CN106634727A - Heat storage glue - Google Patents
Heat storage glue Download PDFInfo
- Publication number
- CN106634727A CN106634727A CN201510737398.1A CN201510737398A CN106634727A CN 106634727 A CN106634727 A CN 106634727A CN 201510737398 A CN201510737398 A CN 201510737398A CN 106634727 A CN106634727 A CN 106634727A
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- CN
- China
- Prior art keywords
- glue
- heat
- accumulation
- electronic product
- paraffin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention discloses a heat storage glue, which comprises, by mass, 1-60% of paraffin and 40-99% of a glue. According to the present invention, the heat storage glue can absorb heat, wherein the heat storage glue absorbs the heat of the heat source close to the heat storage glue so as to reduce the temperature of the heat source when the heat storage glue is applied in electronic products, such that the electronic product can normally and efficiently operate so as to protect the electronic product.
Description
Technical field
The present invention relates to a kind of accumulation of heat glue that can absorb heat.
Background technology
With informationalized development, increasing high performance information electronic product occurs therewith,
But this electronic product is in use, when being passed through due to electric current or electrically by when meeting send out
Heat；When the excessive heat that it is produced, various harmful effects can be caused to electronic product：1、
Secure context, when temperature exceedes temperature is envisioned, and electronic product can smolder or catch fire；2nd, performance
Aspect, heating causes the speed of service of electronic product to decline, and even results in failure, generation action
It is bad.Electronic product problems of excessive heat how is solved, becomes the important class of e-machine commercialization
Topic.
For this purpose, we have developed a kind of accumulation of heat glue that can absorb heat.
The content of the invention
The invention aims to overcome the deficiencies in the prior art and providing one kind can absorb heat
Accumulation of heat glue.
To reach above-mentioned purpose, the technical solution used in the present invention is：A kind of accumulation of heat glue, by matter
Amount percentage includes following components：Paraffin 1-60%；Glue 40-99%.
Preferably, the accumulation of heat glue is included by mass percentage, paraffin 1-15%；Glue
85-99%.
Preferably, the accumulation of heat glue is included by mass percentage, paraffin 15-30%；Glue
70-85%.
Preferably, the accumulation of heat glue is included by mass percentage, paraffin 30-40%；Glue
60-70%.
Preferably, the accumulation of heat glue is included by mass percentage, paraffin 40-50%；Glue
50-60%.
Preferably, the accumulation of heat glue is included by mass percentage, paraffin 50-60%；Glue
40-50%.
Preferably, the glue is acrylic glue or silica column glue or rubber cement.
Due to the utilization of above-mentioned technical proposal, the present invention has compared with prior art following excellent
Point：
Accumulation of heat glue of the present invention can absorb heat, when it is applied in electronic product, lead to
The heat for absorbing the thermal source near it is crossed, the temperature of thermal source is reduced, enables electronic product normal high
Effect operating, so as to realize protecting the purpose of electronic product.
Specific embodiment
Below the present invention is described in further detail for Jing specific embodiments.
Embodiment one
A kind of accumulation of heat glue of the present invention, by mass percentage comprising following components：Paraffin
1-60%；Acrylic glue 40-99%.
Accumulation of heat glue of the present invention can absorb heat, when it is applied in electronic product, lead to
The heat for absorbing the thermal source near it is crossed, the temperature 2-10 degree of thermal source is reduced, electronic product is made
Can normally and efficiently operate, so as to realize protecting the purpose of electronic product.
Embodiment two
A kind of accumulation of heat glue of the present invention, by mass percentage comprising following components：Paraffin
1-15%；Acrylic glue 85-99%.
Accumulation of heat glue of the present invention can absorb heat, when it is applied in electronic product, lead to
The heat for absorbing the thermal source near it is crossed, the temperature 3-5 degree of thermal source is reduced, electronic product is enable
Normally and efficiently operate, so as to realize protecting the purpose of electronic product.
Embodiment three
A kind of accumulation of heat glue of the present invention, by mass percentage comprising following components：Paraffin
15-30%；Silica column glue 70-85%.
Accumulation of heat glue of the present invention can absorb heat, when it is applied in electronic product, lead to
The heat for absorbing the thermal source near it is crossed, the temperature 2-5 degree of thermal source is reduced, electronic product is enable
Normally and efficiently operate, so as to realize protecting the purpose of electronic product.
Example IV
A kind of accumulation of heat glue of the present invention, by mass percentage comprising following components：Paraffin
30-40%；Acrylic glue 60-70%.
Accumulation of heat glue of the present invention can absorb heat, when it is applied in electronic product, lead to
The heat for absorbing the thermal source near it is crossed, the temperature 2-10 degree of thermal source is reduced, electronic product is made
Can normally and efficiently operate, so as to realize protecting the purpose of electronic product.
