CN107690265A - Flexible heat sink device - Google Patents
Flexible heat sink device Download PDFInfo
- Publication number
- CN107690265A CN107690265A CN201710868472.2A CN201710868472A CN107690265A CN 107690265 A CN107690265 A CN 107690265A CN 201710868472 A CN201710868472 A CN 201710868472A CN 107690265 A CN107690265 A CN 107690265A
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- CN
- China
- Prior art keywords
- heat sink
- sink device
- copper foil
- flexible heat
- gasification
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000011889 copper foil Substances 0.000 claims abstract description 51
- 238000002309 gasification Methods 0.000 claims abstract description 46
- 239000012224 working solution Substances 0.000 claims abstract description 37
- 230000005855 radiation Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 230000000717 retained effect Effects 0.000 claims description 10
- 210000000576 arachnoid Anatomy 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 8
- 230000009466 transformation Effects 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 238000002207 thermal evaporation Methods 0.000 claims description 3
- 230000011218 segmentation Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 18
- 238000000059 patterning Methods 0.000 abstract description 16
- 238000009833 condensation Methods 0.000 abstract description 5
- 230000005494 condensation Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 26
- 239000010949 copper Substances 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000000758 substrate Substances 0.000 description 10
- 238000005452 bending Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 230000005674 electromagnetic induction Effects 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 241000239290 Araneae Species 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides carry out patterning along the copper foil (D) of vacuum chamber (V) inner face and form trickle, exquisite, various capillary line (E)【Grating texture or liquid sucting core structure etc.】, ensure the efficient circulation of working solution (R)；Liquid-sucking core (Wick) angle is adjusted simultaneously, can control caused by the gasification and liquefaction of working solution (R) in the speed in different sections；Further, gasification and liquefied field are set for, while can adjust gasification and the liquefaction interval of working solution (R), the phenomenon of dry (Dry) of adjustment work liquid (R)；Further, working solution (R) is made to be scattered when being liquefied after gasification portion (V1) gasifies at condensation portion (V3) by the capillary line (E) of variform to gasification portion (V1)；The capillary line (E) can carry out being formed in the lump when patterning forms elongated slot (H) on copper foil (D), therefore need not set extra twine (M), also can guarantee that accuracy and productive flexible heat sink device.
Description
Technical field
It is specially special using the flexibility for the FFCL for having forged and pressed single or double the present invention relates to a kind of flexible heat sink device
The characteristic of trickle exquisite patterning can be carried out by seeking peace, while realization arbitrarily can bend or fold, for electronic equipments inside
Circuit element between caused heat, the flexible heat sink device effectively to be radiated.
Background technology
Generally, electronic equipments are pointed to, it is necessary to while the design of " compact ", from CPU or other various circuits
The smart mobile phone of element generation heat, tablet personal computer, intelligent television, medicine equipment, navigator, aviation electronics apparatus are wearable
Electronic product, intelligent watch or MP3 etc..Heat pipe (Heat Pipe) is for the heat inside radiating electronic apparatus, passes through medium
The evaporation and condensation of (working solution), heat is set to be transferred to the radiating electronic element of radiating part from heated parts.
Specifically, heat pipe is to carry out reduced pressure treatment (Reduced Pressure：Vacuum) inside load the work such as ethanol
After liquid, one end of heat pipe is set to be heated, liquid is changed into the steam flow other end, and (in vacuum environment, phase transition temperature is relatively low, as from liquid
Body is changed into the low characteristic of phase transition temperature needed for gas), it is changed into liquid after other end steam heat release, passes through capillarity and return
It flow to the structure of original position.
Fig. 1 a include heat pipe 120 to show according to prior art literature (KR published patent 2015-0091873)
A kind of portable unit structure chart.
Understand that portable unit 100 includes with reference to figure 1：Circuit substrate 110 including at least an electronic component 110a, set
On electronic component 110a, the heat pipe 120 of heat caused by radiating electronic element 110a and make circuit substrate 110 and heat
The heat sink material that pipe 120 is bonded to each other.
Electronic component 110a can be AP (Application Processor：Application processor), CPU (Central
Processing Unit：Central processing unit), PMIC (Power Management IC：One of power management loop).Above-mentioned
Electronic component 110a is the main pyrotoxin of portable unit.Therefore, heat pipe 120 is on electronic component 110a, and makes electronics
Heat spreader caused by element 110a is to other parts.
Fig. 1 b are the drawings for showing a kind of example that heat pipe is set in circuit substrate according to prior art literature.
Heat pipe 120 is located on electronic component 110a, and including：The evaporation part of heat caused by absorbing circuit substrate 110
310 (Evaporator), the lateral parts for being formed at circuit substrate 110, the heat transfer of absorption to electronic component 110a
The connecting portion 320 of opposite direction, the cohesion portion 330 (Condenser) for distributing conducted heat.
Evaporation part 310 is converted into gas after absorbing heat caused by electronic component 110a, is converted into the heat edge of gas
Connecting portion 320 and be moved to cohesion portion 330.The heat cohesion that cohesion portion 330 makes to be converted into gas is liquid, shown in discharging
The heat of absorption.The heat discharged is re-moved to evaporation part 310 along connecting portion 320.
With this, heat pipe 120 can make heat caused by circuit substrate 110 be dispersed to the portable dress beyond circuit substrate 110
Put internal other positions.
Fig. 1 c are the drawings for showing the heat pipe in prior art literature.
Understand that portable unit a is in figure, Fig. 1 b portable unit is cut to the sectional view of " X2 " with reference to figure 1c.It is cut to
The part of " X2 " is the part that the connecting portion 320 of heat pipe 120 is formed.Heat pipe 120 is by vapor chamber 410, liquid-sucking core 420
(Wick), heat conducting base material 430 is formed.
Understood with reference to figure 1c, vapor chamber 410 (Vapor Cavity) carries out phase after absorbing heat from circuit substrate 450
Become, it is converted into gas.The heat for being converted into gas moves along vapor chamber 410, is conveyed to cohesion portion 330.Liquid-sucking core 420
Around vapor chamber 410, the heat discharged from cohesion portion 330 carries out phase transformation, it is converted into liquid.It is converted into the heat of liquid
Amount is returned to evaporation part 310 along liquid-sucking core 420.Heat conducting base material 430 is around liquid-sucking core 420；Wherein, heat conducting base material 430 is
By copper (Cu), silver-colored (Ag), titanium (Ti), chromium (Gr), golden (Au), carbon (C), nickel (Ni), iron (Fe), platinum (Pt), graphite
(Graphite), one of boron nitride (BN), or both more than alloy form.
But the thickness of heat pipe 120 is excessive, the heat for not being suitable for absorbing electronic component 110a is released in battery afterwards
Put.The width of portable unit is considered, insertion heat pipe 120 makes electronic component 110a and battery 130 be directly connected to be very difficult
's.
Finally, the heat pipe 120 in prior art literature can discharge the heat inside portable unit, but because itself is tied
The limitation of structure, as there is the limitation such as size, thickness, and freely it can not bend or fold, therefore be attached to electronics device
It is very difficult inside tool.
The content of the invention
It is an object of the invention to provide a kind of flexible heat sink device, is specially：Using having forged and pressed single or double
FFCL flexible characteristic and the characteristic that trickle exquisite patterning can be carried out, while realization arbitrarily can bend or fold, for
Caused heat, is effectively radiated between circuit element inside electronic equipments.
It is a further object to provide a kind of flexible heat sink device, it is specially：Along vacuum chamber inner face
Copper foil carries out patterning and forms trickle, exquisite, various capillary line, ensures the efficient circulation of working solution, adjusts simultaneously
The angle of liquid-sucking core (Wick), it can control caused by the gasification and liquefaction of working solution in the speed in different sections；Further, set
Gasification and liquefied field are carried out, while can adjust gasification and the liquefaction interval of working solution, dry (Dry's) of adjustment work liquid
Phenomenon.
It is a further object to provide a kind of flexible heat sink device, it is specially：Make working solution in gasification portion
When being liquefied after gasification in condensation portion, scattered by the capillary line of variform to gasification portion；The capillary line can be with copper foil
On formed in the lump when patterning forms elongated slot, therefore extra twine need not be set, ensure that accuracy and productivity.
It is a further object to provide a kind of flexible heat sink device, it is specially：Additionally include, provided with one
The intermediate radiator piece (thin copper coin) of the corresponding elongated hole of elongated slot between side FCCL and another side FCCL, further improves, passes through
The radiating that fin is carried out.
It is a further object to provide a kind of flexible heat sink device, it is specially：Additionally include, provided with one
The middle FCCL of the corresponding elongated hole of elongated slot between side FCCL and another side FCCL, further expand the volume of vacuum chamber, increase
The capacity of working solution, with this further improves radiating effect.
It is a further object to provide a kind of flexible heat sink device, it is specially：There is external heat radiation piece,
The slit corresponding with the antenna slit of loop aerial and antenna perforate and perforate, further improve the radiation fin work(of loop aerial
Can, thus further strengthen NFC antenna or the performance of WPT antennas.
It is a further object to provide a kind of flexible heat sink device, it is specially：Optionally assigned in vacuum chamber
While giving expansion field, three-dimensional shape is formed by bending or folding, is mounted freely on inside electronic equipments.
It is a further object to provide a kind of flexible heat sink device, it is specially：One kind is made, from gasification portion
Start, reach the vacuum chamber that the path width in cohesion portion becomes narrow gradually by move portion, when working solution evaporates, promptly pass through
The move portion and cohesion portion that width becomes narrow gradually are liquefied, and thus improve radiating rate.
It is a further object to provide a kind of flexible heat sink device, it is specially：On the basis of fold line, folding
After having folded side FCCL and another side FCCL, attached along periphery copper foil, can simply make flexible heat sink device.
To achieve these goals, the essential characteristic in technical pattern of the invention includes：The copper foil of fexible film is enterprising
After row patterning, the side FCCL of elongated slot (Long Groove) is formed in remaining periphery copper foil inside length direction
(Flexible Copper Clad Laminate：Flexible copper-clad plate) and along above-mentioned periphery copper foil attach, make above-mentioned elongated slot into
For with gasification portion, move portion, cohesion portion function vacuum chamber while, the another side that is integrally formed with above-mentioned side FCCL
FCCL, and being filled in above-mentioned vacuum chamber, above-mentioned gasification portion by it is thermal evaporation while, move, reach along above-mentioned move portion
Because low temperature switchs to liquefy after to above-mentioned cohesion portion, it is back to afterwards along above-mentioned move portion in the cyclic process in above-mentioned gasification portion,
The working solution of radiating is realized by the phase transformation of itself.
The present invention technique effect be, using the FFCL for having forged and pressed single or double flexible characteristic and trickle essence can be carried out
The characteristic of the patterning of cause, while realization arbitrarily can bend or fold, for institute between the circuit element inside electronic equipments
Caused heat, is effectively radiated.
Technique effect of the invention further is, along the copper foil of vacuum chamber inner face carry out patterning formed it is trickle, exquisite,
Various capillary line, ensures the efficient circulation of working solution, while adjusts liquid-sucking core (Wick) angle, can control work
In the speed in different sections caused by the gasification and liquefaction of liquid；Further, gasification and liquefied field are set for, can adjust work
While making gasification and the liquefaction interval of liquid, the phenomenon of dry (Dry) of adjustment work liquid.
Technique effect of the invention further is when the working solution is liquefied after gasifying in gasification portion in condensation portion, by more
The capillary line of kind form scatters to gasification portion；The capillary line can be with when carrying out patterning and forming elongated slot in the lump on copper foil
Formed, therefore extra twine need not be set, ensure that accuracy and productivity.
Further technique effect of the invention is that another side FCCL has forms symmetrical elongated slot and periphery copper with side FCCL
Paper tinsel, while be integrally formed with side FCCL, the space of vacuum chamber is expanded, the capacity of working solution is added with this, is further carried
High radiating effect.
Further technique effect of the invention is, by additionally including, provided between side FCCL and another side FCCL
The intermediate radiator piece (thin copper coin) of the corresponding elongated hole of elongated slot, further improve, the radiating effect carried out with fin.
Further technique effect of the invention is, by additionally including, provided between side FCCL and another side FCCL
The middle FCCL of the corresponding elongated hole of elongated slot, further expand the volume of vacuum chamber, add the capacity of working solution, enter one with this
Step improves radiating effect.
Further technique effect of the invention is, by internal set heat radiation fin, while improving radiating effect, to prevent in advance,
Liquid caused by maximization of radiating in gasification portion does (Dry of working solution) phenomenon.
Further technique effect of the invention is, when side FCCL and another side FCCL are formed in face as field, can be located at electricity
On the surface of the parts such as the battery inside sub- apparatus, now vacuum chamber is shaped with wire, for radiating, further, makes wire
Vacuum chamber in face as forming interconnected arachnoid vacuum chamber in field, make phase transformation of the working solution by itself, in spider
Moved in netted vacuum chamber, thus maximize radiating effect；Further, make between wire or arachnoid vacuum chamber
Side FCCL or another side FCCL copper foil is retained, and makes it as external heat radiation piece.
Further technique effect of the invention is to have external heat radiation piece, antenna slit and antenna with loop aerial
The corresponding slit of perforate and perforate, further improve loop aerial radiation fin function, thus further strengthen NFC antenna or
The performance of WPT antennas.
Technique effect of the invention further is, while vacuum chamber optionally assigns expansion field, by bending or
Folding forms three-dimensional shape, is mounted freely on inside electronic equipments.
Further technique effect of the invention is to make one kind, since gasification portion, reach cohesion portion by move portion
The vacuum chamber that path width becomes narrow gradually, when working solution evaporates, the move portion promptly become narrow gradually by width and cohesion
Portion is liquefied, and thus improves radiating rate.
Further technique effect of the invention is, on the basis of fold line, after being folded side FCCL and another side FCCL, and edge
Periphery copper foil to attach, can simply make flexible heat sink device.
Brief description of the drawings
Fig. 1 a are the structure charts for showing the portable unit including heat pipe in prior art literature；
Fig. 1 b are the implementation illustrations for showing to set heat pipe in circuit substrate in prior art literature；
Fig. 1 c are the structure charts for showing the heat pipe in prior art literature；
Fig. 2 is to show the fabrication figure for the heat pipe of general electronic equipments；
Fig. 3 is the engineering drawing for showing to make the flexible heat sink device according to the present invention；
Fig. 4 is the functional diagram for showing the flexible heat sink device according to the present invention；
Fig. 5 is the structure chart for showing to be applied to the capillary line of the variform of the flexible heat sink device according to the present invention；
Fig. 6 is the sectional view for showing the flexible heat sink device according to the 1st embodiment of the invention；
Fig. 7 (A) is the elevational sectional view for showing the flexible heat sink device according to the 2nd embodiment of the invention；
Fig. 7 (B) is the top cross-sectional view for showing the flexible heat sink device according to the 2nd embodiment of the invention；
Fig. 7 (C) is the functional diagram for showing the flexible heat sink device according to the 2nd embodiment of the invention；
Fig. 8 is the structure chart for including FPCB for showing the flexible heat sink apparatus function according to the 3rd embodiment of the invention；
Fig. 9 a are the structure charts for showing the flexible heat sink device according to the 4th embodiment of the invention；
Fig. 9 b are the structure charts for including loop aerial for showing the flexible heat sink device according to the 4th embodiment of the invention；
Figure 10 is the structure chart for showing the flexible heat sink device according to the 5th embodiment of the invention；
Figure 11 is the structure chart for showing the flexible heat sink device according to the 6th embodiment of the invention；
Figure 12 is the structure chart for showing the flexible heat sink device according to the 7th embodiment of the invention；
Figure 13 is the engineering drawing for showing to make the flexible heat sink device according to the 8th embodiment of the invention.
Embodiment
The preferred embodiment of the flexible heat sink device of the present invention is illustrated below in conjunction with accompanying drawing, embodiment may be present more
It is individual, by these embodiments, it can more clearly understand the purpose of the present invention, feature and beneficial effect.
Fig. 2 is to show the fabrication figure for the heat pipe of general electronic equipments.
The heat pipe P for being generally used for electronic equipments is that twine M (Mesh) is inserted inside copper pipe, after carrying out application of vacuum,
Pour into after working solution R to be compressed and form.Afterwards as in prior art literature, located at the side of circuit substrate, pass through
Working solution R gasification realizes thermolysis with liquefied phase transformation.
But above-mentioned heat pipe P is made of copper, when being bent or being bent, it may occur that equivalent phenomenon, therefore hinder work
Make liquid R movement；The angle of bending or bending especially can not be freely set, can not be with the inside mounting condition of electronic equipments
It is compatible；Meanwhile copper pipe has fixed diameter or width in itself, therefore, radiating effect can not also be accomplished ultimate attainment.
Fig. 3 is the engineering drawing for showing to make the flexible heat sink device according to the present invention.
As shown in figure 3, FCCL (Flexible Copper Clad Laminate：Flexible copper-clad plate) it is in fexible film F
(such as Kapton：Polyimid Film) surface on attached copper or nickel, copper foil D (Laminating) in such as forging and stamping
Structure.Above-mentioned copper foil D may be formed in fexible film F two sides or one side；Especially because fexible film F's and copper foil D
Relation, arbitrarily it can bend or fold, and trickle, exquisite, various pattern can be formed by etching.
The present invention using the FCCL for having forged and pressed single or double copper foil D flexible characteristic with can carry out trickle exquisite pattern
A kind of characteristic of change, there is provided flexible heat sink device.
Fig. 4 is the functional diagram for showing the flexible heat sink device according to the present invention, and Fig. 5 shows to be applied to according to the present invention
The capillary line E of the variform of flexible heat sink device structure chart.
As shown in Figure 3, Figure 4, included according to the flexible heat sink device of the present invention：Pattern is carried out on fexible film F copper foil D
After change, elongated slot H (Long Groove) side FCCL10 is formed in remaining periphery copper foil T inside lengths direction
(Flexible Copper Clad Laminate：Flexible copper-clad plate) and along side FCCL10 peripheries copper foil T attachings, make length
Groove H turn into gasification portion V1, move portion V2, cohesion portion V3 functions vacuum chamber V while, be integrally formed with side FCCL10
Another side FCCL20, and be filled in vacuum chamber V, gasification portion V1 by it is thermal evaporation while, move along portion V2 movements, reach
Because low temperature switchs to liquefy after to cohesion portion V3, portion V2 is moved along afterwards and is back in gasification portion V1 cyclic process, by certainly
The working solution R of radiating is realized in the phase transformation of body.
Elongated slot H is to be etched in side FCCL10 copper foil D or another side FCCL20 copper foil D or photoetching treatment carrys out shape
Into；Wherein, when being etched on copper foil D or photoetching, fexible film F can be made to be exposed to vacuum chamber V completely, or retained certain
The copper foil D of thickness.
Now, side FCCL10 and another side FCCL one or two sides copper foil D, can be according to the receiving space of electronic equipments
Size determines；Exquisite and trickle patterning can be carried out on above-mentioned fexible film F copper foil D；Further, can be random
Bending folds, therefore effectively dissipates caused heat between the circuit element inside electronic equipments.
As shown in figure 4, the position that high fever is produced as gasification portion V1 and electronic equipments internal circuit board, IC chip, CPU etc. connects
When touching or closing on, the working solution R inside vacuum chamber V gasifies, and by being liquefied after move portion V2 in the cohesion portion of low temperature, leads to
The phase transformation of itself is crossed to realize radiating effect, the temperature inside electronic equipments is reduced with this；Further, working solution R gas is passed through
Change and liquefaction, in gasification portion V1 to move portion V2, cohesion portion V3 circulation repeatedly, to realize the radiating effect of continuation.
Further, as shown in figure 5, forming the periphery copper foil T of vacuum chamber V medial surfaces by carrying out patterning on copper foil D,
Exquisite and ultimate attainment trickle various capillary line E (grating texture or liquid sucting core structure) is provided with along periphery copper foil T, is come
Ensure that working solution R is effectively circulated；Further, the angle of liquid-sucking core (Wick) is adjusted, can control working solution R gasification and liquefaction
The caused speed in different sections；Further, gasification and liquefied field are set for, can adjust working solution R gasification and
While liquefaction interval, the phenomenon of adjustment work liquid R dry (Dry).
Further, working solution R is made to pass through the capillary of variform when being liquefied after gasification portion V1 gasifies in condensation portion V3
Pipeline E scatters to gasification portion V1；Capillary line E can be with, is formed in the lump when carrying out patterning on copper foil D and forming elongated slot H, because
This need not set the extra twine M mentioned in prior art literature, also can guarantee that accuracy and productivity.
Further, another side FCCL20 has forms symmetrical elongated slot H and periphery copper foil T with side FCCL10, while with one
Side FCCL10 is integrally formed, and expands vacuum chamber V space, and working solution R capacity is added with this, further improves radiating effect
Fruit.
Fig. 6 is the sectional view for showing the flexible heat sink device according to the 1st embodiment of the invention.
As shown in Fig. 6 (A), additionally include in the present embodiment, provided with the length between side FCCL10 and another side FCCL20
Elongated hole J corresponding groove H intermediate radiator piece 30 (thin copper coin), further improve, the radiating effect carried out with fin 30；
Further, as shown in Fig. 6 (B), additionally include in the present embodiment, provided with the elongated slot between side FCCL10 and another side FCCL20
Elongated hole J corresponding H middle FCCL40, further expand vacuum chamber V volume, add working solution R capacity, entered with this
One step improves radiating effect.
Fig. 7 (A) is the elevational sectional view for showing the flexible heat sink device according to the 2nd embodiment of the invention；Fig. 7 (B) is to show
Go out the top cross-sectional view of the flexible heat sink device according to the 2nd embodiment of the invention；Fig. 7 (C) is to show to be implemented according to the present invention the 2nd
The functional diagram of the flexible heat sink device of example.
As shown in Fig. 7 (A) and (B), also included according to the flexible heat sink device of the 2nd embodiment of the invention, make side
Copper foil D on the inside of FCCL10 elongated slot H is retained, and makes it as the internal set heat radiation fin I for distributing heat.
As shown in Fig. 7 (C), by internal set heat radiation fin I, while radiating effect can be improved, prevent in advance, it is very big because radiating
Liquid caused by changing in gasification portion V1 does (working solution R Dry) phenomenon.
Fig. 8 is the structure chart for including FPCB60 for showing the flexible heat sink apparatus function according to the 3rd embodiment of the invention.
As shown in Fig. 8 (B), according to the flexible heat sink device of 3rd embodiment of the invention, available for distributing FPCB60
(Flexible Printed Circuit Board：Flexible PCB) heat, therefore can be set as the form of a variety of bendings
Meanwhile as shown in Fig. 8 (A), formed in the lump when FPCB60 is made.
Fig. 9 a are the structure charts for showing the flexible heat sink device according to the 4th embodiment of the invention；Fig. 9 b are shown according to this
Invent the structure chart for including loop aerial 51 of the flexible heat sink device of the 4th embodiment.
As illustrated in fig. 9, according to the side FCCL10 and another side FCCL20 of the flexible heat sink device of the 4th embodiment of the invention
In face as field Y shape into, vacuum chamber V in face as wire L1 can be turned into the Y of field, further, wire L1 vacuum chamber V face as
Interconnected arachnoid L2 can be formed in the Y of field；Further, face is made as the wire L1 or arachnoid L2 that are formed in the Y of field
Vacuum chamber V between side FCCL10 or another side FCCL20 copper foil D retained, make it as the external of heat is distributed and dissipate
Backing 0.
According to 4th embodiment of the invention, side FCCL10 and another side FCCL20 can be set when face is as forming on the Y of field
On the surface of battery inside electronic equipments etc., now vacuum chamber V is shaped with wire L1, for radiating, further, makes wire
L1 vacuum chamber V makes phases of the working solution R by itself in vacuum chamber V of the face as forming interconnected arachnoid L2 in the Y of field
Become, moved in arachnoid L2 vacuum chamber V, thus maximize radiating effect；Further, wire L1 or arachnoid L2 is made
Vacuum chamber V between side FCCL10 or another side FCCL20 copper foil D retained, make it as external heat radiation piece 0；Though or
So it is not shown, the copper foil D of the side FCCL10 or another side FCCL20 between wire L1 or arachnoid L2 vacuum chamber V is protected
Stay, a variety of circular patterns are formed on, the function of NFC antenna or WPT antennas etc. can be achieved.
As shown in figure 9b, also included according to the flexible heat sink device of the 4th embodiment of the invention, set on external fin 0
The slit S1 put, and the perforate S2 connected with slit S1.
As shown in Fig. 9 b (A), the copper foil D on extra fexible film F surfaces carries out patterning and forms NFC antenna or WPT
The loop aerial 51 of antenna etc, the copper foil D for surveying surface in the loop aerial 51 is retained, be used as it and distribute electronics device
The antenna fin 52 of tool heating position heat, further, antenna fin 52 may include the antenna slit 53a and antenna of opening
Perforate 53b.
When copper foil D on extra fexible film F surfaces carries out patterning and forms loop aerial 51, the inner side of loop aerial 51
The copper foil D in face belongs to garbage area (Dead Space), therefore can only be disposed by etching modes such as (Etching), but this
The copper foil D of the inner side of loop aerial 51 is retained in invention, while making it as antenna fin 52, pass through antenna slit
53a and antenna perforate 53b are open, and play a part of radiation fin.
As shown in Fig. 9 b (A), loop aerial 51 makes heating part in addition to intrinsic communication function, as antenna fin 52
The heat of position conducts and radiated；Further, as shown in Fig. 9 b (B) and (C), on external fin 0 set slit S1 and with it is narrow
After the perforate S2 for stitching S1 connections, it is covered on loop aerial 51, further enhances work(of the loop aerial 51 as radiation fin
Energy.
Smart mobile phone, tablet personal computer etc. are set as realizing wireless identification tag, micropayment or battery by near field communication
Charging.
For example, it is located at intelligence with the loop aerial 51 and battery of the transmitting antenna linkage of unshowned near field wireless launcher
The inside of mobile phone or tablet personal computer, magnetic field is produced in transmitting antenna by way of electromagnetic induction, loop aerial 51 is according to magnetic field
Change, produce faradic electromagnetic induction to realize wireless identification tag, the design of micropayment or battery charging.
When being not provided with antenna slit 53a on antenna fin 52, in the case of being further not provided with antenna perforate 53b, give
Unshowned near field wireless launcher provides power supply, conducting electric current is formed magnetic field, but antenna fin 52
Blanketing is played for the magnetic field, it may occur however that the loop aerial 51 of smart mobile phone or tablet personal computer can not produce induced-current,
The situation of near field communication can not be realized by finally resulting in.
When being not provided with surface-slit S1 such as antenna fin 52, although turning on electric current in transmitting antenna, in antenna
Fin 52 can occur the electric current opposite with the sense of current of transmitting antenna (Eddy Current) and reduce magnetic field intensity, can not produce
To smart mobile phone or the induced-current of the loop aerial 51 of tablet personal computer, near field communication can not be realized by finally resulting in for life.
With this, in the upper shed of antenna fin 52 in the case of antenna slit 53a, near field wireless launcher is given to provide electricity
Source, make to turn on electric current formation magnetic field in transmitting antenna, the magnetic field is opened by the antenna slit 53a or antenna of antenna fin 52
Loop aerials 51 of the hole 53b in all directions with smart mobile phone or tablet personal computer is connected, and is formed induced-current, is realized near field channel radio
Letter, wireless identification tag, micropayment or battery charging are as realized by electromagnetic induction.
As, the transmitting antenna to unshowned near field wireless launcher, which turns on electric current, can produce magnetic field, and the magnetic field leads to
Cross the loop aerial 51 of antenna slit 53a and antenna perforate 53b in all directions with smart mobile phone or tablet personal computer to be connected, form sense
Induced current, near field communication is ensured, has as ensured the wireless charging of wireless identification tag, micropayment or battery.
As described above, antenna fin 52 dissipates antenna because turning on the electric current in antenna slit 53a and antenna perforate 53b
The integral surface of backing 52 turns on high current, forms powerful magnetic field, plays a part of radiation fin, makes transmitting antenna to annular day
The flux guiding efficiency of line 51 maximizes.
As, in the case of antenna slit 53a and antenna perforate 53b is configured with antenna fin 52, sent out near field
Emitter provides power supply, makes to turn on electric current formation magnetic field in transmitting antenna, the magnetic field passes through antenna slit 53a and antenna perforate
Loop aerials 51 of the 53b in all directions with smart mobile phone or tablet personal computer is connected, and is formed induced-current, is realized that near field is wireless with this
Communication, wireless identification tag, micropayment or battery charging are as realized by electromagnetic induction.
For example, the transmitting antenna of loop aerial 51 and near field wireless launcher links, and when carrying out the wireless charging of battery, ring
Shape antenna 51 by electromagnetic induction, that is, is the principle according to induced field, the transmitting antenna near field wireless launcher turns on
Electric current forms magnetic field, in 100~200KHz frequency band or the progress battery charging in 6MHz frequency bands.
Further, when carrying out work as NFC such as loop aerial 51, frequency 13.56MHz, inductor is played a part of,
The transmitting antenna near field wireless launcher matches (Coupling) simultaneously, realizes wireless identification tag or micropayment etc..
It is narrow that the antenna shown with Fig. 9 b (A) is provided with external fin 0 as shown in Fig. 9 b (B) and (C), in the present invention
53a and antenna perforate 53b relative slit S1 and perforate S2 are stitched, the function of radiation fin is further improved, further, improves
The performance of NFC antenna or WPT antennas.
Figure 10 is the structure chart for showing the flexible heat sink device according to the 5th embodiment of the invention.
As shown in Figure 10 (A) and (B), according to the 5th embodiment of the invention, vacuum chamber V may include to have expanded gasification portion V1, move
The expansion field V4 that any one place is formed among dynamic portion V2, cohesion portion V3；Expansion field V4 can be as directly heated gas
The change portion V1 or cohesion portion V3 for liquefaction steam, with this, the gasification and liquefaction change for making working solution R are more calculated；Especially, expand
Field V4 is that the copper foil D on fexible film F carries out patterning formation, therefore can not be realized with the heat pipe of routine, further,
As shown in Fig. 9 (C), using the flexibility of itself, bending or folding form three-dimensional shape, are mounted freely on inside electronic equipments.
Figure 11 is the structure chart for showing the flexible heat sink device according to the 6th embodiment of the invention.
As shown in figure 11, according to the 6th embodiment of the invention, vacuum chamber V is since gasification portion V1, is reached by move portion V2
The form become narrow gradually to cohesion portion V3 path width, when working solution R evaporates in gasification portion V1, promptly by width by
Gradual change narrow move portion V2 and cohesion portion V3 are liquefied, and thus improve radiating rate.
Figure 12 is the structure chart for showing the flexible heat sink device according to the 7th embodiment of the invention.
According to the 7th embodiment of the invention, vacuum chamber V also includes, and enables the copper foil D on the inside of side FCCL10 elongated slot H
Retain, make its cutting plate K as segmentation gasification portion V1 and cohesion portion V3；With this, make working solution R in gasification portion V1 Quick-gasifyings
Afterwards, it is quickly removed to reaching cohesion portion V3 between cutting plate K, while is moved in the liquefied working solution R of cohesion portion V3 from newly
Reach gasification portion V1 between cutting plate K, with this, further increase radiating rate.
Figure 13 is the engineering drawing for showing to make the flexible heat sink device according to the 8th embodiment of the invention.
As shown in figure 13, according to the 8th embodiment of the invention, on the basis of fold line Z, side FCCL10 and another side are folded
After FCCL20, attached along periphery copper foil T, can simply make flexible heat sink device；Above-mentioned side FCCL10 and another side
FCCL20 can form the flexible heat sink device of lamination form according to fold line Z quantity.
Claims (11)
- A kind of 1. flexible heat sink device, it is characterised in that：After being patterned on copper foil (D) including fexible film (F), Remaining periphery copper foil (T) inside length direction forms the side FCCL (10) of elongated slot (H)；Attached along the periphery copper foil (T), the elongated slot (H) is turned into gasification portion (V1), move portion (V2), cohesion portion (V3) while vacuum chamber (V) of function, the another side FCCL (20) that is integrally formed with the side FCCL (10)；Be filled in the vacuum chamber (V), the gasification portion (V1) by it is thermal evaporation while, moved along the move portion (V2) It is dynamic, reach after the cohesion portion (V3) because low temperature switchs to liquefy, be back to the gasification portion along the move portion (V2) afterwards (V1) in cyclic process, the working solution (R) of radiating is realized by the phase transformation of itself.
- 2. flexible heat sink device according to claim 1, it is characterised in that：The another side FCCL (20) has and described one Side FCCL (10) forms symmetrical elongated slot (H) and periphery copper foil (T), while is integrally formed with the side FCCL (10).
- 3. flexible heat sink device according to claim 2, it is characterised in that：Also include, provided with the side FCCL (10) the intermediate radiator piece (30) of the corresponding elongated hole (J) of the elongated slot (H) between the another side FCCL (20) or centre FCCL(40)。
- 4. flexible heat sink device according to claim 1, it is characterised in that：Also include the length for making the side FCCL (10) Copper foil (D) on the inside of groove (H) is retained, the internal set heat radiation fin (I) for making it be used to radiate.
- 5. flexible heat sink device according to claim 1, it is characterised in that：The side FCCL (10) and another side FCCL (20) in face as being formed on field (Y)；The vacuum chamber (V) is in the face as turning into wire (L1) on field (Y)；It is described linear (L1) vacuum chamber (V) is in the face as forming interconnected arachnoid (L2) on field (Y).
- 6. flexible heat sink device according to claim 5, it is characterised in that：Make the face as the institute formed on field (Y) The copper foil (D) for stating the side FCCL (10) between the vacuum chamber (V) of linear (L1) or another side FCCL (20) is retained, and is made It is used for the external heat radiation piece (0) to radiate；The external heat radiation piece (0) includes slit (S1)；The external heat radiation piece (0) Also include the perforate (S2) connected with the slit (S1).
- 7. flexible heat sink device according to claim 1, it is characterised in that：The vacuum chamber (V) includes, and expands the gas Change portion (V1), move portion (V2), the expansion field (V4) that any one place forms among cohesion portion (V3).
- 8. flexible heat sink device according to claim 1, it is characterised in that：The vacuum chamber (V) is from the gasification portion (V1) start, reach the form that the path width of the cohesion portion (V3) becomes narrow gradually by the move portion (V2).
- 9. flexible heat sink device according to claim 1, it is characterised in that：The vacuum chamber (V) also includes, and makes described one Copper foil (D) on the inside of side FCCL (10) elongated slot (H) is retained, and makes it as the segmentation gasification portion (V1) and the cohesion The cutting plate (K) in portion (V3).
- 10. flexible heat sink device according to claim 1, it is characterised in that：The side FCCL (10) and another side FCCL (20) converted on the basis of fold line (Z), and attach and be integrally formed along the periphery copper foil (T).
- 11. according to the flexible heat sink device described in claim 1-10 any one, it is characterised in that：Including along the vacuum The copper foil (D) of chamber (V) inner circumferential pattern the capillary line (E) of formation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170096885A KR20190013008A (en) | 2017-07-31 | 2017-07-31 | Flexible heat cooler |
| KR10-2017-0096885 | 2017-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107690265A true CN107690265A (en) | 2018-02-13 |
| CN107690265B CN107690265B (en) | 2024-05-24 |
Family
ID=
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| CN109246997A (en) * | 2018-10-30 | 2019-01-18 | 歌尔科技有限公司 | A kind of flexible heat structure and electronic product |
| CN109287109A (en) * | 2018-11-27 | 2019-01-29 | 上海交通大学 | A kind of dry method phase change heat-exchange apparatus based on capillary water conservancy diversion |
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| CN109287109A (en) * | 2018-11-27 | 2019-01-29 | 上海交通大学 | A kind of dry method phase change heat-exchange apparatus based on capillary water conservancy diversion |
| CN109287109B (en) * | 2018-11-27 | 2020-07-10 | 上海交通大学 | Dry phase-change heat exchange equipment based on capillary diversion |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190013008A (en) | 2019-02-11 |
| CN207491424U (en) | 2018-06-12 |
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