CN105990274A - Heat conduction film and manufacturing method thereof - Google Patents
Heat conduction film and manufacturing method thereof Download PDFInfo
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- CN105990274A CN105990274A CN201510069791.8A CN201510069791A CN105990274A CN 105990274 A CN105990274 A CN 105990274A CN 201510069791 A CN201510069791 A CN 201510069791A CN 105990274 A CN105990274 A CN 105990274A
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Abstract
The invention discloses a heat conduction film and a manufacturing method thereof. The heat conduction film successively comprises, from bottom to top, a bottom layer of a flexible base material, a structural layer and a surface layer of the flexible base material. The structural layer is formed by geometric blocks which are distributed on a bottom layer surface in a protruded mode. Connected grooves are formed between the adjacent geometric blocks. A thickness of the structural layer is 30-50 microns. A width of each groove is the 0.5-3 microns. A pressure working medium is filled in each groove and each groove is full of the pressure working medium. Groove ports around the heat conduction film are plugged. Pressure of the pressure working medium in each groove is 0.5-2MPa. The heat conduction film of the invention has a series of advantages that heat conductivity and an insulating property are possessed; a suitable field is wide, manufacturing cost is low and so on.
Description
Technical field
The invention belongs to conduction new material technology field, relate to the preparation method of a kind of heat conducting film.
Background technology
Whether organization or electric device, too high use temperature usually can cause function to be deteriorated even
Lost efficacy, and additionally can shorten service life, it is therefore desirable to different heat abstractors or mechanism, to avoid work
Make temperature higher than marginal value.
Along with electronic device and product are to high integration, the development in high computing field, its caloric value with
Increase, on the other hand volume is more and more less, heating more concentrate.The material of traditional heat sinks is generally
Aluminum or copper, the most either chip package or product systems heat radiation, be the most all that both materials are straight
Connect heat radiation or coordinate silica gel, fan to form cooling system, it is impossible to meeting the radiating requirements of high-end electronic element,
And have the electronic devices and components of conducting wire cannot avoid electric conductivity accident because of metal class heat conducting film for some
And unusable, and easily there are injured and impression.And some large power high efficiency heat dissipation technology, such as cause
Cooler, water circulation etc. need to employ extra electric power competence exertion radiating effect, do not meet and gradually say today
The ideas of energy-saving studied carefully, is not suitable for for the most increasingly focusing on economize on electricity and light mobile terminal yet.
At present in field of electronic devices, common heat pipe radiating mode and heat conducting film mode.
Heat pipe substantially one includes the closed cavity of working fluid, utilizes phase transformation to carry out heat exchange.Typically
For the temperature difference (thermograde in other words) the biggest, the heat of exchange is the most, the biggest excellent of of heat pipe
Point is that it has good temperature uniformity exactly, i.e. need not reach good under conditions of the temperature difference is very big
Heat transfer effect.Reason among these is that the solution-air phase transformation utilizing working medium in heat pipe is to exchange substantial amounts of heat
Amount, material undergoes phase transition when, temperature be basically unchanged and working medium vaporization (liquefaction) when
May require that absorption (release) substantial amounts of latent heat.Then the work process of heat pipe is briefly described is exactly so:
Working medium inside heat pipe at one end absorbs substantial amounts of heat from the external world, liquid be changing into gaseous state, at air pressure
Ordering about under, flow to other end, be condensed into liquid, discharge the substantial amounts of latent heat of vaporization, liquid is again
Under the ordering about of certain driving force, (gravity, capillarity of porous material wick etc.) is returned to separately
Absorbing heat in outer one end, so circulates.In this process, thermal resistance is the least.
The manufacturing engineering of heat pipe includes from 12 procedures being machined to inspection in theory, but real
Border tends to reach 20 procedures the most up to a hundred when of manufacture, and high to technological requirement, accordingly
Cost is the highest.Radiator based on heat pipe is by base, heat pipe, fin and fan group
Becoming, volume is relatively big, and different thermal source devices needs to customize different heat spreader structures, and application has
Certain limitation.
Heat conducting film material the most on the market has native graphite heat conducting film, electrographite heat conducting film, nano-sized carbon
Heat conducting film, the material carbon nanotube of high heat conduction and Graphene may be alternatively configured heat conducting film, but the prices of raw materials are high,
And technology is immature.
Above-described various fin and heat conducting film, all have electric conductivity, and this has conduction for some
The electronic devices and components of circuit can conduct electricity in using, and easily causes short circuit phenomenon, and price the most thousand of unit one is flat
Side's rice, the most hundreds of unit one square meter, it is impossible to benefit general mass product, the only product of minority height unit price
Afford to use this type of heat conducting film.
Summary of the invention
The technical problem to be solved is to provide a kind of heat conducting film, to overcome prior art to exist
Not enough.
For solving above-mentioned technical problem, the present invention adopts the following technical scheme that:
A kind of heat conducting film, is followed successively by the table of the bottom of flexible parent metal, structure sheaf and flexible parent metal from top to bottom
Layer, it is characterised in that: described structure sheaf is by there being the prominent geometry block being distributed in bottom surface to constitute, adjacent
Forming through groove between geometry block, the thickness of described structure sheaf is 30-50 micron, described groove
Width is 0.5-3 micron, is filled with the pressure working medium of full groove, described heat conducting film four in described groove
The ditch notch in week is blocked, and described pressure working medium is 0.5-2MPa at the pressure of groove.
Connected by adhesive layer between described structure sheaf and top layer.
Described geometry block preferred regular hexagon shape thus form cellular groove.
Described flexible parent metal is PI or PET.The thickness of described bottom is 50-200 micron, the thickness on top layer
Degree is 100 μm, and described pressure working medium is water or carbon dioxide.
In an embodiment of invention, described structure sheaf is to be the flexible parent metal of integrative-structure with bottom.
Also having in an embodiment in the present invention, described structure sheaf is structure glue.
Also having in an embodiment in the present invention, described structure sheaf is PET or metallic film.
It addition, invention also provides for the manufacture method of a kind of heat conducting film, it is characterised in that comprise the steps of:
A, on the bottom of flexible membrane, produce the structure sheaf of geometry block of prominent bottom surface distribution, adjacent
The groove that the spaced formation of geometry block is through, the thickness of structure sheaf is 30-50 micron, and the width of groove is
0.5-3 micron；
B, by flexible membrane and the phase adhesion of structure sheaf surface, close groove and form pipeline；
C, in groove filling pressure working medium, pressure working medium is full of groove, pressure working medium be full of after pressure
For 0.5-2MPa；
D, the ditch notch of closure heat conducting film surrounding.
Described top layer is attached with structure sheaf by adhesive layer.
In one embodiment of this invention, described step A is the bulge-structure utilizing and having continuous distribution
Masterplate, in flexible thin-film material's surface imprint, forms bottom, structure sheaf and groove.
In another embodiment of the invention, described step A is to print geometry block pattern in bottom surface
Structure glue.
In one more embodiment of the present invention, in described step A, first structure sheaf is combined with bottom,
And on structure sheaf, smear photoresist, structure sheaf is lost by recycling with the cancellated mask of geometry
Carving, stopping until etching into bottom surface.
Use technique scheme, the heat conducting film of the present invention is formed for cancellated trickle pipeline, often
Article one, the pipeline formed has the adjacent channel of more than at least two, side thin film pass through heat exchange pattern from
The heat that thermal source absorbs can spread rapidly and then be evenly distributed in the pressure working medium in each pipeline of thin film,
Pressure working medium conducts heat to the opposite side flexible material thin film fitted therewith again by the way of conduction of heat
In.Flexible material thin film can be dispelled the heat by the laminating mode such as metal shell or heat loss through convection.As
This forms a dynamic equilibrium, the temperature of thermal source is maintained within the scope of certain, and used soft
Property material film possesses electric insulating quality, it is adaptable to have the electronic component of conducting wire.
Therefore, the heat conducting film of the present invention has heat conductivity, insulating properties, suitable application area is wide, cost of manufacture is low
Etc. series of advantages.
Accompanying drawing explanation
The present invention is described in detail with detailed description of the invention below in conjunction with the accompanying drawings:
Fig. 1 is the section of structure of the present invention；
Fig. 2 is the floor map of structure sheaf.
Detailed description of the invention
As it is shown in figure 1, the heat conducting film of the present invention, it is followed successively by the bottom 100 of flexible parent metal, knot from top to bottom
The top layer 400 of structure layer 200, adhesive layer 300 and flexible parent metal.
Shown in Fig. 2, wherein, structure sheaf 200 is by there being the prominent geometry block 201 being distributed in bottom surface
Constitute, between adjacent geometry block 201, form through groove 202.Pressure working medium it is filled with in groove 202,
The ditch notch of heat conducting film surrounding is blocked.
The thickness of bottom 100 is 100 microns, and the thickness of structure sheaf is 30-50 micron, the thickness of adhesive layer
Degree is 20 microns, and the thickness on top layer 400 is 100 microns, and the width of groove is 0.5-3 micron.Pressure
Working medium is full of whole groove.
The flexible parent metal on bottom 100 and top layer 400 selects PET or PI, and adhesive layer 300 uses epoxy glue.
In a most preferred embodiment, the most orthohexagonal geometry block forms structure sheaf, such structure sheaf
In be the formation of the trickle pipeline of alveolate texture, the pipeline of each can be with four adjacent pipelines
Connection, when being filled with due to pressure working medium, has the biggest pressure, reaches 0.5-2MPa, should
Pressure makes the heat at thermal source can be transmitted by the rapid terminad of form of pressure wave, and radiating efficiency is high.
The heat conducting film of said structure formed on bottom 100 there is the structure sheaf 200 of passing-through groove 202 can
To be made by following three kinds of techniques respectively:
1, utilize the masterplate of geometric form through hole with continuous distribution in flexible thin-film material's surface imprint,
Form bottom, structure sheaf and groove.In the process, bottom and structure sheaf are structure as a whole.
2, in the structure glue of bottom surface printing geometry block pattern.Formed through between this geometry block pattern
Groove.This structure glue uses macromolecule material, such as epoxy resin, polyacrylate or polyurethane.
3, first structure sheaf is combined with bottom, and on structure sheaf, smears photoresist, utilizing band
There is geometry cancellated mask that structure sheaf is etched, stopping until etching into bottom surface.Structure
Layer can be pet layer or metal level, and metal level can be copper, and aluminum etc. has the material of high thermal conductivity.
Heat conduction is tested:
Heat conducting film bottom and the flexible parent metal on top layer that this heat conduction test uses are all to use PET, in employing
Stating the 2nd kind of technique to be made, structure glue is epoxy resin, and adhesive layer uses epoxy glue.
The thickness of the bottom 100 of heat conducting film is 100 microns, and the geometry block of structure sheaf is regular hexagon, thick
Degree is 40 microns, and the thickness of adhesive layer is 20 microns, and the thickness on top layer 400 is 100 microns, groove
Width be 2 microns.The pressure working medium filled in groove is water, and pressure is 1MPa.
When carrying out heat conduction test, A point, B point to thermal source with away from thermal source 3.5cm measure respectively.
Its measurement result is as shown in table 1:
Table 1: the heat conducting film of this patent carries out heat conduction test (unit: DEG C)
| Thermal source | A point | B point | |
| Initial temperature | 80 | 25 | 25 |
| Equilibrium temperature | 80 | 78 | 78 |
Carry out contrasting heat conduction test with normal aluminium foil
A point, B point to thermal source with away from thermal source 3.5cm measure the most respectively.Its measurement result such as table
Shown in 2:
Table 2: normal aluminium foil carries out heat conduction test (unit: DEG C)
| Thermal source | A point | B point | |
| Initial temperature | 80 | 25 | 25 |
| Equilibrium temperature | 80 | 55 | 55 |
Compare it is found that use normal aluminium foil by above-mentioned two tables, it is impossible to the temperature of thermal source is quickly dissipated
Cloth, and the very difficult equilibrium temperature close to thermal source of equilibrium temperature.And use the heat conducting film of the present invention, heat conducting film
The equilibrium temperature of upper A point and B point, very close to the equilibrium temperature of thermal source, illustrates the heat conducting film heat conduction of this patent
Hurry up, heat conductivity high.
The above, be only presently preferred embodiments of the present invention, and the present invention not makees any pro forma limit
System, has usually intellectual, if without departing from right proposed by the invention in any art
In the protection domain required, utilize the local done by disclosed technology contents to change or modify
Equivalent embodiments, and without departing from the technical characteristic content of the present invention, the most still belong to the technology of the present invention feature
In the range of.
Claims (11)
1. a heat conducting film, is followed successively by the bottom of flexible parent metal, structure sheaf and flexible parent metal from top to bottom
Top layer, it is characterised in that: described structure sheaf by there being the prominent geometry block being distributed in bottom surface to constitute, phase
Forming through groove between adjacent geometry block, the thickness of described structure sheaf is 30-50 micron, described groove
Width be 0.5-3 micron, be filled with the pressure working medium of full groove, described heat conducting film in described groove
The ditch notch of surrounding is blocked, and described pressure working medium is 0.5-2MPa at the pressure of groove.
Heat conducting film the most according to claim 1, it is characterised in that: between described structure sheaf and top layer
Connected by adhesive layer.
Heat conducting film the most according to claim 1, it is characterised in that: the most positive six limits of described geometry block
Shape shape thus form cellular groove.
Heat conducting film the most according to claim 1, it is characterised in that: described flexible parent metal be PI or
Person PET；The thickness of described bottom is 50-200 micron, and the thickness on top layer is 100 μm, described pressure work
Matter is water or carbon dioxide.
Heat conducting film the most according to claim 1, it is characterised in that: described structure sheaf be with bottom in
The flexible parent metal of integrative-structure；Or described structure sheaf is structure glue；Or described structure sheaf be PET or
Metallic film.
6. the manufacture method of a heat conducting film, it is characterised in that comprise the steps of:
A, on the bottom of flexible membrane, produce the structure sheaf of geometry block of prominent bottom surface distribution, adjacent
The groove that the spaced formation of geometry block is through, the thickness of structure sheaf is 30-50 micron, and the width of groove is
0.5-3 micron；
B, by flexible membrane and the phase adhesion of structure sheaf surface, close groove and form pipeline；
C, in groove filling pressure working medium, pressure working medium is full of groove, pressure working medium be full of after pressure
For 0.5-2MPa；
D, the ditch notch of closure heat conducting film surrounding.
The manufacture method of heat conducting film the most according to claim 6, it is characterised in that: described top layer leads to
Cross adhesive layer to be attached with structure sheaf.
The manufacture method of heat conducting film the most according to claim 6, it is characterised in that: described step A
Be the masterplate utilizing the bulge-structure with continuous distribution in flexible thin-film material's surface imprint, formed bottom,
Structure sheaf and groove.
The manufacture method of heat conducting film the most according to claim 6, it is characterised in that: described step A
It is in the structure glue at bottom surface printing geometry block pattern.
The manufacture method of heat conducting film the most according to claim 6, it is characterised in that: described step A
In, first structure sheaf being combined with bottom, and on structure sheaf, smear photoresist, recycling is with several
Structure sheaf is etched by what cancellated mask, stops until etching into bottom surface.
The manufacture method of 11. heat conducting films according to claim 9, it is characterised in that: described structure
The material of layer is copper or aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510069791.8A CN105990274B (en) | 2015-02-10 | 2015-02-10 | A kind of heat conducting film and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510069791.8A CN105990274B (en) | 2015-02-10 | 2015-02-10 | A kind of heat conducting film and preparation method thereof |
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| CN105990274A true CN105990274A (en) | 2016-10-05 |
| CN105990274B CN105990274B (en) | 2018-06-15 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571307A (en) * | 2016-10-08 | 2017-04-19 | 中国电子科技集团公司第五十五研究所 | Preparation method of microchannel heat sink for high-heat flux heat dissipation |
| CN107833869A (en) * | 2017-10-23 | 2018-03-23 | 南京旭羽睿材料科技有限公司 | A kind of graphene heat conducting film and preparation method thereof |
| CN109246997A (en) * | 2018-10-30 | 2019-01-18 | 歌尔科技有限公司 | A kind of flexible heat structure and electronic product |
| CN112752388A (en) * | 2019-10-30 | 2021-05-04 | 江西晶润光学有限公司 | Supporting structure and flexible printed circuit board |
| WO2021082287A1 (en) * | 2019-10-30 | 2021-05-06 | 南昌欧菲生物识别技术有限公司 | Support structure and flexible printed circuit board |
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| US20030159806A1 (en) * | 2002-02-28 | 2003-08-28 | Sehmbey Maninder Singh | Flat-plate heat-pipe with lanced-offset fin wick |
| CN203336548U (en) * | 2013-06-28 | 2013-12-11 | 华南理工大学 | Integrated radiator based on foamy copper and micro groove channels |
| CN103488266A (en) * | 2013-10-14 | 2014-01-01 | 浙江嘉熙光电设备制造有限公司 | Thin sheet type CPU heat dissipation device and machining method thereof |
| CN204577416U (en) * | 2015-02-10 | 2015-08-19 | 上海蓝沛新材料科技股份有限公司 | A kind of heat conducting film |
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2015
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030159806A1 (en) * | 2002-02-28 | 2003-08-28 | Sehmbey Maninder Singh | Flat-plate heat-pipe with lanced-offset fin wick |
| CN203336548U (en) * | 2013-06-28 | 2013-12-11 | 华南理工大学 | Integrated radiator based on foamy copper and micro groove channels |
| CN103488266A (en) * | 2013-10-14 | 2014-01-01 | 浙江嘉熙光电设备制造有限公司 | Thin sheet type CPU heat dissipation device and machining method thereof |
| CN204577416U (en) * | 2015-02-10 | 2015-08-19 | 上海蓝沛新材料科技股份有限公司 | A kind of heat conducting film |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571307A (en) * | 2016-10-08 | 2017-04-19 | 中国电子科技集团公司第五十五研究所 | Preparation method of microchannel heat sink for high-heat flux heat dissipation |
| CN107833869A (en) * | 2017-10-23 | 2018-03-23 | 南京旭羽睿材料科技有限公司 | A kind of graphene heat conducting film and preparation method thereof |
| CN107833869B (en) * | 2017-10-23 | 2019-11-08 | 南京旭羽睿材料科技有限公司 | A kind of graphene heat conducting film and preparation method thereof |
| CN109246997A (en) * | 2018-10-30 | 2019-01-18 | 歌尔科技有限公司 | A kind of flexible heat structure and electronic product |
| CN112752388A (en) * | 2019-10-30 | 2021-05-04 | 江西晶润光学有限公司 | Supporting structure and flexible printed circuit board |
| WO2021082287A1 (en) * | 2019-10-30 | 2021-05-06 | 南昌欧菲生物识别技术有限公司 | Support structure and flexible printed circuit board |
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| CN105990274B (en) | 2018-06-15 |
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