Embodiment five
A kind of accumulation of heat glue of the present invention, by mass percentage comprising following components：Paraffin
40-50%；Silica column glue 50-60%.Accumulation of heat glue of the present invention can absorb heat, when
When it is applied in electronic product, by the heat for absorbing the thermal source near it, thermal source is reduced
Temperature 2-10 degree, enables electronic product normally and efficiently to operate, so as to realize protecting electronic product
Purpose.
Embodiment six
A kind of accumulation of heat glue of the present invention, by mass percentage comprising following components：Paraffin
50-60%；Rubber cement 40-50%.Accumulation of heat glue of the present invention can absorb heat, when it should
When in electronic product, by the heat for absorbing the thermal source near it, the temperature of thermal source is reduced
2-10 degree, enables electronic product normally and efficiently to operate, so as to realize protecting the mesh of electronic product
's.
Above-described embodiment technology design only to illustrate the invention and feature, its object is to allow ripe
The personage for knowing technique will appreciate that present disclosure and be carried out, can not be limited with this
Protection scope of the present invention processed, all equivalence changes made according to spirit of the invention or repaiies
Decorations, all should cover within the scope of the present invention.
Claims (7)
1. a kind of accumulation of heat glue, it is characterised in that：Following components is included by mass percentage：Stone
Wax 1-60%；Glue 40-99%.
2. accumulation of heat glue according to claim 1, it is characterised in that：By mass percentage
Comprising paraffin 1-15%；Glue 85-99%.
3. accumulation of heat glue according to claim 1, it is characterised in that：By mass percentage
Comprising paraffin 15-30%；Glue 70-85%.
4. accumulation of heat glue according to claim 1, it is characterised in that：By mass percentage
Comprising paraffin 30-40%；Glue 60-70%.
5. accumulation of heat glue according to claim 1, it is characterised in that：By mass percentage
Comprising paraffin 40-50%；Glue 50-60%.
6. accumulation of heat glue according to claim 1, it is characterised in that：By mass percentage
Comprising paraffin 50-60%；Glue 40-50%.
7. the accumulation of heat glue according to any of the above claim, it is characterised in that：The glue
Water is acrylic glue or silica column glue or rubber cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510737398.1A CN106634727A (en) | 2015-10-30 | 2015-10-30 | Heat storage glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510737398.1A CN106634727A (en) | 2015-10-30 | 2015-10-30 | Heat storage glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106634727A true CN106634727A (en) | 2017-05-10 |
Family
ID=58809972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510737398.1A Pending CN106634727A (en) | 2015-10-30 | 2015-10-30 | Heat storage glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106634727A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030207064A1 (en) * | 1996-04-29 | 2003-11-06 | Bunyan Michael H. | Conformal thermal interface material for electronic components |
| CN1491438A (en) * | 2001-04-06 | 2004-04-21 | 信越化学工业株式会社 | Radiating structural body of electronic part and radiating sheet used for radiating structural body |
| CN102250588A (en) * | 2011-05-18 | 2011-11-23 | 杨福河 | High-performance phase-change heat conduction material and preparation method thereof |
| CN202996862U (en) * | 2012-12-11 | 2013-06-12 | 浙江昱辉阳光能源江苏有限公司 | Backboard and photovoltaic assembly |
| CN103849356A (en) * | 2014-03-20 | 2014-06-11 | 中国电子科技集团公司第三十三研究所 | Electrical insulating phase-change heat conducting material and preparation method thereof |
| CN104694032A (en) * | 2013-12-04 | 2015-06-10 | 凯尔凯德新材料科技泰州有限公司 | Thermally conductive tape with high thermal conductivity, and preparation method thereof |
-
2015
- 2015-10-30 CN CN201510737398.1A patent/CN106634727A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030207064A1 (en) * | 1996-04-29 | 2003-11-06 | Bunyan Michael H. | Conformal thermal interface material for electronic components |
| CN1491438A (en) * | 2001-04-06 | 2004-04-21 | 信越化学工业株式会社 | Radiating structural body of electronic part and radiating sheet used for radiating structural body |
| CN102250588A (en) * | 2011-05-18 | 2011-11-23 | 杨福河 | High-performance phase-change heat conduction material and preparation method thereof |
| CN202996862U (en) * | 2012-12-11 | 2013-06-12 | 浙江昱辉阳光能源江苏有限公司 | Backboard and photovoltaic assembly |
| CN104694032A (en) * | 2013-12-04 | 2015-06-10 | 凯尔凯德新材料科技泰州有限公司 | Thermally conductive tape with high thermal conductivity, and preparation method thereof |
| CN103849356A (en) * | 2014-03-20 | 2014-06-11 | 中国电子科技集团公司第三十三研究所 | Electrical insulating phase-change heat conducting material and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |