CN105744812A - Heat radiating assembly and mobile terminal - Google Patents
Heat radiating assembly and mobile terminal Download PDFInfo
- Publication number
- CN105744812A CN105744812A CN201610287064.3A CN201610287064A CN105744812A CN 105744812 A CN105744812 A CN 105744812A CN 201610287064 A CN201610287064 A CN 201610287064A CN 105744812 A CN105744812 A CN 105744812A
- Authority
- CN
- China
- Prior art keywords
- heat
- piece
- radiating
- adsorption
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005855 radiation Effects 0.000 claims abstract description 32
- 238000010521 absorption reaction Methods 0.000 claims description 131
- 238000001179 sorption measurement Methods 0.000 claims description 118
- 239000000463 material Substances 0.000 claims description 65
- 239000002131 composite material Substances 0.000 claims description 49
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 26
- 239000002202 Polyethylene glycol Substances 0.000 claims description 22
- 239000003094 microcapsule Substances 0.000 claims description 22
- 229920001223 polyethylene glycol Polymers 0.000 claims description 22
- 238000009825 accumulation Methods 0.000 claims description 16
- 239000000377 silicon dioxide Substances 0.000 claims description 16
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 15
- 239000007822 coupling agent Substances 0.000 claims description 15
- 235000012239 silicon dioxide Nutrition 0.000 claims description 14
- 238000005338 heat storage Methods 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 10
- 206010011732 Cyst Diseases 0.000 claims description 8
- 208000031513 cyst Diseases 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 6
- 238000004064 recycling Methods 0.000 abstract 1
- 239000012071 phase Substances 0.000 description 22
- 239000007791 liquid phase Substances 0.000 description 16
- 229920000139 polyethylene terephthalate Polymers 0.000 description 16
- 239000005020 polyethylene terephthalate Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 10
- -1 organo-siloxane compound Chemical class 0.000 description 10
- 239000012782 phase change material Substances 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- 239000006185 dispersion Substances 0.000 description 9
- 239000000499 gel Substances 0.000 description 8
- 239000007790 solid phase Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 230000007704 transition Effects 0.000 description 6
- 241001507939 Cormus domestica Species 0.000 description 5
- 230000009466 transformation Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000001110 calcium chloride Substances 0.000 description 2
- 229910001628 calcium chloride Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001804 emulsifying effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- JZMYRQHKOYJYQO-UHFFFAOYSA-N methanol;1,2-xylene Chemical compound OC.CC1=CC=CC=C1C JZMYRQHKOYJYQO-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat radiating assembly which comprises an absorbing member and a heat radiating member. The absorbing member comprises a connecting surface and an absorbing surface which are arranged in a manner of facing each other. The connecting surface is arranged on the heat radiating member. The absorbing surface is used for being absorbed on a device so that the heat radiating member performs heat radiation on heat on the device. The heat radiating member in the heat radiating assembly is arranged on the connecting surface of the absorbing member; then the absorbing surface of the absorbing member is used for being pressed on a device, thereby exhausting air in a plurality of absorbing holes, so that the heat radiating member can be absorbed on the device through the plurality of absorbing holes in a vacuum absorbing manner. Furthermore when detachment of the heat radiating member is required, the heat radiating member can be detached through applying a small force, thereby realizing no heat radiating member damage, realizing recycling of the heat radiating member and improving reliability of the heat radiating member. The invention further provides a mobile terminal.
Description
Technical field
The present invention relates to a kind of electronic device field, particularly relate to a kind of radiating subassembly and mobile terminal.
Background technology
Development along with mobile phone industry, mobile phone configuration is more and more higher, central processing unit (CentralProcessingUnit/CPU) dominant frequency is more and more higher, power consumption is increasing, and also strain is big mutually to cause cell-phone heating amount, if these heats do not reach control or transfer, the impact of two aspects will be brought: 1. chip for cell phone temperature is too high, causing that mobile phone computing is slack-off, even card, affects the use of mobile phone；2. chip for cell phone temperature transfer is to phone housing, causes that skin temperature is higher, there will be the problems such as hot, boiling hot ear during use.
For solving the heating problem of mobile phone; it is usually in the industry at present and radiating piece is pasted onto on the equipment that heat is concentrated; to play the effect of soaking and heat radiation; after finding when but inventor states technical scheme on the implementation that radiating piece is pasted onto on equipment; taken off inconvenience, it will usually radiating piece is caused damage.
Summary of the invention
It is an object of the invention to provide a kind of can the radiating subassembly of being dismounted for multiple times and there is the mobile terminal of this radiating subassembly.
In order to solve above-mentioned technical problem, the invention provides a kind of radiating subassembly, including adsorption piece and radiating piece, described adsorption piece includes the joint face and the adsorption plane that are oppositely arranged, described joint face is arranged on described radiating piece, described adsorption plane is for being adsorbed in device, so that the heat on described device is dispelled the heat by described radiating piece.
Wherein, described adsorption plane offers multiple adsorption hole, and described adsorption piece is adsorbed on described device by the plurality of adsorption hole.
Wherein, described radiating piece includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function, and described heat absorption heat accumulating is for absorbing the heat on described device, and the heat of absorption is stored by described heat absorption heat accumulating.
Wherein, described radiating piece also includes titanate coupling agent and glue-line, described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, and described glue-line stacking is covered on described flaky material, and described flaky material is adhered to the joint face of described adsorption piece by described glue-line.
Wherein, described radiating piece also includes retarder thinner and bonding solution, and described heat absorption heat accumulating, described retarder thinner and described bonding solution mix and coats on the joint face of described adsorption piece.
Wherein, described radiating piece also includes substrate and glue-line, described heat absorption heat accumulating is coated in described substrate, and described glue-line stacking is covered on described radiating piece, and the substrate being coated with described heat absorption heat accumulating is adhered on the joint face of described adsorption piece by described glue-line.
Wherein, described radiating piece includes the composite material with the material properties of heat absorption, heat accumulation and heat sinking function, described composite material is by absorbing heat heat accumulating and heat conduction and heat radiation material mixing forms, described heat conduction and heat radiation material for passing to described heat absorption heat accumulating by the heat on described device, described heat absorption heat accumulating, for absorbing and storing the heat on described device, stores the heat of described heat conduction and heat radiation conduct simultaneously.
Wherein, the mass ratio of described heat absorption heat accumulating and described heat conduction and heat radiation material is 1:1.
Wherein, described radiating piece also includes titanate coupling agent and glue-line, described composite material and described titanate coupling agent are mixed and made into flaky material, and described glue-line stacking is covered on described flaky material, and described flaky material is adhered to the joint face of described adsorption piece by described glue-line.
Wherein, described radiating piece also includes retarder thinner and bonding solution, and described composite material, described retarder thinner and described bonding solution mix and coats on the joint face of described adsorption piece.
Wherein, described radiating piece also includes substrate and glue-line, and described composite material is coated in described substrate, and described glue-line stacking is covered on described radiating piece, and the substrate being coated with described composite material is adhered on the joint face of described adsorption piece by described glue-line.
Wherein, described heat absorption heat accumulating includes silicon dioxide and Polyethylene Glycol, and the mass ratio of described silicon dioxide and Polyethylene Glycol is 1:1～1:9.
Wherein, described heat absorption heat accumulating by some with described silicon dioxide be cyst wall, with described Polyethylene Glycol be capsule-core microcapsule constituted.
Wherein, described radiating subassembly also includes protecting film, and described protecting film is arranged on described radiating piece, and described protecting film is located remotely from the side of joint face of described adsorption piece.
The embodiment of the present invention additionally provides a kind of mobile terminal, and including device and radiating subassembly, the adsorption plane of described adsorption piece is adsorbed on described device.
Radiating piece in radiating subassembly provided by the invention is arranged on the joint face of adsorption piece, again the adsorption plane of adsorption piece is located at device for pressure, air in multiple adsorption holes is emptied, enable radiating piece by multiple adsorption hole vac sorbs on device, and when radiating piece needs to dismount, only power need to be made slightly to be taken off by radiating piece, be damaged from radiating piece, radiating piece can be repeatedly used, improve the reliability of radiating subassembly.
Accompanying drawing explanation
In order to be illustrated more clearly that technical scheme, the accompanying drawing used required in embodiment will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic diagram of a kind of mobile terminal that the embodiment of the present invention one provides；
Fig. 1 a is the schematic diagram that the device shown in Fig. 1 arranges radiating subassembly；
Fig. 2 is the profile of a kind of radiating subassembly that the embodiment of the present invention two provides；
Fig. 3 is the profile of a kind of radiating subassembly that the embodiment of the present invention three provides；
Fig. 4 is the profile of a kind of radiating subassembly that the embodiment of the present invention four provides；
Fig. 5 is the profile of a kind of radiating subassembly that the embodiment of the present invention five provides；
Fig. 6 is the profile of a kind of radiating subassembly that the embodiment of the present invention six provides；
Fig. 7 is the profile of a kind of radiating subassembly that the embodiment of the present invention seven provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
The mobile terminal that the present embodiments relate to can be any equipment possessing communication and storage function, such as: panel computer, mobile phone, electronic reader, remote controller, personal computer (PersonalComputer, PC), notebook computer, mobile unit, Web TV, wearable device etc. have the smart machine of network function.
As shown in Fig. 1 and Fig. 1 a, for a kind of mobile terminal 100 that invention first embodiment provides, mobile terminal 100 includes device 20 and radiating subassembly 10, radiating subassembly 10 is adsorbed on device 20, so that the heat on device 20 is dispelled the heat, device 20 can be the device 20 that caloric value is bigger, such as bonnet and battery cover, support or radome etc..It should be understood that radiating subassembly 10 can be arranged at the whole surface of device 20, required region can also be arranged at.The present embodiment is adsorbed on bonnet with radiating subassembly 10 and illustrates.Concrete, radiating subassembly 10 is arranged at the first area for carrying battery of the inner surface of bonnet, is namely that the heat concentrated on first area is dispelled the heat, thus reducing the heating impact of bonnet.
It should be understood that bonnet offers multiple thermal hole 21.Thermal hole 21 can be processed to form by the mode of cut, so that thermal hole 21 can reach the sightless effect of naked eyes, thus not affecting the outward appearance of bonnet.Thermal hole 21 can be arranged in first area, it is also possible to arrange around first area, the heat in bonnet is better conducted heat, and improves the heat dispersion of bonnet further.
Wherein, the detailed description of the invention of radiating subassembly 10 refers to following example.
Refer to Fig. 2, for inventing a kind of radiating subassembly 30 that the second embodiment provides, radiating subassembly 30 includes adsorption piece 31 and radiating piece 32, and radiating piece 32 is used for dispelling the heat, and radiating piece 32 is arranged on adsorption piece 31.
In the present embodiment, adsorption piece 31 includes the joint face 311 and the adsorption plane 312 that are oppositely arranged, and radiating piece 32 is arranged on the adsorption plane 312 of adsorption piece 31, and adsorption plane 312 is adsorbed on device.It should be understood that adsorption plane 312 offers multiple adsorption hole 312a, radiating piece 32 is adsorbed on device by multiple adsorption hole 312a.Concrete, adsorption piece 31 is cushion, adsorption plane 312 array offers the adsorption hole 312a of multiple semicircle, radiating piece 32 is arranged on the joint face 311 of adsorption piece 31, being pressed by the adsorption plane 312 of adsorption piece 31 is located on device again, air in multiple adsorption hole 312a is emptied, makes radiating piece 32 can pass through multiple adsorption hole 312a vac sorbs on first area.When radiating piece 32 needs to dismount, only power need to be made slightly to be taken off by radiating piece 32, be damaged from radiating piece 32 so that radiating piece 32 assembly can repeatedly use, improve the reliability of radiating subassembly 30.Certainly, in other embodiments, device can also offer the adsorption hole of multiple semicircle, and adsorption plane is squeezed in multiple adsorption hole, so that adsorption piece is adsorbed on device.Concrete, adsorption plane is plane, is extruded by multiple adsorption holes of adsorption plane respective devices, is discharged by the air of the adsorption hole on device, to realize the vac sorb of radiating piece and device.
In the present embodiment, radiating piece 32 includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function, and heat absorption heat accumulating is for absorbing the heat on device, and the heat of absorption is stored by the heat accumulating that absorbs heat.
By arranging radiating subassembly 30 on device, radiating piece 32 in radiating subassembly 30 includes having the heat absorption heat accumulating of heat absorption and heat storage function and can the heat on device be absorbed, and by heat storage at self, after the temperature of device lowers, the heat of storage is slowly dispersed in air, thus reducing the heat of device, so that the mobile terminal with this device has preferably heat dispersion, the reliability that raising equipment uses, decreases the heating impact on device.
In the present embodiment, heat absorption heat accumulating can be a kind of phase-change material, it can change physical property and can absorb substantial amounts of heat along with variations in temperature, increase along with the heat absorbed, heat absorption heat accumulating gradates as another kind of phase mutually from one, can stably maintain another kind of phase after absorbing sufficient heat and no longer absorb heat, and when not having thermal source or heat relatively low on device, heat absorption heat accumulating carries out dispelling the heat and gradually along with reducing of heat is reverted to original phase mutually gradually by another kind.Wherein, heat absorption heat accumulating can along with the change of temperature from solid phase to liquid phase or liquid phase to solid transformation, or solid phase is to gas phase or liquid phase to solid transformation, or liquid phase is to gas phase or gas phase to liquid phase.
It should be understood that the mating shapes of the shape of radiating piece 32 and device, when the heat of device reaches uniform temperature, the heat on device is absorbed heat and heat accumulation by heat absorption heat accumulating, and device is lowered the temperature.
In order to further improve, heat absorption heat accumulating preferably comprises the silicon dioxide and Polyethylene Glycol that mass ratio is 1:1～1:9.Inventor is drawn by substantial amounts of experiment, by silicon dioxide and Polyethylene Glycol with mass ratio for 1:1～1:9 mixing can prepare organic-composite phase-change material has suitable phase transition temperature, the heat of device can be absorbed in time, improve the reliability of device further.Concrete, the phase transition temperature that the mixing of this heat absorption heat accumulating prepares is 40 degree, and after the heat namely produced at device reaches 40 degree, heat absorption heat accumulating carries out decalescence, is taken away by the heat of device, so that device to be lowered the temperature.Certainly, in other embodiments, heat absorption heat accumulating can also be inorganic phase-changing material, or composite phase-change material etc..
In order to further improve, heat absorption heat accumulating by some with silicon dioxide be cyst wall, with Polyethylene Glycol be capsule-core microcapsule constituted.Device preferably can be carried out heat absorption heat accumulation by the heat absorption heat accumulating of this microcapsule structure, and then reaches preferably heat dispersion.Concrete, Polyethylene Glycol is joined in certain density Ludox, after all dissolving, drip CaCl2Accelerator solution, under strong stirring so that sol gel reaction occurs Polyethylene Glycol in Ludox, forms three-dimensional net structure gel after standing；By gel forced air drying 24～48h in 80 DEG C of baking ovens, be cooled to room temperature, can access with organo-siloxane compound produce in the basic conditions a large amount of with silica dioxide gel be cyst wall, the microcapsule that is capsule-core with the Polyethylene Glycol after emulsifying.Namely in each microcapsule, silicon dioxide wraps the Polyethylene Glycol as capsule-core as cyst wall so that Polyethylene Glycol will not leak from the process of solid-liquid, it is possible to is well lived by Silica-coated.The heat absorption heat accumulating of this formation microcapsule structure is after the heat of device reaches 40 degree, start the heat absorbing on device, and capsule-core itself is gradually increased gradually from solid-liquid along with heat, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating absorbs is saturated, it stops absorbing heat, and after the temperature of device is gradually decrease to preset temperature, capsule-core can be converted to solid phase from liquid phase gradually, by the heat of absorption, (phase transition process being transformed from the solidified state into liquid at capsule-core due to heat absorption heat accumulating can take away a part of latent heat to capsule-core simultaneously, so time capsule-core in heat only small) come out gradually, it is delivered in air, this moment, changed by the circulation of above-mentioned solid phase to liquid phase, thus device is lowered the temperature, improve heat dispersion and the reliability of the device with this radiating subassembly.Certainly, in other embodiments, heat absorption heat accumulating can also be other structure so that heat absorption heat accumulating can by changing to device cooling from the circulation being solid to gas phase.
As shown in Figure 2, in order to further improve, radiating piece 32 also includes titanate coupling agent and glue-line 322, heat absorption heat accumulating and titanate coupling agent are mixed and made into flaky material 321, glue-line 322 stacking is covered on flaky material 321, flaky material 321 is adhered on the joint face 311 of adsorption piece 31 by glue-line 322, and the adsorption plane 312 again through adsorption piece 31 is adsorbed on the joint face 311 of adsorption piece 31.
In the present embodiment, heat absorption heat accumulating is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, namely without influence on the heat absorption heat storage function of heat absorption heat accumulating, add titanate coupling agent hydrophobically modified at pulverous heat absorption heat accumulating and obtain inorganic plan organic composite shaping phase-change material, this inorganic plan organic composite shaping phase-change material is prepared through tabletting machine flake and flaky material 321 again, flaky material 321 stacking again connects upper glue layer 322 and forms radiating piece 32.It should be understood that glue-line 322 can be gum, double faced adhesive tape or mould release membrance etc..This flaky material 321 of radiating piece 32 can be cut into definite shape according to the shape of device, applies more convenient, is fitted on device without waiting for the phase, it is achieved the function of heat absorption heat accumulation.
In order to further improve, radiating subassembly 30 also includes protecting film 33, and protecting film 33 is arranged on radiating piece 32, and protecting film 33 is located remotely from the side of adsorption plane 312 of adsorption piece 31.
By arranging protecting film 33 on radiating piece 32, so that radiating piece 32 to be protected further, improve the reliability of radiating subassembly 30 further.
In the present embodiment, protecting film 33 is polyethylene terephthalate (PET), and its stacking is covered on flaky material 321, and opposing with glue-line 322, and flaky material 321 can be shaped and have dust-proof effect by protecting film 33 further.Certainly, in other embodiments, the material of protecting film 33 can also be other, such as silica gel.
As shown in Figure 3, for the radiating subassembly 230 that third embodiment of the invention provides, this radiating subassembly 230 is roughly the same with the basic structure of the radiating subassembly 30 that first embodiment of the invention provides, it is different in that, radiating piece 232 in the present embodiment includes heat radiator material, retarder thinner and bonding solution, and heat absorption heat accumulating, retarder thinner and bonding solution mix and coats on the joint face 2311 of adsorption piece 231.
By retarder thinner, bonding solution are mixed to form radiating piece 232 with heat absorption heat accumulating, radiating piece 232 is made directly to have adhesive force, can coat on the joint face 2311 of adsorption piece 231 without still further increasing glue-line, thus providing one to use advantageously radiating piece 232.
In the present embodiment, heat absorption heat accumulating is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, namely without influence on the heat absorption heat storage function of heat absorption heat accumulating, it is added to retarder thinner at pulverous heat absorption heat accumulating and adds the mixing of special binder solution (such as: methanol dimethylbenzene, acrylic resin etc.), radiating piece 232 is made to have adhesive force, radiating piece 232 directly adopts the form of coating be piled into certain thickness and is attached on the joint face 2311 of adsorption piece 231, thus realizing the function of heat absorption heat accumulation.
In order to further improve, radiating subassembly 230 also includes protecting film 233, and protecting film 233 is arranged on radiating piece 232, and protecting film 233 is located remotely from the side of adsorption piece 231.
By arranging protecting film 233 on radiating piece 232, so that radiating piece 232 to be protected further, improve the reliability of radiating subassembly 230 further.
In the present embodiment, protecting film 233 is polyethylene terephthalate (PET).Wherein, after radiating piece 232 is directly coated on the joint face 2311 of adsorption piece 231, protecting film 233 is arranged on radiating piece 232.Radiating piece 232 can be shaped and have dust-proof effect by protecting film 233 further.Certainly, in other embodiments, the material of protecting film 233 can also be other, such as silica gel.
As shown in Figure 4, for the radiating subassembly 330 that fourth embodiment of the invention provides, this radiating subassembly 330 is roughly the same with the basic structure of the radiating subassembly 30 that first embodiment of the invention provides, it is different in that, this radiating piece 332 includes heat radiator material 3321, substrate 3322 and glue-line 3323, heat absorption heat accumulating 3321 is coated in substrate 3322, and glue-line 3323 stacking is connected on heat absorption heat accumulating 3321, and glue-line 3323 is adhered on the joint face 3311 of adsorption piece 331.
By directly heat absorption heat accumulating 3321 being coated molding in substrate 3322, then at heat absorption heat accumulating 3321, glue-line 3323 is set to be pasted on the joint face 3311 of adsorption piece 331, it is not necessary to tablet machine carries out tabletting, makes relatively simple.
In the present embodiment, substrate 3322 is polyethylene terephthalate (PET), heat absorption heat accumulating 4321 is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating 3321, namely without influence on the heat absorption heat storage function of heat absorption heat accumulating 3321, pulverous heat absorption heat accumulating 3321 is directly coated at molding in substrate 3322, the substrate 3322 with heat absorption heat accumulating 3321 is adhered on the joint face 3311 of adsorption piece 331 by glue-line 3323, realize the heat absorption heat storage function of radiating piece 332.It should be understood that glue-line 3323 can be gum, double faced adhesive tape or other etc..
In order to further improve, radiating subassembly 330 also includes protecting film 333, and protecting film 333 is arranged on radiating piece 332, and is located remotely from the side of adsorption piece 331.
By arranging protecting film 333 on radiating piece 332, so that radiating piece 332 to be protected further, improve the reliability of radiating subassembly 330 further.
In the present embodiment, protecting film 333 is polyethylene terephthalate (PET).Protecting film 333 is arranged in substrate 3322.Radiating piece can be shaped and have dust-proof effect by protecting film 333 further.Certainly, in other embodiments, the material of protecting film 333 can also be other, such as silica gel.
