CN105744812B - Radiating subassembly and mobile terminal - Google Patents
Radiating subassembly and mobile terminal Download PDFInfo
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- CN105744812B CN105744812B CN201610287064.3A CN201610287064A CN105744812B CN 105744812 B CN105744812 B CN 105744812B CN 201610287064 A CN201610287064 A CN 201610287064A CN 105744812 B CN105744812 B CN 105744812B
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- heat
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- adsorption
- radiating piece
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
Abstract
The present invention discloses a kind of radiating subassembly, including adsorption piece and radiating piece, and adsorption piece includes the joint face and adsorption plane being oppositely arranged, and joint face is set on radiating piece, and adsorption plane is for being adsorbed in device, so that radiating piece radiates to the heat on device.Radiating piece in radiating subassembly provided by the invention is set on the joint face of adsorption piece, again the adsorption plane of adsorption piece is used to press and is set to device, by the air emptying in multiple adsorption holes, enable radiating piece by multiple adsorption hole vacuum suctions on device, and when radiating piece needs to dismount, it only need to make slightly power that can remove radiating piece, radiating piece will not be damaged, radiating piece is repeatedly used, the reliability of radiating subassembly is improved.The present invention also provides a kind of mobile terminals.
Description
Technical field
The present invention relates to a kind of electronic equipment field more particularly to a kind of radiating subassemblies and mobile terminal.
Background technique
With the development of mobile phone industry, mobile phone configuration is higher and higher, central processing unit (Central Processing
Unit/CPU) dominant frequency is higher and higher, and power consumption is increasing, and cell-phone heating amount is caused also accordingly to become larger, if these heats are not up to
To control or transfer, it will bring the influence of two aspects: 1. chip for cell phone temperature are excessively high, cause mobile phone operation slack-off, even
Caton influences the use of mobile phone；2. chip for cell phone temperature is transferred to phone housing, cause skin temperature higher, when use can go out
It now scalds one's hand, scald the problems such as ear.
It is at present in the industry usually to be pasted onto radiating piece in the equipment of heat concentration for the heating problem for solving mobile phone, with
Play the role of soaking and heat dissipation, but after discovery radiating piece is pasted onto equipment when inventor states technical solution on the implementation,
Removed inconvenience, it will usually damage to radiating piece.
Summary of the invention
The purpose of the present invention is to provide one kind to be capable of the radiating subassembly of being dismounted for multiple times and with the movement of the radiating subassembly
Terminal.
It is described in order to solve the above-mentioned technical problems, the present invention provides a kind of radiating subassembly, including adsorption piece and radiating piece
Adsorption piece includes the joint face and adsorption plane being oppositely arranged, and the joint face is set on the radiating piece, and the adsorption plane is used
In being adsorbed on device, so that the radiating piece radiates to the heat on the device.
Wherein, the adsorption plane opens up multiple adsorption holes, and the adsorption piece is adsorbed in described by the multiple adsorption hole
On device.
Wherein, the radiating piece includes the heat absorption heat accumulating of the material properties with heat absorption and heat storage function, the suction
Hot heat accumulating is used to absorb the heat on the device, and the heat absorption heat accumulating stores the heat of absorption.
Wherein, the radiating piece further includes titanate coupling agent and glue-line, the heat absorption heat accumulating and the titanate esters
Coupling agent is mixed and made into flaky material, and the glue-line stacking is covered on the flaky material, and the flaky material passes through described
Glue-line is adhered to the joint face of the adsorption piece.
Wherein, the radiating piece further includes retarder thinner and bonding solution, the heat absorption heat accumulating, the retarder thinner
It mixes and is coated on the joint face of the adsorption piece with the bonding solution.
Wherein, the radiating piece further includes substrate and glue-line, and the heat absorption heat accumulating is coated in the substrate, described
Glue-line stacking is covered on the radiating piece, and the substrate for being coated with the heat absorption heat accumulating is adhered to institute by the glue-line
It states on the joint face of adsorption piece.
Wherein, the radiating piece includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function, described mixed
Condensation material is made of heat absorption heat accumulating and heat conduction and heat radiation material mixing, and the heat conduction and heat radiation material is used for will be on the device
Heat transfer gives the heat absorption heat accumulating, and the heat absorption heat accumulating is for absorbing and storing the heat on the device, together
When store the heat of heat conduction and heat radiation material conduction.
Wherein, the heat absorption heat accumulating and the mass ratio of the heat conduction and heat radiation material are 1:1.
Wherein, the radiating piece further includes titanate coupling agent and glue-line, and the mixing material and the titanate esters are coupled
Agent is mixed and made into flaky material, and the glue-line stacking is covered on the flaky material, and the flaky material passes through the glue-line
It is adhered to the joint face of the adsorption piece.
Wherein, the radiating piece further includes retarder thinner and bonding solution, the mixing material, the retarder thinner and institute
Bonding solution is stated to mix and be coated on the joint face of the adsorption piece.
Wherein, the radiating piece further includes substrate and glue-line, and the mixing material is coated in the substrate, the glue-line
Stacking is covered on the radiating piece, and the substrate for being coated with the mixing material is adhered to the adsorption piece by the glue-line
Joint face on.
Wherein, the heat absorption heat accumulating includes silica and polyethylene glycol, the silica and polyethylene glycol
Mass ratio is 1:1~1:9.
Wherein, the heat absorption heat accumulating by it is several using the silica as cyst wall, using the polyethylene glycol as capsule-core
Micro-capsule constitute.
