CN104178048B - A kind of ultrathin heat conduction adhesive tape - Google Patents
A kind of ultrathin heat conduction adhesive tape Download PDFInfo
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- CN104178048B CN104178048B CN201410440357.1A CN201410440357A CN104178048B CN 104178048 B CN104178048 B CN 104178048B CN 201410440357 A CN201410440357 A CN 201410440357A CN 104178048 B CN104178048 B CN 104178048B
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Abstract
The present invention proposes a kind of ultrathin heat conduction adhesive tape, described adhesive tape is have base material or without the one-faced tapes of base material or double sticky tape; When described adhesive tape is the adhesive tape without base material, the heat-conducting glue that described adhesive tape is 0.5-2 μm by thickness is formed; When described adhesive tape is the adhesive tape with base material, by thickness, to be 1-5 μm of base material and single or double total thickness be described adhesive tape that the heat-conducting glue of 0.5-2 μm is formed, and described heat-conducting glue is by adding nano ceramics heat conductive filler, nano metal heat conductive filler and carbon nanotube in high molecular polymer or Graphene is made.Ultrathin heat conduction adhesive tape of the present invention is owing to have employed above-mentioned heat-conducting glue, can it make the thickness that is as thin as 0.5 μm and have 20? the thermal conductivity of more than W/ (mk), and the heat conduction adhesive tape under this thickness can possess the larger mechanical strength of relatively existing heat conduction adhesive tape, possesses better mechanical property.
Description
Technical field
The present invention relates to a kind of ultrathin heat conduction adhesive tape with heat conduction function for radiating element, described heat conduction adhesive tape can be double sticky tape or one-faced tapes.
Background technology
The heat radiation of the electronicss such as current mobile phone mainly adopts the mode of pasting radiating element on the components and parts needing heat radiation, these radiating elements are generally the flaky radiator part of the fin material such as graphite, copper carbon body or other type, for the fashion trend needs of satisfied ultrathin electronics.
Although these radiating elements are rather considerable on heat conductivility of today, but these radiating elements still need to be connected with the components and parts that needs dispel the heat by mode such as bonding glue or adhesive tape (double sticky tape or one-faced tapes) etc., therefore the heat conductivility of existing bonding glue or adhesive tape becomes the bottleneck that heat dispersion improves gradually.
Popular along with electronics ultrathin trend, adopt the mode of smearing the glue possessing heat conduction function to paste radiating element, there is glue and smear uneven, be difficult to standardized defect, and due to electronic equipment internal space more and more narrower and small, in reality be difficult to so operate.On the other hand, heat conduction adhesive tape sticking radiating element is adopted to can be good at solving the defect of glue, but existing heat conduction adhesive tape or thermal conductivity is little, be difficult to the needs meeting heat radiation; Be exactly be difficult to do very thin, mainly due in order to improve adhesive tape thermal conductivity, need to add mass filler, and heat conduction adhesive tape does thin words and can intensity can be caused very low by mass filler, cause operational difficulty and cohesive force is very poor, radiating element firmly cannot be bonded to need heat radiation components and parts on, and once heat conduction adhesive tape is done thick, heat conduction adhesive tape can sharply reduce again at the thermal conductivity of thickness direction, and is also difficult to the needs meeting electronics ultrathin.
The another kind of usage of heat-conducting glue is sprayed directly on the components and parts of needs heat radiation, but it exists coating thickness too greatly equally, the shortcoming that thermal conductivity is little.Because the heat-conducting glue that can be used for spraying is usually rarer, heat conductive filler content is wherein relatively low, causes it can only improve thermal conductivity by the mode increasing coating thickness; Or improve thermal conductivity by adding various filler in heat conduction adhesive tape, more improve viscosity thus, consequently filler makes glue mixture powdered too much, the viscosity of glue mixture is lost, and has no idea for making ultra-thin, that thermal conductivity is higher, mechanical property is good again heat conduction adhesive tape.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of ultrathin heat conduction adhesive tape, to reduce or to avoid problem noted earlier.
