof.
In figure, 1-release film, 2-heat-conducting glue adhesion coating, 3-PET film.
Embodiment
Be described in further detail to heat conduction adhesive tape with high thermal conductivity of the present invention and preparation method thereof below.
Below with reference to accompanying drawings the present invention is described in more detail, which show the preferred embodiments of the present invention, should be appreciated that those skilled in the art can revise the present invention described here and still realize beneficial effect of the present invention.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as limitation of the present invention.
In order to clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the present invention chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, a large amount of implementation detail must be made to realize the specific objective of developer, such as, according to regarding system or the restriction about business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
For making object of the present invention, feature becomes apparent, and is further described the specific embodiment of the present invention below in conjunction with accompanying drawing.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
As shown in Figure 1, the heat conduction adhesive tape with high thermal conductivity according to the present invention comprises PET film, heat-conducting glue adhesion coating, the release film that thickness is 5-50um, and this heat conduction adhesive tape has the high thermal conductivity of 10-25w/mk simultaneously at plane and thickness direction.Have in the heat conduction adhesive tape of high thermal conductivity above-mentioned, described heat-conducting glue adhesion coating comprises following composition: tackiness agent 100 parts, and graphite flake is 50-500 part, toughner 0-10 part, solidifying agent 1-10 part, promotor 0.01-1 part, solvent 100-200 part.Described tackiness agent is epoxyn, acrylic ester adhesive, Polyvinyl acetate adhesive, one or more the combination in silica gel and polyurethane adhesive; Described solidifying agent is polyamine curing agent, phenolic curing agent, anhydride curing agent, Polymercaptan curing agent, one or more the combination in polyisocyanate curing agent; Described toughner is thiorubber, silicon rubber, acrylic elastomer, polyvinyl butyral acetal, urethane, one or more the combination in Vinyl Acetate Copolymer.; Described promotor is trolamine, triethylene diamine, DMA, methyl ethyl diketone, one or more the combination in benzyldimethylamine; Described solvent is acetone, ethyl acetate, dimethyl formamide, one or more combination of ethanol.Have in the heat conduction adhesive tape of high thermal conductivity above-mentioned, described graphite flake be by by polymeric membrane at 2200-3300
oat the temperature of C, greying is also pulverized and is obtained, and its mean diameter is at 1-100um.Described polymeric membrane is polyethersulfone ketone, polyhenylene vinylidene, polyimide, polyetherimide, one or more the combination in resol ， polyoxadiazole.Have in the heat conduction adhesive tape of high thermal conductivity above-mentioned, corona treatment or the coupling agent treatment of enhancing and adhesive layer cohesive force were done in described PET film surface, in use use as one with heat-conducting glue adhesion coating, or the release process reducing cohesive force was done on PET film surface, make it can peel off from adhesive layer, heat-conducting glue adhesion coating is used alone.Described heat-conducting glue adhesion coating thickness is at 50-10000um.
The making method with the heat conduction adhesive tape of high thermal conductivity provided by the invention is as follows:
The first step, by polymeric membrane in graphitizing furnace at 2200-3300
oat the temperature of C, greying forms graphite film, in pulverizer, be then ground into the graphite flake of 1-100um;
Second step, is dissolved in 100-200 part solvent by 1-10 part solidifying agent and 0.01-1 part promotor, fully stirs and mixes;
3rd step, by 0-10 part toughner, 0.1-10 part coupling agent, the graphite flake of 100 parts of tackiness agent and 50-500 part the first step gained is blended in the solution of second step gained, and through high speed agitator dispersion 4-8 hour, obtained tackiness agent mixed solution;
4th step, PET film surface is done and strengthens and the corona treatment of adhesive layer cohesive force or coupling agent treatment, in use use as one with heat-conducting glue adhesion coating, or the release process reducing cohesive force is done to PET film surface, make it can peel off from adhesive layer, heat-conducting glue adhesion coating is used alone, the thermal conductive adhesive mixed solution of the 3rd step gained is coated in the PET film that thickness is 5-50um, obtain heat-conducting glue/PET composite membrane through overbaking;
5th step, by the composite membrane of the 4th step gained and the rolling of release film compound, obtains the heat conduction adhesive tape with high thermal conductivity.
For starting material not the thermal conductivity of heat conduction adhesive tape that draws of proportioning as following table:
| Content | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Scope |
| Epoxy resin adhesive | 100 | 100 | 100 | 100 | 100 |
| Graphite flake | 100 | 200 | 300 | 450 | 100-500 |
| Solidifying agent | 1 | 3 | 6 | 9 | 1-10 |
| Ethyl acetate | 100 | 120 | 130 | 150 | 100-150 |
| Toluene | 50 | 70 | 90 | 100 | 50-100 |
| Toughner | 5 | 6 | 8 | 10 | 5-10 |
| Coupling agent | 0.1 | 0.3 | 0.6 | 1 | 0.1-1 |
| Thermal conductivity (W/mk) | 10 | 15 | 20 | 25 | 10-25 |
In sum, heat conduction adhesive tape with high thermal conductivity provided by the invention and preparation method thereof, comprise PET film, heat-conducting glue adhesion coating, release film that thickness is 5-50um, this heat conduction adhesive tape has the high thermal conductivity of 10-25w/mk simultaneously at plane and thickness direction, again because PET film has good snappiness, solve conventional thermal conductive material due to metal/metal oxide/ceramic packing cause hard crisp problem, thus can greatly increase its heat radiation and reliability.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (8)
1. have a heat conduction adhesive tape for heat radiation heat storage function, it is characterized in that, comprise metallic film, heat-conducting glue adhesion coating, release film, this heat conduction adhesive tape has the high thermal conductivity of 10-25w/mk simultaneously at plane and thickness direction.
2. heat conduction adhesive tape according to claim 1, is characterized in that, described heat-conducting glue adhesion coating thickness is at 50-10000um, comprise following composition: tackiness agent 100 parts, graphite flake is 50-500 part, toughner 0-10 part, solidifying agent 1-10 part, promotor 0.01-1 part, solvent 100-200 part.
3. heat conduction adhesive tape according to claim 1, is characterized in that, described metal film surfaces did corona treatment or the coupling agent treatment of enhancing and adhesive layer cohesive force, in use uses as one with heat-conducting glue adhesion coating.
4. there is a making method for the heat conduction adhesive tape of heat radiation heat storage function, it is characterized in that, comprise the following steps:
The first step, by polymeric membrane in graphitizing furnace at 2200-3300
oat the temperature of C, greying forms graphite film, in pulverizer, be then ground into the graphite flake of 1-100um;
Second step, is dissolved in 100-200 part solvent by 1-10 part solidifying agent and 0.01-1 part promotor, fully stirs and mixes;
3rd step, by 0-10 part toughner, 0.1-10 part coupling agent, the graphite flake of 100 parts of tackiness agent and 50-500 part the first step gained is blended in the solution of second step gained, and through high speed agitator dispersion 4-8 hour, obtained tackiness agent mixed solution;
4th step, coats on metallic film by the thermal conductive adhesive mixed solution of the 3rd step gained, obtains heat-conducting glue/metal composite film through overbaking.
5. the 5th step, by the composite membrane of the 4th step gained and the rolling of release film compound, obtains the heat conduction adhesive tape with heat radiation heat storage function.
6. making method according to claim 4, is characterized in that: described tackiness agent is at least one in epoxyn, acrylic ester adhesive, Polyvinyl acetate adhesive, silica gel and polyurethane adhesive; Described graphite flake be by by polymeric membrane at 2200-3300
oat the temperature of C, greying is also pulverized and is obtained, and its mean diameter is at 1-100um; Described solidifying agent is one or more the combination in polyamine curing agent, phenolic curing agent, anhydride curing agent, Polymercaptan curing agent, polyisocyanate curing agent; Described toughner is one or more the combination in thiorubber, silicon rubber, acrylic elastomer, polyvinyl butyral acetal, urethane, Vinyl Acetate Copolymer; Described promotor is trolamine, triethylene diamine, DMA, methyl ethyl diketone, one or more the combination in benzyldimethylamine; Described solvent is acetone, ethyl acetate, dimethyl formamide, one or more combination of ethanol.
7. making method according to claim 4, is characterized in that, described polymeric membrane is one or more the combination in polyethersulfone ketone, polyhenylene vinylidene, polyimide, polyetherimide, resol, polyoxadiazole.
8. making method according to claim 4, is characterized in that, the material of described metallic film is one or more the combination in copper, aluminium, gold and silver, tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310639572.XA CN104694032A (en) | 2013-12-04 | 2013-12-04 | Thermally conductive tape with high thermal conductivity, and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310639572.XA CN104694032A (en) | 2013-12-04 | 2013-12-04 | Thermally conductive tape with high thermal conductivity, and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104694032A true CN104694032A (en) | 2015-06-10 |
Family
ID=53341598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310639572.XA Pending CN104694032A (en) | 2013-12-04 | 2013-12-04 | Thermally conductive tape with high thermal conductivity, and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104694032A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105860882A (en) * | 2016-06-27 | 2016-08-17 | 强新正品（苏州）环保材料科技有限公司 | Conductive adhesive |
| CN106046407A (en) * | 2016-06-22 | 2016-10-26 | 强新正品（苏州）环保材料科技有限公司 | Manufacturing method of heat conduction silicon gel sheet |
| CN106634726A (en) * | 2015-10-30 | 2017-05-10 | 苏州市达昇电子材料有限公司 | Application of heat storage adhesive |
| CN106634727A (en) * | 2015-10-30 | 2017-05-10 | 苏州市达昇电子材料有限公司 | Heat storage glue |
| CN107195435A (en) * | 2017-06-07 | 2017-09-22 | 合肥励仙电力工程有限公司 | It is a kind of for heat sink material of transformer and preparation method thereof |
| CN107400490A (en) * | 2017-07-10 | 2017-11-28 | 东莞市沅邦电子材料有限公司 | A kind of low temperature curing type single-component epoxy glue |
| CN108269754A (en) * | 2018-02-01 | 2018-07-10 | 京东方科技集团股份有限公司 | Film carrier platform, film sticking equipment, method for adhering film and treat pad pasting for display panel |
| WO2019000285A1 (en) * | 2017-06-28 | 2019-01-03 | 陈鸿文 | Heat conductive adhesive film |
| CN109280531A (en) * | 2018-08-30 | 2019-01-29 | 宁波吉象塑胶科技股份有限公司 | Low noise adhesive tape |
| CN111253828A (en) * | 2019-11-26 | 2020-06-09 | 东莞市美庆电子科技有限公司 | Heat-conducting gasket and preparation method thereof |
| CN113683991A (en) * | 2021-09-18 | 2021-11-23 | 衡阳华灏新材料科技有限公司 | High-heat-dissipation protective film and application thereof |
-
2013
- 2013-12-04 CN CN201310639572.XA patent/CN104694032A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106634726A (en) * | 2015-10-30 | 2017-05-10 | 苏州市达昇电子材料有限公司 | Application of heat storage adhesive |
| CN106634727A (en) * | 2015-10-30 | 2017-05-10 | 苏州市达昇电子材料有限公司 | Heat storage glue |
| CN106046407A (en) * | 2016-06-22 | 2016-10-26 | 强新正品（苏州）环保材料科技有限公司 | Manufacturing method of heat conduction silicon gel sheet |
| CN105860882A (en) * | 2016-06-27 | 2016-08-17 | 强新正品（苏州）环保材料科技有限公司 | Conductive adhesive |
| CN107195435A (en) * | 2017-06-07 | 2017-09-22 | 合肥励仙电力工程有限公司 | It is a kind of for heat sink material of transformer and preparation method thereof |
| WO2019000285A1 (en) * | 2017-06-28 | 2019-01-03 | 陈鸿文 | Heat conductive adhesive film |
| CN107400490A (en) * | 2017-07-10 | 2017-11-28 | 东莞市沅邦电子材料有限公司 | A kind of low temperature curing type single-component epoxy glue |
| CN108269754A (en) * | 2018-02-01 | 2018-07-10 | 京东方科技集团股份有限公司 | Film carrier platform, film sticking equipment, method for adhering film and treat pad pasting for display panel |
| CN108269754B (en) * | 2018-02-01 | 2021-09-14 | 京东方科技集团股份有限公司 | Film carrying table, film pasting equipment, film pasting method and film to be pasted for display panel |
| CN109280531A (en) * | 2018-08-30 | 2019-01-29 | 宁波吉象塑胶科技股份有限公司 | Low noise adhesive tape |
| CN109280531B (en) * | 2018-08-30 | 2021-04-06 | 宁波吉象塑胶科技股份有限公司 | Low-noise adhesive tape |
| CN111253828A (en) * | 2019-11-26 | 2020-06-09 | 东莞市美庆电子科技有限公司 | Heat-conducting gasket and preparation method thereof |
| CN113683991A (en) * | 2021-09-18 | 2021-11-23 | 衡阳华灏新材料科技有限公司 | High-heat-dissipation protective film and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104694032A (en) | Thermally conductive tape with high thermal conductivity, and preparation method thereof | |
| CN104694033A (en) | Heat conducting adhesive tape with heat dissipating and heat storing functions, and making method thereof | |
| CN104673122A (en) | Heat conduction glue film with high heat conductivity and manufacturing method of heat conduction glue film | |
| CN104178048B (en) | A kind of ultrathin heat conduction adhesive tape | |
| WO2019114047A1 (en) | Reactive thermally conductive insulating double sided adhesive tape and preparation method therefor | |
| CN104559424A (en) | Efficient graphene-based cooling coating as well as preparation method and application thereof | |
| CN110760233A (en) | Heat-conducting composite coating and heat-conducting coating prepared from same | |
| WO2017113084A1 (en) | Modified ultra-thin adhesive tape with high heat conductivity based on synthetic graphite | |
| CN105419667B (en) | Thermally conductive high viscous metal base double faced adhesive tape | |
| CN102660210A (en) | Halogen-free high heat-resistant and heat-conducting resin film and manufacturing method thereof | |
| CN109852274B (en) | Graphene heat-conducting adhesive film and preparation process thereof | |
| JP2017504500A (en) | Metal encapsulant with excellent heat dissipation, manufacturing method thereof, and flexible electronic element encapsulated with metal encapsulant | |
| CN204669808U (en) | A kind of electromagnetic shielding film with thermal conductive resin | |
| CN106626583A (en) | Ultra-thin heat dissipation film and preparation method thereof | |
| CN102013281A (en) | Conductive silver adhesive for high-power LED | |
| CN1970666A (en) | Heat-conductive glue | |
| CN105007704A (en) | Composite heat-dissipation wave-absorbing film | |
| CN105315970A (en) | Thermal interface material for chip testing and preparation method of thermal interface material | |
| CN103059760B (en) | Heat conductive adhesive film with heat dissipation function and manufacturing method thereof | |
| CN108300004B (en) | Graphene heat-conducting slurry and preparation method thereof | |
| CN103059758B (en) | Heat conducting adhesive tape for electronic device and preparation method thereof | |
| CN103320072B (en) | Graphite-based epoxy resin conductive adhesive and preparation method therefor | |
| CN202941077U (en) | Graphite heat radiation structure for electronic product | |
| CN107446525A (en) | Paste heat-conducting glue containing conducting high polymers thing | |
| CN209602442U (en) | Heat conductive silica gel laminated film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150610 |