CN110698994A - Heat-conducting insulating adhesive tape and preparation method thereof - Google Patents
Heat-conducting insulating adhesive tape and preparation method thereof Download PDFInfo
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- CN110698994A CN110698994A CN201910861883.8A CN201910861883A CN110698994A CN 110698994 A CN110698994 A CN 110698994A CN 201910861883 A CN201910861883 A CN 201910861883A CN 110698994 A CN110698994 A CN 110698994A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
- C09J2400/263—Presence of textile or fabric in the substrate
Abstract
The invention relates to a heat-conducting insulating adhesive tape and a preparation method thereof; the heat-conducting insulating adhesive tape comprises a base material layer, a heat-conducting adhesive layer and a release film layer which are sequentially arranged from bottom to top; the substrate layer is a non-woven fabric substrate or a composite fiber cloth substrate, and the heat-conducting adhesive layer comprises an adhesive, a nanometer heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent. According to the invention, the non-woven fabric or the composite fiber cloth is preferably selected as the material of the base material layer, and the nano heat-conducting filler selected in the heat-conducting adhesive layer is combined, so that the high insulativity and the high heat-conducting property of the adhesive tape are comprehensively realized; the heat-conducting insulating adhesive tape prepared by the invention is used for replacing the traditional insulating adhesive tape, so that the insulativity can be ensured, the problem of temperature rise of devices can be solved, the running stability of products is improved, and the service life of the products is prolonged; meanwhile, the preparation method has the advantages of simple process, short process flow, common used equipment and low price of raw materials, and is suitable for batch production and use.
Description
Technical Field
The invention relates to the technical field of insulating tapes, in particular to a heat-conducting insulating tape and a preparation method thereof.
Background
With the development of electronic technology, electronic devices tend to be miniaturized and light and thin, and meanwhile, the performance and power of electronic components are continuously improved, and the heat flux density is rapidly increased, so that how to effectively solve the problem of heat dissipation becomes a bottleneck of further development of electronic technology.
Printed Circuit Board (PCB) cards have a lot of heat sources, wherein the problem of temperature rise of chips and mos (metal Oxide semiconductor) tubes and other heating devices can be effectively solved by means of heat sinks or heat sinks, but no effective solution is available in the industry for electronic and magnetic devices, such as transformers and inductors, which are composed of magnetic cores and coils.
At present, insulating tapes are used between windings and at outsourcing positions of magnetic devices such as transformers to play insulating, fixing and protecting roles, and due to the fact that the heat conductivity coefficient of the insulating tapes is extremely low, heat generated during working of the transformers is sealed inside the devices and cannot form convective heat transfer with external cold air, and therefore the problem that temperature rise of the transformers exceeds the standard is caused.
The heat-conducting adhesive tape popular in the market is roughly divided into a substrate type and a substrate-free type, and both sides of the substrate-free type heat-conducting adhesive tape usually have viscosity, so that the winding construction between magnetic device windings and at an outer package position is inconvenient, and the heat-conducting adhesive tape is suitable for being used as a heat-conducting interface material to connect a radiator and a heat source; the heat-conducting adhesive tape with a base material is generally a sheet material such as a PET (polyethylene terephthalate) film, so that the heat resistance is high, the sealing performance is high, the integral heat transfer capacity of the heat-conducting adhesive tape is reduced, and the problem of poor insulating performance is also caused.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a heat-conducting insulating adhesive tape which comprehensively realizes high insulativity and high heat conductivity of the adhesive tape so as to solve the technical problems of poor heat dissipation performance of a film material adhesive tape and poor insulating performance of a cloth-based adhesive tape in the prior heat-conducting adhesive tape.
The technical purpose is achieved through the following technical scheme:
a heat-conducting insulating adhesive tape comprises a substrate layer, a heat-conducting adhesive layer and a release film layer which are sequentially arranged from bottom to top; the substrate layer is a non-woven fabric substrate or a composite fiber cloth substrate, and the heat-conducting adhesive layer comprises an adhesive, a nanometer heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent.
Compared with the prior art, the invention preferably selects the non-woven fabric or the composite fiber cloth as the material of the base material layer, and combines the selected nanometer heat-conducting filler in the heat-conducting adhesive layer, thereby solving the technical problems of poor heat dissipation performance of the film material adhesive tape and poor insulating performance of the cloth-based adhesive tape in the existing insulating adhesive tape, and comprehensively realizing high insulativity and high heat-conducting performance of the adhesive tape. The heat-conducting insulating adhesive tape has higher heat conductivity coefficient and basic fixing and protecting performance on the premise of meeting basic insulation and even enhancing the insulation performance, and the heat-conducting insulating adhesive tape prepared by the invention can ensure the insulation performance, solve the temperature rise problem of devices, improve the running stability of products and prolong the service life of the products by replacing the traditional insulating adhesive tape.
Further, the heat-conducting adhesive layer comprises the following raw materials in parts by weight: 80-120 parts of an adhesive, 100-200 parts of a nano heat-conducting filler, 1.5-5 parts of a heat stabilizer, 2-6 parts of an antioxidant, 1-10 parts of a plasticizer, 0.5-3 parts of a coupling agent and 10-50 parts of a solvent. The formula is optimized by optimizing the proportion of each processing aid of the heat-conducting adhesive layer material.
Further, the adhesive is one or a mixture of more of organic silicon, polyurethane and acrylic adhesive.
Further, the nano heat conducting filler is one or a mixture of nano ceramic particles, whiskers and fibers.
Further, the mixing ratio of the nano-scale ceramic particles, the whiskers and the fibers in the nano heat-conducting filler is 1: 1: 1-1: 5: 9. by optimizing the mixing proportion of the three components, the added ceramic whiskers or fibers can play a role of a heat conduction chain, break through the existence mode of an island form of ceramic particles in a matrix, connect the ceramic particles to form a criss-cross heat conduction network, and greatly improve the heat conductivity coefficient of the composite material.
Further, the coupling agent is a silane or titanate coupling agent. The addition of the coupling agent can improve the dispersibility of the heat-conducting filler and improve the overall performance of the heat-conducting adhesive tape.
The plasticizer is one or more of aliphatic dibasic acid esters, phthalic acid esters, benzene polyacid esters, benzoic acid esters, polyol esters, chlorinated hydrocarbons, epoxy compounds, citric acid esters and polyesters. The plasticizer is one or more of aliphatic dibasic acid esters, phthalic acid esters, benzene polyacid esters, benzoic acid esters, polyol esters, chlorinated hydrocarbons, epoxy, citric acid esters and polyesters.
Further, one or more of toluene, xylene, alcohols, ethers or ketones are mixed.
In addition, the invention also provides a preparation method of the heat-conducting insulating adhesive tape, which comprises the following specific steps:
a. firstly, weighing an adhesive, a nano heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent according to the weight parts in the formula for later use;
b. adding a heat stabilizer, an antioxidant and a plasticizer into a solvent, and uniformly mixing to obtain a mixed diluent;
c. mixing the nanometer heat-conducting filler with the mixed diluent obtained in the previous step to obtain a suspension I;
d. adding a coupling agent into the suspension I, and uniformly mixing to obtain a suspension II;
e. mixing an adhesive with the suspension II to obtain a heat-conducting adhesive;
f. carrying out surface treatment on the base material to increase the surface adhesion;
g. uniformly compounding the heat-conducting adhesive obtained in the step e on the substrate subjected to surface treatment in the step f through a single-side gluing process, and drying to obtain a heat-conducting adhesive/substrate composite film;
h. bonding the adhesive layer of the heat-conducting adhesive/substrate composite film obtained in the previous step with a release film to obtain a heat-conducting insulating adhesive tape;
i. and d, cutting and winding the heat-conducting insulating adhesive tape prepared in the step h.
Further, in the step c, the mixing condition is that the mixture is mixed for 10-20 minutes by an ultrasonic dispersion machine at the temperature of 45-65 ℃; in the step d, mixing is carried out for 5-10 minutes by an ultrasonic dispersion machine at the temperature of 45-65 ℃; and e, dispersing for 3-6 hours at room temperature by using a high-speed stirrer under the mixing condition.
Compared with the prior art, the non-woven fabric or composite fiber cloth is preferably selected as the material of the base material layer, the nano heat-conducting filler selected in the heat-conducting adhesive layer is combined, the type selection and the proportion of the processing aid of the material of the heat-conducting adhesive layer are further optimized, the base material layer and the heat-conducting adhesive layer are matched with each other, the technical problems that a film adhesive tape in the existing insulating adhesive tape is poor in heat dissipation performance and the insulating performance of a cloth-based adhesive tape is poor are solved, and the high insulation performance and the high heat-conducting performance of the adhesive tape are comprehensively realized. In addition, the preparation method of the heat-conducting insulating adhesive tape provided by the invention has the advantages of low price of raw materials, simple process, short process flow, use of common equipment and suitability for batch production and use.
Detailed Description
Example 1
In this embodiment, the invention provides a heat-conducting insulating tape, which includes a substrate layer, a heat-conducting adhesive layer, and a release film layer, which are sequentially disposed from bottom to top. Wherein the substrate layer is a non-woven fabric substrate; the heat-conducting adhesive layer comprises the following raw materials in parts by weight: 100 parts of an adhesive, 125 parts of a nano heat-conducting filler, 2 parts of a heat stabilizer, 3 parts of an antioxidant, 5 parts of a plasticizer, 1.5 parts of a coupling agent and 40 parts of a solvent, wherein in the embodiment, the adhesive is an organic silicon adhesive, the nano heat-conducting filler is a nano ceramic powder heat-conducting filler, the plasticizer is diisooctyl phthalate, the used solvent is xylene, and the coupling agent is a silane coupling agent.
Example 2
In this embodiment, the invention provides a heat-conducting insulating tape, which includes a substrate layer, a heat-conducting adhesive layer, and a release film layer, which are sequentially disposed from bottom to top. Wherein the substrate layer is a non-woven fabric substrate; the heat-conducting adhesive layer comprises the following raw materials in parts by weight: 120 parts of an adhesive, 140 parts of a nano heat-conducting filler, 1.5 parts of a heat stabilizer, 2.5 parts of an antioxidant, 6 parts of a plasticizer, 2 parts of a coupling agent and 45 parts of a solvent, wherein in the embodiment, the adhesive is an acrylic adhesive, the nano heat-conducting filler is a nano ceramic fiber heat-conducting filler, the plasticizer is dibutyl phthalate, the used solvent is butanone, and the coupling agent is a titanate coupling agent.
Example 3
In this embodiment, the invention provides a heat-conducting insulating tape, which includes a substrate layer, a heat-conducting adhesive layer, and a release film layer, which are sequentially disposed from bottom to top. Wherein the substrate layer is a non-woven fabric substrate; the heat-conducting adhesive layer comprises the following raw materials in parts by weight: 115 parts of adhesive, 150 parts of nano heat-conducting filler, 2.5 parts of heat stabilizer, 3.5 parts of antioxidant, 8 parts of plasticizer, 2 parts of coupling agent and 45 parts of solvent, wherein in the embodiment, the adhesive is polyurethane adhesive, the nano heat-conducting filler is nano ceramic whisker heat-conducting filler, the plasticizer is dimethyl phthalate, the used solvent is toluene, and the coupling agent is titanate coupling agent.
Example 4
In this embodiment, the invention provides a method for preparing a heat-conducting insulating tape, which specifically includes the following steps:
a. firstly, weighing an adhesive, a nano heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent according to the weight parts in the formula for later use;
b. adding 2 parts of heat stabilizer, 3 parts of antioxidant and 5 parts of diisooctyl phthalate into 40 parts of dimethylbenzene for uniform mixing to obtain a mixed diluent;
c. mixing 125 parts of nano ceramic powder heat-conducting filler with the mixed diluent obtained in the previous step under the condition of mixing for 12 minutes by an ultrasonic dispersion machine at the temperature of 45 ℃ to obtain suspension I;
d. adding 1.5 parts of silane coupling agent into the suspension I, and mixing for 6 minutes by an ultrasonic dispersion machine at the temperature of 45 ℃ to obtain a suspension II;
e. mixing 100 parts of organic silicon adhesive with the suspension II under the condition of dispersing for 4 hours at room temperature by a high-speed stirrer to obtain a heat-conducting adhesive;
f. carrying out surface treatment on the base material by using a corona machine so as to increase the surface adhesion;
g. uniformly compounding the heat-conducting adhesive obtained in the step e on the substrate subjected to surface treatment in the step f through a single-side gluing process, and drying to obtain a heat-conducting adhesive/substrate composite film;
h. bonding the adhesive layer of the heat-conducting adhesive/substrate composite film obtained in the previous step with a release film to obtain a heat-conducting insulating adhesive tape;
i. and d, cutting and winding the heat-conducting insulating adhesive tape prepared in the step h.
Example 5
In this embodiment, the invention provides a method for preparing a heat-conducting insulating tape, which specifically includes the following steps:
a. firstly, weighing an adhesive, a nano heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent according to the weight parts in the formula for later use;
b. adding 1.5 parts of heat stabilizer, 2.5 parts of antioxidant and 6 parts of dibutyl phthalate into 45 parts of butanone for uniform mixing to obtain a mixed diluent;
c. mixing 140 parts of nano ceramic fiber heat-conducting filler with the diluent obtained in the previous step under the condition of mixing for 15 minutes by an ultrasonic dispersion machine at the temperature of 45 ℃ to obtain suspension I;
d. adding 2 parts of titanate coupling agent into the suspension I, and mixing for 8 minutes by an ultrasonic dispersion machine at the temperature of 45 ℃ to obtain a suspension II;
e. mixing 120 parts of acrylic acid adhesive with the suspension II under the condition of dispersing for 4.5 hours at room temperature by a high-speed stirrer to obtain a heat-conducting adhesive;
f. carrying out surface treatment on the base material by using a corona machine so as to increase the surface adhesion;
g. uniformly compounding the heat-conducting adhesive obtained in the step e on the substrate subjected to surface treatment in the step f through a single-side gluing process, and drying to obtain a heat-conducting adhesive/substrate composite film;
h. bonding the adhesive layer of the heat-conducting adhesive/substrate composite film obtained in the previous step with a release film to obtain a heat-conducting insulating adhesive tape;
i. and d, cutting and winding the heat-conducting insulating adhesive tape prepared in the step h.
Example 6
In this embodiment, the invention provides a method for preparing a heat-conducting insulating tape, which specifically includes the following steps:
a. firstly, weighing an adhesive, a nano heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent according to the weight parts in the formula for later use;
b. adding 2.5 parts of heat stabilizer, 3.5 parts of antioxidant and 8 parts of dimethyl phthalate into 50 parts of toluene, and uniformly mixing to obtain a mixed diluent;
c. mixing 150 parts of nano ceramic whisker heat-conducting filler with the diluent obtained in the previous step under the condition of mixing for 16 minutes by an ultrasonic dispersion machine at the temperature of 50 ℃ to obtain a suspension I;
d. adding 2.5 parts of titanate coupling agent into the suspension I, and mixing for 10 minutes by an ultrasonic dispersion machine at the temperature of 50 ℃ to obtain a suspension II;
e. mixing 115 parts of polyurethane adhesive with the suspension II under the condition of dispersing for 5 hours at room temperature by a high-speed stirrer to obtain a heat-conducting adhesive;
f. carrying out surface treatment on the base material by using a corona machine so as to increase the surface adhesion;
g. uniformly compounding the heat-conducting adhesive obtained in the step e on the substrate subjected to surface treatment in the step f through a single-side gluing process, and drying to obtain a heat-conducting adhesive/substrate composite film;
h. bonding the adhesive layer of the heat-conducting adhesive/substrate composite film obtained in the previous step with a release film to obtain a heat-conducting insulating adhesive tape;
i. and d, cutting and winding the heat-conducting insulating adhesive tape prepared in the step h.
Example 7
The heat-conducting insulating tape prepared in the above embodiment was tested, and the test results are shown in table one:
watch 1
The prepared heat-conducting insulating adhesive tape and the traditional insulating adhesive tape are applied to a transformer for testing, and the test data are compared as shown in the following table two (the test is carried out by a thermocouple under 100V input voltage):
watch two
The test data show that the heat-conducting insulating adhesive tape prepared by the invention has the advantages of high heat conductivity coefficient, good electrical insulating property, high breakdown voltage resistance, good weather resistance and good high-temperature stability, and compared with the traditional insulating adhesive tape, the heat-conducting insulating adhesive tape has obvious advantage in heat-conducting property.
Therefore, compared with the prior art, the non-woven fabric or composite fiber cloth is preferably selected as the material of the base material layer, the nano heat-conducting filler selected from the heat-conducting adhesive layer is combined, the type selection and the proportion of the processing aid of the material of the heat-conducting adhesive layer are further optimized, and the base material layer and the heat-conducting adhesive layer are matched with each other, so that the technical problems that the film adhesive tape in the existing insulating tape is poor in heat dissipation performance and the insulating performance of the cloth-based adhesive tape are solved, and the high insulation performance and the high heat-conducting performance of the adhesive tape are comprehensively realized. In addition, the preparation method of the heat-conducting insulating adhesive tape provided by the invention has the advantages of low price of raw materials, simple process, short process flow, use of common equipment and suitability for batch production and use.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (10)
1. A heat-conductive insulating tape characterized in that: comprises a substrate layer, a heat-conducting adhesive layer and a release film layer which are arranged from bottom to top in sequence; the substrate layer is a non-woven fabric substrate or a composite fiber cloth substrate, and the heat-conducting adhesive layer comprises an adhesive, a nanometer heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent.
2. The thermally conductive and insulating tape according to claim 1, wherein: the heat-conducting adhesive layer comprises the following raw materials in parts by weight: 80-120 parts of an adhesive, 100-200 parts of a nano heat-conducting filler, 1.5-5 parts of a heat stabilizer, 2-6 parts of an antioxidant, 1-10 parts of a plasticizer, 0.5-3 parts of a coupling agent and 10-50 parts of a solvent.
3. The thermally conductive and insulating tape according to claim 1, wherein: the adhesive is one or a mixture of organic silicon, polyurethane and acrylic adhesive.
4. The thermally conductive and insulating tape according to claim 1, wherein: the nano heat-conducting filler is one or a mixture of nano ceramic particles, whiskers and fibers.
5. The thermally conductive and insulating tape according to claim 4, wherein: the mixing ratio of the nano-scale ceramic particles, the whiskers and the fibers in the nano heat-conducting filler is 1: 1: 1-1: 5: 9.
6. the thermally conductive and insulating tape according to claim 1, wherein: the coupling agent is silane or titanate coupling agent.
7. The thermally conductive and insulating tape according to claim 1, wherein: the plasticizer is one or more of aliphatic dibasic acid esters, phthalic acid esters, benzene polyacid esters, benzoic acid esters, polyol esters, chlorinated hydrocarbons, epoxy, citric acid esters and polyesters.
8. The thermally conductive and insulating tape according to claim 1, wherein: the solvent is one or a mixture of toluene, xylene, alcohols, ethers or ketone solvents.
9. A preparation method of a heat-conducting insulating adhesive tape is characterized by comprising the following steps: the method comprises the following specific steps:
a. firstly, weighing an adhesive, a nano heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent according to the weight parts in the formula for later use;
b. adding a heat stabilizer, an antioxidant and a plasticizer into a solvent, and uniformly mixing to obtain a mixed diluent;
c. mixing the nanometer heat-conducting filler with the mixed diluent obtained in the previous step to obtain a suspension I;
d. adding a coupling agent into the suspension I, and uniformly mixing to obtain a suspension II;
e. mixing an adhesive with the suspension II to obtain a heat-conducting adhesive;
f. carrying out surface treatment on the base material to increase the surface adhesion;
g. uniformly compounding the heat-conducting adhesive obtained in the step e on the substrate subjected to surface treatment in the step f through a single-side gluing process, and drying to obtain a heat-conducting adhesive/substrate composite film;
h. bonding the adhesive layer of the heat-conducting adhesive/substrate composite film obtained in the previous step to a release film;
i. and d, cutting and winding the heat-conducting insulating adhesive tape prepared in the step h.
10. The method for preparing a heat-conductive insulating tape according to claim 9, wherein: in the step c, the mixing condition is that the mixture is mixed for 10 to 20 minutes by an ultrasonic dispersion machine at the temperature of 45 to 65 ℃; in the step d, mixing is carried out for 5-10 minutes by an ultrasonic dispersion machine at the temperature of 45-65 ℃; and e, dispersing for 3-6 hours at room temperature by using a high-speed stirrer under the mixing condition.
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| CN201910861883.8A CN110698994A (en) | 2019-09-12 | 2019-09-12 | Heat-conducting insulating adhesive tape and preparation method thereof |
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Cited By (6)
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| CN111447733A (en) * | 2020-03-12 | 2020-07-24 | 佛山科学技术学院 | Deep ultraviolet resistant flexible PCB substrate and preparation method thereof |
| CN113072893A (en) * | 2021-03-24 | 2021-07-06 | 东莞市美鑫工业胶带有限公司 | High-temperature-resistant adhesive tape and preparation method thereof |
| CN113136146A (en) * | 2021-03-02 | 2021-07-20 | 浙江海泰新材料有限公司 | High-thermal-conductivity insulating adhesive tape |
| CN113861876A (en) * | 2021-09-29 | 2021-12-31 | 科建高分子材料（上海）股份有限公司 | Heat-conducting waterproof insulating adhesive tape |
| CN114133882A (en) * | 2021-12-29 | 2022-03-04 | 苏州艾乐格新材料有限公司 | Heat-conducting insulating composite adhesive tape and preparation method and application thereof |
| CN114805887A (en) * | 2022-03-24 | 2022-07-29 | 深圳市飞荣达科技股份有限公司 | Insulating phase-change heat-conducting film and preparation method thereof |
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| CN111447733A (en) * | 2020-03-12 | 2020-07-24 | 佛山科学技术学院 | Deep ultraviolet resistant flexible PCB substrate and preparation method thereof |
| CN111447733B (en) * | 2020-03-12 | 2023-04-25 | 佛山科学技术学院 | Deep ultraviolet-resistant flexible PCB (printed circuit board) base material and preparation method thereof |
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| CN113072893A (en) * | 2021-03-24 | 2021-07-06 | 东莞市美鑫工业胶带有限公司 | High-temperature-resistant adhesive tape and preparation method thereof |
| CN113861876A (en) * | 2021-09-29 | 2021-12-31 | 科建高分子材料（上海）股份有限公司 | Heat-conducting waterproof insulating adhesive tape |
| CN114133882A (en) * | 2021-12-29 | 2022-03-04 | 苏州艾乐格新材料有限公司 | Heat-conducting insulating composite adhesive tape and preparation method and application thereof |
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