Referring to Fig. 5, for a kind of radiating subassembly 40 that invention the 5th embodiment provides, radiating subassembly 40 includes adsorption piece 41 and radiating piece 42, and radiating piece 42 is used for dispelling the heat, and radiating piece 42 is arranged on adsorption piece 41.
In the present embodiment, adsorption piece 41 includes the joint face 411 and the adsorption plane 412 that are oppositely arranged, and radiating piece 42 is arranged on adsorption piece 41, and adsorption plane 412 is adsorbed on device.It should be understood that adsorption plane 412 offers multiple adsorption hole 412a, radiating piece 42 is adsorbed on device by multiple adsorption hole 412a.Concrete, adsorption piece 41 is cushion, adsorption plane 412 array offers the adsorption hole 412a of multiple semicircle, radiating piece 42 is arranged on the joint face 411 of adsorption piece 41, being pressed by the adsorption plane 412 of adsorption piece 41 is located on device again, air in multiple adsorption hole 412a is emptied, makes radiating piece 42 can pass through multiple adsorption hole 412a vac sorbs on device.When radiating piece 42 needs to dismount, only power need to be made slightly to be taken off by radiating piece 42, be damaged from radiating piece 42 so that radiating piece 42 shell repeatedly uses, improve the reliability of radiating subassembly 40.Certainly, in other embodiments, device can also offer the adsorption hole 412a of multiple semicircle, and adsorption plane 412 is squeezed in multiple adsorption hole 412a, so that adsorption piece 41 is adsorbed on device.Concrete, adsorption plane 412 is plane, is extruded by multiple adsorption hole 412a of adsorption plane 412 respective devices, is discharged by the air of the adsorption hole 412a on device, to realize the vac sorb of radiating piece 42 and device.
In the present embodiment, radiating piece 42 includes the composite material with the material properties of heat absorption, heat accumulation and heat sinking function, composite material is by absorbing heat heat accumulating and heat conduction and heat radiation material mixing forms, heat conduction and heat radiation material is for passing to heat absorption heat accumulating by the heat on device, the heat absorption heat accumulating heat for absorbing and on memory device, stores the heat of heat conduction and heat radiation conduct simultaneously.
Radiating subassembly 40 provided by the invention includes having heat absorption, the composite material of heat accumulation and heat sinking function, composite material is by absorbing heat heat accumulating and heat conduction and heat radiation material mixing forms, the heat absorption heat accumulating heat for absorbing and on memory device, simultaneously heat conduction and heat radiation material is accelerated heat absorption heat accumulating and to the absorption of the heat on device and is distributed, utilize composite material that the heat on device is absorbed heat, heat accumulation and heat radiation, such that it is able to reduce the temperature of device, properly functioning to ensure the mobile terminal with this device, simultaneously by the effect of heat accumulation and heat radiation, device temperature can be avoided too high.
It should be understood that composite material is mixed to form by heat conduction and heat radiation material and heat absorption heat accumulating, heat absorption heat accumulating is the material of the material properties with heat absorption and heat storage function, and the mass ratio of heat absorption heat accumulating and heat conduction and heat radiation material is 1:1.The heat absorption heat accumulating comprised by the composite material in radiating piece 42 carries out absorbing heat and heat accumulation, heat on device can be absorbed and is stored in heat absorption heat accumulating, to reduce the temperature of device, and heat can be avoided to be directly delivered to phone housing by storing heat；The heat conduction and heat radiation material comprised by the composite material in radiating piece 42 carries out conducting heat and dispelling the heat, can accelerate the heat absorption heat accumulating heat absorption to device, after heat absorption heat accumulating absorbs the heat of abundance, heat in heat absorption heat accumulating can be dispelled the heat again, further enhance the cooling-down effect to device.
Understandable, heat absorption heat accumulating can be a kind of phase-change material, it can change physical property and can absorb substantial amounts of heat along with variations in temperature, increase along with the heat absorbed, heat absorption heat accumulating gradates as another kind of phase mutually from one, can stably maintain another kind of phase after absorbing sufficient heat and no longer absorb heat, and the heat absorbed can take away a part of latent heat along with the phase transformation of heat absorption heat accumulating, and when device not having heat or heat relatively low, heat absorption heat accumulating carries out dispelling the heat and gradually along with reducing of heat is reverted to original phase mutually gradually by another kind.Wherein, heat absorption heat accumulating can along with the change of temperature from solid phase to liquid phase or liquid phase to solid transformation, or solid phase is to gas phase or liquid phase to solid transformation, or liquid phase is to gas phase or gas phase to liquid phase.
Optionally, heat absorption heat accumulating preferably comprises the silicon dioxide and Polyethylene Glycol that mass ratio is 1:1～1:9.Inventor is drawn by substantial amounts of experiment, by silicon dioxide and Polyethylene Glycol with mass ratio for 1:1～1:9 mixing can prepare organic-composite phase-change material has suitable phase transition temperature, the heat of device can be absorbed in time, improve the reliability of device and mobile terminal further.Concrete, the phase transition temperature that the mixing of this heat absorption heat accumulating prepares is 40 degree, and after the heat namely concentrated on device reaches 40 degree, heat absorption heat accumulating carries out decalescence, is taken away by the heat of device, so that device to be lowered the temperature.Certainly, in other embodiments, heat absorption heat accumulating can also be inorganic phase-changing material, or composite phase-change material etc..
