CN110435279A - Novel heat-conducting material and production method, using the electronic product of novel heat-conducting material - Google Patents
Novel heat-conducting material and production method, using the electronic product of novel heat-conducting material Download PDFInfo
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- CN110435279A CN110435279A CN201910819983.4A CN201910819983A CN110435279A CN 110435279 A CN110435279 A CN 110435279A CN 201910819983 A CN201910819983 A CN 201910819983A CN 110435279 A CN110435279 A CN 110435279A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B29/005—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to another layer of paper or cardboard layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M6/00—Primary cells; Manufacture thereof
- H01M6/50—Methods or arrangements for servicing or maintenance, e.g. for maintaining operating temperature
- H01M6/5038—Heating or cooling of cells or batteries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical Kinetics & Catalysis (AREA)
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- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides novel heat-conducting material and production method, using the electronic product of novel heat-conducting material, novel heat-conducting material includes: heat-radiating substrate and cardboard；The cardboard includes facial tissue and base stock, and the back side of the facial tissue is coated with adhesive layer；The one side of the heat-radiating substrate is bonded with the back side of the cardboard facial tissue by the adhesive layer.Heat radiation stability of the present invention and heat dissipation effect improve electronic product service life, and reduce the purpose of cost.
Description
Technical field
The present invention relates to heat conduction and heat radiation material technical field, espespecially novel heat-conducting material and production method, lead using novel
The electronic product of hot material.
Background technique
Currently, the development speed of various electronic products is very fast.On the basis for developing related hardware technology and software technology
On, there are one great difficulty needs to overcome, and is exactly the heat dissipation problem of electronic product, in recent years, graphite is as highly thermally conductive property
Material, by the attention of numerous researchers, since the wellability of graphite and metal is poor, scientific research personnel is proposed gold such as copper or aluminium
Belong to and being distributed in graphite particle as engagement material, forms distributed compound system.
The prior art often uses Heat Conduction Material of the graphite cloth patch material as electronic equipment, and the heat of battery is passed
It radiates in the region that being directed at can radiate.As shown in Fig. 2, graphite cloth patch material includes three layers, it is gum layer, graphite respectively
Layer and conductive layer of cloth, however, can cause to be layered because falling, graphite laminated using graphite material as the heat conduction and heat radiation material of major ingredient
After will increase gap, influence heat-conducting effect, electronic product can temperature rise, performance decline, and graphite cloth patch material is due to adopting
With graphite, higher cost.
Summary of the invention
The object of the present invention is to provide novel heat-conducting material and production method, using the electronic product of novel heat-conducting material,
It realizes heat radiation stability and heat dissipation effect, improves electronic product service life, and reduce the purpose of cost.
Technical solution provided by the invention is as follows:
The present invention provides a kind of novel heat-conducting material, and the novel heat-conducting material includes:
Heat-radiating substrate and cardboard；
The cardboard includes facial tissue and base stock, and the back side of the facial tissue is coated with adhesive layer；
The one side of the heat-radiating substrate is bonded with the back side of the cardboard facial tissue by the adhesive layer.
Further, the heat-radiating substrate is iron plate, any one in copper foil, the heat-radiating substrate with a thickness of 10 μm
~100um.
Further, the copper foil is rolled copper foil.
Further, the adhesive layer includes acrylic resin adhesive, modified acryl resin binder, asphalt mixtures modified by epoxy resin
One of rouge adhesive, modified epoxy adhesive are a variety of, the cardboard with a thickness of 5 μm~50um.
The present invention also provides a kind of electronic products using novel heat-conducting material, including heating element and novel heat-conducting material
Material；
The novel heat-conducting material includes:
Heat-radiating substrate and cardboard；
The cardboard includes facial tissue and base stock, and the back side of the facial tissue is coated with adhesive layer；
The one side of the heat-radiating substrate is bonded with the back side of the cardboard facial tissue by the adhesive layer；
The cardboard base stock of the novel heat-conducting material wraps up the heating element, and the heat-radiating substrate and shell or scattered
Hot device fits closely.
Further, the heat-radiating substrate is iron plate, any one in copper foil, the heat-radiating substrate with a thickness of 10 μm
~100um.
Further, the copper foil is rolled copper foil.
Further, the adhesive layer includes acrylic resin adhesive, modified acryl resin binder, asphalt mixtures modified by epoxy resin
One of rouge adhesive, modified epoxy adhesive are a variety of, the cardboard with a thickness of 5 μm~50um.
The present invention also provides a kind of production methods of novel heat-conducting material, comprising steps of
Adhesive is uniformly coated in the one side of heat-radiating substrate；
It will uniformly be coated on the heat-radiating substrate of the adhesive and stick cardboard, and the facial tissue back side of the cardboard is close to institute
State heat-radiating substrate；
The heat-radiating substrate after the cardboard will be sticked to dry, the adhesive forms adhesive layer, so that described dissipate
The one side of hot substrate is bonded to obtain novel heat-conducting material by the adhesive layer with the back side of the cardboard facial tissue.
Further, described to stick the heat-radiating substrate after the cardboard and dry, the adhesive forms adhesive
Layer, so that the one side of the heat-radiating substrate is bonded to obtain novel heat-conducting with the back side of the cardboard facial tissue by the adhesive layer
After material comprising steps of
Press the heat-radiating substrate, the pressure given by gap between idler wheel and idler wheel, make the cardboard with it is described
Heat-radiating substrate passes through the intermediate adhesive layer close adhesion.
The novel heat-conducting material and production method that there is provided through the invention, using the electronic product of novel heat-conducting material, energy
Enough heat radiation stability and heat dissipation effect, improve electronic product service life, and reduce the purpose of cost.
Detailed description of the invention
Below by clearly understandable mode, preferred embodiment is described with reference to the drawings, to novel heat-conducting material and production
Method gives further using above-mentioned characteristic, technical characteristic, advantage and its implementation of the electronic product of novel heat-conducting material
Explanation.
Fig. 1 is a kind of structural schematic diagram of one embodiment of novel heat-conducting material of the present invention；
Fig. 2 is the structural schematic diagram of graphite cloth patch material in the prior art；
Fig. 3 is a kind of flow chart of one embodiment of the production method of novel heat-conducting material of the present invention；
Fig. 4 is a kind of flow chart of another embodiment of the production method of novel heat-conducting material of the present invention；
Fig. 5 is a kind of structural schematic diagram of one embodiment of soft copper patch of the present invention；
Fig. 6 is a kind of structural schematic diagram of one embodiment of the electronic product using novel heat-conducting material of the present invention；
Fig. 7 is a kind of structural schematic diagram of one embodiment of the phone wrist-watch using novel heat-conducting material of the present invention；
Drawing reference numeral explanation:
Novel heat-conducting material 1；
Heat-radiating substrate 11, cardboard 12；
Facial tissue 122, base stock 121, adhesive layer 123；
Graphite cloth pastes material 2；
Conductive layer of cloth 21, graphite linings 22, gum layer 23；
Soft copper patch 3；
Soft copper piece 31, gum 32.
Specific embodiment
In being described below, for illustration and not for limitation, the tool of such as particular system structure, technology etc is proposed
Body details, so as to provide a thorough understanding of the present application embodiment.However, it will be clear to one skilled in the art that there is no these specific
The application also may be implemented in the other embodiments of details.In other cases, it omits to well-known system, device, electricity
The detailed description of road and method, so as not to obscure the description of the present application with unnecessary details.
It should be appreciated that ought use in this specification and in the appended claims, term " includes " indicates the description
Feature, entirety, step, operation, the presence of element and/or component, but one or more other features, entirety, step are not precluded
Suddenly, the presence or addition of operation, element, component and/or set.
To make simplified form, part related to the present invention is only schematically shown in each figure, they are not represented
Its practical structures as product.In addition, there is identical structure or function in some figures so that simplified form is easy to understand
Component only symbolically depicts one of those, or has only marked one of those.Herein, "one" is not only indicated
" only this ", can also indicate the situation of " more than one ".
It will be further appreciated that the term "and/or" used in present specification and the appended claims is
Refer to any combination and all possible combinations of one or more of associated item listed, and including these combinations.
In the specific implementation, terminal device described in the embodiment of the present application is including but not limited to such as with the sensitive table of touch
Mobile phone, laptop computer, private tutor's machine or the tablet computer in face (for example, touch-screen display and/or touch tablet) it
Other portable devices of class.It is to be further understood that in certain embodiments, the terminal device is not that portable communications are set
It is standby, but the desktop computer with touch sensitive surface (such as: touch-screen display and/or touch tablet).
In following discussion, the terminal device including display and touch sensitive surface is described.However, should manage
Solution, terminal device may include that other one or more physical Users of such as physical keyboard, mouse and/or control-rod connect
Jaws equipment.
