CN111447733B - Deep ultraviolet-resistant flexible PCB (printed circuit board) base material and preparation method thereof - Google Patents

Deep ultraviolet-resistant flexible PCB (printed circuit board) base material and preparation method thereof Download PDF

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CN111447733B
CN111447733B CN202010169024.5A CN202010169024A CN111447733B CN 111447733 B CN111447733 B CN 111447733B CN 202010169024 A CN202010169024 A CN 202010169024A CN 111447733 B CN111447733 B CN 111447733B
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uvc
resistant
deep ultraviolet
flexible pcb
agent
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CN111447733A (en
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张力
叶鑫
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Foshan University
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Foshan University
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/32—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond
    • D06M11/36—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond with oxides, hydroxides or mixed oxides; with salts derived from anions with an amphoteric element-oxygen bond
    • D06M11/44—Oxides or hydroxides of elements of Groups 2 or 12 of the Periodic System; Zincates; Cadmates
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/32—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond
    • D06M11/36—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompounds; Salts derived from anions with an amphoteric element-oxygen bond with oxides, hydroxides or mixed oxides; with salts derived from anions with an amphoteric element-oxygen bond
    • D06M11/45—Oxides or hydroxides of elements of Groups 3 or 13 of the Periodic System; Aluminates
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/51—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with sulfur, selenium, tellurium, polonium or compounds thereof
    • D06M11/55—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with sulfur, selenium, tellurium, polonium or compounds thereof with sulfur trioxide; with sulfuric acid or thiosulfuric acid or their salts
    • D06M11/56—Sulfates or thiosulfates other than of elements of Groups 3 or 13 of the Periodic System
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/58—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with nitrogen or compounds thereof, e.g. with nitrides
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/77—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with silicon or compounds thereof
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/80—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with boron or compounds thereof, e.g. borides
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
    • D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
    • D06M15/21—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • D06M15/244—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of halogenated hydrocarbons
    • D06M15/256—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of halogenated hydrocarbons containing fluorine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M2200/00—Functionality of the treatment composition and/or properties imparted to the textile material
    • D06M2200/25—Resistance to light or sun, i.e. protection of the textile itself as well as UV shielding materials or treatment compositions therefor; Anti-yellowing treatments
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)

Abstract

The invention discloses a deep ultraviolet resistant flexible PCB substrate and a preparation method thereof. The base material comprises a fiber cloth layer and a UVC-resistant bonding layer, wherein the UVC-resistant bonding layer is formed by covering one side or two sides of a UVC-resistant dispersion liquid with the fiber cloth layer in a curing mode, and the UVC-resistant dispersion liquid comprises an adhesive, a UV reflecting agent, a UV absorbing agent and a heat conducting agent. The preparation method comprises preparing UVC-resistant dispersion; the UVC-resistant dispersion liquid is covered on one side or two sides of the fiber cloth layer; and (5) solidifying and forming. Due to the addition of the UV reflecting agent and the UV absorbing agent, the service life of the deep ultraviolet resistant flexible PCB substrate under the irradiation of the UVC-LED is greatly prolonged. Due to the addition of the heat conducting agent, the heat dissipation effect of the deep ultraviolet resistant flexible PCB substrate is improved. And the UVC-resistant bonding layer is formed by covering the fiber cloth layer on one side or two sides of the UVC-resistant dispersion liquid and then solidifying, so that the bending angle of the UVC-resistant bonding layer can reach 140-180 degrees.

Description

Deep ultraviolet-resistant flexible PCB (printed circuit board) base material and preparation method thereof
Technical Field
The invention relates to the technical field of compositions of high molecular compounds, in particular to a deep ultraviolet resistant flexible PCB substrate and a method for preparing the substrate.
Background
Semiconductor light emitting diodes (LEDs for short) have been recognized as the most valuable new light source in the 21 st century in various lighting fields such as decorative lighting, automotive lighting, backlights, etc., due to a series of advantages such as long service life, energy saving, small size, etc.
Ultraviolet light is classified into UVA, UVB, UVC and UVD. The UVC wavelength ranges from 200 to 280nm, and is called deep ultraviolet, also called short wave sterilization ultraviolet. In terms of sterilization rate, UVC is within the peak of microbial absorption, and can kill viruses and bacteria within 1s by disrupting the DNA structure of the microorganism. Ultraviolet LED disinfection is to select deep ultraviolet wave band such as 260-280 nm, which is most easily absorbed by nucleic acid (substances affecting bacteria and virus propagation and remains), ultraviolet rays can destroy chemical bonds in nucleic acid molecules, cause decomposition and denaturation of nucleoprotein or nucleic acid, cause synthesis disorder of protein and enzyme in bacteria, and achieve the aim of sterilization.
The deep ultraviolet UVC-LED opens up a new application scene in the deep ultraviolet sterilization market by virtue of the advantages of small volume, high starting speed, low power consumption and the like, forms a trend substitution for a UV mercury lamp, and can be used for air conditioning and air cleaning of air sterilization; a water tank for sterilizing water, a direct drinking water and a humidifier; the surface sterilization intelligent closestool, toothbrush sterilization and other scenes show great application value and potential.
The LED is typically a metal-based printed circuit board (MCPCB) for visible light. However, these are not suitable for UVC-LED applications. Because UVC degrades organic substances such as epoxy, silicone, polyester, etc., the lifetime of PCB boards in UV applications is significantly reduced.
Meanwhile, UVC-LEDs have a particularly low External Quantum Efficiency (EQE), converting only about 5% of the power input into light, and the remaining 95% of the power is converted into heat. The heat must be removed quickly to keep the LED chip below its maximum operating temperature. If the LED chip is not cooled in time, its lifetime will eventually be shortened, even unusable. Since UVC-LEDs are too small, an efficient heat dissipation path is through the back of the LED. Heat is conducted from the LED chip, through the module PCB, to the heat sink, and then released to the atmosphere. Therefore, the PCB on which the LEDs are mounted needs to have high heat conductive properties.
The use of glass and ceramic rigid substrates, while meeting the UVC resistance requirements, has limited practical application to the use of ceramic/quartz substrates for deep ultraviolet UVC-LEDs commonly used in the current market. Such as three-dimensional or ribbon UVC, the design is constrained by a rigid substrate.
Therefore, how to provide a flexible UVC-LED substrate, which meets the UVC resistance and flexibility at the same time, so as to realize the flexible connection of the UVC-LED, improve the designability of application occasions, and solve the problem in the field of UVC-LED lamps.
Disclosure of Invention
The present invention addresses the above-mentioned problems by providing a deep ultraviolet resistant flexible PCB substrate that solves one or more of the technical problems of the prior art, and at least provides a beneficial choice or creation.
In order to solve the technical problems, the invention provides the following technical scheme:
the utility model provides a deep ultraviolet resistant flexible PCB substrate, includes fibrous cloth layer and resistant UVC bond line, resistant UVC bond line is by resistant UVC dispersion one side or the double-sided post curing shaping of covering fibrous cloth layer, resistant UVC dispersion includes binder, UV reflector, UV absorbent, heat conduction agent, the binder is prepared through homo-polymerization, copolymerization or blending by fluorine-containing organic compound, the UV reflector is barium sulfate.
Further, the UV absorber is selected from one or a combination of more than two of cerium oxide, titanium oxide and zinc oxide.
Further, the fluorine-containing organic compound is selected from polytetrafluoroethylene, polytetrafluoroethylene propylene, fusible polytetrafluoroethylene, polytrifluoroethylene, and polydifluoroethylene dichloride.
Further, the heat conductive agent is one or a combination of more than two of aluminum oxide, aluminum nitride, silicon carbide and boron nitride.
Further, the fiber cloth layer is one of glass fiber, quartz fiber, high silica fiber, alumina fiber, silicon carbide fiber, aluminum nitride fiber and boron nitride fiber.
Specifically, the weight ratio of each raw material is as follows:
Figure BDA0002408488160000031
wherein the UV reflecting agent, the UV absorbing agent and the heat conducting agent are powder, and the particle size is not more than 2 microns.
On the other hand, the invention also provides a method for preparing the deep ultraviolet resistant flexible PCB substrate, which specifically comprises the following steps:
s1, preparing a binder into a suspension, sequentially adding a UV (ultraviolet) reflecting agent, a UV absorbing agent and a heat conducting agent, and dispersing and stirring at a high speed of 500-10000rpm for 1-12 hours to obtain a UVC-resistant dispersion;
s2, coating one side of the UVC-resistant dispersion liquid or impregnating two sides of the fiber cloth layer with the UVC-resistant dispersion liquid;
s3, carrying out gradient heating on the fiber cloth layer with the UVC-resistant dispersion liquid to enable the UVC-resistant dispersion liquid to be solidified into a UVC-resistant bonding layer.
Wherein, the gradient heating in the step S3 is three-section heating, namely drying at 80-120 ℃ and heating rate less than or equal to 50 ℃/h; baking at 120-300 ℃ with a heating rate less than or equal to 30 ℃/h; the temperature rising rate is less than or equal to 10 ℃/h above 300 ℃ and sintering is carried out for 1min to 240min at 360 ℃ to 420 ℃. And heating in three sections to melt the binder in the UVC-resistant dispersion liquid, smoothly bonding the UV reflecting agent, the UV absorbing agent and the heat conducting agent powder, and curing with the fiber cloth layer to form a bonding sheet with good bonding force, thus obtaining the deep ultraviolet-resistant flexible PCB substrate.
Compared with the prior art, the invention has the advantages that: due to the addition of the UV reflecting agent and the UV absorbing agent, the service life of the deep ultraviolet resistant flexible PCB substrate is greatly prolonged compared with that of a conventional PCB under the irradiation of UVC-LEDs. Meanwhile, due to the addition of the heat conducting agent, the heat conductivity coefficient of the deep ultraviolet resistant flexible PCB substrate is improved by more than 2 times compared with that of a conventional FR-4 epoxy glass cloth laminated board, the heat dissipation effect is improved, and the service life of the UVC-LED lamp beads is prolonged obviously. And the UVC-resistant bonding layer is formed by covering the fiber cloth layer on one side or both sides of the UVC-resistant dispersion liquid and then solidifying, so that the bending angle of the UVC-resistant bonding layer can reach 140-180 degrees, the requirements of various flexible circuit designs can be met, and the application scene of the UVC-LED is widened.
Detailed Description
The technical scheme of the present invention will be further specifically described by means of specific examples, but the present invention is not limited to these examples.
Example 1
A preparation method of a deep ultraviolet resistant flexible PCB substrate comprises the following steps:
mixing 100 parts of 60wt% polytetrafluoroethylene resin emulsion with 20 parts of water, dispersing and stirring at a high speed of 500-10000rpm to prepare a uniform suspension, and sequentially adding 20 parts of UV (ultraviolet) reflecting agent nano barium sulfate (median diameter d50=80 nm) powder, 20 parts of UV absorbing agent nano cerium oxide (median diameter d50=50 nm) powder and 30 parts of heat conducting agent submicron aluminum oxide (median diameter d50=400 nm) powder, and continuing dispersing at a high speed for 1-12h to obtain a UVC-resistant dispersion; dipping a fiber cloth layer made of high silica fibers in UVC-resistant dispersion liquid to obtain fiber cloth layer dipping cloth coated with polytetrafluoroethylene resin, a UV (ultraviolet) reflecting agent, a UV absorbing agent and a heat conducting agent; then the obtained immersed cloth is put into a sintering furnace, and is dried at the temperature of 80-120 ℃ respectively, and the heating rate is 40 ℃/h; baking at 120-300 ℃ with a heating rate of 20 ℃/h; heating rate of above 300 ℃ is 5 ℃/h, and sintering is carried out for 120min at 360-420 ℃. And melting polytetrafluoroethylene resin particles under the heating effect, and bonding the barium sulfate, cerium oxide and aluminum oxide powder to obtain the deep ultraviolet-resistant flexible PCB substrate.
Example 2
Quartz fibers are selected as the fiber cloth layer, polytrifluoroethylene is selected as the binder, barium sulfate (with median diameter d50=50 nm) is selected as the UV reflecting agent, titanium oxide is selected as the UV absorbing agent, silicon carbide is selected as the heat conducting agent, and the UVC-resistant dispersion liquid is subjected to deep ultraviolet-resistant flexible PCB base materials according to the steps of the embodiment 1 according to the mass ratio of 50:25:25:20.
Example 3
Alkali-free glass fibers (Chongqing national composite material company) are selected as the fiber cloth layer, fusible polytetrafluoroethylene is selected as the binder, barium sulfate (with median diameter d50=30nm) is selected as the UV reflecting agent, zinc oxide is selected as the UV absorbing agent, aluminum nitride is selected as the heat conducting agent, and the UVC-resistant dispersion liquid is subjected to deep ultraviolet-resistant flexible PCB base materials according to the steps of the embodiment 1 according to the mass ratio of 50:20:20:30.
Example 4
The method comprises the steps of selecting an alumina fiber (3M company, brand Nextel 610) as a fiber cloth layer, selecting polyperfluoroethylene propylene as a binder, selecting barium sulfate (with median diameter d50=30nm) as a UV reflecting agent, selecting zinc oxide as a UV absorbing agent and selecting silicon nitride as a heat conducting agent, and performing deep ultraviolet resistant flexible PCB substrate according to the steps of the embodiment 1 according to the mass ratio of 50:30:20:20 of the UVC resistant dispersion liquid
Example 5
Silicon carbide fiber (Nicalon, japanese carbon Co., ltd.), polytetrafluoroethylene as binder, barium sulfate (d50=100 nm) as UV reflector, cerium oxide as UV absorber, and boron nitride as heat conductive agent, wherein the UVC dispersion liquid is prepared according to the mass ratio of 50:30:20:20, and the method is carried out according to the steps of the embodiment 1
Example 6
The deep ultraviolet resistant flexible PCB substrates prepared in examples 1 to 5 were subjected to UVC irradiation comparison, thermal conductivity comparison, and flexibility test comparison with commercially available FR-4 epoxy glass cloth laminates, respectively. The UVC irradiation comparison refers to the period of time that the substrate is cracked, softened and the like and cannot be used under the continuous irradiation of 265nm UVC-LEDs. The thermal conductivity is measured by a thermal flow method. Bending angle refers to bending the sheet until a crack or white mark appears.
Sample numbering Thermal conductivity (W/m.K) 265nm UVC life (Tian) Bending angle
Example 1 0.81 ＞90 170°
Example 2 0.77 ＞90 180°
Example 3 0.79 ＞90 142°
Example 4 0.82 ＞90 167°
Example 5 0.80 ＞90 172°
Comparative example 0.39 3 30°
The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solutions of the present invention within the scope of the technical concept of the present invention, which all fall within the protection scope of the present invention.

Claims (8)

1. The deep ultraviolet resistant flexible PCB substrate is characterized by comprising a fiber cloth layer and a UVC resistant bonding layer, wherein the UVC resistant bonding layer is formed by single-sided or double-sided covering of a UVC resistant dispersion liquid, the UVC resistant dispersion liquid comprises a binder, a UV reflecting agent, a UV absorbing agent and a heat conducting agent, the binder is prepared by homo-polymerization, copolymerization or blending of fluorine-containing organic compounds, and the UV reflecting agent is barium sulfate; the weight ratio of each raw material is as follows:
1-40% of a fiber cloth layer;
40-90% of a binder;
1-40% of UV reflecting agent;
1-40% of UV absorber;
1-40% of heat conducting agent.
2. The deep ultraviolet resistant flexible PCB substrate of claim 1 wherein the UV absorber is selected from one or a combination of two or more of cerium oxide, titanium oxide, zinc oxide.
3. The deep ultraviolet resistant flexible PCB substrate of claim 1 wherein the fluorine containing organic compound is selected from the group consisting of polytetrafluoroethylene, polyperfluoroethylene propylene, fusible polytetrafluoroethylene, polytrifluoroethylene, polydifluoroethylene.
4. The deep ultraviolet resistant flexible PCB substrate of claim 1 wherein the thermal conductive agent is one or a combination of two or more of aluminum oxide, aluminum nitride, silicon carbide, boron nitride.
5. The deep ultraviolet resistant flexible PCB substrate of claim 1 wherein the fiber cloth layer is one of glass fiber, quartz fiber, high silica fiber, alumina fiber, silicon carbide fiber, aluminum nitride fiber, boron nitride fiber.
6. The deep ultraviolet resistant flexible PCB substrate of claim 1 wherein the UV reflector, UV absorber and thermally conductive agent are powders having a particle size of no greater than 2 microns.
7. The method for preparing the deep ultraviolet resistant flexible PCB substrate according to any one of claims 1 to 6, comprising the steps of:
s1, preparing a binder into a suspension, sequentially adding a UV (ultraviolet) reflecting agent, a UV absorbing agent and a heat conducting agent, and dispersing and stirring at a high speed of 500-10000rpm for 1-12 hours to obtain a UVC-resistant dispersion;
s2, coating one side of the UVC-resistant dispersion liquid or impregnating two sides of the fiber cloth layer with the UVC-resistant dispersion liquid;
s3, carrying out gradient heating on the fiber cloth layer with the UVC-resistant dispersion liquid to enable the UVC-resistant dispersion liquid to be solidified into a UVC-resistant bonding layer.
8. The method for preparing the deep ultraviolet resistant flexible PCB substrate according to claim 7, wherein the gradient heating in the step S3 is three-stage heating, namely drying at 80-120 ℃ and heating rate less than or equal to 50 ℃/h; baking at 120-300 ℃ with a heating rate less than or equal to 30 ℃/h;
the temperature rising rate is less than or equal to 10 ℃/h above 300 ℃ and sintering is carried out for 1min to 240min at 360 ℃ to 420 ℃.
CN202010169024.5A 2020-03-12 2020-03-12 Deep ultraviolet-resistant flexible PCB (printed circuit board) base material and preparation method thereof Active CN111447733B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108951195A (en) * 2018-06-27 2018-12-07 河南职业技术学院 A kind of tents of waterproof antiultraviolet
CN109487548A (en) * 2018-11-20 2019-03-19 合肥巧织纺织科技有限公司 A kind of immersion deposition prepares super-hydrophobic-antibacterial-ultraviolet protection polyester fiber cloth method
CN110698994A (en) * 2019-09-12 2020-01-17 广州视源电子科技股份有限公司 Heat-conducting insulating adhesive tape and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108951195A (en) * 2018-06-27 2018-12-07 河南职业技术学院 A kind of tents of waterproof antiultraviolet
CN109487548A (en) * 2018-11-20 2019-03-19 合肥巧织纺织科技有限公司 A kind of immersion deposition prepares super-hydrophobic-antibacterial-ultraviolet protection polyester fiber cloth method
CN110698994A (en) * 2019-09-12 2020-01-17 广州视源电子科技股份有限公司 Heat-conducting insulating adhesive tape and preparation method thereof

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