Preferably, heat absorption heat accumulating by some with silicon dioxide be cyst wall, with Polyethylene Glycol be capsule-core microcapsule constituted.Device preferably can be carried out heat absorption heat accumulation by the heat absorption heat accumulating of this microcapsule structure, and then reaches preferably heat dispersion.Concrete, the process making heat absorption heat accumulating is: joined by Polyethylene Glycol in certain density Ludox, after all dissolving, drips CaCl2Accelerator solution, under strong stirring so that sol gel reaction occurs Polyethylene Glycol in Ludox, forms three-dimensional net structure gel after standing；By gel forced air drying 24～48h in 80 DEG C of baking ovens, be cooled to room temperature, can access with organo-siloxane compound produce in the basic conditions a large amount of with silica dioxide gel be cyst wall, the microcapsule that is capsule-core with the Polyethylene Glycol after emulsifying.Namely in each microcapsule, silicon dioxide wraps the Polyethylene Glycol as capsule-core as cyst wall so that Polyethylene Glycol will not leak from the process of solid-liquid, it is possible to is well lived by Silica-coated.After the heat absorption heat accumulating heat on device of this formation microcapsule structure reaches 40 degree, start the heat absorbing on device, and capsule-core itself is gradually increased gradually from solid-liquid along with heat, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating absorbs is saturated, it stops absorbing heat, and after the temperature on device is gradually decrease to preset temperature, capsule-core can be converted to solid phase from liquid phase gradually, by the heat of absorption, (phase transition process being transformed from the solidified state into liquid at capsule-core due to heat absorption heat accumulating can take away a part of latent heat to capsule-core simultaneously, so time capsule-core in heat only small) come out gradually, it is delivered in air, this moment, changed by the circulation of above-mentioned solid phase to liquid phase, thus device is lowered the temperature, improve heat dispersion and the reliability of the mobile terminal with device.Wherein, heat conduction and heat radiation material in composite material is due to heat transfer own and heat dispersion, can speed up the heat absorption heat accumulating absorption to the heat of device, heat on device can quickly be reduced, and the process of heat release is carried out at heat absorption heat accumulating, it also is able to the heat on heat absorption heat accumulating is carried out Quick diffusing, thus realizing the composite material fast cooling to device.Certainly, in other embodiments, heat absorption heat accumulating can also be other structure so that heat absorption heat accumulating can by changing to device cooling from the circulation being solid to gas phase.
It should be understood that heat conduction and heat radiation material can be the heat dispersion such as graphite or metal preferably material.Wherein, heat conduction and heat radiation material is preferably graphite, and its quality is softer to be easily worked.The manufacturing process of composite material is particularly as follows: smash to pieces heat absorption heat accumulating and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, namely without influence on the heat absorption heat storage function of heat absorption heat accumulating；Powdered heat conduction and heat radiation material will be smashed again to pieces and be mixed to form composite material with pulverous heat absorption heat accumulating, so that composite material has the function of heat absorption, heat accumulation and heat radiation.
Further, radiating subassembly 40 also includes titanate coupling agent and glue-line 422, composite material and titanate coupling agent are mixed and made into flaky material 421, and glue-line 422 stacking is covered on flaky material 421, and flaky material 421 is adhered on the joint face 411 of adsorption piece 41 by glue-line 422.
By composite material and titanate coupling agent are mixed and made into flaky material 421, it is connected on flaky material 421 again through glue-line 422 stacking and forms radiating piece 42, not only make radiating piece 42 can go to cut according to the shape of device, and then can have with heat radiation and preferably coordinate, can be absorbed heat in each position of heat radiation, heat accumulation and heat radiation, further heat radiation is lowered the temperature, improve heat dispersion and the reliability of heat radiation, and the radiating piece 42 of lamellar is applied more convenient, directly it is stained with, is cooled into coating without waiting for it.
In the present embodiment, inorganic plan organic composite shaping phase-change material is obtained by composite material adds titanate coupling agent hydrophobically modified, this inorganic plan organic composite shaping phase-change material prepares flake and flaky material 421 again through tabletting machine, and flaky material 421 stacking again connection upper glue layer 422 is pasted on the adsorption plane 412 of adsorption piece 41 and forms radiating subassembly 40.It should be understood that glue-line 422 can be gum, double faced adhesive tape or mould release membrance etc..Radiating piece 42 can be cut into definite shape according to the shape of device, is fitted on device, it is achieved the function of heat absorption, heat accumulation and heat radiation.
In order to further improve, radiating subassembly 40 also includes protecting film 43, and protecting film 43 is arranged on radiating piece 42, and protecting film 43 is located remotely from the side of joint face 411 of adsorption piece 41.
By arranging protecting film 43 on radiating piece 42, so that radiating piece 42 to be protected further, improve the reliability of radiating subassembly 40 further.
In the present embodiment, protecting film 43 is polyethylene terephthalate (PET), and its stacking is connected on flaky material 421, and opposing with glue-line 422, and flaky material 421 can be shaped and have dust-proof effect by protecting film 43 further.Certainly, in other embodiments, the material of protecting film 433 can also be other, such as silica gel, graphite.
As shown in Figure 6, for a kind of radiating subassembly 240 that invention sixth embodiment provides, this radiating subassembly 240 is roughly the same with the basic structure of the radiating subassembly 40 that fifth embodiment of the invention provides, it is different in that, radiating subassembly 240 in the present embodiment includes composite material, retarder thinner and bonding solution, and composite material, retarder thinner and bonding solution mix and coats on the joint face 2411 of adsorption piece 241.
By retarder thinner, bonding solution are mixed to form radiating piece 242 with composite material, radiating piece 242 is made directly to have adhesive force, can coat on the joint face 2411 of adsorption piece 241 without still further increasing glue-line, thus providing one to use advantageously radiating subassembly 240.
In the present embodiment, composite material is added to retarder thinner and adds the mixing of special binder solution (such as: methanol dimethylbenzene, acrylic resin etc.), radiating piece 242 is made to have adhesive force, radiating piece 242 directly adopts the form of coating be piled into certain thickness be attached on the joint face 2411 of adsorption piece 241, thus realizing the function of heat absorption, heat accumulation and heat radiation.
In order to further improve, radiating subassembly 240 also includes protecting film 243, and protecting film 243 is arranged on radiating piece 242, and protecting film 243 is located remotely from the side of adsorption piece 241.
By arranging protecting film 243 on radiating piece 242, so that radiating piece 242 to be protected further, improve the reliability of radiating subassembly 240 further.
In the present embodiment, protecting film 243 is polyethylene terephthalate (PET).Wherein, after radiating piece 242 is directly coated on the joint face 2411 of adsorption piece 241, protecting film 243 is arranged on radiating piece 242.Radiating piece 242 can be shaped and have dust-proof effect by protecting film 243 further.Certainly, in other embodiments, the material of protecting film 243 can also be other, such as silica gel.
As shown in Figure 7, for a kind of radiating subassembly 340 that invention the 7th embodiment provides, this radiating subassembly 340 is roughly the same with the basic structure of the radiating subassembly 40 that fifth embodiment of the invention provides, it is different in that, radiating piece 342 in the present embodiment includes composite material 3421, substrate 3422 and glue-line 3423, radiating piece 342 i.e. composite material 3421 is coated in substrate 3422, and glue-line 3423 stacking is connected on composite material 3421, and glue-line 3423 is adhered on the joint face 3411 of adsorption piece 341.
By directly composite material 3421 being coated molding in substrate 3422, then glue-line 3423 is set on radiating piece 342 i.e. composite material 3421 to be pasted on the joint face 3411 of adsorption piece 341, it is not necessary to tablet machine carries out tabletting, makes relatively simple.
In the present embodiment, substrate 3422 is polyethylene terephthalate (PET), composite material 3421 is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, namely without influence on the heat absorption heat storage function of composite material 3421, pulverous composite material 3421 is directly coated at molding in substrate 3422, the substrate 3422 with composite material 3421 is adhered on the joint face 3411 of adsorption piece 341 by glue-line 3423, it is achieved the heat absorption heat storage function of radiating piece 342.It should be understood that glue-line 3423 can be gum, double faced adhesive tape or other etc..
In order to further improve, radiating subassembly 340 also includes protecting film 343, and protecting film 343 is arranged on radiating piece 342, and is located remotely from the side of adsorption piece 341.
By arranging protecting film 343 on radiating piece 342, so that radiating piece 342 to be protected further, improve the reliability of radiating subassembly 340 further.
In the present embodiment, protecting film 343 is polyethylene terephthalate (PET).Protecting film 343 is arranged in substrate 3422.Radiating piece 342 can be shaped and have dust-proof effect by protecting film 343 further.Certainly, in other embodiments, the material of protecting film 343 can also be other, such as silica gel.
Being above the preferred embodiment of the present invention, it is noted that for those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (15)
1. a radiating subassembly, it is characterized in that, including adsorption piece and radiating piece, described adsorption piece includes the joint face and the adsorption plane that are oppositely arranged, described joint face is arranged on described radiating piece, described adsorption plane is for being adsorbed in device, so that the heat on described device is dispelled the heat by described radiating piece.
2. radiating subassembly according to claim 1, it is characterised in that described adsorption plane offers multiple adsorption hole, and described adsorption piece is adsorbed on described device by the plurality of adsorption hole.
3. radiating subassembly according to claim 1, it is characterized in that, described radiating piece includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function, and described heat absorption heat accumulating is for absorbing the heat on described device, and the heat of absorption is stored by described heat absorption heat accumulating.
4. radiating subassembly according to claim 3, it is characterized in that, described radiating piece also includes titanate coupling agent and glue-line, described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, described glue-line stacking is covered on described flaky material, and described flaky material is adhered to the joint face of described adsorption piece by described glue-line.
5. radiating subassembly according to claim 3, it is characterised in that described radiating piece also includes retarder thinner and bonding solution, and described heat absorption heat accumulating, described retarder thinner and described bonding solution mix and coats on the joint face of described adsorption piece.
6. radiating subassembly according to claim 3, it is characterized in that, described radiating piece also includes substrate and glue-line, described heat absorption heat accumulating is coated in described substrate, described glue-line stacking is covered on described radiating piece, and the substrate being coated with described heat absorption heat accumulating is adhered on the joint face of described adsorption piece by described glue-line.
7. radiating subassembly according to claim 1, it is characterized in that, described radiating piece includes the composite material with the material properties of heat absorption, heat accumulation and heat sinking function, described composite material is by absorbing heat heat accumulating and heat conduction and heat radiation material mixing forms, described heat conduction and heat radiation material for passing to described heat absorption heat accumulating by the heat on described device, described heat absorption heat accumulating, for absorbing and storing the heat on described device, stores the heat of described heat conduction and heat radiation conduct simultaneously.
8. the radiating subassembly according to claim or 7, it is characterised in that the mass ratio of described heat absorption heat accumulating and described heat conduction and heat radiation material is 1:1.
9. radiating subassembly according to claim 8, it is characterized in that, described radiating piece also includes titanate coupling agent and glue-line, described composite material and described titanate coupling agent are mixed and made into flaky material, described glue-line stacking is covered on described flaky material, and described flaky material is adhered to the joint face of described adsorption piece by described glue-line.