Wherein, the radiating subassembly further includes protective film, and the protective film is set on the radiating piece, and the protection
Film is located remotely from the side of the joint face of the adsorption piece.
The embodiment of the invention also provides a kind of mobile terminal, including device and radiating subassembly, the absorption of the adsorption piece
Face is adsorbed on the device.
Radiating piece in radiating subassembly provided by the invention is set on the joint face of adsorption piece, then by the absorption of adsorption piece
Face is set to device for pressing, and the air in multiple adsorption holes is emptied, radiating piece is enable to pass through multiple adsorption hole vacuum
It is adsorbed on device, and when radiating piece needs to dismount, only need to make slightly power that can remove radiating piece, heat dissipation will not be damaged
Part enables radiating piece to repeatedly use, and improves the reliability of radiating subassembly.
Detailed description of the invention
In order to illustrate more clearly of technical solution of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without any creative labor, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of schematic diagram for mobile terminal that the embodiment of the present invention one provides；
Fig. 1 a is the schematic diagram of device setting radiating subassembly shown in FIG. 1；
Fig. 2 is a kind of sectional view of radiating subassembly provided by Embodiment 2 of the present invention；
Fig. 3 is a kind of sectional view for radiating subassembly that the embodiment of the present invention three provides；
Fig. 4 is a kind of sectional view for radiating subassembly that the embodiment of the present invention four provides；
Fig. 5 is a kind of sectional view for radiating subassembly that the embodiment of the present invention five provides；
Fig. 6 is a kind of sectional view for radiating subassembly that the embodiment of the present invention six provides；
Fig. 7 is a kind of sectional view for radiating subassembly that the embodiment of the present invention seven provides.
Specific embodiment
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu is fully described by.
The present embodiments relate to mobile terminal can be any equipment for having communication and store function, such as: it is flat
Plate computer, mobile phone, electronic reader, remote controler, personal computer (Personal Computer, PC), laptop, vehicle
Carry the smart machine with network function such as equipment, Web TV, wearable device.
As shown in Fig. 1 and Fig. 1 a, for a kind of mobile terminal 100 that invention first embodiment provides, mobile terminal 100 includes
Device 20 and radiating subassembly 10, radiating subassembly 10 are adsorbed on device 20, to radiate to the heat on device 20, device 20
It can be calorific value biggish device 20, such as rear cover, that is, battery cover, bracket or shielding case etc..It should be understood that radiating subassembly
10 can be set in the whole surface of device 20, can also be set to required region.The present embodiment is with the absorption of radiating subassembly 10
It covers and illustrates after.Specifically, radiating subassembly 10 is set to the first area for being used to carry battery of the inner surface of rear cover
On, it is to radiate to the heat concentrated on first area, so that reducing the fever of rear cover influences.
It should be understood that rear cover opens up multiple thermal holes 21.The mode that thermal hole 21 can be cut by laser processes shape
At so that thermal hole 21 can achieve the sightless effect of naked eyes, to not influence the appearance of rear cover.Thermal hole 21 can be set
In first area, it can also be arranged around first area, preferably be conducted heat to the heat in rear cover, after further increasing
The heat dissipation performance of lid.
Wherein, the specific embodiment of radiating subassembly 10 refers to following embodiment.
Referring to figure 2., a kind of radiating subassembly 30 provided for invention second embodiment, radiating subassembly 30 include adsorption piece 31
With radiating piece 32, for radiating, radiating piece 32 is set on adsorption piece 31 radiating piece 32.
In the present embodiment, adsorption piece 31 includes the joint face 311 and adsorption plane 312 being oppositely arranged, and radiating piece 32 is arranged
In on the adsorption plane 312 of adsorption piece 31, adsorption plane 312 is adsorbed on device.It should be understood that adsorption plane 312 opens up multiple suctions
Attached hole 312a, radiating piece 32 are adsorbed on device by multiple adsorption hole 312a.Specifically, adsorption piece 31 is cushion, adsorption plane
312 arrays open up the adsorption hole 312a of multiple semicircles, and radiating piece 32 is set on the joint face 311 of adsorption piece 31, then will absorption
The pressure of adsorption plane 312 of part 31 is set on device, and the air in multiple adsorption hole 312a is emptied, enables radiating piece 32 by more
A adsorption hole 312a vacuum suction is on first area.When radiating piece 32 needs to dismount, only it need to make power that can will radiate slightly
Part 32 is removed, and radiating piece 32 will not be damaged, and 32 component of radiating piece is repeatedly used, improve radiating subassembly 30 can
By property.Certainly, in other embodiments, device can also open up the adsorption hole of multiple semicircles, and adsorption plane is extruded in multiple absorption
Kong Zhong, so that adsorption piece is adsorbed on device.Specifically, adsorption plane is plane, by multiple adsorption holes of adsorption plane respective devices
It is squeezed, the air of the adsorption hole on device is discharged, to realize the vacuum suction of radiating piece and device.
In the present embodiment, radiating piece 32 includes the heat absorption heat accumulating of the material properties with heat absorption and heat storage function,
Heat absorption heat accumulating is used to absorb the heat on device, and the heat accumulating that absorbs heat stores the heat of absorption.
By the way that radiating subassembly 30 is arranged on device, the radiating piece 32 in radiating subassembly 30 includes having heat absorption and heat accumulation function
The heat absorption heat accumulating of energy can absorb the heat on device, and by heat storage at itself, when the temperature of device
After lowering, the heat of storage is slowly dispersed into air, so that the heat of device is reduced, so that with the device
Mobile terminal has preferable heat dissipation performance, improves the reliability that equipment uses, reduces the influence generated heat to device.
In the present embodiment, heat absorption heat accumulating can be a kind of phase-change material, can change with temperature change
Physical property simultaneously can absorb a large amount of heat, and with the increase of the heat of absorption, the heat accumulating that absorbs heat is gradated from a kind of phase
For another phase, another phase of maintenance can be stablized after the sufficient heat of absorption and no longer absorbed heat, and working as on device does not have heat source
Or heat it is lower when, heat absorption heat accumulating carry out heat dissipation and gradually with the reduction of heat by another kind be mutually gradually recovered as original
The phase come.Wherein, heat absorption heat accumulating can change from solid phase to liquid phase or liquid phase to solid phase with the variation of temperature, or solid
Perhaps liquid phase changes opposite gas phase to solid phase or liquid phase is to gas phase or gas phase to liquid phase.
It should be understood that the shape of radiating piece 32 and the shape of device match, when the heat of device reaches certain temperature
When, heat absorption heat accumulating carries out heat absorption and heat accumulation to the heat on device, to cool down to device.
In order to further improve, heat absorption heat accumulating preferably comprise the silica that mass ratio is 1:1~1:9 and
Polyethylene glycol.Inventor obtains through a large number of experiments, and silica and polyethylene glycol are mixed with mass ratio for 1:1~1:9
Can organic-composite phase-change material obtained there is suitable phase transition temperature, the heat of device can be absorbed in time, come further
Improve the reliability of device.Specifically, the phase transition temperature that the heat absorption heat accumulating is mixed to prepare is 40 degree, i.e., generated in device
After heat reaches 40 degree, heat absorption heat accumulating carries out decalescence, the heat of device is taken away, to cool down to device.When
So, in other embodiments, heat absorption heat accumulating can also be inorganic phase-changing material or composite phase-change material etc..
In order to further improve, heat absorption heat accumulating by it is several using silica as cyst wall, using polyethylene glycol as capsule
The micro-capsule of core is constituted.The heat absorption heat accumulating of the microcapsule structure preferably can carry out heat absorption heat accumulation to device, and then reach preferable
Heat dissipation performance.Specifically, polyethylene glycol is added in certain density silica solution, after all dissolutions, CaCl is added dropwise2Promote
Solidifying agent solution, so that sol gel reaction occurs in silica solution for polyethylene glycol, is formed three-dimensional under strong stirring after standing
Network structure gel；By gel in 80 DEG C of baking ovens 24~48h of forced air drying, be cooled to room temperature, can access with organosilicon
Oxygen compound generate under alkaline condition it is a large amount of using silica dioxide gel as cyst wall, using emulsify after polyethylene glycol as capsule-core
Micro-capsule.I.e. in each micro-capsule, silica wraps the polyethylene glycol as capsule-core as cyst wall so that polyethylene glycol from
It will not be leaked during solid-liquid, can be good at being lived by Silica-coated.The heat absorption of the formation microcapsule structure is stored up
Hot material after the heat of device reaches 40 degree, start absorb device on heat, and capsule-core itself with heat gradually
Increase gradually from solid-liquid, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating absorbs has been saturated, and is stopped
Heat is only absorbed, and after the temperature of device is gradually decrease to preset temperature, capsule-core gradually can be converted to solid phase from liquid phase, simultaneously
Capsule-core is by the heat of absorption (since heat absorption heat accumulating can take away a part in the phase transition process that capsule-core is transformed from the solidified state into liquid
Latent heat, so when capsule-core in heat very little) gradually come out, be transmitted in air, this moment, extremely by above-mentioned solid phase
The circulation of liquid phase is converted, to cool down to device, improves the heat dissipation performance and reliability with the device of the radiating subassembly.
Certainly, in other embodiments, heat absorption heat accumulating can also be other structures, and heat absorption heat accumulating is passed through from admittedly
Mutually to cool down to device to the circulation conversion of gas phase.
As shown in Fig. 2, radiating piece 32 further includes titanate coupling agent and glue-line 322, heat absorption in order to further improve
Heat accumulating and titanate coupling agent are mixed and made into flaky material 321, and the stacking of glue-line 322 is covered on flaky material 321, sheet
Material 321 is adhered on the joint face 311 of adsorption piece 31 by glue-line 322, then is adsorbed in by the adsorption plane 312 of adsorption piece 31
On the joint face 311 of adsorption piece 31.
In the present embodiment, heat absorption heat accumulating is smashed to pieces and strong stirring obtains powder, due to powder diameter much
Greater than the diameter of each micro-capsule, therefore the microcapsule structure in heat absorption heat accumulating will not be destroyed, that is, will not influence heat absorption heat accumulation material
The heat absorption heat storage function of material, powdered heat absorption heat accumulating addition titanate coupling agent hydrophobically modified obtain it is inorganic intend it is organic
Composite shape-setting phase-change material, then it is sheet that flake, which is made, through tabletting machine in the inorganic quasi- organic composite shaping phase-change material
Connection upper glue layer 322 is laminated again and forms radiating piece 32 for material 321, flaky material 321.It should be understood that glue-line 322 can be back
Glue, double-sided adhesive or release film etc..The flaky material 321 of radiating piece 32 can be cut into certain shapes according to the shape of device, answer
It with more convenient, is fitted on device without waiting for the phase, realizes the function of heat absorption heat accumulation.
In order to further improve, radiating subassembly 30 further includes protective film 33, and protective film 33 is set on radiating piece 32,
And protective film 33 is located remotely from the side of the adsorption plane 312 of adsorption piece 31.
It is further increased scattered by the way that protective film 33 is arranged on radiating piece 32 with further being protected to radiating piece 32
The reliability of hot component 30.
In the present embodiment, protective film 33 is polyethylene terephthalate (PET), and stacking is covered on flaky material
On 321, and it is opposite with glue-line 322, protective film 33 further can carry out shaping flaky material 321 and with dust-proof work
With.Certainly, in other embodiments, the material of protective film 33 can also be other, such as silica gel.
As shown in figure 3, the radiating subassembly 230 provided for third embodiment of the invention, the radiating subassembly 230 and the present invention the
The basic structure for the radiating subassembly 30 that one embodiment provides is roughly the same, the difference is that, the radiating piece in the present embodiment
232 include heat radiator material, retarder thinner and bonding solution, and heat absorption heat accumulating, retarder thinner and the mixing of bonding solution are simultaneously
It is coated on the joint face 2311 of adsorption piece 231.
By the way that retarder thinner, bonding solution and heat absorption heat accumulating are mixed to form radiating piece 232, so that radiating piece 232
Directly there is adhesive force, can be coated on the joint face 2311 of adsorption piece 231 without still further increasing glue-line, to provide
It is a kind of to use advantageously radiating piece 232.
In the present embodiment, heat absorption heat accumulating is smashed to pieces and strong stirring obtains powder, due to powder diameter much
Greater than the diameter of each micro-capsule, therefore the microcapsule structure in heat absorption heat accumulating will not be destroyed, that is, will not influence heat absorption heat accumulation material
The heat absorption heat storage function of material is added to retarder thinner and addition special binder solution mixing in powdered heat absorption heat accumulating
(such as: methanol dimethylbenzene, acrylic resin etc.), so that radiating piece 232 has adhesive force, radiating piece 232 is directlyed adopt into painting
The form of cloth is piled into certain thickness and is attached on the joint face 2311 of adsorption piece 231, to realize the function of heat absorption heat accumulation.
In order to further improve, radiating subassembly 230 further includes protective film 233, and protective film 233 is set to radiating piece
On 232, and protective film 233 is located remotely from the side of adsorption piece 231.
It is further increased by the way that protective film 233 is arranged on radiating piece 232 with further being protected to radiating piece 232
The reliability of radiating subassembly 230.
In the present embodiment, protective film 233 is polyethylene terephthalate (PET).Wherein, straight in radiating piece 232
After connecing on the joint face 2311 for be coated on adsorption piece 231, protective film 233 is set on radiating piece 232.Protective film 233 can
Further radiating piece 232 is carried out shaping and is had the function of dust-proof.Certainly, in other embodiments, the material of protective film 233
Can also be to be other, such as silica gel.
As shown in figure 4, the radiating subassembly 330 provided for fourth embodiment of the invention, the radiating subassembly 330 and the present invention the
The basic structure for the radiating subassembly 30 that one embodiment provides is roughly the same, the difference is that, which includes heat absorption
Heat sink material 3321, substrate 3322 and glue-line 3323, heat absorption heat accumulating 3321 are coated in substrate 3322, and glue-line 3323 is laminated
It is connected on heat absorption heat accumulating 3321, and glue-line 3323 is adhered on the joint face 3311 of adsorption piece 331.
It is formed by the way that directly heat absorption heat accumulating 3321 is coated in substrate 3322, then is set in heat absorption heat accumulating 3321
Glue-line 3323 is set to be pasted on the joint face 3311 of adsorption piece 331, tabletting is carried out without tablet press machine, makes relatively simple.
In the present embodiment, substrate 3322 is polyethylene terephthalate (PET), and heat absorption heat accumulating 4321 is smash
Broken and strong stirring obtains powder, since the diameter of powder is far longer than the diameter of micro-capsule, will not destroy heat absorption heat accumulation material
Microcapsule structure in material 3321 will not influence the heat absorption heat storage function of heat absorption heat accumulating 3321, powdered heat absorption is stored up
Hot material 3321 is directly coated in substrate 3322 and forms, and will there is the substrate 3322 of heat absorption heat accumulating 3321 to pass through glue-line
3323 are adhered on the joint face 3311 of adsorption piece 331, realize the heat absorption heat storage function of radiating piece 332.It should be understood that glue-line
3323 can be gum, double-sided adhesive or other etc..
In order to further improve, radiating subassembly 330 further includes protective film 333, and protective film 333 is set to radiating piece
On 332, and it is located remotely from the side of adsorption piece 331.
It is further increased by the way that protective film 333 is arranged on radiating piece 332 with further being protected to radiating piece 332
The reliability of radiating subassembly 330.
In the present embodiment, protective film 333 is polyethylene terephthalate (PET).Protective film 333 is set to base
On bottom 3322.Protective film 333 can further carry out shaping radiating piece and have the function of dust-proof.Certainly, in other implementations
In example, the material of protective film 333 can also be other, such as silica gel.
Referring to Fig. 5, for a kind of radiating subassembly 40 that the 5th embodiment of invention provides, radiating subassembly 40 includes adsorption piece 41
With radiating piece 42, for radiating, radiating piece 42 is set on adsorption piece 41 radiating piece 42.
In the present embodiment, adsorption piece 41 includes the joint face 411 and adsorption plane 412 being oppositely arranged, and radiating piece 42 is arranged
In on adsorption piece 41, adsorption plane 412 is adsorbed on device.It should be understood that adsorption plane 412 opens up multiple adsorption hole 412a, dissipate
Warmware 42 is adsorbed on device by multiple adsorption hole 412a.Specifically, adsorption piece 41 is cushion, 412 array of adsorption plane is opened up
The adsorption hole 412a of multiple semicircles, radiating piece 42 are set on the joint face 411 of adsorption piece 41, then by the adsorption plane of adsorption piece 41
412 pressures are set on device, and the air in multiple adsorption hole 412a is emptied, radiating piece 42 is enable to pass through multiple adsorption hole 412a
Vacuum suction is on device.When radiating piece 42 needs to dismount, it only need to make power that can remove radiating piece 42 slightly, will not damage
Radiating piece 42 improves the reliability of radiating subassembly 40 so that 42 shell of radiating piece repeatedly uses.Certainly, in other embodiments
In, device can also open up the adsorption hole 412a of multiple semicircles, and adsorption plane 412 is extruded in multiple adsorption hole 412a, so as to inhale
Attachment 41 is adsorbed on device.Specifically, adsorption plane 412 is plane, by multiple adsorption hole 412a of 412 respective devices of adsorption plane
It is squeezed, the air of the adsorption hole 412a on device is discharged, to realize the vacuum suction of radiating piece 42 and device.
In the present embodiment, radiating piece 42 includes the mixing material of the material properties with heat absorption, heat accumulation and heat sinking function,
Mixing material is made of heat absorption heat accumulating and heat conduction and heat radiation material mixing, and heat conduction and heat radiation material is used to pass the heat on device
Heat absorption heat accumulating is passed, heat absorption heat accumulating is used to absorb and the heat on memory device, while storing heat conduction and heat radiation material
The heat of conduction.
Radiating subassembly 40 provided by the invention includes the mixing material with heat absorption, heat accumulation and heat sinking function, mixing material
It being mixed by heat absorption heat accumulating and heat conduction and heat radiation material, heat absorption heat accumulating is used to absorb and the heat on memory device,
Heat conduction and heat radiation material is accelerated heat absorption heat accumulating to the absorption of the heat on device and is distributed simultaneously, using mixing material to device
On heat absorbed heat, heat accumulation and heat dissipation, so as to reduce the temperature of device, to guarantee that there is the mobile terminal of the device
It operates normally, while passing through the effect of heat accumulation and heat dissipation, it can be excessively high to avoid device temperature.
It should be understood that mixing material is mixed to form by heat conduction and heat radiation material and heat absorption heat accumulating, absorb heat heat accumulation
Material is the material of the material properties with heat absorption and heat storage function, and the mass ratio for heat accumulating and the heat conduction and heat radiation material of absorbing heat is
1:1.Heat absorption and heat accumulation are carried out by the heat absorption heat accumulating that the mixing material in radiating piece 42 is included, it can be on device
Heat is absorbed and is stored in heat absorption heat accumulating, to reduce the temperature of device, and can be to avoid by storage heat
Heat is directly delivered to phone housing；By the heat conduction and heat radiation material that the mixing material in radiating piece 42 is included carry out heat transfer and
Heat dissipation can accelerate the heat absorption to heat absorption heat accumulating to device, after heat absorption heat accumulating is absorbed into sufficient heat, and can
To radiate to the heat in heat absorption heat accumulating, the cooling effect to device is further enhanced.
It should be understood that heat absorption heat accumulating can be a kind of phase-change material, object can be changed with temperature change
Rationality matter simultaneously can absorb a large amount of heat, with the increase of the heat of absorption, absorb heat heat accumulating from a kind of phase gradate for
It is another mutually and the heat that no longer absorbs heat, and absorb can be with to stablize maintenance after absorbing sufficient heat for another phase
Absorb heat heat accumulating phase transformation and take away a part of latent heat, and when not having heat or lower heat on device, absorb heat heat accumulation
Material carries out heat dissipation and is gradually mutually gradually recovered by another kind as original phase with the reduction of heat.Wherein, absorb heat heat accumulation material
Material can be as perhaps liquid phase changes to solid phase or solid phase is to gas phase or liquid phase to solid phase from solid phase to liquid phase for the variation of temperature
Transformation or liquid phase are to gas phase or gas phase to liquid phase.
Optionally, heat absorption heat accumulating preferably comprises the silica and polyethylene glycol that mass ratio is 1:1~1:9.Hair
Bright people obtains through a large number of experiments, and silica and polyethylene glycol are mixed and obtained can be had for 1:1~1:9 with mass ratio
Machine-composite phase-change material has suitable phase transition temperature, can absorb the heat of device, in time to further increase device and shifting
The reliability of dynamic terminal.Specifically, the phase transition temperature that the heat absorption heat accumulating is mixed to prepare is 40 degree, i.e., concentrated on device
After heat reaches 40 degree, heat absorption heat accumulating carries out decalescence, the heat of device is taken away, to cool down to device.When
So, in other embodiments, heat absorption heat accumulating can also be inorganic phase-changing material or composite phase-change material etc..
Preferably, heat absorption heat accumulating is made of using silica as cyst wall, by the micro-capsule of capsule-core of polyethylene glycol several.
The heat absorption heat accumulating of the microcapsule structure preferably can carry out heat absorption heat accumulation to device, and then reach preferable heat dissipation performance.Tool
Body, the process of production heat absorption heat accumulating are as follows: polyethylene glycol is added in certain density silica solution, to whole dissolutions
Afterwards, CaCl is added dropwise2Accelerator solution, under strong stirring, so that sol gel reaction occurs in silica solution for polyethylene glycol,
Three-dimensional net structure gel is formed after standing；By gel in 80 DEG C of baking ovens 24~48h of forced air drying, be cooled to room temperature, can
Access using organo-siloxane compound generate under alkaline condition it is a large amount of using silica dioxide gel as cyst wall, with poly- after emulsifying
Ethylene glycol is the micro-capsule of capsule-core.I.e. in each micro-capsule, silica wraps the polyethylene glycol as capsule-core as cyst wall, makes
Obtaining polyethylene glycol will not leak during from solid-liquid, can be good at being lived by Silica-coated.The micro- glue of the formation
After heat of the heat absorption heat accumulating of capsule structure on device reaches 40 degree, start to absorb the heat on device, and capsule-core sheet
Body is gradually increased with heat gradually from solid-liquid, after capsule-core is converted to liquid phase, the heat of heat absorption heat accumulating absorption
Amount has been saturated, and stops absorbing heat, and after the temperature on device is gradually decrease to preset temperature, capsule-core can be gradually from liquid
Mutually be converted to solid phase, at the same capsule-core by the heat of absorption (since heat absorption heat accumulating is transformed from the solidified state into capsule-core the phase of liquid
Change process can take away a part of latent heat, so when capsule-core in heat very little) gradually come out, be transmitted in air,
This moment, it is converted by the circulation of above-mentioned solid phase to liquid phase, to cool down to device, improves the mobile terminal with device
Heat dissipation performance and reliability.Wherein, heat transfer and heat dissipation performance of the heat conduction and heat radiation material in mixing material due to itself, Neng Goujia
Absorption of the speed heat absorption heat accumulating to the heat of device, enables the heat on device quickly to reduce, and store up in heat absorption
Hot material carries out exothermic process, also Quick diffusing can be carried out to the heat on heat absorption heat accumulating, to realize mixing material
Expect the fast cooling to device.Certainly, in other embodiments, heat absorption heat accumulating can also be other structures, so that heat absorption
Heat accumulating can cool down to device by converting from the circulation for being solid to gas phase.
It should be understood that heat conduction and heat radiation material can be the preferable materials of heat dissipation performances such as graphite or metal.Wherein, it leads
Hot heat sink material is preferably graphite, and quality is softer to be easily worked.The manufacturing process of mixing material specifically: by the heat accumulation material that absorbs heat
Material is smashed to pieces and strong stirring obtains powder, since the diameter of powder is far longer than the diameter of each micro-capsule, will not destroy suction
Microcapsule structure in hot heat accumulating will not influence the heat absorption heat storage function of heat absorption heat accumulating；It will smash to pieces into again powdered
Heat conduction and heat radiation material and powdered heat absorption heat accumulating be mixed to form mixing material inhaled so that mixing material has
Heat, the function of heat accumulation and heat dissipation.
Further, radiating subassembly 40 further includes titanate coupling agent and glue-line 422, mixing material and titanate coupling agent
It is mixed and made into flaky material 421, the stacking of glue-line 422 is covered on flaky material 421, and flaky material 421 is bonded by glue-line 422
In on the joint face 411 of adsorption piece 41.
By the way that mixing material and titanate coupling agent are mixed and made into flaky material 421, then pass through the stacking connection of glue-line 422
In forming radiating piece 42 on flaky material 421, radiating piece 42 is not only enabled to go to be cut according to the shape of device, in turn
There can be preferably cooperation with heat dissipation, can be absorbed heat to each position of heat dissipation, heat accumulation and heat dissipation, further to heat dissipation
Cool down, improves the heat dissipation performance and reliability of heat dissipation, and the application of radiating piece 42 of sheet is more convenient, is directly stained with i.e.
Can, coating is cooled into without waiting for it.
In the present embodiment, titanate coupling agent hydrophobically modified will be added in mixing material to obtain inorganic quasi- organic composite and determine
Shape phase-change material, then it is flaky material that flake, which is made, through tabletting machine in the inorganic quasi- organic composite shaping phase-change material
421, the formation radiating subassembly 40 of adsorption plane 412 that connection upper glue layer 422 is pasted on adsorption piece 41 is laminated in flaky material 421 again.It can
With understanding, glue-line 422 can be gum, double-sided adhesive or release film etc..Radiating piece 42 can be cut into according to the shape of device
Certain shapes is fitted on device, realizes the function of heat absorption, heat accumulation and heat dissipation.
In order to further improve, radiating subassembly 40 further includes protective film 43, and protective film 43 is set on radiating piece 42,
And protective film 43 is located remotely from the side of the joint face 411 of adsorption piece 41.
It is further increased scattered by the way that protective film 43 is arranged on radiating piece 42 with further being protected to radiating piece 42
The reliability of hot component 40.
In the present embodiment, protective film 43 is polyethylene terephthalate (PET), and stacking is connected to flaky material
On 421, and it is opposite with glue-line 422, protective film 43 further can carry out shaping flaky material 421 and with dust-proof work
With.Certainly, in other embodiments, the material of protective film 433 can also be other, such as silica gel, graphite.
As shown in fig. 6, for a kind of radiating subassembly 240 that invention sixth embodiment provides, the radiating subassembly 240 and the present invention
The basic structure for the radiating subassembly 40 that 5th embodiment provides is roughly the same, the difference is that, the heat dissipation in the present embodiment
Component 240 includes mixing material, retarder thinner and bonding solution, and mixing material, retarder thinner and bonding solution are mixed and is coated with
In on the joint face 2411 of adsorption piece 241.
By the way that retarder thinner, bonding solution and mixing material are mixed to form radiating piece 242, so that radiating piece 242 is direct
With adhesive force, can be coated on the joint face 2411 of adsorption piece 241 without still further increasing glue-line, to provide one kind
Use advantageously radiating subassembly 240.
In the present embodiment, by mixing material be added to retarder thinner and addition special binder solution mix (such as: methanol
Dimethylbenzene, acrylic resin etc.) so that radiating piece 242 has adhesive force, radiating piece 242 is directlyed adopt to the form heap of coating
Product is attached on the joint face 2411 of adsorption piece 241 at certain thickness, to realize the function of heat absorption, heat accumulation and heat dissipation.
In order to further improve, radiating subassembly 240 further includes protective film 243, and protective film 243 is set to radiating piece
On 242, and protective film 243 is located remotely from the side of adsorption piece 241.
It is further increased by the way that protective film 243 is arranged on radiating piece 242 with further being protected to radiating piece 242
The reliability of radiating subassembly 240.
In the present embodiment, protective film 243 is polyethylene terephthalate (PET).Wherein, straight in radiating piece 242
After connecing on the joint face 2411 for be coated on adsorption piece 241, protective film 243 is set on radiating piece 242.Protective film 243 can
Further radiating piece 242 is carried out shaping and is had the function of dust-proof.Certainly, in other embodiments, the material of protective film 243
Can also be to be other, such as silica gel.
As shown in fig. 7, for a kind of radiating subassembly 340 that the 7th embodiment of invention provides, the radiating subassembly 340 and the present invention
The basic structure for the radiating subassembly 40 that 5th embodiment provides is roughly the same, the difference is that, the heat dissipation in the present embodiment
Part 342 includes mixing material 3421, substrate 3422 and glue-line 3423, and radiating piece 342 is that mixing material 3421 is coated on substrate
On 3422, the stacking of glue-line 3423 is connected in mixing material 3421, and glue-line 3423 is adhered to the joint face 3411 of adsorption piece 341
On.
It is formed by the way that directly mixing material 3421 is coated in substrate 3422, then in radiating piece 342 i.e. mixing material
Glue-line 3423 is set on 3421 to be pasted on the joint face 3411 of adsorption piece 341, carries out tabletting without tablet press machine, production is more
Simply.
In the present embodiment, substrate 3422 is polyethylene terephthalate (PET), and mixing material 3421 is smashed to pieces simultaneously
Strong stirring obtains powder, since the diameter of powder is far longer than the diameter of micro-capsule, will not destroy in heat absorption heat accumulating
Microcapsule structure, that is, will not influence the heat absorption heat storage function of mixing material 3421, powdered mixing material 3421 directly applied
It is distributed in substrate 3422 and forms, the substrate 3422 with mixing material 3421 is adhered to adsorption piece 341 by glue-line 3423
On joint face 3411, the heat absorption heat storage function of radiating piece 342 is realized.It should be understood that glue-line 3423 can be gum, double-sided adhesive
Or it is other etc..
In order to further improve, radiating subassembly 340 further includes protective film 343, and protective film 343 is set to radiating piece
On 342, and it is located remotely from the side of adsorption piece 341.
It is further increased by the way that protective film 343 is arranged on radiating piece 342 with further being protected to radiating piece 342
The reliability of radiating subassembly 340.
In the present embodiment, protective film 343 is polyethylene terephthalate (PET).Protective film 343 is set to base
On bottom 3422.Protective film 343 can further carry out shaping radiating piece 342 and have the function of dust-proof.Certainly, in other realities
It applies in example, the material of protective film 343 can also be other, such as silica gel.
It is the preferred embodiment of the present invention above, it is noted that for those skilled in the art,
Various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as this hair
Bright protection scope.
Claims (12)
1. a kind of radiating subassembly, which is characterized in that including adsorption piece and radiating piece, the adsorption piece includes the connection being oppositely arranged
Face and adsorption plane, the joint face are set on the radiating piece, and the adsorption plane is for being adsorbed in device, so that described dissipate
Warmware radiates to the heat on the device；Adsorption piece is cushion, and adsorption plane array opens up the adsorption hole of multiple semicircles, is dissipated
Warmware is set on the joint face of adsorption piece, then the absorption face pressure of adsorption piece is set on device, by the sky in multiple adsorption holes
Gas emptying, enables radiating piece by multiple adsorption hole vacuum suctions on the device；
Multiple thermal holes are opened up on device, the mode that thermal hole is cut by laser processes to be formed, so that thermal hole can achieve
Visually sightless effect；
The radiating piece includes the heat absorption heat accumulating of the material properties with heat absorption and heat storage function, the heat absorption heat accumulating
For absorbing the heat on the device, and the heat absorption heat accumulating stores the heat of absorption；
The heat absorption heat accumulating is smashed and is stirred to get to pieces powder, and the diameter of the powder is greater than the diameter of each micro-capsule, institute
The production method for stating micro-capsule are as follows: the polyethylene glycol after emulsification is added in certain density silica solution, after all dissolutions, drop
Add CaCl2Accelerator solution, under strong stirring, so that sol gel reaction occurs in silica solution for polyethylene glycol, after standing
Form three-dimensional net structure gel；By gel in 80 DEG C of baking ovens 24~48h of forced air drying, be cooled to room temperature, can access
Using organo-siloxane compound generate under alkaline condition it is a large amount of using silica dioxide gel as cyst wall, with emulsify after polyethylene glycol
For the micro-capsule of capsule-core；
In each micro-capsule, silica wraps the polyethylene glycol as capsule-core as cyst wall, so that polyethylene glycol is from admittedly
It will not be leaked during phase-liquid phase, can be good at being lived by Silica-coated；
The heat absorption heat accumulating of the formation microcapsule structure starts to absorb the heat on device after the heat of device reaches 40 degree
Amount, and capsule-core gradually increasing gradually from solid-liquid with heat itself, after capsule-core is converted to liquid phase, heat absorption storage
The heat that hot material absorbs has been saturated, and stops absorbing heat, and after the temperature of device is gradually decrease to preset temperature, capsule
Core is gradually converted to solid phase from liquid phase, while capsule-core gradually comes out the heat of absorption, is transmitted in air, by above-mentioned
It is solid to the circulation conversion of liquid phase, is cooled down to device.
2. radiating subassembly according to claim 1, which is characterized in that the radiating piece further includes titanate coupling agent and glue
Layer, the heat absorption heat accumulating and the titanate coupling agent are mixed and made into flaky material, and the glue-line stacking is covered on described
On flaky material, the flaky material is adhered to the joint face of the adsorption piece by the glue-line.
3. radiating subassembly according to claim 1, which is characterized in that the radiating piece further includes retarder thinner and bonds molten
Liquid, the heat absorption heat accumulating, the retarder thinner and the bonding solution mix and are coated on the joint face of the adsorption piece
On.
4. radiating subassembly according to claim 1, which is characterized in that the radiating piece further includes substrate and glue-line, described
Heat absorption heat accumulating is coated in the substrate, and the glue-line stacking is covered on the radiating piece, and is coated with the heat absorption
The substrate of heat accumulating is adhered on the joint face of the adsorption piece by the glue-line.
5. radiating subassembly according to claim 1, which is characterized in that the radiating piece includes with heat absorption, heat accumulation and dissipating
The mixing material of the material properties of heat function, the mixing material are made of heat absorption heat accumulating and heat conduction and heat radiation material mixing,
The heat conduction and heat radiation material is used for the heat transfer on the device to the heat absorption heat accumulating, the heat absorption heat accumulating
For absorbing and storing the heat on the device, while storing the heat of the heat conduction and heat radiation material conduction.
6. according to radiating subassembly described in claim or 5, which is characterized in that the heat absorption heat accumulating and the heat conduction and heat radiation
The mass ratio of material is 1:1.
7. radiating subassembly according to claim 6, which is characterized in that the radiating piece further includes titanate coupling agent and glue
Layer, the mixing material and the titanate coupling agent are mixed and made into flaky material, and the glue-line stacking is covered on the sheet
On material, the flaky material is adhered to the joint face of the adsorption piece by the glue-line.
8. radiating subassembly according to claim 6, which is characterized in that the radiating piece further includes retarder thinner and bonds molten
Liquid, the mixing material, the retarder thinner and the bonding solution are mixed and are coated on the joint face of the adsorption piece.
9. radiating subassembly according to claim 6, which is characterized in that the radiating piece further includes substrate and glue-line, described
Mixing material is coated in the substrate, and the glue-line stacking is covered on the radiating piece, and is coated with the mixing material
Substrate be adhered to by the glue-line on the joint face of the adsorption piece.
10. radiating subassembly according to claim 1 or 5, which is characterized in that the heat absorption heat accumulating includes silica
And polyethylene glycol, the mass ratio of the silica and polyethylene glycol are 1:1~1:9.
11. radiating subassembly according to claim 1 or 5, which is characterized in that the radiating subassembly further includes protective film, institute
It states protective film to be set on the radiating piece, and the protective film is located remotely from the side of the joint face of the adsorption piece.
12. a kind of mobile terminal, which is characterized in that the heat dissipation group including device and as described in claim 1 to 11 any one
Part, the adsorption plane of the adsorption piece are adsorbed on the device.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287064.3A CN105744812B (en) | 2016-04-29 | 2016-04-29 | Radiating subassembly and mobile terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287064.3A CN105744812B (en) | 2016-04-29 | 2016-04-29 | Radiating subassembly and mobile terminal |
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| CN105744812B true CN105744812B (en) | 2018-12-11 |
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| US6700315B2 (en) * | 2001-08-03 | 2004-03-02 | Samsung Sdi Co., Ltd. | Plasma display device having efficient heat conductivity |
| CN1545121A (en) * | 2003-11-26 | 2004-11-10 | 友达光电股份有限公司 | Plasma display capable of adding application degree between plasma display panel and cooling plate |
| CN103374333A (en) * | 2012-04-13 | 2013-10-30 | 南京德朔实业有限公司 | Composite phase change material |
| CN104449590A (en) * | 2014-12-05 | 2015-03-25 | 中国工程物理研究院化工材料研究所 | Phase-change energy-storage material nanocapsule and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1322091C (en) * | 2006-01-06 | 2007-06-20 | 华南理工大学 | Process for preparing compound forming phase changing material of polyethyldiol/silicon dioxide |
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2016
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6700315B2 (en) * | 2001-08-03 | 2004-03-02 | Samsung Sdi Co., Ltd. | Plasma display device having efficient heat conductivity |
| CN1545121A (en) * | 2003-11-26 | 2004-11-10 | 友达光电股份有限公司 | Plasma display capable of adding application degree between plasma display panel and cooling plate |
| CN103374333A (en) * | 2012-04-13 | 2013-10-30 | 南京德朔实业有限公司 | Composite phase change material |
| CN104449590A (en) * | 2014-12-05 | 2015-03-25 | 中国工程物理研究院化工材料研究所 | Phase-change energy-storage material nanocapsule and preparation method thereof |
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| CN105744812A (en) | 2016-07-06 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |