CN111447733A - Deep ultraviolet resistant flexible PCB substrate and preparation method thereof - Google Patents
Deep ultraviolet resistant flexible PCB substrate and preparation method thereof Download PDFInfo
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- CN111447733A CN111447733A CN202010169024.5A CN202010169024A CN111447733A CN 111447733 A CN111447733 A CN 111447733A CN 202010169024 A CN202010169024 A CN 202010169024A CN 111447733 A CN111447733 A CN 111447733A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
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- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/32—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond
- D06M11/36—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond with oxides, hydroxides or mixed oxides; with salts derived from anions with an amphoteric element-oxygen bond
- D06M11/44—Oxides or hydroxides of elements of Groups 2 or 12 of the Periodic System; Zincates; Cadmates
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/32—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond
- D06M11/36—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond with oxides, hydroxides or mixed oxides; with salts derived from anions with an amphoteric element-oxygen bond
- D06M11/45—Oxides or hydroxides of elements of Groups 3 or 13 of the Periodic System; Aluminates
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/51—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with sulfur, selenium, tellurium, polonium or compounds thereof
- D06M11/55—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with sulfur, selenium, tellurium, polonium or compounds thereof with sulfur trioxide; with sulfuric acid or thiosulfuric acid or their salts
- D06M11/56—Sulfates or thiosulfates other than of elements of Groups 3 or 13 of the Periodic System
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/58—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with nitrogen or compounds thereof, e.g. with nitrides
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/77—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with silicon or compounds thereof
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/80—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with boron or compounds thereof, e.g. borides
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/21—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/244—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of halogenated hydrocarbons
- D06M15/256—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of halogenated hydrocarbons containing fluorine
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M2200/00—Functionality of the treatment composition and/or properties imparted to the textile material
- D06M2200/25—Resistance to light or sun, i.e. protection of the textile itself as well as UV shielding materials or treatment compositions therefor; Anti-yellowing treatments
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
Abstract
The invention discloses a deep ultraviolet resistant flexible PCB substrate and a preparation method thereof, wherein the substrate comprises a fiber cloth layer and a UVC resistant bonding layer, the UVC resistant bonding layer is formed by covering the fiber cloth layer on one side or two sides of a UVC resistant dispersion liquid and then curing, the UVC resistant dispersion liquid comprises a binder, a UV reflecting agent, a UV absorbent and a heat conducting agent, the preparation method comprises the steps of preparing the UVC resistant dispersion liquid, covering the fiber cloth layer on one side or two sides of the UVC resistant dispersion liquid, and curing and forming, the service life of the deep ultraviolet resistant flexible PCB substrate under the irradiation of UVC-L ED is greatly prolonged due to the addition of the UV reflecting agent and the UV absorbent, the heat radiation effect of the deep ultraviolet resistant flexible PCB substrate is improved due to the addition of the heat conducting agent, and the bending angle of the UVC resistant bonding layer can reach 140 degrees and 180 degrees due to the fact that the UVC resistant dispersion liquid covers the fiber cloth layer on one side or two.
Description
Technical Field
The invention relates to the technical field of high molecular compound compositions, in particular to a deep ultraviolet resistant flexible PCB substrate and a method for preparing the substrate.
Background
Semiconductor light emitting diodes (L ED) have been widely used in various illumination fields such as decorative illumination, automotive illumination, backlight, etc. owing to their advantages such as long service life, energy saving, and small size, and L ED is known as the most valuable new light source in the 21 st century.
Ultraviolet rays are classified into UVA, UVB, UVC and UVD.UVC, wherein the wavelength of the UVC is 200-280 nm, which is called deep ultraviolet and is also called short wave sterilization ultraviolet rays, in terms of sterilization speed, UVC is in the range of microbial absorption peaks and can kill viruses and bacteria by destroying DNA structures of the microorganisms within 1s, and ultraviolet L ED sterilization is that the deep ultraviolet band is selected, such as 260-280 nm, which is most easily absorbed by nucleic acid (substances influencing propagation and survival of the bacteria and the viruses), and the ultraviolet rays can destroy chemical bonds in nucleic acid molecules, cause decomposition and denaturation of nucleoprotein or nucleic acid, cause synthesis barriers of proteins and enzymes in the bacteria, and further achieve the aim of sterilization.
The deep ultraviolet UVC-L ED develops a new application scene in the deep ultraviolet sterilization and disinfection market by virtue of the advantages of small volume, high starting speed, low power consumption and the like, forms a trend substitution for a UV mercury lamp, can be used for air-conditioning and air-cleaning of air sterilization, and shows huge application value and potential in the scenes of water tank bacteriostasis, direct drinking water, humidifiers of water sterilization, intelligent closestool of surface sterilization, toothbrush disinfection and the like.
For visible light L ED are typically metal-based printed circuit boards (MCPCB), however, these are not suitable for UVC-L ED applications because UVC degrades organic substances such as epoxy, silicone, polyester, etc., significantly reducing the life of PCB boards in UV applications.
At the same time, UVC-L ED has a particularly low External Quantum Efficiency (EQE), converting only about 5% of the power input to light, the remaining 95% to heat, the heat must be removed quickly to keep the L ED chip below its maximum operating temperature, if the L ED chip is not cooled in time, its life will eventually be shortened, or even unusable, because UVC-L ED is too small, the effective heat dissipation path is through the L ED back side, the heat is conducted away from the L ED chip, through the module PCB, to the heat sink, and then out to the atmosphere, therefore a PCB mounting L ED must have high thermal conductivity.
The deep ultraviolet UVC-L ED commonly used in the market is a ceramic/quartz substrate, and although the requirement of UVC resistance can be met, the use of glass and ceramic rigid substrates limits the practical application of UVC-L ED.
Therefore, how to provide a flexible UVC-L ED substrate, and simultaneously meet the UVC resistance and flexibility, thereby realizing the flexible connection of UVC-L ED and improving the designability of application occasions is a problem to be solved urgently in the field of UVC-L ED lamps.
Disclosure of Invention
The present invention is directed to the above-mentioned problems, and provides a deep ultraviolet resistant flexible PCB substrate, which solves one or more of the problems of the prior art, and provides at least one of the advantages.
In order to solve the technical problems, the invention provides the following technical scheme on one hand:
the deep ultraviolet resistant flexible PCB base material comprises a fiber cloth layer and a UVC resistant bonding layer, wherein the UVC resistant bonding layer is formed by one-sided or double-sided covering of the fiber cloth layer with UVC resistant dispersion liquid, the UVC resistant dispersion liquid comprises a binder, a UV reflecting agent, a UV absorbent and a heat conducting agent, the binder is prepared from a fluorine-containing organic compound through homopolymerization, copolymerization or blending, and the UV reflecting agent is barium sulfate.
Further, the UV absorbent is one or a combination of more than two of cerium oxide, titanium oxide and zinc oxide.
Further, the fluorine-containing organic compound is selected from polytetrafluoroethylene, polyperfluoroethylene propylene, meltable polytetrafluoroethylene, polychlorotrifluoroethylene, and polydifluorodichloroethylene.
Further, the heat conducting agent is one or a combination of more than two of aluminum oxide, aluminum nitride, silicon carbide and boron nitride.
Further, the fiber cloth layer is one of glass fiber, quartz fiber, high silica fiber, alumina fiber, silicon carbide fiber, aluminum nitride fiber and boron nitride fiber.
Specifically, the weight ratio of each raw material is as follows:
the UV reflecting agent, the UV absorbing agent and the heat conducting agent are powder, and the particle size is not more than 2 microns.
On the other hand, the invention also provides a method for preparing the deep ultraviolet resistant flexible PCB substrate, which specifically comprises the following steps:
s1, preparing a binding agent into a suspension, sequentially adding a UV reflecting agent, a UV absorbing agent and a heat conducting agent, and dispersing and stirring at a high speed of 500 plus 10000rpm for 1-12h to obtain a UVC-resistant dispersion liquid;
s2, coating one side or impregnating two sides of the UVC-resistant dispersion liquid into a fiber cloth layer;
and S3, carrying out gradient heating on the fiber cloth layer with the UVC-resistant dispersion liquid to solidify the UVC-resistant dispersion liquid into a UVC-resistant combined layer.
Wherein the gradient heating in the step S3 is three-stage heating, and drying is respectively carried out at 80-120 ℃, and the heating rate is less than or equal to 50 ℃/h; baking at the temperature of 300 ℃ at the temperature of 120 ℃ and at the heating rate of less than or equal to 30 ℃/h; the heating rate is less than or equal to 10 ℃/h above 300 ℃, and the sintering is carried out for 1min to 240min at the temperature of 360 ℃ and 420 ℃. And (3) melting the binder in the UVC-resistant dispersion liquid through three-stage heating, smoothly bonding the UV reflecting agent, the UV absorbing agent and the heat conducting agent powder, and curing the UV reflecting agent, the UV absorbing agent and the heat conducting agent powder with a fiber cloth layer to form a bonding sheet with good bonding force, so that the deep ultraviolet-resistant flexible PCB substrate is obtained.
Compared with the prior art, the ultraviolet-resistant flexible PCB substrate has the advantages that due to the addition of the UV reflecting agent and the UV absorbent, the service life of the ultraviolet-resistant flexible PCB substrate is greatly prolonged compared with that of a conventional PCB under the irradiation of UVC-L ED, meanwhile, due to the addition of the heat conducting agent, the heat conductivity coefficient of the ultraviolet-resistant flexible PCB substrate is improved by more than 2 times compared with that of a conventional FR-4 epoxy glass cloth laminated board, the heat dissipation effect is improved, the service life of UVC-L ED lamp beads is obviously prolonged, and due to the fact that the UVC-resistant bonding layer is formed by curing after a fiber cloth layer is covered on one side or two sides of UVC-resistant dispersion liquid, the bending angle of the UVC-resistant bonding layer can reach 140-180 degrees, the requirements of various flexible circuit designs can be met, and the application scenes of UV.
Detailed Description
The technical solution of the present invention is further specifically described below by way of specific examples, but the present invention is not limited to these examples.
Example 1
A preparation method of a deep ultraviolet resistant flexible PCB substrate comprises the following steps:
mixing 100 parts by weight of 60 wt% polytetrafluoroethylene resin emulsion with 20 parts by weight of water, dispersing and stirring at a high speed of 10000rpm for 500 times, preparing uniform suspension, then sequentially adding 20 parts by weight of UV reflecting agent nano barium sulfate (median diameter d50 is 80nm), 20 parts by weight of UV absorbing agent nano cerium oxide (median diameter d50 is 50nm) and 30 parts by weight of heat conducting agent submicron aluminum oxide (median diameter d50 is 400nm), and continuing to disperse at a high speed for 1-12h to obtain a UVC-resistant dispersion liquid; soaking a fiber cloth layer made of high silica fibers in a UVC-resistant dispersion liquid to obtain fiber cloth layer impregnated cloth coated with polytetrafluoroethylene resin, a UV reflecting agent, a UV absorbing agent and a heat conducting agent; then putting the obtained impregnated cloth into a sintering furnace, and respectively drying at 80-120 ℃ with the heating rate of 40 ℃/h; baking at the temperature of 120 ℃ and 300 ℃ at the heating rate of 20 ℃/h; the temperature rise rate is 5 ℃/h above 300 ℃, and the sintering is carried out for 120min at the temperature of 360 ℃ and 420 ℃. And melting the polytetrafluoroethylene resin particles under the heating action, and bonding the barium sulfate, the cerium oxide and the aluminum oxide powder to obtain the deep ultraviolet resistant flexible PCB substrate.
Example 2
The method comprises the steps of selecting quartz fibers as a fiber cloth layer, selecting polychlorotrifluoroethylene as a binder, selecting barium sulfate as a UV reflecting agent (with a median diameter d50 being 50nm), selecting titanium oxide as a UV absorbing agent, selecting silicon carbide as a heat conducting agent, and carrying out the deep ultraviolet resistant flexible PCB substrate according to the steps of example 1 according to the mass ratio of 50:25:25:20 by using the UVC resistant dispersion liquid.
Example 3
The method comprises the steps of selecting alkali-free glass fiber (composite material company in Chongqing China), selecting meltable polytetrafluoroethylene as a fiber cloth layer, barium sulfate as a UV reflecting agent (median diameter d50 is 30nm), zinc oxide as a UV absorbing agent, and aluminum nitride as a heat conducting agent, and carrying out the deep ultraviolet resistant flexible PCB substrate according to the steps of example 1 by using the UVC dispersion liquid according to the mass ratio of 50:20:20: 30.
Example 4
Selecting an alumina fiber (3M company, brand Nextel 610) as a fiber cloth layer, selecting polyfluorinated ethylene propylene as a binder, selecting barium sulfate as a UV reflecting agent (with the median diameter d50 being 30nm), selecting zinc oxide as a UV absorbent, selecting silicon nitride as a heat conducting agent, and carrying out deep ultraviolet resistant flexible PCB substrate material according to the steps of example 1 by using UVC dispersion liquid according to the mass ratio of 50:30:20:20
Example 5
Selecting silicon carbide fiber (Nicalon, Japan carbon Co., Ltd.), polytetrafluoroethylene as a binder, barium sulfate as a UV reflecting agent (median diameter d50 is 100nm), cerium oxide as a UV absorbing agent, and boron nitride as a heat conducting agent, and carrying out deep ultraviolet resistant flexible PCB substrate material treatment according to the steps of example 1 by using UVC dispersion liquid according to the mass ratio of 50:30:20:20
Example 6
The deep ultraviolet resistant flexible PCB base materials prepared in the embodiments 1 to 5 and a commercially available FR-4 epoxy glass cloth laminated board are respectively subjected to UVC irradiation comparison, thermal conductivity comparison and flexibility test comparison, wherein the UVC irradiation comparison refers to the time length of unusable time such as cracking, softening and the like of the base material under the continuous irradiation of 265nm UVC-L ED, the thermal conductivity is measured by a heat flow method, and the bending angle refers to the time length of bending the board until cracks or white marks appear.
| Sample numbering | Thermal conductivity (W/m.K) | 265nm UVC radiation Life (sky) | Bending angle |
| Example 1 | 0.81 | ＞90 | 170° |
| Example 2 | 0.77 | ＞90 | 180° |
| Example 3 | 0.79 | ＞90 | 142° |
| Example 4 | 0.82 | ＞90 | 167° |
| Example 5 | 0.80 | ＞90 | 172° |
| Comparative example | 0.39 | 3 | 30° |
The preferred embodiments of the present invention have been described in detail, but the present invention is not limited to the details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, which fall within the protective scope of the present invention.
Claims (9)
1. The deep ultraviolet resistant flexible PCB substrate is characterized by comprising a fiber cloth layer and a UVC resistant bonding layer, wherein the UVC resistant bonding layer is formed by one-side or double-side covering of the fiber cloth layer by a UVC resistant dispersion liquid and then curing, the UVC resistant dispersion liquid comprises a binder, a UV reflecting agent, a UV absorbent and a heat conducting agent, the binder is prepared from a fluorine-containing organic compound through homopolymerization, copolymerization or blending, and the UV reflecting agent is barium sulfate.
2. The deep ultraviolet resistant flexible PCB substrate of claim 1, wherein the UV absorber is selected from one or a combination of two or more of cerium oxide, titanium oxide, and zinc oxide.
3. The deep ultraviolet resistant flexible PCB substrate of claim 1, wherein the fluorine-containing organic compound is selected from the group consisting of polytetrafluoroethylene, polyperfluoroethylene propylene, meltable polytetrafluoroethylene, polychlorotrifluoroethylene, and polydifluorodichloroethylene.
4. The deep ultraviolet resistant flexible PCB substrate of claim 1, wherein the thermal conductor is one or a combination of two or more of aluminum oxide, aluminum nitride, silicon carbide, and boron nitride.
5. The deep ultraviolet resistant flexible PCB substrate of claim 1, wherein the fiber cloth layer is one of glass fiber, quartz fiber, high silica fiber, alumina fiber, silicon carbide fiber, aluminum nitride fiber, boron nitride fiber.
6. The deep ultraviolet resistant flexible PCB substrate of any one of claims 1 to 5, wherein the weight ratio of each raw material is as follows:
7. the deep ultraviolet resistant flexible PCB substrate of claim 6, wherein the UV reflector, UV absorber and thermal conductor are powders with a particle size of not more than 2 microns.
8. The method for preparing a deep ultraviolet resistant flexible PCB substrate of any one of claims 1 to 7, comprising the steps of:
s1, preparing a binding agent into a suspension, sequentially adding a UV reflecting agent, a UV absorbing agent and a heat conducting agent, and dispersing and stirring at a high speed of 500 plus 10000rpm for 1-12h to obtain a UVC-resistant dispersion liquid;
s2, coating one side or impregnating two sides of the UVC-resistant dispersion liquid into a fiber cloth layer;
and S3, carrying out gradient heating on the fiber cloth layer with the UVC-resistant dispersion liquid to solidify the UVC-resistant dispersion liquid into a UVC-resistant combined layer.
9. The method for preparing the deep ultraviolet resistant flexible PCB substrate of claim 8, wherein the gradient heating of step S3 is a three-stage heating, which is drying at 80-120 ℃ respectively, and the heating rate is less than or equal to 50 ℃/h; baking at the temperature of 300 ℃ at the temperature of 120 ℃ and at the heating rate of less than or equal to 30 ℃/h; the heating rate is less than or equal to 10 ℃/h above 300 ℃, and the sintering is carried out for 1min to 240min at the temperature of 360 ℃ and 420 ℃.
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| CN202010169024.5A CN111447733B (en) | 2020-03-12 | 2020-03-12 | Deep ultraviolet-resistant flexible PCB (printed circuit board) base material and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108951195A (en) * | 2018-06-27 | 2018-12-07 | 河南职业技术学院 | A kind of tents of waterproof antiultraviolet |
| CN109487548A (en) * | 2018-11-20 | 2019-03-19 | 合肥巧织纺织科技有限公司 | A kind of immersion deposition prepares super-hydrophobic-antibacterial-ultraviolet protection polyester fiber cloth method |
| CN110698994A (en) * | 2019-09-12 | 2020-01-17 | 广州视源电子科技股份有限公司 | Heat-conducting insulating adhesive tape and preparation method thereof |
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2020
- 2020-03-12 CN CN202010169024.5A patent/CN111447733B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108951195A (en) * | 2018-06-27 | 2018-12-07 | 河南职业技术学院 | A kind of tents of waterproof antiultraviolet |
| CN109487548A (en) * | 2018-11-20 | 2019-03-19 | 合肥巧织纺织科技有限公司 | A kind of immersion deposition prepares super-hydrophobic-antibacterial-ultraviolet protection polyester fiber cloth method |
| CN110698994A (en) * | 2019-09-12 | 2020-01-17 | 广州视源电子科技股份有限公司 | Heat-conducting insulating adhesive tape and preparation method thereof |
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