10. radiating subassembly according to claim 8, it is characterised in that described radiating piece also includes retarder thinner and bonding solution, and described composite material, described retarder thinner and described bonding solution mix and coats on the joint face of described adsorption piece.
11. radiating subassembly according to claim 8, it is characterized in that, described radiating piece also includes substrate and glue-line, described composite material is coated in described substrate, described glue-line stacking is covered on described radiating piece, and the substrate being coated with described composite material is adhered on the joint face of described adsorption piece by described glue-line.
12. the radiating subassembly according to claim 3 or 7, it is characterised in that described heat absorption heat accumulating includes silicon dioxide and Polyethylene Glycol, the mass ratio of described silicon dioxide and Polyethylene Glycol is 1:1～1:9.
13. radiating subassembly according to claim 12, it is characterised in that described heat absorption heat accumulating by some with described silicon dioxide be cyst wall, with described Polyethylene Glycol be capsule-core microcapsule constituted.
14. the radiating subassembly according to claim 3 or 7, it is characterised in that described radiating subassembly also includes protecting film, and described protecting film is arranged on described radiating piece, and described protecting film is located remotely from the side of joint face of described adsorption piece.
15. a mobile terminal, it is characterised in that including device and the radiating subassembly as described in claim 1 to 14 any one, the adsorption plane of described adsorption piece is adsorbed on described device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287064.3A CN105744812B (en) | 2016-04-29 | 2016-04-29 | Radiating subassembly and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287064.3A CN105744812B (en) | 2016-04-29 | 2016-04-29 | Radiating subassembly and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105744812A true CN105744812A (en) | 2016-07-06 |
| CN105744812B CN105744812B (en) | 2018-12-11 |
Family
ID=56287881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610287064.3A Expired - Fee Related CN105744812B (en) | 2016-04-29 | 2016-04-29 | Radiating subassembly and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105744812B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6700315B2 (en) * | 2001-08-03 | 2004-03-02 | Samsung Sdi Co., Ltd. | Plasma display device having efficient heat conductivity |
| CN1545121A (en) * | 2003-11-26 | 2004-11-10 | 友达光电股份有限公司 | Plasma display capable of adding application degree between plasma display panel and cooling plate |
| CN1793277A (en) * | 2006-01-06 | 2006-06-28 | 华南理工大学 | Process for preparing compound forming phase changing material of polyethyldiol/silicon dioxide |
| CN103374333A (en) * | 2012-04-13 | 2013-10-30 | 南京德朔实业有限公司 | Composite phase change material |
| CN104449590A (en) * | 2014-12-05 | 2015-03-25 | 中国工程物理研究院化工材料研究所 | Phase-change energy-storage material nanocapsule and preparation method thereof |
-
2016
- 2016-04-29 CN CN201610287064.3A patent/CN105744812B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6700315B2 (en) * | 2001-08-03 | 2004-03-02 | Samsung Sdi Co., Ltd. | Plasma display device having efficient heat conductivity |
| CN1545121A (en) * | 2003-11-26 | 2004-11-10 | 友达光电股份有限公司 | Plasma display capable of adding application degree between plasma display panel and cooling plate |
| CN1793277A (en) * | 2006-01-06 | 2006-06-28 | 华南理工大学 | Process for preparing compound forming phase changing material of polyethyldiol/silicon dioxide |
| CN103374333A (en) * | 2012-04-13 | 2013-10-30 | 南京德朔实业有限公司 | Composite phase change material |
| CN104449590A (en) * | 2014-12-05 | 2015-03-25 | 中国工程物理研究院化工材料研究所 | Phase-change energy-storage material nanocapsule and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 梁发思，谢世杰: "《激光精密加工》", 31 July 1990 * |
| 王松文: "《基础生物例析》", 31 October 1990 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105744812B (en) | 2018-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105792620A (en) | Chip, circuit board and mobile terminal | |
| CN105744811A (en) | Housing and mobile terminal | |
| CN102548355B (en) | Electronic equipment | |
| CN105873417B (en) | A kind of chip, circuit board and mobile terminal | |
| CN105744810A (en) | Housing of terminal and mobile terminal | |
| CN105744425A (en) | Telephone receiver assembly and mobile terminal | |
| CN106061198A (en) | Screen assembly and mobile terminal | |
| CN105828551A (en) | Rear shell and mobile terminal | |
| CN105792619A (en) | Heat radiation device and mobile terminal | |
| CN105916351A (en) | Shielding case and mobile terminal | |
| CN105916350B (en) | A kind of terminal device and associated method | |
| CN107333033B (en) | Camera and mobile terminal | |
| CN105933582A (en) | Pick-up head and mobile terminal | |
| CN105792618A (en) | Metal support and mobile terminal | |
| CN105744812A (en) | Heat radiating assembly and mobile terminal | |
| CN105744732A (en) | Circuit board and mobile terminal | |
| CN205179142U (en) | Modified heat dissipation type mobile phone motherboard | |
| CN107343375B (en) | Rear shell and mobile terminal | |
| CN107249284B (en) | A kind of mobile terminal | |
| CN105825783A (en) | Display screen bracket and terminal | |
| CN105828579A (en) | Hardware support and mobile terminal | |
| CN105827758A (en) | Telephone receiver component and mobile terminal | |
| CN106028741A (en) | Heat conduction pipe and mobile terminal | |
| CN105873357B (en) | Circuit board and mobile terminal | |
| CN105744822A (en) | Shielding cover, circuit board and mobile terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181211 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |