CN107833869A - A kind of graphene heat conducting film and preparation method thereof - Google Patents
A kind of graphene heat conducting film and preparation method thereof Download PDFInfo
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- CN107833869A CN107833869A CN201710992274.7A CN201710992274A CN107833869A CN 107833869 A CN107833869 A CN 107833869A CN 201710992274 A CN201710992274 A CN 201710992274A CN 107833869 A CN107833869 A CN 107833869A
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 70
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 229920002799 BoPET Polymers 0.000 claims abstract description 14
- 230000000694 effects Effects 0.000 claims abstract description 13
- 239000011888 foil Substances 0.000 claims abstract description 11
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 6
- 239000010439 graphite Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 14
- 150000001336 alkenes Chemical class 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 6
- 239000004575 stone Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000003763 carbonization Methods 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- 238000005087 graphitization Methods 0.000 claims description 3
- 238000006722 reduction reaction Methods 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000001737 promoting effect Effects 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000009975 flexible effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Carbon And Carbon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of graphene heat conducting film and preparation method thereof, the graphene heat conducting film includes PET film, PI plastic foils and internal heat-conducting layer, the internal heat-conducting layer includes heat conductive filament, graphene places position and graphene, the graphene is located at graphene and placed inside position, the heat conductive filament is arranged between the interval that multiple graphenes are placed between position, and heat conductive filament uses the pattern of curved arrangement.This kind of graphene heat conducting film and preparation method thereof, technique is simple, easy to operation, and the product quality obtained is stable, and effect is good, suitable for promoting and application；Heat-conducting effect will be good than individual layer and double-layer graphite film, and graphene heat conducting film has pliability, can crimp storage, it is easy to use, good heat conduction effect, it is easy to use, it can be widely applied to the equipment such as notebook computer, mobile phone, TV, video camera, LED and vehicle radiating fin.
Description
Technical field
The present invention relates to grapheme material related substances and preparation method thereof technical field, specially a kind of graphene heat conduction
Film and preparation method thereof.
Background technology
With developing rapidly for modern science and technology, the miniaturization of electronic device, chip dominant frequency improve constantly, and function increasingly increases
By force, the power consumption of one single chip gradually increases, and these result in heat flow density and drastically increased.And study and show, the electricity more than 55%
The failure mode of sub- equipment is too high caused by temperature, therefore the heat dissipation problem of electronic device has in the development of electronic device
Very important effect.
Existing market portioned product carries out heat conduction and heat radiation, especially copper and aluminium by metal group material, although the heat conduction of copper
Coefficient is 398W/mK, but weight is big, the application for limiting it such as oxidizable, and the thermal conductivity factor of aluminium is 237W/mK, it is difficult to
Meets the needs of existing product is to heat conduction and heat radiation.
The content of the invention
It is an object of the invention to provide a kind of graphene heat conducting film and preparation method thereof, to solve in above-mentioned background technology
The problem of proposition.
To achieve the above object, the present invention provides following technical scheme：A kind of graphene heat conducting film and preparation method thereof, should
Graphene heat conducting film includes PET film, PI plastic foils and internal heat-conducting layer, and the internal heat-conducting layer includes heat conductive filament, graphene
Position and graphene are placed, the graphene is located at graphene and placed inside position, and the heat conductive filament is arranged on multiple graphenes and placed
Between interval between position, and heat conductive filament uses the pattern of curved arrangement.
Preferably, the PET film, the thickness value scope of PI plastic foils and internal heat-conducting layer three altogether are 2-3mm,
The respective thickness of both the PET film and PI plastic foils is equal, and the thickness range of the internal heat-conducting layer is 0.5-1mm.
Preferably, the graphene places the circle that is shaped as of position, and the inside diameter scope of graphene placement position is 4-
5mm, and the marginal position of graphene placement position is 0.5-0.9mm apart from the distance range of graphene.
Preferably, the preparation method step of the graphene heat conducting film is：
A is soaked and stirred to graphene oxide using ultrasonic wave, and the ratio range of graphene and water is in soaking solution
0.1-0.01, the speed of agitator scope during stirring is 1000-2500rps；
B carries out multistage filtering using the graphene oxide comminuted material obtained in A, when filtering, gradually makes to obtain material
Grain is less and less；
Graphene oxide solution after being filtered in B is uniformly applied in PET film by C, starts to improve the environment residing for the solution
Temperature, the ambient temperature range residing for the solution are 20-1000 DEG C, are constantly dried so that its formation possesses consolidating for crimpability
Body material；
D carries out reduction reaction operation to the graphite oxide that is prepared, first carries out carbonisation, and the temperature inside retort rises
Speed is 12 DEG C/min, and maximum temperature value is no more than 2800 DEG C so that its internal functional group decomposes, and discharges gas, ensures stone
Black alkene film is internally formed stomata or cavity；
E comes into effect graphitization to the material in D, gradually obtains graphene film.
Compared with prior art, the beneficial effects of the invention are as follows：This kind of graphene heat conducting film and preparation method thereof, technique letter
It is single, it is easy to operation, and the product quality obtained is stable, effect is good, suitable for promoting and application；Heat-conducting effect is than individual layer and double-deck stone
Ink film will get well, and graphene heat conducting film has pliability, can crimp storage, and easy to use, good heat conduction effect is easy to use,
It can be widely applied to the equipment such as notebook computer, mobile phone, TV, video camera, LED and vehicle radiating fin.
Brief description of the drawings
Fig. 1 is the internal structure schematic diagram of the present invention；
Fig. 2 is the transverse interface cross section structure diagram of the present invention.
In figure：1 PET film, 2 heat conductive filaments, 3 graphenes place position, 4 graphenes, 5 PI plastic foils, 6 inside heat-conducting layers.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
, it is necessary to explanation in description of the invention, the orientation of instruction such as term " vertical ", " on ", " under ", " level " or
Person's position relationship is based on orientation shown in the drawings or position relationship, is for only for ease of the description present invention and simplifies description,
Rather than instruction either implies that signified device or element must have specific orientation, with specific azimuth configuration and behaviour
Make, therefore be not considered as limiting the invention.In addition, " first ", " second ", " the 3rd ", " the 4th " are only used for describing mesh
, and it is not intended that instruction or hint relative importance.In description of the invention, it is also necessary to explanation, unless otherwise
Clearly regulation and limitation, term " settings ", " installation ", " connected ", " connection ", should be interpreted broadly, for example, it may be company
Connect or be fixedly connected or be detachably connected, or integrally connected, can mechanically connect or be electrically connected
Connect, can be directly connected to or be connected by intermediary, can be the connection of two element internals.For ability
For the those of ordinary skill in domain, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
Fig. 1-2 is referred to, the present invention provides a kind of technical scheme：A kind of graphene heat conducting film and preparation method thereof, the stone
Black alkene heat conducting film includes PET film 1, PI plastic foils 5 and internal heat-conducting layer 6, and the PET film 1, PI plastic foils 5 and inside are led
The thickness value scope of the three of thermosphere 6 altogether is 2-3mm, and both respective thickness of the PET film 1 and PI plastic foils 5 is equal,
The thickness range of the internal heat-conducting layer 6 is 0.5-1mm, and the internal heat-conducting layer 6 includes heat conductive filament 2, graphene places the and of position 3
Graphene 4, the graphene 4 are located at graphene and placed inside position 3, and the graphene placement position 3 is shaped as circle, and graphite
The inside diameter scope that alkene places position 3 is 4-5mm, and graphene places distance range of the marginal position apart from graphene 4 of position 3
It is 0.5-0.9mm, the heat conductive filament 2 is arranged between the interval that multiple graphenes are placed between position 3, and heat conductive filament 2 is using bent
The pattern of type arrangement.
The preparation method step of the graphene heat conducting film is：
A is soaked and stirred to graphene oxide using ultrasonic wave, and the ratio range of graphene and water is in soaking solution
0.1-0.01, the speed of agitator scope during stirring is 1000-2500rps；
B carries out multistage filtering using the graphene oxide comminuted material obtained in A, when filtering, gradually makes to obtain material
Grain is less and less；
Graphene oxide solution after being filtered in B is uniformly applied in PET film by C, starts to improve the environment residing for the solution
Temperature, the ambient temperature range residing for the solution are 20-1000 DEG C, are constantly dried so that its formation possesses consolidating for crimpability
Body material；
D carries out reduction reaction operation to the graphite oxide that is prepared, first carries out carbonisation, and the temperature inside retort rises
Speed is 12 DEG C/min, and maximum temperature value is no more than 2800 DEG C so that its internal functional group decomposes, and discharges gas, ensures stone
Black alkene film is internally formed stomata or cavity；
E comes into effect graphitization to the material in D, gradually obtains graphene film.
This kind of graphene heat conducting film and preparation method thereof, technique is simple, easy to operation, and the product quality obtained is stable,
Effect is good, suitable for promoting and applying；Heat-conducting effect will be good than individual layer and double-layer graphite film, and graphene heat conducting film has flexible
Property, storage can be crimped, easy to use, good heat conduction effect is easy to use, and it is mechanical, electrical to can be widely applied to notebook computer, hand
Depending on, the equipment such as video camera, LED and vehicle radiating fin.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (4)
- A kind of 1. graphene heat conducting film and preparation method thereof, it is characterised in that：The graphene heat conducting film includes PET film（1）、 PI plastic foils（5）With internal heat-conducting layer（6）, the internal heat-conducting layer（6）Including heat conductive filament（2）, graphene place position（3）And stone Black alkene（4）, the graphene（4）Position is placed positioned at graphene（3）Inside, the heat conductive filament（2）Multiple graphenes are arranged on to put Set（3）Between interval between, and heat conductive filament（2）Using the pattern of curved arrangement.
- A kind of 2. graphene heat conducting film according to claim 1 and preparation method thereof, it is characterised in that：The PET film （1）, PI plastic foils（5）With internal heat-conducting layer（6）The thickness value scope of three altogether is 2-3mm, the PET film（1）With PI plastic foils（5）Both respective thickness is equal, the internal heat-conducting layer（6）Thickness range be 0.5-1mm.
- A kind of 3. graphene heat conducting film according to claim 1 and preparation method thereof, it is characterised in that：The graphene is put Set（3）Be shaped as circle, and graphene places position（3）Inside diameter scope be 4-5mm, and graphene places position（3） Marginal position apart from graphene（4）Distance range be 0.5-0.9mm.
- A kind of 4. graphene heat conducting film according to claim 1 and preparation method thereof, it is characterised in that：The graphene heat conduction The preparation method step of film is：A is soaked and stirred to graphene oxide using ultrasonic wave, and the ratio range of graphene and water is in soaking solution 0.1-0.01, the speed of agitator scope during stirring is 1000-2500rps；B carries out multistage filtering using the graphene oxide comminuted material obtained in A, when filtering, gradually makes to obtain material Grain is less and less；Graphene oxide solution after being filtered in B is uniformly applied in PET film by C, starts to improve the environment residing for the solution Temperature, the ambient temperature range residing for the solution are 20-1000 DEG C, are constantly dried so that its formation possesses consolidating for crimpability Body material；D carries out reduction reaction operation to the graphite oxide that is prepared, first carries out carbonisation, and the temperature inside retort rises Speed is 12 DEG C/min, and maximum temperature value is no more than 2800 DEG C so that its internal functional group decomposes, and discharges gas, ensures stone Black alkene film is internally formed stomata or cavity；E comes into effect graphitization to the material in D, gradually obtains graphene film.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911193401.2A CN110993574A (en) | 2017-10-23 | 2017-10-23 | Graphene heat-conducting film and preparation method thereof |
| CN201710992274.7A CN107833869B (en) | 2017-10-23 | 2017-10-23 | A kind of graphene heat conducting film and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710992274.7A CN107833869B (en) | 2017-10-23 | 2017-10-23 | A kind of graphene heat conducting film and preparation method thereof |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911193401.2A Division CN110993574A (en) | 2017-10-23 | 2017-10-23 | Graphene heat-conducting film and preparation method thereof |
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| Publication Number | Publication Date |
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| CN107833869A true CN107833869A (en) | 2018-03-23 |
| CN107833869B CN107833869B (en) | 2019-11-08 |
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| CN201911193401.2A Withdrawn CN110993574A (en) | 2017-10-23 | 2017-10-23 | Graphene heat-conducting film and preparation method thereof |
| CN201710992274.7A Active CN107833869B (en) | 2017-10-23 | 2017-10-23 | A kind of graphene heat conducting film and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109140385A (en) * | 2018-10-15 | 2019-01-04 | 华域视觉科技(上海)有限公司 | A kind of car light part and preparation method thereof with anti-focusing heat sinking function |
| CN109968846A (en) * | 2019-04-30 | 2019-07-05 | 山东华滋自动化技术股份有限公司 | A kind of graphene coating process |
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| CN102651961A (en) * | 2012-05-29 | 2012-08-29 | 邱璟 | Heat-conduction heat-dissipation interface material and manufacturing method thereof |
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| CN105086461A (en) * | 2015-09-30 | 2015-11-25 | 桂林健评环保节能产品开发有限公司 | Composite heat conductive material for LEDs |
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| CN106384730A (en) * | 2016-12-06 | 2017-02-08 | 江苏悦达新材料科技有限公司 | High heat conduction metal foil layer/graphene metal mixed layer composite heat radiation film |
| WO2017036055A1 (en) * | 2015-08-31 | 2017-03-09 | 新纳科技有限公司 | Thermally conductive structure and heat dissipation device |
| CN107902645A (en) * | 2017-10-13 | 2018-04-13 | 南京旭羽睿材料科技有限公司 | The preparation method of single-layer graphene |
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2017
- 2017-10-23 CN CN201911193401.2A patent/CN110993574A/en not_active Withdrawn
- 2017-10-23 CN CN201710992274.7A patent/CN107833869B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102651961A (en) * | 2012-05-29 | 2012-08-29 | 邱璟 | Heat-conduction heat-dissipation interface material and manufacturing method thereof |
| CN103122075A (en) * | 2013-03-19 | 2013-05-29 | 苏州格瑞丰纳米科技有限公司 | High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof |
| CN105990274A (en) * | 2015-02-10 | 2016-10-05 | 上海量子绘景电子股份有限公司 | Heat conduction film and manufacturing method thereof |
| WO2017036055A1 (en) * | 2015-08-31 | 2017-03-09 | 新纳科技有限公司 | Thermally conductive structure and heat dissipation device |
| CN105086461A (en) * | 2015-09-30 | 2015-11-25 | 桂林健评环保节能产品开发有限公司 | Composite heat conductive material for LEDs |
| CN106384730A (en) * | 2016-12-06 | 2017-02-08 | 江苏悦达新材料科技有限公司 | High heat conduction metal foil layer/graphene metal mixed layer composite heat radiation film |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109140385A (en) * | 2018-10-15 | 2019-01-04 | 华域视觉科技(上海)有限公司 | A kind of car light part and preparation method thereof with anti-focusing heat sinking function |
| CN109140385B (en) * | 2018-10-15 | 2023-09-01 | 华域视觉科技(上海)有限公司 | Car lamp part with anti-focusing and heat-dissipating functions and preparation method thereof |
| CN109968846A (en) * | 2019-04-30 | 2019-07-05 | 山东华滋自动化技术股份有限公司 | A kind of graphene coating process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110993574A (en) | 2020-04-10 |
| CN107833869B (en) | 2019-11-08 |
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Effective date of registration: 20201111 Address after: Room 808, No. 218 Ningguo Road, Yangpu District, Shanghai 200082 Patentee after: Xinhua (Shanghai) equipment Co., Ltd Address before: 211100 Jiangsu City, Jiangning, Qilin District, science and Technology Innovation Park, Hui Chi Road, unit B, building 300, building two Patentee before: NANJING XUYURUI MATERIAL TECHNOLOGY Co.,Ltd. |