CN109246997A - A kind of flexible heat structure and electronic product - Google Patents
A kind of flexible heat structure and electronic product Download PDFInfo
- Publication number
- CN109246997A CN109246997A CN201811280431.2A CN201811280431A CN109246997A CN 109246997 A CN109246997 A CN 109246997A CN 201811280431 A CN201811280431 A CN 201811280431A CN 109246997 A CN109246997 A CN 109246997A
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- Prior art keywords
- heat
- flexible
- accommodation space
- electronic product
- flexibility
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- 238000007789 sealing Methods 0.000 claims abstract description 33
- 230000004308 accommodation Effects 0.000 claims abstract description 30
- 239000007770 graphite material Substances 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 239000012528 membrane Substances 0.000 claims abstract description 16
- 239000000126 substance Substances 0.000 claims abstract description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 239000006260 foam Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000002791 soaking Methods 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 7
- 229920000058 polyacrylate Polymers 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- 230000003190 augmentative effect Effects 0.000 claims description 3
- 239000004745 nonwoven fabric Substances 0.000 claims description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 3
- 229920006267 polyester film Polymers 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 238000009954 braiding Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 32
- 230000017525 heat dissipation Effects 0.000 description 8
- 230000009466 transformation Effects 0.000 description 7
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011162 core material Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of flexible heat structure and electronic products.The flexibility heat structure includes: two sheets of flexible crust, and the flexible skin includes at least two sheets of flexible film layer and one layer of graphite material, and the graphite material is located between two layers of flexible membrane layer；Sealing frame, the sealing frame are hollow structure, and the sealing frame is folded between two layers of flexible skin, and the middle vacancy of the sealing frame constitutes the accommodation space of sealing, and the air pressure range in the accommodation space is 10‑1Pa‑10‑3Pa；Capillary structure and liquid working substance, the capillary structure are arranged in the accommodation space, and the liquid working substance is filled in the accommodation space；The accommodation space is configured as vacuumizing.
Description
Technical field
The invention belongs to technical field of electronic products, and in particular, to a kind of flexible heat structure and electronic product.
Background technique
In recent years, the technology of consumer electronics product is fast-developing, and the electronic products such as mobile phone, VR equipment, AR glasses obtain
The approval of consumer, is widely used.The performance of consumer electronics product is also gradually promoted.Existing consumer electronics product has
Performance characteristics small in size, power consumption is high, this causes the problems in heat collection in electronic product.In order to meet the design of electronic product
Demand often has complicated stacking device architecture inside existing electronic product, this especially increases device from electronic product
Watchcase heat dissipation difficulty.
Those skilled in the art attempt to place the thermal component such as phase transformation soaking plate in electronic product also to strengthen electricity
The heat dissipation performance of sub- product.But since structure is complicated in electronic product, the thermal components such as phase transformation soaking plate are limited to it certainly
The planform of body, it is difficult to adapt to structure in electronic product, shape needs.In addition, existing heat sink, phase transformation soaking plate etc.
Component with heat sinking function is frequently with metal material, but metal material can generate electromagnetism to equipment such as antennas in electronic product
Shielding, seriously affects the performance of electronic equipment.
Summary of the invention
It is an object of the present invention to provide a kind of new solutions of improved equal heat structure.
According to the first aspect of the invention, a kind of equal heat structure of flexibility is provided, comprising:
Two sheets of flexible crust, the flexible skin include at least two sheets of flexible film layer and one layer of graphite material, the stone
Ink material layer is located between two layers of flexible membrane layer；
Sealing frame, the sealing frame are hollow structure, and the sealing frame is folded between two layers of flexible skin, described
The middle vacancy of sealing frame constitutes the accommodation space of sealing, and the air pressure range in the accommodation space is 10-1Pa-10-3Pa；
Capillary structure and liquid working substance, the capillary structure are arranged in the accommodation space, the liquid working substance filling
In the accommodation space.
Optionally, the flexible membrane layer is Kapton or polyester film.
Optionally, the graphite material is made of at least one of graphene film, graphite fibre.
Optionally, heat-conducting glue layer, the flexible membrane layer are equipped between two layers of flexible membrane layer and the graphite material
Pass through the heat-conducting glue layer and the graphite material bonding connection.
Optionally, the sealing frame is made of polyacrylate foam tape, and two layers of flexible skin distinguishes adhesion
In the two sides of the sealing frame.
Optionally, the capillary structure includes at least one of non-woven fabrics, mesh grid, wire mesh.
The present invention also provides a kind of electronic products, which includes:
Shell；
Heat generating components, the heat generating components are arranged in the shell；
The above-mentioned equal heat structure of flexibility, the flexibility soaking structure setting is in the shell, the flexible heat structure tool
There are central area and fringe region, the flexible heat structure extends from the central area to surrounding, constitutes the marginal zone
Domain, the central area are attached on the heat generating components.
Optionally, the fringe region has bending relative to the central area, and the fringe region is in the shell
Inner bending extends.
Optionally, the shape of inner surface of the shape profiling of the flexible heat structure in the shell.
Optionally, the electronic product is augmented reality glasses, and the heat generating components is control chip.
According to one embodiment of the disclosure, the flexible heat structure has good in the case where guaranteeing heating conduction
Good deformability.The assembly space that there is different shape to require can preferably be adapted to.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 is the side cross sectional views for the flexibility heat structure that the specific embodiment of the invention provides；
Fig. 2 is the part perspective view of the explosion for the flexibility heat structure that the specific embodiment of the invention provides；
Fig. 3 is the part perspective view of the explosion for the flexibility heat structure that the specific embodiment of the invention provides；
Fig. 4 is the schematic perspective view for the flexibility heat structure that the specific embodiment of the invention provides；
Fig. 5 is the partial schematic sectional view for the electronic product that the specific embodiment of the invention provides；
Fig. 6 is the partial schematic sectional view for the electronic product that the specific embodiment of the invention provides.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
The present invention provides a kind of equal heat structures of flexibility, as shown in Figure 1, the flexibility heat structure includes outside two sheets of flexible
Skin, sealing frame and capillary structure and liquid working substance.
As shown in Figure 1-3, the flexible skin 1 includes at least two sheets of flexible film layer 11 and one layer of graphite material 12.It is soft
Property film layer 11 using have good deformability material be made, the graphite material 12 is then folded in two layers of flexibility
Between film layer 11.Graphite material generally also has good extension and deformability, and therefore, the flexible skin 1 has good
Deformability.
The sealing frame 2 is located between two layers of flexible skin 1, and the sealing frame 2 is hollow structure, the middle vacancy
The space of composition is used to form the accommodation space 21 in flexible heat structure.As shown in Figure 1-3, two sheets of flexible crust 1 is from sealing
Sealing frame 2 is enclosed in centre by the two sides of frame 2, and hollow part is enclosed in flexible skin 1, constitutes the accommodation space 21.
It is provided with capillary structure 3 in the accommodation space 21, is also filled with liquid working substance.It is evacuated in the accommodation space 21, so as to
Liquid working substance can vaporize after absorbing heat and take away heat, reach efficient heat-transfer effect.
Preferably, the air pressure range vacuumized in the accommodation space is 10-1Pa-10-3Pa.If in accommodation space
Air pressure is greater than 10-1Pa understands some liquid working substance and vaporizes in the case where not absorbing heat, causes to have in accommodation space
Liquid working substance total amount reduces.Such case makes the heat transfer property relative drop of flexible heat structure.If in accommodation space
Air pressure is less than 10-3Pa, extraneous pressure are possible to cause sealing frame and flexible skin deformation, damage, in turn result in sealing
Space collapse.Such case will also result in the heat transfer property relative drop of flexible heat structure.In air pressure model provided by the invention
In enclosing, the flexible heat structure can show more preferably heat transfer property.The present invention is not intended to limit in the accommodation space
Air pressure has to comply with above range, different according to the performance requirement of practical application and used material, can be by sealing frame
Other air pressures are evacuated in space.
Flexible heat structure provided by the invention is in composite membrane shape structure, in practical applications, can be bent in required
Moulding, with meet in electronic equipment to assembly thermal component shape needs.The flexibility soaking inside configuration encapsulating
Liquid working substance can efficiently transmit heat by phase transformation, to achieve the purpose that improve electronic product heat transfer, heat dissipation performance.
Existing phase transformation soaking plate is in the plate structure of hard, since the moulding of its own limits, is unable to satisfy electronics
To the shape need of thermal component in equipment.Although and metal fin can be fabricated to meet shape needs moulding,
The heat dissipation performance of metal fin can not meet the requirement of radiating efficiency in crowded electronic product.
On the other hand, it is folded with graphite material in the flexibility of the invention flexible skin of heat structure, graphite material
The heating conduction that conducts heat is better than the metal shell of traditional phase transformation soaking plate.Flexible heat structure provided by the invention is relative to existing
Phase transformation soaking plate and other thermal components have more preferably heat transfer, heat dissipation performance.Moreover, flexible heat structure does not use metal
Outer layer effectively reduces its own risk that electromagnetic shielding, electromagnetic interference are caused to electronic product.
Optionally, the flexible membrane layer is made of polyimides or polyester material.Both materials have good change
Shape and sealing performance, on the one hand, reliably graphite material can be encapsulated between two sheets of flexible film layer；On the other hand, energy
Enough so that the flexible skin has good plastic deformation ability, so that flexibility heat structure of the invention can satisfy
The moulding such as bending need.In practical applications, Kapton or polyester film can be made as the flexible membrane layer.
Optionally, the graphite material can be made of at least one of graphene film, graphite fibre.Due to soft
The equal heat structure of property needs to embody good deformability, therefore the graphite material between flexible membrane layer can preferably show
Good deformability out.Graphite material itself has certain deformability, and uses made of graphene film or graphite fibre
Graphite material can show better ductility and deformability.In this way, the deformability of flexible heat structure is more preferable, energy
Enough electronic products that preferably adapts to are to the shape need of thermal component.Moreover, using made of graphene film and/or graphite fibre
Graphite material less easy fracture, damage.
It preferably, as shown in Figure 1, 2, further include heat-conducting glue layer 13 in the flexible skin 1.The heat-conducting glue layer 13 is arranged
Between the flexible membrane layer 11 and graphite material 12, the flexible membrane layer 11 passes through the heat-conducting glue layer 13 and the graphite
12 adhesion of material layer is fixed.On the one hand the structural stability of the flexible skin can be improved in the heat-conducting glue layer, by flexible membrane
Layer is closely bonded with graphite material to be connect.On the other hand, the heat transfer efficiency of flexible skin in a thickness direction can also be improved,
Heat is enabled quickly to be transmitted to the other side from the side of flexible skin, so that the flexible heat structure integrally can
More efficient heat transfer, heat dissipation.
In flexible heat structure provided by the invention, the sealing frame has good sealing performance and structural strength,
The accommodation space is formed with empty region wherein.Optionally, the sealing frame can use polyacrylate foam tape system
At.Foam tape has cementability, close bonding connection can be formed with the flexible skin of its two sides, thus by hollow region
It is fully sealed.For hollow region, can be formed by cutting a part of material in foam tape, the present invention misaligns sky
The generation type in region is limited.For example, the sealing frame can be made using VHB adhesive tape.This foam tape is two-sided
The bonding agent on viscose glue foam tape, foam core material and surface layer is constituted with polyacrylate viscoelastic body.The polyacrylate
Foam tape itself has good sealing performance and structural strength, and foamed cotton core is 100% fully closed pore structure, air and liquid
The polyacrylate foam tape cannot be passed through.Thereby it is ensured that the liquid working substance being located in accommodation space will not overflow
Out, moreover, polyacrylate foam tape will not occur because of being evacuated in the accommodation space it is severely deformed, collapse.
Optionally, the capillary structure can use at least one of non-woven fabrics, mesh grid, wire mesh.The hair
Fine texture mainly plays the role of capillary absorption to the liquid working substance of liquid in accommodation space, and liquid working substance is promoted to be moved to heat
Measure higher region.
The present invention also provides a kind of electronic products, as shown in figure 5, the electronic product include shell 4, heat generating components 5 with
And above-mentioned flexible heat structure 100.The shell 4 is used to accommodate each components in electronic product, and the heat generating components 5 is electricity
One or more components in sub- product are arranged in the shell 4.Heat generating components of the present invention does not refer to simple use
In the component of generation heat, and refer to the component that heat can be generated in electronic product work.For example, the heat generating components can be with
It is that components, the present invention such as control chip, battery, antenna, loudspeaker limit not to this.The present invention does not also produce the electronics
The type of product is limited, such as can be mobile phone, AR glasses, game paddle etc..
The flexible heat structure 100 is also disposed in the shell 4, and the flexible heat structure 100 has center
Domain 101 and fringe region 102.For the heat structure 100 of the flexibility shown in Fig. 1,4,6, the flexible heat structure 100 is from institute
It states central area 101 to extend to the periphery, to form the fringe region 102.The central area 101 and the heat generating components
5 contacts, so that effectively the heat that heat generating components 5 generates is transferred on the flexible heat structure 100.
Since the fringe region is located at around the central area, the heat being transferred on central area can be along soft
The equal heat structure of property is quickly transferred on the fringe region around.The equal heat structure of flexibility provided through the invention, heating part
The heat that part generates can quickly be transferred to larger range of space around, and then improve the efficiency that heat distributes.
In order to preferably adapt to the space in the shell 4, enable to can be used in flexible heat structure 100 and shell 4
The space of heat dissipation matches, or meets space environment complicated in shell 4, and the fringe region 102 can be relative to described
Central area 101 is in bending form, as Figure 4-Figure 6.After the flexible equal heat structure 100 extends outwardly from central area 101,
It is bent according to the space characteristic for being supplied to thermal component in shell 4, to form the fringe region 102 of bending.
Preferably, as shown in Figure 5,6, the flexible heat structure 100 can also be bent into the inner surface with the shell 4
The shape of phase profiling.By this design method, the fringe region 102 can be made closer in the inner surface of shell 4, in turn
Heat is reached except shell 4 by shell 4, improves the heat-sinking capability of electronic product.
Fig. 1,5,6 show the approach of heat transfer in this embodiment.Firstly, heat generating components 5 generates heat, heat
Amount is transferred in the accommodation space 21 by the side flexible skin 1 of flexible heat structure 100；Later, due to accommodation space
It is the environment of rough vacuum in 21, so liquid working substance can vaporize after absorbing heat, the working medium after vaporization can be full of quickly
Heat is brought in fringe region from the central area 101 during gas-phase working medium transfer by entire accommodation space 21
102；Later, gas-phase working medium is touched in accommodation space 21 than behind colder region, such as is arrived at and be located at as shown in Fig. 4,6
After the fringe region 102 of side, gas-phase working medium condenses into the working medium of liquid, and heat is discharged；The heat being released passes through two again
The flexible skin 1 of side is transmitted to the surface of flexible heat structure 100, and then from the shell on the surface close to flexible skin 14
Heat is shed；Liquefied working medium can be absorbed by capillary structure 3, since the biggish region of heat does not have liquid refrigerant, institute
The higher area of heat can be sucked back into for the liquid refrigerant condensed in the lower region of heat by capillary phenomenon by stating capillary structure 3
Above-mentioned heat dissipation step is repeated in domain.The heat in electronic product efficiently can be transmitted to shell 4 from heat generating components as a result,
Each region, the external world is distributed heat to by shell 4.
As shown in figure 4, the flexible heat structure 100 is bent to form three-dimensional structure, including one piece of central area 101
With three block edge regions 102.One side surface of the central area 101 is attached on the heat generating components 5, wherein two pieces of sides
Edge region 102 extends to the side wall and bottom wall portion of the shell 4, and in addition a block edge region 102 is then to before the shell 4
Extend on wall.Heat passes through the central area 101, is transferred to each fringe region 102, is transferred to the side of shell 4 again later
On wall, bottom wall and antetheca, so that heat be made quickly to shed.The rear wall of the shell is upper to be distributed with the fringe region, this
Design can be in order to avoid user is being to experience excessively high temperature using electronic product, and fringe region of the present invention is set
It counts position and carries out considered critical.
Optionally, as shown in Figure 5,6, the electronic product can be augmented reality glasses, and the heat generating components 5 is then increasing
Control chip in strong Reality glasses.By being bent to the flexible heat structure, contoured design, can effectively increase pair
The utilization rate of housing area improves electronic product radiating performance.Flexible heat structure provided by the invention can replace existing completely
Some thermal components, the problem of there is better heat transfer property and electromagnetic shielding can be reduced.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (10)
1. a kind of equal heat structure of flexibility characterized by comprising
Two sheets of flexible crust, the flexible skin include at least two sheets of flexible film layer and one layer of graphite material, the graphite material
The bed of material is located between two layers of flexible membrane layer；
Sealing frame, the sealing frame are hollow structure, and the sealing frame is folded between two layers of flexible skin, the sealing
The middle vacancy of frame constitutes the accommodation space of sealing, and the air pressure range in the accommodation space is 10-1Pa-10-3Pa；
Capillary structure and liquid working substance, the capillary structure are arranged in the accommodation space, and the liquid working substance is filled in institute
It states in accommodation space.
2. the equal heat structure of flexibility according to claim 1, which is characterized in that the flexible membrane layer be Kapton or
Polyester film.
3. the equal heat structure of flexibility according to claim 1, which is characterized in that the graphite material using graphene film,
At least one of graphite fibre is made.
4. the equal heat structure of flexibility according to claim 1, which is characterized in that two layers of flexible membrane layer and the graphite material
Heat-conducting glue layer is equipped between the bed of material, the flexible membrane layer passes through the heat-conducting glue layer and the graphite material bonding connection.
5. the equal heat structure of flexibility according to claim 1, which is characterized in that the sealing frame uses polyacrylate foam
Adhesive tape is made, and two layers of flexible skin sticks in the two sides of the sealing frame respectively.
6. the equal heat structure of flexibility according to claim 1, which is characterized in that the capillary structure includes non-woven fabrics, braiding
At least one of net, wire mesh.
7. a kind of electronic product characterized by comprising
Shell；
Heat generating components, the heat generating components are arranged in the shell；
The equal heat structure of flexibility described in claim 1-6 is one of any, the flexibility soaking structure setting is in the shell, institute
Stating flexible heat structure has central area and fringe region, and the flexible heat structure prolongs from the central area to surrounding
It stretches, constitutes the fringe region, the central area is attached on the heat generating components.
8. electronic product according to claim 7, which is characterized in that the fringe region has relative to the central area
There is bending, the fringe region extends in the shell inner bending.
9. electronic product according to claim 7 or 8, which is characterized in that the shape profiling of the flexible heat structure in
The shape of the inner surface of the shell.
10. electronic product according to claim 7, which is characterized in that the electronic product is augmented reality glasses, described
Heat generating components is control chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811280431.2A CN109246997A (en) | 2018-10-30 | 2018-10-30 | A kind of flexible heat structure and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811280431.2A CN109246997A (en) | 2018-10-30 | 2018-10-30 | A kind of flexible heat structure and electronic product |
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| Publication Number | Publication Date |
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| CN109246997A true CN109246997A (en) | 2019-01-18 |
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Family Applications (1)
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| CN201811280431.2A Pending CN109246997A (en) | 2018-10-30 | 2018-10-30 | A kind of flexible heat structure and electronic product |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110418550A (en) * | 2019-06-25 | 2019-11-05 | 华为技术有限公司 | Soaking plate and folding terminal |
| CN113358723A (en) * | 2021-05-12 | 2021-09-07 | 清华大学 | Flexible device and preparation method thereof, flexible device assembly and application |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007147226A (en) * | 2005-11-30 | 2007-06-14 | Matsushita Electric Ind Co Ltd | Flexible heat pipe and its manufacturing method |
| CN105990274A (en) * | 2015-02-10 | 2016-10-05 | 上海量子绘景电子股份有限公司 | Heat conduction film and manufacturing method thereof |
| CN106142777A (en) * | 2015-03-31 | 2016-11-23 | 李少帅 | A kind of polyimides height heat radiation coverlay |
| CN206556484U (en) * | 2017-01-26 | 2017-10-13 | 广州华钻电子科技有限公司 | A kind of new type superthin soaking plate |
| CN107690265A (en) * | 2017-07-31 | 2018-02-13 | 深圳市嘉姆特通信电子有限公司 | Flexible heat sink device |
| CN207330825U (en) * | 2017-10-12 | 2018-05-08 | 东莞晟泰胶粘制品有限公司 | A kind of acrylic foam double-faced adhesive band |
| CN207515592U (en) * | 2017-10-16 | 2018-06-19 | 华南理工大学 | Ultrathin flexible soaking plate |
| CN108366508A (en) * | 2017-01-26 | 2018-08-03 | 中国科学院工程热物理研究所 | A kind of flexibility microflute group's radiator |
| CN209643211U (en) * | 2018-10-30 | 2019-11-15 | 歌尔科技有限公司 | A kind of flexible heat structure and electronic product |
-
2018
- 2018-10-30 CN CN201811280431.2A patent/CN109246997A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007147226A (en) * | 2005-11-30 | 2007-06-14 | Matsushita Electric Ind Co Ltd | Flexible heat pipe and its manufacturing method |
| CN105990274A (en) * | 2015-02-10 | 2016-10-05 | 上海量子绘景电子股份有限公司 | Heat conduction film and manufacturing method thereof |
| CN106142777A (en) * | 2015-03-31 | 2016-11-23 | 李少帅 | A kind of polyimides height heat radiation coverlay |
| CN206556484U (en) * | 2017-01-26 | 2017-10-13 | 广州华钻电子科技有限公司 | A kind of new type superthin soaking plate |
| CN108366508A (en) * | 2017-01-26 | 2018-08-03 | 中国科学院工程热物理研究所 | A kind of flexibility microflute group's radiator |
| CN107690265A (en) * | 2017-07-31 | 2018-02-13 | 深圳市嘉姆特通信电子有限公司 | Flexible heat sink device |
| CN207330825U (en) * | 2017-10-12 | 2018-05-08 | 东莞晟泰胶粘制品有限公司 | A kind of acrylic foam double-faced adhesive band |
| CN207515592U (en) * | 2017-10-16 | 2018-06-19 | 华南理工大学 | Ultrathin flexible soaking plate |
| CN209643211U (en) * | 2018-10-30 | 2019-11-15 | 歌尔科技有限公司 | A kind of flexible heat structure and electronic product |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110418550A (en) * | 2019-06-25 | 2019-11-05 | 华为技术有限公司 | Soaking plate and folding terminal |
| CN110418550B (en) * | 2019-06-25 | 2021-06-01 | 华为技术有限公司 | Vapor chamber and folding terminal |
| CN113358723A (en) * | 2021-05-12 | 2021-09-07 | 清华大学 | Flexible device and preparation method thereof, flexible device assembly and application |
| CN113358723B (en) * | 2021-05-12 | 2023-08-25 | 清华大学 | Flexible device, preparation method thereof, flexible device assembly and application |
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