CN106634726A - Application of heat storage adhesive - Google Patents
Application of heat storage adhesive Download PDFInfo
- Publication number
- CN106634726A CN106634726A CN201510737396.2A CN201510737396A CN106634726A CN 106634726 A CN106634726 A CN 106634726A CN 201510737396 A CN201510737396 A CN 201510737396A CN 106634726 A CN106634726 A CN 106634726A
- Authority
- CN
- China
- Prior art keywords
- glue
- heat
- accumulation
- purposes
- electronic product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J121/00—Adhesives based on unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J191/00—Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof
- C09J191/06—Waxes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an application of a heat storage adhesive. The heat storage adhesive is used in cooperation with a heat diffusion material for heat dissipation, and the heat diffusion material is graphite or copper or aluminum. The heat storage adhesive is used for heat dissipation, when the heat storage adhesive is applied to an electronic product, the heat storage adhesive absorbs heat of surrounding heat sources to decrease temperatures of the heat sources, so that the electronic product can operate normally and efficiently, and the electronic product is protected.
Description
Technical field
The present invention relates to a kind of purposes of accumulation of heat glue, it is used to radiate.
Background technology
With informationalized development, increasing high performance information electronic product occurs therewith,
But this electronic product is in use, when being passed through due to electric current or electrically by when meeting send out
Heat；When the excessive heat that it is produced, various harmful effects can be caused to electronic product：1、
Secure context, when temperature exceedes temperature is envisioned, and electronic product can smolder or catch fire；2nd, performance
Aspect, heating causes the speed of service of electronic product to decline, and even results in failure, generation action
It is bad.Electronic product problems of excessive heat how is solved, becomes the important class of e-machine commercialization
Topic.
For this purpose, we have developed and a kind of can absorb accumulation of heat glue of heat and application thereof.
The content of the invention
The invention aims to overcome the deficiencies in the prior art and provide a kind of accumulation of heat glue of energy
Purposes, it is used to radiate.
To reach above-mentioned purpose, the technical solution used in the present invention is：A kind of purposes of accumulation of heat glue,
The accumulation of heat glue is used to radiate.
Preferably, the accumulation of heat glue is used with thermal diffusion material fit, for radiating.
Preferably, the thermal diffusion material is graphite or copper or aluminium.
Preferably, the accumulation of heat glue, by mass percentage comprising following components：Paraffin 1-60%；
Glue 40-99%.
Preferably, the accumulation of heat glue, includes by mass percentage, paraffin 1-15%；Glue
85-99%.
Preferably, the accumulation of heat glue, includes by mass percentage, paraffin 15-30%；Glue
70-85%.
Preferably, the accumulation of heat glue, includes by mass percentage, paraffin 30-40%；Glue
60-70%.
Preferably, the accumulation of heat glue, includes by mass percentage, paraffin 40-50%；Glue
50-60%.
Preferably, the accumulation of heat glue, includes by mass percentage, paraffin 50-60%；Glue
40-50%.
Preferably, the glue is acrylic glue or silica column glue or rubber cement.
Due to the utilization of above-mentioned technical proposal, the present invention has compared with prior art following excellent
Point：
The purposes of accumulation of heat glue of the present invention is for radiating, when it is applied in electronic product
When, by the heat for absorbing the thermal source near it, the temperature of thermal source is reduced, enable electronic product
Normally and efficiently operate, so as to realize protecting the purpose of electronic product.
Specific embodiment
Below the present invention is described in further detail for Jing specific embodiments.
Embodiment one
A kind of purposes of accumulation of heat glue, the accumulation of heat glue is used to radiate.
The accumulation of heat glue, by mass percentage comprising following components：Paraffin 1-60%；Acrylic
Glue 40-99%.
The purposes of accumulation of heat glue of the present invention is for radiating, when it is applied in electronic product
When, by the heat for absorbing the thermal source near it, the temperature 2-10 degree of thermal source is reduced, make electricity
Sub- product can normally and efficiently operate, so as to realize protecting the purpose of electronic product.
Embodiment two
A kind of purposes of accumulation of heat glue, the accumulation of heat glue is used to radiate.
The accumulation of heat glue is used with thermal diffusion material fit, for radiating；The one of the accumulation of heat glue
Side or both sides are provided with thermal diffusion material.
The thermal diffusion material is graphite or copper or aluminium.
Accumulation of heat glue of the present invention, by mass percentage comprising following components：Paraffin 1-15%；
Acrylic glue 85-99%.
The purposes of accumulation of heat glue of the present invention is for radiating, when it is applied in electronic product
When, by the heat for absorbing the thermal source near it, the temperature 3-5 degree of thermal source is reduced, make electronics
Product can normally and efficiently operate, so as to realize protecting the purpose of electronic product.
Embodiment three
A kind of purposes of accumulation of heat glue, the accumulation of heat glue is used to radiate.
The accumulation of heat glue is used with thermal diffusion material fit, for radiating；The one of the accumulation of heat glue
Side or both sides are provided with thermal diffusion material.
The thermal diffusion material is graphite or copper or aluminium.
Accumulation of heat glue of the present invention, by mass percentage comprising following components：Paraffin 15-30%；
Silica column glue 70-85%.
The purposes of accumulation of heat glue of the present invention is for radiating, when it is applied in electronic product
When, by the heat for absorbing the thermal source near it, the temperature 2-5 degree of thermal source is reduced, make electronics
Product can normally and efficiently operate, so as to realize protecting the purpose of electronic product.
Example IV
A kind of purposes of accumulation of heat glue, the accumulation of heat glue is used to radiate.
The accumulation of heat glue is used with thermal diffusion material fit, for radiating；The one of the accumulation of heat glue
Side or both sides are provided with thermal diffusion material.
The thermal diffusion material is graphite or copper or aluminium.
Accumulation of heat glue of the present invention, by mass percentage comprising following components：Paraffin 30-40%；
Acrylic glue 60-70%.
The purposes of accumulation of heat glue of the present invention is for radiating, when it is applied in electronic product
When, by the heat for absorbing the thermal source near it, the temperature 2-10 degree of thermal source is reduced, make electricity
Sub- product can normally and efficiently operate, so as to realize protecting the purpose of electronic product.
Embodiment five
A kind of purposes of accumulation of heat glue, the accumulation of heat glue is used to radiate.
The accumulation of heat glue is used with thermal diffusion material fit, for radiating；The one of the accumulation of heat glue
Side or both sides are provided with thermal diffusion material.
The thermal diffusion material is graphite or copper or aluminium.
Accumulation of heat glue of the present invention, by mass percentage comprising following components：Paraffin 40-50%；
Silica column glue 50-60%.The purposes of accumulation of heat glue of the present invention be for radiating, when
When it is applied in electronic product, by the heat for absorbing the thermal source near it, thermal source is reduced
Temperature 2-10 degree, enables electronic product normally and efficiently to operate, so as to realize protecting electronic product
Purpose.
Embodiment six
A kind of purposes of accumulation of heat glue, the accumulation of heat glue is used to radiate.
The accumulation of heat glue is used with thermal diffusion material fit, for radiating；The one of the accumulation of heat glue
Side or both sides are provided with thermal diffusion material.
The thermal diffusion material is graphite or copper or aluminium.
Accumulation of heat glue of the present invention, by mass percentage comprising following components：Paraffin 50-60%；
Rubber cement 40-50%.The purposes of accumulation of heat glue of the present invention is for radiating, when it should
When in electronic product, by the heat for absorbing the thermal source near it, the temperature of thermal source is reduced
2-10 degree, enables electronic product normally and efficiently to operate, so as to realize protecting the mesh of electronic product
's.
Above-described embodiment technology design only to illustrate the invention and feature, its object is to allow ripe
The personage for knowing technique will appreciate that present disclosure and be carried out, can not be limited with this
Protection scope of the present invention processed, all equivalence changes made according to spirit of the invention or repaiies
Decorations, all should cover within the scope of the present invention.
Claims (10)
1. a kind of purposes of accumulation of heat glue, it is characterised in that the accumulation of heat glue is used to radiate.
2. the purposes of accumulation of heat glue according to claim 1, it is characterised in that the storage
Hot glue is used with thermal diffusion material fit, for radiating.
3. the purposes of accumulation of heat glue according to claim 2, it is characterised in that：The heat
Diffusion material is graphite or copper or aluminium.
4. the purposes of the accumulation of heat glue according to claim 1 or 2 or 3, it is characterised in that：
The accumulation of heat glue, by mass percentage comprising following components：Paraffin 1-60%；Glue 40-99%.
5. the purposes of accumulation of heat glue according to claim 4, it is characterised in that：The storage
Hot glue, includes by mass percentage, paraffin 1-15%；Glue 85-99%.
6. the purposes of accumulation of heat glue according to claim 4, it is characterised in that：The storage
Hot glue, includes by mass percentage, paraffin 15-30%；Glue 70-85%.
7. the purposes of accumulation of heat glue according to claim 4, it is characterised in that：The storage
Hot glue, includes by mass percentage, paraffin 30-40%；Glue 60-70%.
8. the purposes of accumulation of heat glue according to claim 4, it is characterised in that：The storage
Hot glue, includes by mass percentage, paraffin 40-50%；Glue 50-60%.
9. the purposes of accumulation of heat glue according to claim 4, it is characterised in that：The storage
Hot glue, includes by mass percentage, paraffin 50-60%；Glue 40-50%.
10. the purposes of the accumulation of heat glue according to claim 5 or 6 or 7 or 8 or 9, its
It is characterised by：The glue is acrylic glue or silica column glue or rubber cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510737396.2A CN106634726A (en) | 2015-10-30 | 2015-10-30 | Application of heat storage adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510737396.2A CN106634726A (en) | 2015-10-30 | 2015-10-30 | Application of heat storage adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106634726A true CN106634726A (en) | 2017-05-10 |
Family
ID=58811011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510737396.2A Pending CN106634726A (en) | 2015-10-30 | 2015-10-30 | Application of heat storage adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106634726A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1491438A (en) * | 2001-04-06 | 2004-04-21 | 信越化学工业株式会社 | Radiating structural body of electronic part and radiating sheet used for radiating structural body |
| CN102250588A (en) * | 2011-05-18 | 2011-11-23 | 杨福河 | High-performance phase-change heat conduction material and preparation method thereof |
| CN202996862U (en) * | 2012-12-11 | 2013-06-12 | 浙江昱辉阳光能源江苏有限公司 | Backboard and photovoltaic assembly |
| CN103849356A (en) * | 2014-03-20 | 2014-06-11 | 中国电子科技集团公司第三十三研究所 | Electrical insulating phase-change heat conducting material and preparation method thereof |
| CN104694032A (en) * | 2013-12-04 | 2015-06-10 | 凯尔凯德新材料科技泰州有限公司 | Thermally conductive tape with high thermal conductivity, and preparation method thereof |
-
2015
- 2015-10-30 CN CN201510737396.2A patent/CN106634726A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1491438A (en) * | 2001-04-06 | 2004-04-21 | 信越化学工业株式会社 | Radiating structural body of electronic part and radiating sheet used for radiating structural body |
| CN102250588A (en) * | 2011-05-18 | 2011-11-23 | 杨福河 | High-performance phase-change heat conduction material and preparation method thereof |
| CN202996862U (en) * | 2012-12-11 | 2013-06-12 | 浙江昱辉阳光能源江苏有限公司 | Backboard and photovoltaic assembly |
| CN104694032A (en) * | 2013-12-04 | 2015-06-10 | 凯尔凯德新材料科技泰州有限公司 | Thermally conductive tape with high thermal conductivity, and preparation method thereof |
| CN103849356A (en) * | 2014-03-20 | 2014-06-11 | 中国电子科技集团公司第三十三研究所 | Electrical insulating phase-change heat conducting material and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |
|
| RJ01 | Rejection of invention patent application after publication |