Terminal device supports various application programs, such as one of the following or multiple: drawing application program, demonstration application
Program, network creation application program, word-processing application, disk imprinting application program, spreadsheet applications, game are answered
With program, telephony application, videoconference application, email application, instant messaging applications, forging
Refining supports application program, photo management application program, digital camera application program, digital camera applications program, web browsing to answer
With program, digital music player application and/or video frequency player application program.
At least one of such as touch sensitive surface can be used in the various application programs that can be executed on the terminal device
Public physical user-interface device.It can be adjusted among applications and/or in corresponding application programs and/or change touch is quick
Feel the corresponding information shown in the one or more functions and terminal on surface.In this way, terminal public physical structure (for example,
Touch sensitive surface) it can support the various application programs with user interface intuitive and transparent for a user.
In addition, term " first ", " second " etc. are only used for distinguishing description, and should not be understood as in the description of the present application
Indication or suggestion relative importance.
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, Detailed description of the invention will be compareed below
A specific embodiment of the invention.It should be evident that drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing, and obtain other embodiments.
One embodiment of the invention, as shown in Figure 1, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123.
Specifically, cardboard 12 includes facial tissue 122 and base stock 121, base stock 121 is generally common base stock 121, base stock 121
Surface is coated with silicon layer, has barrier action to adhesive.Facial tissue 122 is divided into art paper/PET/PVC etc. by material, and facial tissue
122 back side is coated with adhesive layer 123, and the cardboard 12 in the present embodiment is back bakelized paper, and back bakelized paper is mostly higher with intensity
White board is body paper, and coating adhesive sticker, that is, adhesive layer 123 forms.PP back bakelized paper is a kind of synthesis back bakelized paper, and PP back bakelized paper is just
It is that the back side of PP paper is coated with adhesive layer 123, tears i.e. Pasting, conveniently install and use.
Through this embodiment, the quick conduction that heat is realized by heat-radiating substrate 11 and cardboard 12, realizes effective temperature-reducing.By
Graphite linings are not added in centre, since graphite linings are easy occur the case where layering loose powder when falling or colliding, pass through
Adhesive layer 123 is bonded heat-radiating substrate 11 with cardboard 12 11 copper foil of heat-radiating substrate is facilitated to fix, it is not easy to it is existing layering occur
As the stability of novel heat-conducting material 1 is high, greatly prolongs service life relative to graphite cloth patch material, promotes electronics and produce
The heat dissipation performance of the heating element of product avoids electronic product from being chronically to greatly improve the heat dissipation effect of electronic product
The condition of high temperature, and then promote the service life of electronic product.In addition, 123 heat of adhesive layer is closely bonded with heating element,
To realize the function of carrying out heat conducting and radiating to heating element.The present invention has pyroconductivity height, thickness density controllable, hot
Low, ultrathin characteristic is hindered, the heat heat conduction and heat radiation efficiency of the heating element of electronic product can be promoted.
Second embodiment of the invention, as shown in figures 1 to 6, a kind of electronic product 4 using novel heat-conducting material,
Including heating element 41 and novel heat-conducting material 1；
The novel heat-conducting material 1 includes:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
12 base stock 121 of cardboard of the novel heat-conducting material 1 wraps up the heating element 41, and the heat-radiating substrate 11
It is fitted closely with shell or radiator.
Specifically, cardboard 12 includes facial tissue 122 and base stock 121, base stock 121 is generally common base stock 121, base stock 121
Surface is coated with silicon layer, has barrier action to adhesive.Facial tissue 122 is divided into art paper/PET/PVC etc. by material, and facial tissue
122 back side is coated with adhesive layer 123, and the cardboard 12 in the present embodiment is back bakelized paper, and back bakelized paper is mostly higher with intensity
White board is body paper, and coating adhesive sticker, that is, adhesive layer 123 forms.PP back bakelized paper is a kind of synthesis back bakelized paper, and PP back bakelized paper is just
It is that the back side of PP paper is coated with adhesive layer 123, tears i.e. Pasting, conveniently install and use.
In addition, 12 base stock 121 of cardboard of novel heat-conducting material 1 wraps up the heating element 41, and the heat-radiating substrate
11 fit closely with shell or radiator so that novel heat-conducting material 1 will conduct from the heat of heating element 41 to shell or
At person's radiator, so that the heat of heating element 41 is quickly and effectively discharged.Heating element 41 includes but is not limited to
Chip, battery, circuit board etc..
Through this embodiment, the quick conduction that heat is realized by heat-radiating substrate 11 and cardboard 12, realizes effective temperature-reducing.By
Graphite linings are not added in centre, since graphite linings are easy occur the case where layering loose powder when falling or colliding, pass through
Adhesive layer 123 is bonded heat-radiating substrate 11 with cardboard 12 11 copper foil of heat-radiating substrate is facilitated to fix, it is not easy to it is existing layering occur
As the stability of novel heat-conducting material 1 is high, greatly prolongs service life relative to graphite cloth patch material, promotes electronics and produce
The heat dissipation performance of the heating element 41 of product 4 avoids electronic product 4 long-term to greatly improve the heat dissipation effect of electronic product 4
In the condition of high temperature, and then promote the service life of electronic product 4.The present invention has pyroconductivity height, thickness density controllable, hot
Low, ultrathin characteristic is hindered, the heat heat conduction and heat radiation efficiency of the heating element 41 of electronic product 4 can be promoted.
Third embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；Heat-radiating substrate 11 is iron plate, and the thickness of iron plate is within the scope of 10 μm~100um.
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123.
Specifically, the present embodiment is for one embodiment and second embodiment, what heat-radiating substrate 11 used
It is iron plate of the thickness within the scope of 10 μm~100um, and due to the good heat conductivity of iron plate, and iron plate has thickness small, valence
The cheap advantage of lattice, can generate amount of heat, adhesive layer suitable for the use processes such as the chip of small-sized electronic product, battery
123 heats are closely bonded with heating element, to realize the function of carrying out heat conducting and radiating to heating element.
4th embodiment of the invention, as shown in Fig. 2, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；Heat-radiating substrate 11 is copper foil, and the thickness of copper foil is within the scope of 10 μm~100um.
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123.
Specifically, the present embodiment is for one embodiment and second embodiment, what heat-radiating substrate 11 used
It is copper foil of the thickness within the scope of 10 μm~100um.
The good heat conductivity of copper foil, and copper foil has thickness small, is readily bent, cheap advantage, is suitable for small
The heating element that amount of heat can be generated in the use processes such as chip, the battery of type electronic product radiates.
In addition, the present embodiment is relative to second embodiment, and it is more preferable using ductility, it is easier to curved copper foil, it can
The suitable size of random change shape package electronic product, the heating element of arbitrary shape, to promote novel heat-conducting material 1
Popularity rate.There is high heat transfer and electromagnetic shielding performance using copper foil, 123 heat of adhesive layer is closely pasted with heating element
It closes, to realize the function of carrying out heat conducting and radiating to heating element.Electromagnetic screen is able to achieve using the electromagnetic wave shielding of copper foil
It covers, to reduce the injury to extraneous human body.
5th embodiment of the invention, as shown in Fig. 2, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；Heat-radiating substrate 11 is rolled copper foil, and the thickness of rolled copper foil is in 10 μm~100um model
In enclosing.
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123.
Specifically, the present embodiment is for one embodiment and second embodiment, what heat-radiating substrate 11 used
It is rolled copper foil of the thickness within the scope of 10 μm~100um.
Rolled copper foil is that copper foil is obtained by the method for extruding, and well, rolled copper foil is not only for the degree resistant to bending of rolled copper foil
Good heat conductivity, and rolled copper foil has for the heat-radiating substrate 11 in third embodiment uses the scheme of copper foil
There is thickness smaller, it is easier to which the advantages of being bent can generate the fever of amount of heat suitable for small-sized electronic product use process
Component radiates.Chip, battery, the circuit board etc. that heating element includes but is not limited to.
In addition, more preferable using ductility, it is easier to which curved rolled copper foil arbitrarily change shape can wrap up electronic product
Suitable size, the heating element of arbitrary shape, to promote the popularity rate of novel heat-conducting material 1.There is height using copper foil
Heat transfer and electromagnetic shielding performance, 123 heat of adhesive layer are closely bonded with heating element, to realize to heating element
Carry out the function of heat conducting and radiating.It is able to achieve electromagnetic shielding using the electromagnetic wave shielding of copper foil, to reduce to extraneous human body
Injury.
6th embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123, and paper
Plate 12 with a thickness of 5 μm；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
The adhesive layer 123 is acrylic resin adhesive.
For the present embodiment unlike above-mentioned one embodiment to the 5th embodiment, adhesive layer 123 uses propylene
Acid resin adhesive, and cardboard 12 with a thickness of 5 μm.
7th embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123, and paper
Plate 12 with a thickness of 10 μm；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
The adhesive layer 123 is acrylic resin adhesive.
The present embodiment is unlike above-mentioned one embodiment to the 5th embodiment, and adhesive layer 123 is using modification
Acrylic resin adhesive, and cardboard 12 with a thickness of 10 μm.
8th embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123, and paper
Plate 12 with a thickness of 10um；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
The adhesive layer 123 is epobond epoxyn.
For the present embodiment unlike above-mentioned one embodiment to the 5th embodiment, adhesive layer 123 uses epoxy
Resin binder, and cardboard 12 with a thickness of 10um.
9th embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123, and paper
Plate 12 with a thickness of 15um；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
The adhesive layer 123 is modified epoxy adhesive.
The present embodiment is unlike above-mentioned one embodiment to the 5th embodiment, and adhesive layer 123 is using modification
Epobond epoxyn, and cardboard 12 with a thickness of 15um.
Tenth embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123, and paper
Plate 12 with a thickness of 25um；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
The adhesive layer 123 is the mixture of acrylic resin adhesive and modified epoxy adhesive.
For the present embodiment unlike above-mentioned one embodiment to the 5th embodiment, adhesive layer 123 uses propylene
The mixture of acid resin adhesive and modified epoxy adhesive, and cardboard 12 with a thickness of 25um.
Tenth one embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123, and paper
Plate 12 with a thickness of 15um；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
The adhesive layer 123 is the mixture of acrylic resin adhesive, epobond epoxyn.
For the present embodiment unlike above-mentioned one embodiment to the 5th embodiment, adhesive layer 123 uses propylene
The mixture of acid resin adhesive, epobond epoxyn, and cardboard 12 with a thickness of 15um.
12nd embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123, and paper
Plate 12 with a thickness of 20um；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
The adhesive layer 123 is acrylic resin adhesive, modified acryl resin binder, epobond epoxyn
Mixture.
For the present embodiment unlike above-mentioned one embodiment to the 5th embodiment, adhesive layer 123 uses propylene
Acid resin adhesive, modified acryl resin binder, epobond epoxyn mixture, and cardboard 12 with a thickness of
20um。
13rd embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123, and paper
Plate 12 with a thickness of 24um；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
The adhesive layer 123 is acrylic resin adhesive, acrylic resin adhesive, modified epoxy adhesive
Mixture.
For the present embodiment unlike above-mentioned one embodiment to the 5th embodiment, adhesive layer 123 uses propylene
Acid resin adhesive, acrylic resin adhesive, modified epoxy adhesive mixture, and cardboard 12 with a thickness of
24um。
14th embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123, and paper
Plate 12 with a thickness of 5um；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
The adhesive layer 123 is the mixture of modified acryl resin binder and modified epoxy adhesive.
The present embodiment is unlike above-mentioned one embodiment to the 5th embodiment, and adhesive layer 123 is using modification
The mixture of acrylic resin adhesive and modified epoxy adhesive, and cardboard 12 with a thickness of 5 μm.
15th embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123, and paper
Plate 12 with a thickness of 5 μm~50um；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
The adhesive layer 123 is acrylic resin adhesive, modified acryl resin binder, epoxy resin bonding
Agent, modified epoxy adhesive mixture.
For the present embodiment unlike above-mentioned one embodiment to the 5th embodiment, adhesive layer 123 uses propylene
Acid resin adhesive, modified acryl resin binder, epobond epoxyn, modified epoxy adhesive mixture,
And cardboard 12 with a thickness of 5 μm~50um.
16th embodiment of the invention, a kind of novel heat-conducting material 1, comprising:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
The another side of the heat-radiating substrate 11 is fitted with insulating layer, and insulating layer is 10um~20um.
Specifically, the present embodiment is unlike above-mentioned one embodiment to the 15th embodiment, heat-radiating substrate 11
Another side be fitted with insulating layer, insulating layer is 10um~20um.General insulating layer is ultra-thin PE film, and PE film thickness has good
Insulating capacity and thermal conductivity.
In addition, setting insulating layer, can when heat-radiating substrate 11 is bonded with the shell of electronic equipment or radiator and to radiate,
Avoid the case where accidental short circuit causes electronic equipment to burn out.The present invention has high reliablity, thermal conductivity height, good insulating, thickness
Small, the advantages that being readily bent, is cheap is spent, the heating element suitable for small-sized electronic product radiates.
17th embodiment of the invention, as shown in figure 3, a kind of production method of novel heat-conducting material 1, including step
It is rapid:
Adhesive is uniformly coated in the one side of heat-radiating substrate 11；
It will uniformly be coated on the heat-radiating substrate 11 of the adhesive and stick cardboard 12, and the facial tissue 122 of the cardboard 12
The back side is close to the heat-radiating substrate 11；
The heat-radiating substrate 11 after the cardboard 12 will be sticked to dry, the adhesive forms adhesive layer 123, so that
The one side of the heat-radiating substrate 11 is bonded to obtain novel with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123
Heat Conduction Material 1.
Specifically, the mode of coating includes but is not limited to film applicator coating, dip-coating method coating, screen printing brushing
Cover, spray coating method coating in any one and it is a variety of.
Preferably, the one side in such a way that spray coating method coating and dip-coating method coating combine in heat-radiating substrate 11 is uniform
Adhesive in coating.
Specific, heat-radiating substrate 11 is iron plate, any one in copper foil, the heat-radiating substrate 11 with a thickness of 10 μm~
100um.Preferably, copper foil is rolled copper foil.
Specifically, the adhesive layer 123 includes acrylic resin adhesive, modified acryl resin binder, epoxy
One of resin binder, modified epoxy adhesive are a variety of, the cardboard 12 with a thickness of 5 μm~50um.
Specifically, in the production technology of novel heat-conducting material 1 of the present invention, since the present invention is coated in adhesive on copper foil
After stick cardboard 12, finally drying is so that adhesive forms adhesive layer 123, to allow the one side of heat-radiating substrate 11 and cardboard 12
The back side of facial tissue 122 obtains novel heat-conducting material 1 by the fitting of adhesive layer 123, and simple process saves production cost.Both
Reduce the investment of material, has also simplified process flow for the production of subsequent aluminum substrate, production cost is greatly saved.
Novel heat-conducting material 1 produced by the present invention when in use, only needs directly by 12 base stock of cardboard of novel heat-conducting material 1
121 package heating elements, since heat-radiating substrate 11 is fitted closely with shell or radiator, in this way, it is possible to make novel lead
Hot material 1 will be conducted from the heat of heating element to from shell or radiator so that the heat of heating element by quickly,
Effective discharge, uses simpler convenience.
In addition, being added for graphite linings in compared with the existing technology, the investment of graphite material can be reduced, is reduced costs simultaneously
The use for reducing graphite, realizes environmental protection, shortens process flow, and ensure that the higher rate of pass and production effect
Rate.
18th embodiment of the invention, as shown in figure 4, a kind of production method of novel heat-conducting material 1, including step
It is rapid:
Adhesive is uniformly coated in the one side of heat-radiating substrate 11；
It will uniformly be coated on the heat-radiating substrate 11 of the adhesive and stick cardboard 12, and the facial tissue 122 of the cardboard 12
The back side is close to the heat-radiating substrate 11；
The heat-radiating substrate 11 after the cardboard 12 will be sticked to dry, the adhesive forms adhesive layer 123, so that
The one side of the heat-radiating substrate 11 is bonded to obtain novel with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123
Heat Conduction Material 1；
Press the heat-radiating substrate 11, the pressure given by gap between idler wheel and idler wheel, make the cardboard 12 with
The heat-radiating substrate 11 passes through intermediate 123 close adhesion of the adhesive layer.
Specifically, in the present embodiment, the present invention for above-mentioned 17th embodiment, through high temperature idler wheel roll with
Just heat-radiating substrate 11 is pressed, the pressure given by gap between idler wheel and idler wheel passes through cardboard 12 with heat-radiating substrate 11
Intermediate 123 close adhesion of adhesive layer ensure that novel to realize that cardboard 12 can be firmly adhered on heat-radiating substrate 11
The service life of 1 finished product of Heat Conduction Material.
The configuration of the present invention is simple coats one layer of adhesive on the upper layer of heat-radiating substrate 11 to make heater element and heat-radiating substrate
11 can completely be bonded, and can efficiently solve the heat dissipation problem of heat dissipation element, and overcome graphite and be easy to fall off, and be promoted
Gap and then the defect to heat up.And light weight, advantage low in cost.
Obviously, those skilled in the art should be understood that each module of the above invention or each step can be with general
Computing device realize that they can be concentrated on a single computing device, or be distributed in multiple computing devices and formed
Network on, optionally, they can be realized with the program code that computing device can perform, it is thus possible to which they are stored
Be performed by computing device in the storage device, perhaps they are fabricated to each integrated circuit modules or by they
In multiple modules or step be fabricated to single integrated circuit module to realize.In this way, the present invention is not limited to any specific
Hardware and software combines.
19th embodiment of the invention, as shown in figure 5, a kind of soft copper pastes, comprising:
Soft copper piece and gum；
The soft copper piece with a thickness of 10 μm~40m, gum with a thickness of 5 μm~20m；
Specifically, soft copper patch is a kind of novel heat-conducting material 1 of the invention in the present embodiment.Soft copper piece in the present embodiment
Heat-radiating substrate 11 as of the invention, gum includes as facial tissue 122 and base stock 121, and the back side of facial tissue 122 is coated with adhesive
The cardboard 12 of layer 123.
When the soft copper of the present embodiment is attached to molding, cross cutting and packaging, it is convenient to cut, and has good bending property, can receive
It is rolled into coiled material, facilitate production and is stored, in finished product use process, any plane and curved surface application can be covered in just
Benefit.In addition, its product structure is simple, mature preparation process, raw material are easy to get, and product heat dissipation performance is moderately good.
20th embodiment of the invention as shown in fig. 7, a kind of phone wrist-watch 5, including watch cell 51 and novel is led
Hot material 1；
The novel heat-conducting material 1 includes:
Heat-radiating substrate 11 and cardboard 12；
The cardboard 12 includes facial tissue 122 and base stock 121, and the back side of the facial tissue 122 is coated with adhesive layer 123；
The one side of the heat-radiating substrate 11 is bonded with the back side of 12 facial tissue 122 of cardboard by the adhesive layer 123；
12 base stock 121 of cardboard of the novel heat-conducting material 1 wraps up the watch cell 51, and the heat-radiating substrate 11 with
Shell or radiator fit closely.
Specifically, cardboard 12 includes facial tissue 122 and base stock 121, base stock 121 is generally common base stock 121, base stock 121
Surface is coated with silicon layer, has barrier action to adhesive.Facial tissue 122 is divided into art paper/PET/PVC etc. by material, and facial tissue
122 back side is coated with adhesive layer 123, and the cardboard 12 in the present embodiment is back bakelized paper, and back bakelized paper is mostly higher with intensity
White board is body paper, and coating adhesive sticker, that is, adhesive layer 123 forms.PP back bakelized paper is a kind of synthesis back bakelized paper, and PP back bakelized paper is just
It is that the back side of PP paper is coated with adhesive layer 123, tears i.e. Pasting, conveniently install and use.
In addition, 12 base stock 121 of cardboard of novel heat-conducting material 1 wraps up the watch cell 51, and the heat-radiating substrate 11
It is fitted closely with shell or radiator, so that novel heat-conducting material 1 will be conducted to shell or be dissipated from the heat of watch cell 51
At hot device, so that the heat of watch cell 51 is quickly and effectively discharged.
Through this embodiment, the quick conduction that heat is realized by heat-radiating substrate 11 and cardboard 12, realizes effective temperature-reducing.By
Graphite linings are not added in centre, since graphite linings are easy occur the case where layering loose powder when falling or colliding, pass through
Adhesive layer 123 is bonded heat-radiating substrate 11 with cardboard 12 11 copper foil of heat-radiating substrate is facilitated to fix, it is not easy to it is existing layering occur
As the stability of novel heat-conducting material 1 is high, greatly prolongs service life relative to graphite cloth patch material, promotes phone hand
The heat dissipation performance of the watch cell 51 of table 5 avoids phone wrist-watch 5 from locating for a long time to greatly improve the heat dissipation effect of phone wrist-watch 5
In the condition of high temperature, and then promote the service life of phone wrist-watch 5.The present invention is high with pyroconductivity, thickness density is controllable, thermal resistance
Low, ultrathin characteristic can promote the heat heat conduction and heat radiation efficiency of the watch cell 51 of phone wrist-watch 5.
It should be noted that above-described embodiment can be freely combined as needed.The above is only of the invention preferred
Embodiment, it is noted that for those skilled in the art, in the premise for not departing from the principle of the invention
Under, several improvements and modifications can also be made, these modifications and embellishments should also be considered as the scope of protection of the present invention.
Claims (10)
1. a kind of novel heat-conducting material, which is characterized in that the novel heat-conducting material includes:
Heat-radiating substrate and cardboard；
The cardboard includes facial tissue and base stock, and the back side of the facial tissue is coated with adhesive layer；
The one side of the heat-radiating substrate is bonded with the back side of the cardboard facial tissue by the adhesive layer.
2. novel heat-conducting material according to claim 1, which is characterized in that the heat-radiating substrate is iron plate, in copper foil
Any one, the heat-radiating substrate with a thickness of 10 μm~100um.
3. novel heat-conducting material according to claim 2, which is characterized in that the copper foil is rolled copper foil.
4. novel heat-conducting material according to claim 1-3, which is characterized in that the adhesive layer includes propylene
One of acid resin adhesive, modified acryl resin binder, epobond epoxyn, modified epoxy adhesive or
It is a variety of, the cardboard with a thickness of 5 μm~50um.
5. a kind of electronic product using novel heat-conducting material, which is characterized in that including heating element and novel heat-conducting material；
The novel heat-conducting material includes:
Heat-radiating substrate and cardboard；
The cardboard includes facial tissue and base stock, and the back side of the facial tissue is coated with adhesive layer；
The one side of the heat-radiating substrate is bonded with the back side of the cardboard facial tissue by the adhesive layer；
The cardboard base stock of the novel heat-conducting material wraps up the heating element, and the heat-radiating substrate and shell or radiator
It fits closely.
6. the electronic product of novel heat-conducting material according to claim 5, which is characterized in that the heat-radiating substrate is iron
Any one in piece, copper foil, the heat-radiating substrate with a thickness of 10 μm~100um.
7. the electronic product of novel heat-conducting material according to claim 6, which is characterized in that the copper foil is calendering copper
Foil.
8. according to the electronic product of the described in any item novel heat-conducting materials of claim 5-7, which is characterized in that the adhesive
Layer includes acrylic resin adhesive, modified acryl resin binder, epobond epoxyn, modified epoxy adhesive
One of or it is a variety of, the cardboard with a thickness of 5 μm~50um.
9. a kind of production method of novel heat-conducting material, which is characterized in that comprising steps of
Adhesive is uniformly coated in the one side of heat-radiating substrate；
Cardboard is sticked by being uniformly coated on the heat-radiating substrate of the adhesive, and the facial tissue back side of the cardboard is dissipated close to described
Hot substrate；
The heat-radiating substrate after the cardboard will be sticked to dry, the adhesive forms adhesive layer, so that the heat dissipation base
The one side of plate is bonded to obtain novel heat-conducting material by the adhesive layer with the back side of the cardboard facial tissue.
10. a kind of production method of novel heat-conducting material according to claim 9, which is characterized in that described to stick institute
Heat-radiating substrate after stating cardboard is dried, and the adhesive forms adhesive layer, so that the one side of the heat-radiating substrate and institute
State the back side of cardboard facial tissue be bonded to obtain after novel heat-conducting material by the adhesive layer comprising steps of
The heat-radiating substrate is pressed, the pressure given by gap between idler wheel and idler wheel makes the cardboard and the heat dissipation
Substrate passes through the intermediate adhesive layer close adhesion.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910819983.4A CN110435279A (en) | 2019-08-31 | 2019-08-31 | Novel heat-conducting material and production method, using the electronic product of novel heat-conducting material |
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| CN201910819983.4A CN110435279A (en) | 2019-08-31 | 2019-08-31 | Novel heat-conducting material and production method, using the electronic product of novel heat-conducting material |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202945195U (en) * | 2012-10-15 | 2013-05-22 | 斯迪克新型材料（江苏）有限公司 | Heat radiating adhesive tape for electronic product |
| CN103879087A (en) * | 2014-04-09 | 2014-06-25 | 太仓泰邦电子科技有限公司 | Heat-conducting copper foil |
| CN205030030U (en) * | 2015-10-12 | 2016-02-10 | 上海光德电子科技有限公司 | Ultra -thin nanometer thermal film material |
-
2019
- 2019-08-31 CN CN201910819983.4A patent/CN110435279A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202945195U (en) * | 2012-10-15 | 2013-05-22 | 斯迪克新型材料（江苏）有限公司 | Heat radiating adhesive tape for electronic product |
| CN103879087A (en) * | 2014-04-09 | 2014-06-25 | 太仓泰邦电子科技有限公司 | Heat-conducting copper foil |
| CN205030030U (en) * | 2015-10-12 | 2016-02-10 | 上海光德电子科技有限公司 | Ultra -thin nanometer thermal film material |
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Application publication date: 20191112 |