CN114133882A

CN114133882A - Heat-conducting insulating composite adhesive tape and preparation method and application thereof

Info

Publication number: CN114133882A
Application number: CN202111642713.4A
Authority: CN
Inventors: 周园淇; 张君宝
Original assignee: Suzhou Aileg New Material Co ltd
Current assignee: Suzhou Aileg New Material Co ltd
Priority date: 2021-12-29
Filing date: 2021-12-29
Publication date: 2022-03-04

Abstract

The invention provides a heat-conducting insulating composite adhesive tape and a preparation method and application thereof. The heat-conducting insulating composite adhesive tape comprises a heat-conducting silicone rubber layer, a base material layer and a pressure-sensitive adhesive layer which are sequentially arranged from top to bottom. The heat-conducting insulating composite adhesive tape prepared by the invention has excellent heat-conducting property, excellent bonding strength and good breakdown voltage resistance, and can meet the application requirements of electrical equipment such as PTC air conditioners, solar inverters, IGBT power chips, 5G base stations, 5G smart phones and the like of a plurality of new energy vehicles.

Description

Heat-conducting insulating composite adhesive tape and preparation method and application thereof

Technical Field

The invention belongs to the technical field of heat-conducting and insulating materials, and relates to a heat-conducting and insulating composite adhesive tape and a preparation method and application thereof.

Background

At present, PTC thermal sensitive ceramic resistor heating devices are installed on various automobile engines imported in China, and the heating devices are arranged at a certain position of an engine intake manifold by utilizing the characteristics of quick conduction and heating and constant temperature automatic control of the PTC thermal sensitive ceramic resistors, so that fuel oil and air mixed gas which must pass through the heating devices are heated to increase the temperature, the atomization degree is further improved, the fuel oil and the air mixed gas are easier to ignite after entering a cylinder, and the combustion is more complete.

Among them, in order to make the PTC thermistor conductive and generate heat quickly and effectively in an environment such as high temperature and high humidity, it is necessary to wrap the PTC thermistor with an insulating material. For example, CN108003812A discloses a reactive heat-conducting insulating double-sided tape and a preparation method thereof, the method includes the following steps: taking the following raw materials in percentage by weight: 5-30% of epoxy resin, 3-50% of film forming matter, 0.2-3.0% of curing agent, 0.01-2.0% of accelerant and 30-90% of heat conducting powder, adding the raw materials into a planetary stirrer, uniformly mixing and defoaming in vacuum to obtain reactive heat conducting glue; extruding the reactive heat-conducting glue and the PET release film together through a calender to form a heat-conducting glue film; and (3) attaching the heat-conducting adhesive film to two sides of the polyimide film through attaching equipment to obtain the reactive heat-conducting insulating double-sided adhesive tape. The invention can meet the requirement of high initial viscosity of the high heat-conducting adhesive tape, and can ensure that the heat-conducting adhesive tape has higher mechanical strength and more excellent adhesiveness; the problem of environmental pollution caused by the fact that a solvent is required to be used in the traditional coating process is solved, and the problem of air holes possibly generated in the baking process is avoided. The heat-conducting property, the insulating property and the like of the reaction type heat-conducting insulating double-sided tape need to be further improved.

Because the traditional heat-conducting insulating material is prepared by a single preparation method, the stability of the prepared material needs to be further improved.

Disclosure of Invention

Aiming at the defects of the prior art, the invention aims to provide a heat-conducting insulating composite adhesive tape, a preparation method and application thereof, and the prepared heat-conducting insulating composite adhesive tape has excellent heat-conducting property, excellent bonding strength and good breakdown voltage resistance, and can meet the application requirements of electrical equipment such as PTC air conditioners, solar inverters, IGBT power chips, 5G base stations, 5G smart phones and the like of a plurality of new energy vehicles.

One of the objectives of the present invention is to provide a heat-conducting and insulating composite tape, and to achieve the objective, the present invention adopts the following technical scheme:

the utility model provides a heat conduction insulating composite adhesive tape, includes from last to the heat conduction type silastic-layer, substrate layer and the pressure sensitive adhesive layer that sets gradually down.

According to the heat-conducting insulating composite adhesive tape, the heat-conducting silicone rubber layer enables the adhesive tape to have excellent heat-conducting performance and insulating performance under the condition of very thin thickness, and the pressure-sensitive adhesive layer endows the adhesive tape with good adhesive performance.

The preparation raw materials of the heat-conducting silicone rubber layer comprise a component A and a component B;

wherein the component A comprises vinyl polysiloxane, and the component B comprises hydrogen polysiloxane.

The specific type and choice of the vinyl polysiloxane and the hydrogenpolysiloxane are not particularly limited in the present invention, and various types of vinyl polysiloxanes and hydrogenpolysiloxanes known to those skilled in the art can be selected.

Preferably, the vinyl polysiloxane has a vinyl content of 4 to 6 wt%, such as 4 wt%, 5 wt%, or 6 wt%, etc.

The hydrogen content of the hydrogenpolysiloxane is 4-6 wt%, such as 4 wt%, 5 wt% or 6 wt%, and the viscosity is 800-1200 cps, such as 800cps, 900cps, 1000cps, 1100cps or 1200 cps.

Further, the component A also comprises a first heat-conducting filler, a first solvent and a catalyst. In some embodiments, the a component comprises, by mass percent, 20-30% of a vinyl polysiloxane, 60-80% of a first thermally conductive filler, 100ppm of a platinum catalyst, and the balance of the first solvent make-up to 100%. Further preferably, the component A comprises 25% of vinyl polysiloxane, 70% of first heat-conducting filler, 100ppm of platinum catalyst and the balance of first solvent is added to 100% by mass percentage.

Further, the component B also comprises a second heat-conducting filler and a second solvent. In some embodiments, the component B comprises 20-30% of hydrogenpolysiloxane and 60-80% of second heat-conducting filler, and the balance of the second solvent is supplemented to 100% by mass percentage. Further preferably, the component B comprises 25% of hydrogenpolysiloxane and 70% of second heat-conducting filler by mass percentage, and the balance of the second solvent is added to 100%.

The first heat-conducting filler in the component A and the second heat-conducting filler in the component B are independently selected from any one of aluminum oxide, aluminum hydroxide, boron nitride and graphene or a mixture of at least two of the aluminum oxide, the aluminum hydroxide, the boron nitride and the graphene.

The mass ratio of the component A to the component B in the heat-conducting silicone rubber layer is 1 (0.8-1.2), such as 1:0.8, 1:0.9, 1:1, 1:1.1 or 1: 1.2; further preferably, the mass ratio of the A component to the B component is 1:1.

Through the vinyl content in the vinyl polysiloxane rubber structure in the heat-conducting silicone rubber and the regulation and control of the components and the proportion of the heat-conducting filler filled in the heat-conducting silicone rubber, the heat conductivity of the heat-conducting insulating composite adhesive tape is improved, the insulativity of the heat-conducting insulating composite adhesive tape can be obviously improved, and an electric device can normally operate under higher working voltage. The vinyl polysiloxane rubber with specific vinyl content, the hydrogen-terminated phenyl polysiloxane heat-conducting filler and other components react and solidify under the action of a catalyst to form a space network structure, the heat-conducting filler is coated in the space network, the fillers are uniformly distributed, heat generated in the device during working is transferred, and better heat-conducting and heat-dissipating effects are achieved. Particularly, when specific heat-conducting fillers are adopted, the heat-conducting fillers can be uniformly dispersed in the space network and can be connected with each other, so that the microstructure of the heat-conducting silicone rubber layer is more compact, the transmission of particles influencing the dielectric property and the insulating property of the adhesive tape by water molecules and the like in the environment is avoided, and the excellent insulating strength is still kept in the environment with higher humidity.

The thickness of the heat-conducting silicone rubber layer is 0-100 μm, excluding 0 μm. For example, the thickness of the heat conductive silicone rubber layer is 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm, or 100 μm.

In the present invention, the material of the substrate layer is not particularly limited, and may be selected from, but not limited to, a heat conductive PI film, a non-heat conductive PI film, a PET film, a PC film, a PMMA film, a POE film, a PP film, a PS film, a PU film, a PE film, a PEN film, a TPU film, and the like. Preferably a thermally conductive PI film, such as DuPont's MT/MT + film thermally conductive polyimide film.

The thickness of the substrate layer is 12.5-100 mu m, and can be adjusted according to actual needs. For example, the substrate layer has a thickness of 12.5. mu.m, 15. mu.m, 20. mu.m, 25. mu.m, 28. mu.m, 30. mu.m, 33. mu.m, 35. mu.m, 37.5. mu.m, 38. mu.m, 40. mu.m, 45. mu.m, 48. mu.m, 50. mu.m, 55. mu.m, 60. mu.m, 65. mu.m, 70. mu.m, 75. mu.m, 80. mu.m, 85. mu.m, 90. mu.m, 95. mu.m, 100. mu.m, or the like.

The thickness of the pressure-sensitive adhesive layer is 0-50 μm, excluding 0 μm; for example, the pressure-sensitive adhesive layer has a thickness of 5 μm, 8 μm, 10 μm, 13 μm, 15 μm, 18 μm, 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, 33 μm, 35 μm, 37 μm, 40 μm, 42 μm, 45 μm, 47 μm, or 50 μm.

The pressure-sensitive adhesive is a pressure-sensitive adhesive, and is a viscoelastic body which has the viscous property of liquid and the elastic property of solid at the same time; the viscoelastic body has the influence factors and properties of bearing both the contact process and the damage process of bonding. The pressure-sensitive adhesive layer is organic silicon pressure-sensitive adhesive and/or acrylic pressure-sensitive adhesive.

Preferably, the pressure-sensitive adhesive layer is an acrylic pressure-sensitive adhesive, and the heat-conducting insulating adhesive tape is wrapped on the heating sheet, so that the pressure-sensitive adhesive layer needs to be ensured to continuously keep bonding to the substrate layer in a high-temperature environment.

The second purpose of the present invention is to provide a method for preparing a heat-conducting and insulating composite tape, comprising the following steps: and coating the heat-conducting silicone rubber on a base material, drying, coating the pressure-sensitive adhesive on the other side of the base material, drying and curing to obtain the heat-conducting insulating composite adhesive tape.

The heat-conducting insulating composite adhesive tape is prepared by a coating process, so that the thickness tolerance is controlled to be +/-2 m, the thickness is uniform and is far smaller than that of a calendering extrusion process (the tolerance is about +/-30 m), and the performance is improved more; the thickness of the pressure-sensitive adhesive layer is less than or equal to 25 micrometers; the thickness of the heat-conducting silicone rubber layer is less than or equal to 100 m.

The heat-conducting insulating composite adhesive tape in the application can be used for setting the heat-conducting silicone rubber liquid on one surface of the base material layer in modes of brushing, roll coating, blade coating and the like, and then coating the pressure-sensitive adhesive on the other surface of the base material layer, and the specific process can be as follows: uniformly mixing all the components of the component A to obtain a mixture A; uniformly mixing all the components of the component B to obtain a mixture B; uniformly mixing the mixture A and the mixture B to obtain heat-conducting silicone rubber liquid; and then unreeling the base material subjected to corona and dust sticking treatment to a glue application head of glue applying equipment, uniformly coating the glue solution on the base material, conveying the base material to a drying oven for drying, coating the pressure-sensitive adhesive on the other side of the base material, and drying and curing to obtain the adhesive.

The drying oven in the adhesive tape preparation process is at least 3 sections, and the temperature of the first section of drying oven is set within the range of 40-110 ℃; the temperature of the second section of oven is set within the range of 150-180 ℃; the temperature of the third section of the oven is set within the range of 140-90 ℃. The first section of drying oven mainly carries out drying operation of the diluting solvent, and the second section of drying oven and the third section of drying oven carry out curing molding of glue solution.

Wherein the thickness tolerance of the heat-conducting insulating adhesive tape is not higher than +/-3 microns, and preferably not higher than +/-2 microns.

The third purpose of the invention is to provide the application of the heat-conducting insulating composite adhesive tape, which is used for preparing electrical equipment;

the electrical equipment comprises a PTC air conditioner, a solar inverter, an IGBT power chip, a 5G base station and a 5G smart phone of the new energy automobile.

Compared with the prior art, the invention has the beneficial effects that:

the heat-conducting insulating composite adhesive tape disclosed by the invention has excellent heat-conducting property and excellent bonding strength, particularly has the heat-conducting coefficient of about 2 w/(m.k), the peel strength of more than 250G/inch and the breakdown voltage of 5500v/mil, and can meet the application requirements of electrical equipment such as PTC air conditioners, solar inverters, IGBT power chips, 5G base stations, 5G smart phones and the like of a plurality of new energy vehicles.

The heat-conducting insulating composite adhesive tape is prepared by a coating process, the thickness tolerance is controlled to be +/-2-4 mu m, the thickness is uniform and is far smaller than that of a calendering extrusion process (the tolerance is about +/-30 m), and the performance is improved; the thickness of the pressure-sensitive adhesive layer is less than or equal to 25 micrometers; the thickness of the heat-conducting silicone rubber layer is less than or equal to 100 m; the heat conductivity coefficient is 1-3W/mK, the insulating strength is more than 4kv/mil, good heat conductivity and insulativity can be still maintained under a high-temperature environment, the product stability is good, the high-temperature resistance is good, and the product is not deformed at the high temperature of 200 ℃.

Drawings

FIG. 1 is a schematic structural view of a thermally conductive and electrically insulating composite tape according to the present invention;

wherein, 1-a substrate layer; 2-heat conducting silicone rubber layer; and 3-a pressure-sensitive adhesive layer.

Detailed Description

The technical solution of the present invention is further described by the following specific embodiments with reference to fig. 1.

Unless otherwise specified, various starting materials of the present invention are commercially available or prepared according to conventional methods in the art.

As shown in fig. 1, the heat-conducting insulating composite tape of the present invention comprises a heat-conducting silicone rubber layer 2, a substrate layer 1 and a pressure-sensitive adhesive layer 3, which are sequentially arranged from top to bottom.

Example 1

The heat-conducting insulating composite adhesive tape comprises a base material layer 1, a pressure-sensitive adhesive layer 2 arranged on one surface of the base material layer 1, and a heat-conducting silicone rubber layer 3 on the other surface; the thickness of the base material layer is 37.5 μm, and the thickness of the heat-conducting silicone rubber layer is 50 μm. The material of the substrate layer is a heat-conducting polyimide film, and a DuPont MT/MT + film product is adopted; the material of the pressure-sensitive adhesive layer is acrylic pressure-sensitive adhesive, the thickness of the pressure-sensitive adhesive layer is 25 mu m, and the thickness tolerance of the heat-conducting insulating adhesive tape is +/-2 mu m.

The preparation raw materials of the heat-conducting silicone rubber layer comprise a component A and a component B, wherein the mass ratio of the component A to the component B is 1:1. The component A comprises 25 percent of vinyl polysiloxane, 70 percent of heat-conducting filler alumina, 100ppm of platinum catalyst and 100 percent of solvent toluene which is used for supplementing the balance to 100 percent; the component B comprises 25% of hydrogen-containing polysiloxane, 70% of heat-conducting filler alumina and solvent toluene to make up the balance to 100%. The vinyl polysiloxane has a vinyl content of 5 wt% and a viscosity of 2000 cps; the hydrogenpolysiloxane has a hydrogen content of 5 wt% and a viscosity of 1000 cps.

The specific preparation method of the heat-conducting insulating composite tape of the embodiment is as follows: uniformly mixing all the components of the component A to obtain a mixture A; uniformly mixing all the components of the component B to obtain a mixture B; uniformly mixing the mixture A and the mixture B to obtain a heat-conducting silicone rubber glue solution; and then unreeling the base material subjected to corona and dust sticking treatment to a coating head of a coating device, uniformly coating a heat-conducting silicon rubber glue solution on one side of the base material, drying in an oven, then coating a pressure-sensitive glue solution on the other side of the base material, and drying to obtain the heat-conducting silicon rubber glue solution, wherein the length of each section of the oven is 4 meters, the temperatures of the ovens of 1 st, 2 nd and 3 rd sections are respectively controlled at about 45 ℃, 80 ℃ and 100 ℃, the temperatures of the ovens of 5 th and 6 th sections are controlled at 165 ℃, and the temperature of the oven of 7 th section is controlled at 115 ℃.

Example 2

The heat-conducting insulating composite adhesive tape comprises a base material layer 1, a pressure-sensitive adhesive layer 2 arranged on one surface of the base material layer 1, and a heat-conducting silicone rubber layer 3 on the other surface; the thickness of the base material layer is 37.5 μm, and the thickness of the heat-conducting silicone rubber layer is 50 μm. The material of the substrate layer is a heat-conducting polyimide film, and a DuPont MT/MT + film product is adopted; the material of the pressure-sensitive adhesive layer is acrylic pressure-sensitive adhesive, the thickness of the pressure-sensitive adhesive layer is 25 mu m, and the thickness tolerance of the heat-conducting insulating adhesive tape is +/-2 m.

The preparation raw material of the heat-conducting silicone rubber layer comprises a component A and a component B, wherein the mass ratio of the component A to the component B is 1:1. According to the mass percentage, the component A comprises 25 percent of vinyl polysiloxane, 70 percent of heat-conducting filler aluminum hydroxide, 100ppm of platinum catalyst and 100 percent of solvent toluene for supplementing the balance; the component B comprises 25% of hydrogen-containing polysiloxane, 70% of heat-conducting filler aluminum hydroxide and solvent toluene to make up the balance to 100%. The vinyl polysiloxane has a vinyl content of 5 wt% and a viscosity of 2000 cps; the hydrogenpolysiloxane has a hydrogen content of 5 wt% and a viscosity of 1000 cps.

Example 3

The preparation raw material of the heat-conducting silicone rubber layer comprises a component A and a component B, wherein the mass ratio of the component A to the component B is 1: 0.7. According to the mass percentage, the component A comprises 25 percent of vinyl polysiloxane, 70 percent of heat-conducting filler aluminum hydroxide, 100ppm of platinum catalyst and 100 percent of solvent toluene for supplementing the balance; the component B comprises 25% of hydrogen-containing polysiloxane, 70% of heat-conducting filler alumina and solvent toluene to make up the balance to 100%. The vinyl polysiloxane has a vinyl content of 5 wt% and a viscosity of 2000 cps; the hydrogenpolysiloxane has a hydrogen content of 5 wt% and a viscosity of 1000 cps.

Example 4

The preparation raw material of the heat-conducting silicone rubber layer comprises a component A and a component B, wherein the mass ratio of the component A to the component B is 1:1. According to the mass percentage, the component A comprises 25 percent of vinyl polysiloxane, 70 percent of heat-conducting filler aluminum hydroxide, 100ppm of platinum catalyst and 100 percent of solvent toluene for supplementing the balance; the component B comprises 25% of hydrogen-containing polysiloxane, 70% of heat-conducting filler alumina and solvent toluene to make up the balance to 100%. The vinyl polysiloxane has a vinyl content of 6 wt% and a viscosity of 2000 cps; the hydrogenpolysiloxane has a hydrogen content of 6 wt% and a viscosity of 1000 cps.

Example 5

The difference between this example and example 1 is that the substrate layer is made of a PET film, which is manufactured by fei le kai science and technology industries, ltd, model PG22A, and has a thickness of 50 μm, and the others are the same as those of example 1.

Example 6

This example differs from example 1 in that the vinyl polysiloxane was used in an amount of 40%, the other being the same as in example 1.

Example 7

This example differs from example 1 in that the hydrogenpolysiloxane was used in an amount of 40%, and the rest was the same as example 1.

Example 8

This example is different from example 1 in that the vinyl group content of the vinyl polysiloxane was 2%, and the rest was the same as example 1.

Example 9

This example is different from example 1 in that the vinyl group content of the vinyl polysiloxane was 8%, and the rest was the same as example 1.

Example 10

This example is different from example 1 in that the hydrogen content of the hydrogenpolysiloxane was 2%, and the rest was the same as example 1.

Example 11

This example is different from example 1 in that the hydrogen content of the hydrogenpolysiloxane was 8%, and the rest was the same as example 1.

Comparative example 1

The PI heat-conducting and insulating composite material of the comparative example is a material with ZnO added in conventional matrix resin PI, and specifically comprises the following components: the polyimide PI is 95%, the zinc oxide ZnO is 5%, and the preparation method comprises the following steps:

dispersing and surface treating zinc oxide (ZnO), weighing zinc oxide (ZnO) powder with the diameter of 80nm and the preset mass, adding the zinc oxide (ZnO) powder into alcohol with the volume 10 times that of the zinc oxide (ZnO) powder, then placing suspension of the zinc oxide (ZnO) powder and the alcohol into an ultrasonic vibration instrument for dispersing for 60min, adding a silane coupling agent KH550 accounting for 5% of the mass of the zinc oxide (ZnO) into the suspension in the ultrasonic vibration process, then placing the suspension added with the coupling agent into an oven for drying for 36h at the drying temperature of 80 ℃, and drying the alcohol to obtain a zinc oxide (ZnO) raw material after dispersion and surface treatment; pretreating polyimide PI molding powder, weighing polyimide PI molding powder with the powder diameter of 10 mu m and the preset mass, and then placing the polyimide PI molding powder in an oven for drying for 24 hours at the drying temperature of 70 ℃ to obtain a pretreated polyimide PI raw material;

weighing the obtained pretreated polyimide PI raw material and the dispersed and surface-treated zinc oxide ZnO raw material, placing the raw materials in a beaker to form a mixture, enabling the content of zinc oxide to be 10% of the total mass of the mixture, adding alcohol with the volume 4 times that of the mixture into the beaker to form a suspension, quickly stirring for 60min by using a stirrer to obtain a uniformly dispersed suspension, and then placing the suspension into a drying oven to dry at the drying temperature of 100 ℃ for 48 h;

placing the dried uniformly dispersed suspension into a grinding tool for cold press molding, wherein the molding pressure is 12MPa, the duration is 15s, and repeatedly cold pressing for 3 times to obtain a sample after cold press molding;

and (3) placing the sample subjected to cold press molding in a molding press for high-temperature molding, wherein the molding pressure is 12MPa, the molding temperature is sectional heating and heat preservation, and the specific process comprises the steps of heating to 260 ℃ from room temperature for 30min, preserving heat for 30min, then heating to 340 ℃ for 30min, preserving heat for 30min, and then naturally cooling along with a furnace body to obtain the PI heat-conducting and insulating composite material.

The thermally conductive and insulating adhesive tapes prepared in examples 1 to 11 and comparative example 1 were subjected to performance tests, and the test results are shown in table 1.

Wherein, the thickness tolerance test is carried out according to the standard of GB/T7125-2014 test method for the thickness of the adhesive tape, and the thickness deviation is tested after the thickness of 10 prepared samples in different batches is tested; the thermal conductivity was measured according to the standard of ASTM D5470; the insulation strength was measured according to ASTM D149, and the thermogravimetric analysis was carried out using a thermogravimetric analyzer TGA-601.

TABLE 1

As can be seen from Table 1, the heat-conducting insulating composite adhesive tape is prepared by a coating process, the thickness tolerance is controlled to be +/-2-4 mu m, the thickness is uniform and is far smaller than the thickness tolerance of a calendering extrusion process (the tolerance of the calendering extrusion process is about +/-30 m), and the performance is improved more; the thickness of the pressure-sensitive adhesive layer is less than or equal to 25 micrometers; the thickness of the heat-conducting silicone rubber layer is less than or equal to 100 m; the heat conductivity coefficient is 1-3W/mK, the insulating strength is more than 4kv/mil, good heat conductivity and insulativity can be still maintained under a high-temperature environment, the product stability is good, the high-temperature resistance is good, and the product is not deformed at the high temperature of 200 ℃.

Example 6 the use of vinyl polysiloxane in too much amount results in a lower thermal conductivity and a higher weight loss.

Example 7 the hydrogen-containing polysiloxane was used in an excessive amount to accelerate the reaction and to harden the surface.

Example 8 vinyl polysiloxane has too much vinyl content, the thermal conductivity becomes smaller, and the thermal weight loss becomes larger.

Example 9 vinyl polysiloxane has too low a vinyl group content to be easily molded.

Example 10 the hydrogen content of the hydrogenpolysiloxane was too low, the reaction was incomplete, and the weight loss on heating was large.

Example 11 the hydrogen-containing polysiloxane has a high hydrogen content, a high reaction rate, and a high surface hardness, and is not suitable for use.

The comparison between example 1 and comparative example 1 shows that the material with ZnO added to the conventional matrix resin PI has a significantly lower thermal conductivity and a greater weight loss due to heat.

The present invention is illustrated by the above-mentioned examples, but the present invention is not limited to the above-mentioned detailed process equipment and process flow, i.e. it is not meant to imply that the present invention must rely on the above-mentioned detailed process equipment and process flow to be practiced. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.

The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.

It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.

In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.

Claims

1. The utility model provides a heat conduction insulating composite adhesive tape which characterized in that includes from last heat conduction type silastic-layer, substrate layer and the pressure sensitive adhesive layer that sets gradually extremely down.

2. The heat-conducting insulating composite adhesive tape according to claim 1, wherein the raw material for preparing the heat-conducting silicone rubber layer comprises a component A and a component B;

3. The thermally conductive and insulating composite tape according to claim 2, wherein the vinyl polysiloxane has a vinyl content of 4 to 6 wt%.

4. The heat-conducting insulating composite tape according to claim 2, wherein the hydrogen-containing polysiloxane has a hydrogen content of 4-6 wt% and a viscosity of 800-1200 cps.

5. The heat-conducting insulating composite tape according to claim 2, wherein the component A and the component B further comprise a heat-conducting filler independently selected from any one of alumina, aluminum hydroxide, boron nitride and graphene or a mixture of at least two of the alumina, the aluminum hydroxide, the boron nitride and the graphene.

6. The thermally conductive and insulating composite tape according to claim 1 or 2, wherein the thickness of the thermally conductive silicone rubber layer is 0 to 100 μm excluding 0 μm.

7. The heat-conducting insulating composite tape according to claim 1 or 2, wherein the thickness of the substrate layer is 12.5 to 100 μm.

8. The thermally conductive and insulating composite tape according to claim 1 or 2, wherein the pressure sensitive adhesive layer has a thickness of 0 to 50 μm excluding 0 μm;

the pressure-sensitive adhesive layer is organic silicon pressure-sensitive adhesive and/or acrylic pressure-sensitive adhesive.

9. A method for preparing a heat conductive and insulating composite tape according to any one of claims 1 to 8, comprising the steps of: and coating the heat-conducting silicone rubber on a base material, drying, coating the pressure-sensitive adhesive on the other side of the base material, drying and curing to obtain the heat-conducting insulating composite adhesive tape.

10. Use of the heat conductive and insulating composite tape according to any one of claims 1 to 8, wherein the heat conductive and insulating composite tape is used for the preparation of electrical equipment;