For solving the problems of the technologies described above, a kind of ultrathin heat conduction adhesive tape, described adhesive tape is have base material or without the one-faced tapes of base material or double sticky tape; When described adhesive tape is the adhesive tape without base material, the heat-conducting glue that described adhesive tape is 0.5-2 μm by thickness is formed; When described adhesive tape is the adhesive tape with base material, by thickness, to be 1-5 μm of base material and single or double total thickness be described adhesive tape that the heat-conducting glue of 0.5-2 μm is formed, and described heat-conducting glue is by adding nano ceramics heat conductive filler, nano metal heat conductive filler and carbon nanotube in high molecular polymer or Graphene is made.
Preferably, described heat-conducting glue is made up of the raw material of following weight part: high molecular polymer, 35-45 weight part; Nano ceramics heat conductive filler, 5-10 weight part; Nano metal heat conductive filler, 5-10 weight part; Carbon nanotube or Graphene 20-30 weight part.
Preferably, described nano ceramics heat conductive filler is one of nano zircite, nano aluminium oxide, Nano diamond, nm-class boron nitride or its mixture.
Preferably, described nano metal is one of nano-metal particle, nano metal sheet, nano metal line or its mixture.
Preferably, described nano metal is one of nanometer gold and silver, copper, aluminum metal or its mixture.
Preferably, described high molecular polymer is one of polyethylene, poly-third ethene, epoxy resin, polyethylene terephthalate, polyvinyl chloride or its mixture.
Preferably, described base material is PET sheet or non-woven fabrics, also can be the metal sheet of copper or other material.
Ultrathin heat conduction adhesive tape of the present invention is owing to have employed above-mentioned heat-conducting glue, it can make the thickness that is as thin as 0.5 μm and have the thermal conductivity of more than 20W/ (mk), and the heat conduction adhesive tape under this thickness can possess the larger mechanical strength of relatively existing heat conduction adhesive tape, possesses better mechanical property.
Embodiment
Just as described in the background section, existing heat-conducting glue is pasted radiating element by the mode of smearing and be there is certain defect, and in addition, the another kind of usage of heat-conducting glue is sprayed directly on the components and parts of needs heat radiation, but it is too large equally to there is coating thickness in it, the shortcoming that thermal conductivity is little.Because the heat-conducting glue that can be used for spraying is usually rarer, heat conductive filler content is wherein relatively low, causes it can only improve thermal conductivity by the mode increasing coating thickness.
Therefore, the invention provides a kind of heat-conducting glue that can be used for making ultrathin heat conduction adhesive tape, in order to the above-mentioned defect of customer service prior art.Specifically, the present invention proposes a kind of ultrathin heat conduction adhesive tape, it can be a kind of adhesive tape with base material, or also can be a kind of adhesive tape without base material.Above-mentioned have base material or can be that (two sides of adhesive tape all possesses viscosity to double sticky tape without the adhesive tape of base material, without adhesive tape two sides all toughness of base material, belong to double sticky tape), also can be that (adhesive tape only has one side to possess viscosity to one-faced tapes, having the adhesive tape of base material can be one-faced tapes, also can be double sticky tape).
When described adhesive tape is the adhesive tape without base material, its heat-conducting glue that can be only 0.5-2 μm by thickness is formed.When described adhesive tape is the adhesive tape with base material, it can be 1-5 μm of base material and single or double total thickness be that the heat-conducting glue of 0.5-2 μm is formed by thickness.Wherein, described base material can be PET sheet or non-woven fabrics, also can be the metal sheet of copper or other material.
Namely inventive point of the present invention there are provided a kind of heat-conducting glue of property, it can make the thickness that is as thin as 0.5 μm and have the thermal conductivity of more than 20W/ (mk), and the heat conduction adhesive tape under this thickness can possess the larger mechanical strength of relatively existing heat conduction adhesive tape, possesses better mechanical property.
Specifically, the heat-conducting glue that adopts of heat conduction adhesive tape of the present invention is by adding nano ceramics heat conductive filler, nano metal heat conductive filler and carbon nanotube in high molecular polymer or Graphene is made.In a preferred embodiment, described heat-conducting glue is made up of the raw material of following weight part: high molecular polymer, 35-45 weight part; Nano ceramics heat conductive filler, 5-10 weight part; Nano metal heat conductive filler, 5-10 weight part; Carbon nanotube or Graphene 20-30 weight part.
In existing heat-conducting glue, usually the case of adding carbon nanotube or Graphene in high molecular polymer is had, but carbon nanotube or Graphene cost higher, and have a very large problem to be, the carbon nanotube that can add in high molecular polymer or the amount of Graphene have its limit, that is, when carbon nanotube or Graphene addition excessive time, the mixture of high molecular polymer and carbon nanotube or Graphene can become a kind of floury structure, thus its viscosity is reduced, heat conduction adhesive tape of the present invention cannot be applied to.In addition, in prior art, also the case of adding ceramic filler or metallic stuffing in high molecular polymer is had, but the limited problem of filler addition can be there is equally, thus to cause in the heat-conducting glue made thus heat conduction composition inadequate, thus there is thermal conductivity due to heat-conducting glue lower and the problem of the very high very thin heat conduction adhesive tape of thermal conductivity cannot be obtained.
The present inventor finds through research, heat-conducting glue composition in existing heat-conducting glue can be combinationally used, namely in high molecular polymer, nano ceramics heat conductive filler, nano metal heat conductive filler and carbon nanotube is added or Graphene makes Novel heat-conducting glue, the heat-conducting glue obtained by the raw material of above-mentioned weight part can beat all accommodation more substantial heat conduction composition filler, and can not reduce its viscosity like that foregoing.On the other hand, the heat-conducting glue obtained by the raw material of above-mentioned weight part can also be as thin as the thermal conductivity under the thickness of 0.5 μm with more than 20W/ (mk), and the heat conduction adhesive tape under this thickness can possess the larger mechanical strength of relatively existing heat conduction adhesive tape, possess better mechanical property, this is also one of beat all technique effect of the present invention.Above-mentioned technique effect is applied to heat conduction adhesive tape of the present invention, be those skilled in the art cannot by prior art obtain any technology enlightenment when obtain, thus cause ultrathin heat conduction adhesive tape of the present invention to possess the creativeness surmounting prior art.
In addition, in preferred embodiment as described below, described nano ceramics heat conductive filler can be one of nano zircite, nano aluminium oxide, Nano diamond, nm-class boron nitride or its mixture.Described nano metal can be one of nano-metal particle, nano metal sheet, nano metal line or its mixture.Preferably, described nano metal can be one of nanometer gold, silver, copper, aluminum metal or its mixture.Described high molecular polymer can be one of polyethylene, poly-third ethene, epoxy resin, polyethylene terephthalate, polyvinyl chloride or its mixture.
In sum, ultrathin heat conduction adhesive tape of the present invention is owing to have employed above-mentioned heat-conducting glue, it can make the thickness that is as thin as 0.5 μm and have the thermal conductivity of more than 20W/ (mk), and the heat conduction adhesive tape under this thickness can possess the larger mechanical strength of relatively existing heat conduction adhesive tape, possesses better mechanical property.
Although it will be appreciated by those skilled in the art that the present invention is described according to the mode of multiple embodiment, not each embodiment only comprises an independently technical scheme.So describe in specification sheets be only used to clear for the purpose of; specification sheets should integrally be understood by those skilled in the art, and regards technical scheme involved in each embodiment as the mode that mutually can be combined into different embodiment to understand protection scope of the present invention.
The foregoing is only the schematic embodiment of the present invention, and be not used to limit scope of the present invention.Any those skilled in the art, the equivalent variations done under the prerequisite not departing from design of the present invention and principle, amendment and combination, all should belong to the scope of protection of the invention.
Claims (8)
1. a ultrathin heat conduction adhesive tape, described adhesive tape is have base material or without the one-faced tapes of base material or double sticky tape; When described adhesive tape is the adhesive tape without base material, the heat-conducting glue that described adhesive tape is 0.5-2 μm by thickness is formed; When described adhesive tape is the adhesive tape with base material, by thickness, to be 1-5 μm of base material and single or double total thickness be described adhesive tape that the heat-conducting glue of 0.5-2 μm is formed, it is characterized in that, add the nano ceramics heat conductive filler of 5-10 weight part, the nano metal heat conductive filler of 5-10 weight part, the carbon nanotube of 20-30 weight part or Graphene in the high molecular polymer of described heat-conducting glue by 35-45 weight part and make.
2. ultrathin heat conduction adhesive tape as claimed in claim 1, is characterized in that, described nano ceramics heat conductive filler is one of nano zircite, nano aluminium oxide, Nano diamond, nm-class boron nitride or its mixture.
3. ultrathin heat conduction adhesive tape as claimed in claim 1, is characterized in that, described nano metal is one of nano-metal particle, nano metal sheet, nano metal line or its mixture.
4. ultrathin heat conduction adhesive tape as claimed in claim 3, is characterized in that, described nano metal is one of nanometer gold and silver, copper, aluminum metal or its mixture.
5. the ultrathin heat conduction adhesive tape as described in one of claim 1-4, is characterized in that, described high molecular polymer is one of polyethylene, poly-third ethene, epoxy resin, polyethylene terephthalate, polyvinyl chloride or its mixture.
6. ultrathin heat conduction adhesive tape as claimed in claim 1, is characterized in that, described base material is PET sheet or non-woven fabrics.
7. ultrathin heat conduction adhesive tape as claimed in claim 1, is characterized in that, described base material is copper.
8. ultrathin heat conduction adhesive tape as claimed in claim 1, is characterized in that, described base material is metal sheet.
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| CN201410440357.1A CN104178048B (en) | 2014-09-01 | 2014-09-01 | A kind of ultrathin heat conduction adhesive tape |
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| CN201410440357.1A CN104178048B (en) | 2014-09-01 | 2014-09-01 | A kind of ultrathin heat conduction adhesive tape |
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| CN104178048A CN104178048A (en) | 2014-12-03 |
| CN104178048B true CN104178048B (en) | 2015-11-18 |
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104804673A (en) * | 2015-05-08 | 2015-07-29 | 南通天燕纺织器材有限公司 | Novel high-strength textile leather collar |
| CN105907349A (en) * | 2016-06-08 | 2016-08-31 | 蚌埠高华电子股份有限公司 | Nanometer zirconium oxide modified composite epoxy pouring sealant for LED display screen |
| CN106634763A (en) * | 2016-12-06 | 2017-05-10 | 苏州洛特兰新材料科技有限公司 | High-heat-conductivity electric-insulation adhesive material and preparation method thereof |
| CN107325742A (en) * | 2017-06-30 | 2017-11-07 | 闫晓琦 | A kind of heat-conducting glue band containing conducting high polymers thing |
| CN107446525A (en) * | 2017-08-01 | 2017-12-08 | 昆山德睿懿嘉电子材料科技有限公司 | Paste heat-conducting glue containing conducting high polymers thing |
| CN108084913A (en) * | 2017-12-08 | 2018-05-29 | 江苏伊诺尔新材料科技有限公司 | Superthin polyester double faced adhesive tape |
| CN109401648A (en) * | 2018-11-06 | 2019-03-01 | 苏州环明电子科技有限公司 | Ultra-thin bond plies and its preparation process |
| CN110698994A (en) * | 2019-09-12 | 2020-01-17 | 广州视源电子科技股份有限公司 | Heat-conducting insulating adhesive tape and preparation method thereof |
| DE202020101775U1 (en) * | 2020-04-01 | 2020-05-26 | Certoplast Technische Klebebänder Gmbh | Adhesive tape, in particular cable winding tape for wrapping cables in automobiles |
| US11479694B2 (en) | 2020-10-23 | 2022-10-25 | Jiangsu Enoel New Material Technology Co., Ltd | High-performance ultra-thin double-sided adhesive tape |
| CN113954483A (en) * | 2021-10-19 | 2022-01-21 | 苏州翎慧材料科技有限公司 | Wireless charging receiving terminal wafer module structure |
| CN113801603B (en) * | 2021-10-20 | 2023-03-31 | 福建友谊胶粘带集团有限公司 | Ultrathin heat-conducting adhesive tape and preparation method thereof |
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| JP2003037382A (en) * | 2001-07-25 | 2003-02-07 | Mitsubishi Gas Chem Co Inc | Heat-conductive adhesive sheet |
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Effective date of registration: 20151214 Address after: 100176 prosperous industrial zone, No. 7, Tongji Road, Daxing District economic and Technological Development Zone, Beijing Patentee after: LOVEPAC CONVERTING (BEIJING) CO., LTD. Patentee after: Nolan mobile communication parts (Beijing) Co., Ltd. Address before: 100176 prosperous industrial zone, No. 7, Tongji Road, Daxing District economic and Technological Development Zone, Beijing Patentee before: LOVEPAC CONVERTING (BEIJING) CO., LTD. |