CN107325742A - A kind of heat-conducting glue band containing conducting high polymers thing - Google Patents
A kind of heat-conducting glue band containing conducting high polymers thing Download PDFInfo
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- CN107325742A CN107325742A CN201710527529.2A CN201710527529A CN107325742A CN 107325742 A CN107325742 A CN 107325742A CN 201710527529 A CN201710527529 A CN 201710527529A CN 107325742 A CN107325742 A CN 107325742A
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
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- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
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- C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
- C09J181/02—Polythioethers; Polythioether-ethers
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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Abstract
The present invention relates to a kind of heat-conducting glue band containing conducting high polymers thing, it is that as heat filling a kind of heat-conducting glue band with heat conduction function for radiating element is made in conductive polymer polymer, heat-conducting glue band is characterised by containing conducting high polymers thing, conductive polymer polymer including doping of originally seeking peace, heat-conducting glue composition includes high molecular polymer, conductive polymer polymer bond's filler, nano ceramics heat filling, nano metal heat filling, function carbon material, the heat-conducting glue band not only has high thermal conductivity coefficient, and heat filling belongs to high score subclass with colloid, with good compatibility.
Description
Technical field
The present invention relates to a kind of heat-conducting glue band with heat conduction function for radiating element, more particularly to it is a kind of containing leading
The heat-conducting glue band of electric high molecular polymer.
Background technology
The radiating of the electronic equipments such as current mobile phone, electronic computer is mainly used pastes scattered on the component for needing to radiate
The mode of thermal device, the radiating element such as graphite, copper carbon body is needed by bonding glue or adhesive tape (two-sided tape or one-faced tapes)
It is connected etc. mode with the component for needing to radiate.Therefore, bond glue or the heat conductivility of adhesive tape directly determines heat dispersion
Quality.Radiating element is pasted by the way of the glue for possessing heat conduction function is smeared, on the one hand there is glue and smear uneven,
It is difficult to the defect standardized；Another aspect electronic equipment ultrathin turns into trend, and device interior space is narrow and small all the more, has been difficult to grasp
Make.
Therefore, heat-conducting glue band is increasingly becoming main way.But the existing usual thermal conductivity factor of heat-conducting glue band is small, it is difficult to meet
The need for radiating.In order to improve thermal conductivity factor, all it is conceived to the selection of heat filling.In the prior art, in high molecular polymer
, can be excessive because of addition when middle addition CNT or graphene, viscosity is reduced, and heat-conducting glue band can not be applied to；And in height
Ceramic filler is added in Molecularly Imprinted Polymer or during metal packing, then because filler addition it is limited the reason for, in glue heat conduction into
Divide inadequate, thermal conductivity factor is relatively low.
Lu is flat to take the method for being applied in combination, and the heat-conducting glue composition under the conditions of prior art is applied in combination, i.e., in macromolecule
Nano ceramics heat filling, nano metal heat filling and CNT are added in polymer or novel heat-conducting is made in graphene
Glue (CN104178048B), can accommodate a greater amount of heat conduction composition fillers, without reducing its viscosity.Heat-conducting glue can also be
The thermal conductivity factor under 0.5 μm of thickness with more than 25W/ (mk) is as thin as, and heat-conducting glue band under the thickness can possess
The bigger mechanical strength of relatively existing heat-conducting glue band, possesses more preferable mechanical performance.
Since obtaining the Nobel Prize from Hideki Shirakawa, conductive polymer polymer rapidly becomes common people with its highly conductive characteristic
The new material attracted attention.Its structure is characterized as that molecule has big conjugated electron system, and carrier is with the valency across key locomotivity
Electronics.The electrical conductivity of conductive polymer polymer is adulterated, more up to conductance more than copper between graphite and germanium through bromine, iodine etc.
Rate.The electric conductivity of material is positively related with thermal conductivity, therefore, can be applied to conductive polymer polymer as heat filling
Heat-conducting glue band, you can a kind of novel heat-conducting adhesive tape is made, not only with high thermal conductivity coefficient, and heat filling is belonged to colloid
High score subclass, with good compatibility.
The content of the invention
In order to solve the above technical problems, the present invention provides a kind of heat-conducting glue band containing conducting high polymers thing.
The technical solution adopted by the present invention is：Heat-conducting glue band containing conducting high polymers thing, provided with heat-conducting glue, heat conduction
Glue composition includes high molecular polymer, conductive polymer polymer bond's filler, nano ceramics heat filling, nano metal heat conduction
Filler, function carbon material.
Preferably, each Composition Weight Parts are：35-45 parts of high molecular polymer, conductive polymer polymer bond's filler
5-50 parts, 5-10 parts of nano ceramics heat filling, 5-10 parts of nano metal heat filling, 5-30 parts of function carbon material.
Preferably, conductive polymer polymer bond filler be polyacetylene, it is PEO, polypyrrole, polyphenylene sulfide, poly-
The mixture of one kind or any combination in phthalocyanine-like compound, polyaniline, polythiophene.
Preferably, conductive polymer polymer bond filler is for intrinsic conductive polymer polymer or through bromine, iodine and five oxygen
Change the conductive polymer polymer of the doping such as arsenic.
Preferably, nano metal heat filling be nano-metal particle, nano metal piece, one kind in nano metal line or
The mixture of any combination.
Preferably, nano metal heat filling is one kind in nanogold, Nano Silver, Nanometer Copper, nano aluminum or any group
The mixture of conjunction.
Preferably, high molecular polymer is polyethylene, polystyrene, epoxy resin, PET, polychlorostyrene
The mixture of one kind or any combination in ethene.
Preferably, adhesive tape also includes adhesive band base.
Preferably, adhesive band base is one kind in PET sheet, non-woven fabrics or metal sheet.
It is preferred that, function carbon material is CNT or one kind or mixture in graphene
The present invention has the advantages and positive effects of：The heat-conducting glue band made using this programme has higher heat conduction system
Number (more than 25W/ (mk)), and phase of the conductive polymer polymer bond filler being introduced into being all high molecular colloid
More preferably, colloid is homogeneous for capacitive.
Embodiment
Existing heat-conducting glue is pasted radiating element by way of smearing and there is certain defect, in addition, heat-conducting glue is another
A kind of usage is sprayed directly on the component for needing to radiate, but it equally exists coating thickness too big, heat conduction system
The small shortcoming of number.Because the heat-conducting glue available for spraying is generally diluter, heat filling content therein is relatively low, causes it
Thermal conductivity factor can be improved by way of increasing coating thickness.
Therefore, the invention provides a kind of novel heat-conducting adhesive tape of thing containing conducting high polymers, to overcome existing skill
The drawbacks described above of art.Specifically, the novel heat-conducting adhesive tape of the thing containing conducting high polymers, it can be a kind of with base material
Adhesive tape, or can also be a kind of adhesive tape without base material.It is above-mentioned that there is base material or the adhesive tape without base material can be two-sided tapes
(two sides of adhesive tape all possesses viscosity, and adhesive tape two sides all toughness of no base material belong to two-sided tape) or one-faced tapes
(adhesive tape only has one side to possess viscosity, and the adhesive tape for having base material can be one-faced tapes or two-sided tape).
When adhesive tape is the adhesive tape without base material, it only can be made up of thickness for 0.5-2 μm of heat-conducting glue；When adhesive tape is
During adhesive tape with base material, the heat-conducting glue structure that it can be 1-5 μm of base material by thickness and single or double gross thickness is 0.5-2 μm
Into；Wherein, base material can be the metal sheet of PET sheet or non-woven fabrics or copper, aluminium or other materials.
The inventive point of the present invention is the novel heat-conducting adhesive tape for being the provision of a kind of thing containing conducting high polymers, can be made
Make the heat-conducting glue band of the thermal conductivity factor with more than 25W/ (mk), and heat filling is compatible in colloid in the heat-conducting glue band
Property more preferably, colloid is homogeneous.
Heat-conducting glue composition include high molecular polymer, conductive polymer polymer bond's filler, nano ceramics heat filling,
Nano metal heat filling, function carbon material, it has been investigated that, the heat-conducting glue band of addition conductive polymer polymer can be obtained
Good electrical and thermal conductivity performance；Compared through test of many times and show that the following mass fraction component of addition can prepare electrical conductivity
Height, mechanical strength is high, the heat-conducting glue of good mechanical property, and specific mass fraction is：35-45 parts of high molecular polymer, macromolecule is led
5-50 parts of electric polymer heat filling, 5-10 parts of nano ceramics heat filling, 5-10 parts of nano metal heat filling, function carbon materials
5-30 parts of material.
The molecule of conductive polymer polymer has big conjugated electron system, and its carrier is that have across key locomotivity
Valence electron, therefore can not only play in heat-conducting glue more preferable heat-conducting effect, but also have with colloid preferably compatible
Property, colloid is homogeneous.The heat filling is using intrinsic conductive polymer polymer or through doping such as bromine, iodine and five arsenic oxide arsenoxides
Conductive polymer polymer, specifically can using polyacetylene, PEO, polypyrrole, polyphenylene sulfide, poly- phthalocyanine-like compound,
The mixture of one kind or any combination in polyaniline, polythiophene according to application and can be used as filler during production
Conductive polymer polymer bond's filler of Object Selection heterogeneity, then made a distinction by model.
Nano ceramics heat filling can be one of nano zircite, nano aluminium oxide, Nano diamond, nm-class boron nitride
Or its mixture；Nano metal heat filling is nano-metal particle, nano metal piece, one kind in nano metal line or any
The mixture of combination, nano material is one kind or the mixture of any combination in nanogold, Nano Silver, Nanometer Copper, nano aluminum.
High molecular polymer is the matrix of colloid, plays adhesive effect.Can be polyethylene, polystyrene, epoxy resin,
The mixture of one kind or any combination in PET, polyvinyl chloride, function carbon material belongs to heat filling
In a class, be utilize the special structure of such new carbon itself, along graphite flake layer carry out heat transfer.The function carbon material
It is one kind or mixture in CNT or graphene.
Embodiment 1：
A kind of heat-conducting glue band containing conducting high polymers thing, adhesive tape is without base material, only including heat-conducting glue, wherein heat-conducting glue
Composition includes high molecular polymer, and conductive polymer polymer bond's filler, nano ceramics heat filling, nano metal heat conduction is filled out
Material, function carbon material.
Specific composition and each Composition Weight Parts are：45 parts of polyethylene, 5 parts of PEO, 10 parts of nano aluminium oxide is received
5 parts of gold grain of rice, 30 parts of CNT.
Embodiment 2：
A kind of heat-conducting glue band containing conducting high polymers thing, including adhesive band base and heat-conducting glue, wherein adhesive band base
For PET sheet, wherein heat-conducting glue composition includes high molecular polymer, and conductive polymer polymer bond's filler, nano ceramics is led
Hot filler, nano metal heat filling, function carbon material.
Specific composition and each Composition Weight Parts are：35 parts of polystyrene, 20 parts of polyacetylene, 5 parts of nm-class boron nitride, nanometer
10 parts of silver strip, 5 parts of graphene.
Embodiment 3：
A kind of heat-conducting glue band containing conducting high polymers thing, including adhesive band base and heat-conducting glue, wherein adhesive band base
For non-woven fabrics, wherein heat-conducting glue composition includes high molecular polymer, conductive polymer polymer bond's filler, nano ceramics heat conduction
Filler, nano metal heat filling, function carbon material.
Specific composition and each Composition Weight Parts are：40 parts of epoxy resin, 50 parts of polypyrrole, 8 parts of Nano diamond, nanometer
8 parts of aluminum steel, 20 parts of CNT.
Embodiment 4：
A kind of heat-conducting glue band containing conducting high polymers thing, including adhesive band base and heat-conducting glue, wherein adhesive band base
For metallic copper sheet material, wherein heat-conducting glue composition includes high molecular polymer, conductive polymer polymer bond's filler, nano ceramics
Heat filling, nano metal heat filling, function carbon material.
Specific composition and each Composition Weight Parts are：33 parts of PET, 40 parts of polythiophene is nano oxidized
6 parts of zirconium, 6 parts of nano copper particle, 15 parts of graphene.
Embodiment 5：
A kind of heat-conducting glue band containing conducting high polymers thing, including adhesive band base and heat-conducting glue, wherein adhesive band base
For metal aluminum sheet, wherein heat-conducting glue composition includes high molecular polymer, conductive polymer polymer bond's filler, nano ceramics
Heat filling, nano metal heat filling, function carbon material.
Specific composition and each Composition Weight Parts are：20 parts of polyethylene, 22 parts of polyvinyl chloride, 35 parts of polyphenylene sulfide, nanometer
3 parts of aluminum oxide, 3 parts of nm-class boron nitride, 3 parts of nano-Ag particles, 3 parts of nano aluminum, 8 parts of graphene.
Embodiment 6：
A kind of heat-conducting glue band containing conducting high polymers thing, including adhesive band base and heat-conducting glue, wherein adhesive band base
For PET sheet, wherein heat-conducting glue composition includes high molecular polymer, and conductive polymer polymer bond's filler, nano ceramics is led
Hot filler, nano metal heat filling, function carbon material.
Specific composition and each Composition Weight Parts are：
10 parts of polystyrene, 30 parts of epoxy resin, 5 parts of polyphenylene sulfide, poly- 5 parts of phthalocyanine-like compound, 10 parts of polyaniline is received
10 parts of aluminum oxide of rice, 8 parts of nano-Ag particles, 25 parts of CNT.
One embodiment of the present of invention is described in detail above, but the content is only the preferable implementation of the present invention
Example, it is impossible to be considered as the practical range for limiting the present invention.All equivalent changes made according to the present patent application scope and improvement
Deng within the patent covering scope that all should still belong to the present invention.
Claims (10)
1. a kind of heat-conducting glue band containing conducting high polymers thing, provided with heat-conducting glue, it is characterised in that：The heat-conducting glue composition
Including high molecular polymer, conductive polymer polymer bond's filler, nano ceramics heat filling, nano metal heat filling,
Function carbon material.
2. the heat-conducting glue band according to claim 1 containing conducting high polymers thing, it is characterised in that：Each Ingredients Weight
Number is：35-45 parts of high molecular polymer, 5-50 parts of conductive polymer polymer bond's filler, nano ceramics heat filling 5-
10 parts, 5-10 parts of nano metal heat filling, 5-30 parts of function carbon material.
3. the heat-conducting glue band according to claim 1 or 2 containing conducting high polymers thing, it is characterised in that：The height
Molecule conducting polymer heat filling is polyacetylene, PEO, polypyrrole, polyphenylene sulfide, poly- phthalocyanine-like compound, polyphenyl
The mixture of one kind or any combination in amine, polythiophene.
4. the heat-conducting glue band according to claim 1 or 2 containing conducting high polymers thing, it is characterised in that：The height
Molecule conducting polymer heat filling is intrinsic conductive polymer polymer or the macromolecule through doping such as bromine, iodine and five arsenic oxide arsenoxides
Conducting polymer.
5. according to any described heat-conducting glue band containing conducting high polymers thing in claim 1-4, it is characterised in that：Institute
It is the mixed of nano-metal particle, nano metal piece, one kind in nano metal line or any combination to state nano metal heat filling
Compound.
6. the heat-conducting glue band according to claim 5 containing conducting high polymers thing, it is characterised in that：The nanogold
Category heat filling is one kind or the mixture of any combination in nanogold, Nano Silver, Nanometer Copper, nano aluminum.
7. the heat-conducting glue band according to claim 1 or 2 containing conducting high polymers thing, it is characterised in that：The height
Molecularly Imprinted Polymer is one kind in polyethylene, polystyrene, epoxy resin, PET, polyvinyl chloride or appoints
The mixture of one combination.
8. the heat-conducting glue band according to claim 1 or 2 containing conducting high polymers thing, it is characterised in that：The glue
Band also includes adhesive band base.
9. the heat-conducting glue band according to claim 1 or 2 containing conducting high polymers thing, it is characterised in that：The glue
It is one kind in PET sheet, non-woven fabrics or metal sheet with base material.
10. the heat-conducting glue band according to claim 1 or 2 containing conducting high polymers thing, it is characterised in that：The work(
Energy carbon material is CNT or one kind or mixture in graphene.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710527529.2A CN107325742A (en) | 2017-06-30 | 2017-06-30 | A kind of heat-conducting glue band containing conducting high polymers thing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110656399A (en) * | 2018-06-29 | 2020-01-07 | 河北金雕新材料科技有限公司 | Preparation method of high-performance graphene fiber |
| JP2020153025A (en) * | 2019-03-19 | 2020-09-24 | 出光興産株式会社 | Conductive polymer-containing non-woven fabric, and method for producing conductive polymer-containing non-woven fabric |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103937177A (en) * | 2014-04-19 | 2014-07-23 | 中山市永威新材料有限公司 | Highly heat-conducting modified plastic and preparation method thereof |
| CN104178048A (en) * | 2014-09-01 | 2014-12-03 | 络派模切（北京）有限公司 | Ultrathin heat-conducting adhesive tape |
-
2017
- 2017-06-30 CN CN201710527529.2A patent/CN107325742A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103937177A (en) * | 2014-04-19 | 2014-07-23 | 中山市永威新材料有限公司 | Highly heat-conducting modified plastic and preparation method thereof |
| CN104178048A (en) * | 2014-09-01 | 2014-12-03 | 络派模切（北京）有限公司 | Ultrathin heat-conducting adhesive tape |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110656399A (en) * | 2018-06-29 | 2020-01-07 | 河北金雕新材料科技有限公司 | Preparation method of high-performance graphene fiber |
| JP2020153025A (en) * | 2019-03-19 | 2020-09-24 | 出光興産株式会社 | Conductive polymer-containing non-woven fabric, and method for producing conductive polymer-containing non-woven fabric |
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Application publication date: 20171107 |