CN103879087A - Heat-conducting copper foil - Google Patents
Heat-conducting copper foil Download PDFInfo
- Publication number
- CN103879087A CN103879087A CN201410138902.1A CN201410138902A CN103879087A CN 103879087 A CN103879087 A CN 103879087A CN 201410138902 A CN201410138902 A CN 201410138902A CN 103879087 A CN103879087 A CN 103879087A
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- copper foil
- adhesive
- heat
- insulating barrier
- heat conduction
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat-conducting copper foil which comprises de-bonding layers, an adhesive, a copper foil and an insulation layer, wherein the insulation layer is attached to one side of the copper foil; the other side of the copper foil is coated with the adhesive; the adhesive is arranged on the other side of the insulation layer; the de-bonding layers are arranged on two sides of the adhesive. According to the mode, the heat-conducting copper foil has the advantages of high reliability, good heat conductivity, convenience in adhesion, good insulativity, small thickness, easiness in bending, low price and the like, and is suitable for heat dissipation of chips of small electronic products.
Description
Technical field
The present invention relates to metal film field, particularly relate to a kind of heat conduction Copper Foil.
Background technology
Copper is the service time of a kind of material for a long time, has good electric conductivity and thermal conductivity, extensive application in electronics industry.Nowadays chip performance is more and more higher, the thing followed is that chip caloric value promotes rapidly, make chip cooling become a huge problem, the larger place in space, chip often uses radiator to dispel the heat, and mobile device often integrated level is high, be difficult for installing traditional heat-dissipating device, and only depend on air heat transfer can cause system operation unstable, need to occur that one can good heat transfer and wieldy equipment.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of heat conduction Copper Foil, realizes the quick conduction of heat by Copper Foil and heat conduction glue, realizes effective temperature-reducing; Facilitate Copper Foil to fix by glue being set in Copper Foil both sides, and can fit tightly with shell or radiator, improve heat-sinking capability; Be provided with insulating barrier, avoided accidental short circuit to cause device damage; Have that reliability is high, husband is sought in heat conduction, facilitate stickup, good insulating, thickness are little, be easy to bending, the advantage such as cheap, are applicable to small-sized electronic product chip cooling.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of heat conduction Copper Foil is provided, comprise: from shape layer, adhesive, Copper Foil and insulating barrier, Copper Foil one side is fitted with insulating barrier, and Copper Foil opposite side is coated with adhesive, insulating barrier opposite side is provided with adhesive, is arranged on adhesive both sides from shape layer.
In a preferred embodiment of the present invention, described is papery from shape layer, from the processing of shape layer process silicone oil.
In a preferred embodiment of the present invention, described insulating barrier is ultra-thin PE film, and described PE film thickness is 10-20 micron.
In a preferred embodiment of the present invention, described adhesive is heat-proof acrylic adhesive, and adhesive is interior doped with carbon dust.
The invention has the beneficial effects as follows: heat conduction Copper Foil of the present invention is realized heat quick conduction by Copper Foil and heat conduction glue, realizes effective temperature-reducing; Facilitate Copper Foil to fix by glue being set in Copper Foil both sides, and can fit tightly with shell or radiator, improve heat-sinking capability; Be provided with insulating barrier, avoided accidental short circuit to cause device damage; Have that reliability is high, husband is sought in heat conduction, facilitate stickup, good insulating, thickness are little, be easy to bending, the advantage such as cheap, are applicable to small-sized electronic product chip cooling.
Brief description of the drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing, wherein:
Fig. 1 is the structural representation of heat conduction Copper Foil one preferred embodiment of the present invention;
In accompanying drawing, the mark of each parts is as follows: 1, from shape layer, and 2, adhesive, 3, Copper Foil, 4, insulating barrier.
Detailed description of the invention
To the technical scheme in the embodiment of the present invention be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the embodiment of the present invention comprises:
A kind of heat conduction Copper Foil, comprising: from shape layer 1, adhesive 2, Copper Foil 3 and insulating barrier 4, Copper Foil 3 one sides are fitted with insulating barrier 4, Copper Foil 3 opposite sides are coated with adhesive 2, insulating barrier 4 opposite sides are provided with adhesive 2, are arranged on adhesive 2 both sides from shape layer 1.
Described is papery from shape layer 1,, can effectively divest fast through silicone oil processing from shape layer 1, facilitates Copper Foil to use.
Described insulating barrier 4 is ultra-thin PE film, and described PE film thickness is 10-20 micron, has good insulating capacity and thermal conductivity.
Described adhesive 2 is heat-proof acrylic adhesive, and in adhesive, doped with carbon dust, the capacity of heat transmission is good, and cohesive is good.
When use, by divesting from shape layer 1 of Copper Foil 3, and Copper Foil 3 is affixed on to the position of need to dispelling the heat, it is well fixing, subsequently upper leafing shape layer 1 is peeled off, and fit installation of heat radiator or shell, good heat radiating is provided.
The beneficial effect of heat conduction Copper Foil of the present invention is:
One, realize the quick conduction of heat by Copper Foil and heat conduction glue, realize effective temperature-reducing;
Two, facilitate Copper Foil to fix by glue being set in Copper Foil both sides, and can fit tightly with shell or radiator, improve heat-sinking capability;
Three, be provided with insulating barrier, avoided accidental short circuit to cause device damage;
Four, have that reliability is high, husband is sought in heat conduction, facilitate stickup, good insulating, thickness are little, be easy to bending, the advantage such as cheap, are applicable to small-sized electronic product chip cooling.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. a heat conduction Copper Foil, is characterized in that, comprising: from shape layer, adhesive, Copper Foil and insulating barrier, Copper Foil one side is fitted with insulating barrier, and Copper Foil opposite side is coated with adhesive, insulating barrier opposite side is provided with adhesive, is arranged on adhesive both sides from shape layer.
2. heat conduction Copper Foil according to claim 1, is characterized in that, described is papery from shape layer, from the processing of shape layer process silicone oil.
3. heat conduction Copper Foil according to claim 1, is characterized in that, described insulating barrier is ultra-thin PE film, and described PE film thickness is 10-20 micron.
4. heat conduction Copper Foil according to claim 1, is characterized in that, described adhesive is heat-proof acrylic adhesive, and adhesive is interior doped with carbon dust.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410138902.1A CN103879087A (en) | 2014-04-09 | 2014-04-09 | Heat-conducting copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410138902.1A CN103879087A (en) | 2014-04-09 | 2014-04-09 | Heat-conducting copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103879087A true CN103879087A (en) | 2014-06-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410138902.1A Pending CN103879087A (en) | 2014-04-09 | 2014-04-09 | Heat-conducting copper foil |
Country Status (1)
| Country | Link |
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| CN (1) | CN103879087A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280587A (en) * | 2015-07-03 | 2016-01-27 | 苏州赛伍应用技术有限公司 | Radiator fin for power module and power module made of the same |
| CN106046799A (en) * | 2016-07-13 | 2016-10-26 | 北京天衣鼎嘉工程技术有限公司 | Flame-retardant heat conductive insulation silicone rubber product for power equipment and preparing method of flame-retardant heat conductive insulation silicone rubber product |
| CN106795398A (en) * | 2014-08-18 | 2017-05-31 | 艾利丹尼森公司 | Adhesive tape and heat sink assembly |
| CN109768019A (en) * | 2018-12-29 | 2019-05-17 | 苏州赛伍应用技术股份有限公司 | A kind of power module cooling fin and power module made of it |
| CN110435279A (en) * | 2019-08-31 | 2019-11-12 | 广东小天才科技有限公司 | Novel heat conduction material, manufacturing method and electronic product applying novel heat conduction material |
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| US4639285A (en) * | 1985-02-13 | 1987-01-27 | Shin-Etsu Chemical Co. Ltd. | Heat-resistant flexible laminate for substrate of printed circuit board and a method for the preparation thereof |
| CN201436206U (en) * | 2009-03-09 | 2010-04-07 | 珠海全宝电子科技有限公司 | High heat conducting metal-based and copper foil-coated laminated plate |
| CN101707853A (en) * | 2009-02-24 | 2010-05-12 | 常州市超顺电子技术有限公司 | Metal matrix copper-clad laminate |
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
| CN102593338A (en) * | 2011-01-07 | 2012-07-18 | 昆山雅森电子材料科技有限公司 | Thin high-thermal-conductivity metal substrate and production method thereof |
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2014
- 2014-04-09 CN CN201410138902.1A patent/CN103879087A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4639285A (en) * | 1985-02-13 | 1987-01-27 | Shin-Etsu Chemical Co. Ltd. | Heat-resistant flexible laminate for substrate of printed circuit board and a method for the preparation thereof |
| CN101707853A (en) * | 2009-02-24 | 2010-05-12 | 常州市超顺电子技术有限公司 | Metal matrix copper-clad laminate |
| CN201436206U (en) * | 2009-03-09 | 2010-04-07 | 珠海全宝电子科技有限公司 | High heat conducting metal-based and copper foil-coated laminated plate |
| CN102593338A (en) * | 2011-01-07 | 2012-07-18 | 昆山雅森电子材料科技有限公司 | Thin high-thermal-conductivity metal substrate and production method thereof |
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106795398A (en) * | 2014-08-18 | 2017-05-31 | 艾利丹尼森公司 | Adhesive tape and heat sink assembly |
| CN105280587A (en) * | 2015-07-03 | 2016-01-27 | 苏州赛伍应用技术有限公司 | Radiator fin for power module and power module made of the same |
| CN105280587B (en) * | 2015-07-03 | 2018-08-07 | 苏州赛伍应用技术股份有限公司 | Power module cooling fin and with its manufactured power module |
| CN106046799A (en) * | 2016-07-13 | 2016-10-26 | 北京天衣鼎嘉工程技术有限公司 | Flame-retardant heat conductive insulation silicone rubber product for power equipment and preparing method of flame-retardant heat conductive insulation silicone rubber product |
| CN106046799B (en) * | 2016-07-13 | 2019-08-20 | 北京天衣鼎嘉工程技术有限公司 | Flame-retarded heat-conducting electrically insulating silicone rubber product and preparation method thereof for power equipment |
| CN109768019A (en) * | 2018-12-29 | 2019-05-17 | 苏州赛伍应用技术股份有限公司 | A kind of power module cooling fin and power module made of it |
| CN109768019B (en) * | 2018-12-29 | 2020-12-25 | 苏州赛伍应用技术股份有限公司 | Heat radiating fin for power module and power module manufactured by same |
| CN110435279A (en) * | 2019-08-31 | 2019-11-12 | 广东小天才科技有限公司 | Novel heat conduction material, manufacturing method and electronic product applying novel heat conduction material |
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Application publication date: 20140625 |