CN210287214U - Structure for thermal management of electronic equipment - Google Patents
Structure for thermal management of electronic equipment Download PDFInfo
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- CN210287214U CN210287214U CN201920783794.1U CN201920783794U CN210287214U CN 210287214 U CN210287214 U CN 210287214U CN 201920783794 U CN201920783794 U CN 201920783794U CN 210287214 U CN210287214 U CN 210287214U
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Abstract
The utility model belongs to the technical field of electronic equipment, concretely relates to a structure for electronic equipment heat management. This a structure for electronic equipment thermal management, including first basement rete, heat-conducting layer, thermal-insulated heat preservation and the second basement rete that sets gradually, wherein, thermal-insulated heat preservation is aerogel thin layer, the ultra-thin felt layer of aerogel or aerogel heat preservation sticky tape layer, and the area of first basement rete is less than the area of heat-conducting layer. In the utility model, the thickness of the heat conduction layer can be very thin, and the density and the weight of the heat conduction layer are small; the thickness of aerogel thin layer, the ultra-thin felt layer of aerogel and aerogel heat preservation sticky tape layer can be accomplished very thinly, and structural density is little, weight is little for whole thickness and the weight that is used for the structure of electronic equipment heat management all can be controlled at less value, thereby save space and weight, can be used to compact structure's electronic equipment etc. ensure electronic equipment's frivolousness.
Description
Technical Field
The utility model belongs to the technical field of electronic equipment, concretely relates to a structure for electronic equipment heat management.
Background
With the rapid development of science and technology, more and more electronic devices enter our daily lives, such as computers, mobile phones, wearable devices and the like. With the increase of the operation execution rate of the electronic device, the operation speed of the CPU is higher and higher, and the amount of heat generated during operation is also higher and higher. Usually can adopt to add the fan and reduce CPU surface temperature, this kind of radiating mode need open the wind groove on the equipment box, and the dust gets into in the equipment very easily, adheres to electronic components on, causes short circuit or more serious problem, also can increase equipment volume and weight simultaneously, and is inconvenient to carry. How to rapidly dissipate heat generated by the small and miniature electronic equipment during operation without causing local overhigh temperature becomes a problem to be solved urgently.
SUMMERY OF THE UTILITY MODEL
For solving the not enough of prior art, the utility model provides a structure for electronic equipment heat management.
The utility model provides a technical scheme as follows:
the utility model provides a structure for electronic equipment thermal management, includes first base rete, heat-conducting layer, thermal-insulated heat preservation and the second base rete that stacks gradually the setting, wherein, thermal-insulated heat preservation is aerogel thin layer, the ultra-thin felt layer of aerogel or aerogel heat preservation sticky tape layer, the area of first base rete is less than the area of heat-conducting layer.
The aerogel film layer is a layer of aerogel film. The aerogel film is the thermal-insulated heat preservation film material that contains aerogel material, and the film material that can obtain or this company's special type provides is bought in the market, and thickness is 0.1 ~ 1.5 mm.
The aerogel ultrathin felt layer is a layer of aerogel ultrathin felt. The aerogel ultrathin felt is a heat-preservation felt or film containing aerogel materials and with the thickness within 1mm, and can be obtained through market purchase or a film specially provided by the company.
Among the above-mentioned technical scheme, the heat-conducting layer plays the radiating action, and thermal-insulated heat preservation then can insulate against heat to the higher heat-conducting layer of temperature, avoids the user to contact the heat-conducting layer and produces uncomfortable sensation, is scalded even. Furthermore, the thickness of the heat conduction layer can be very thin, and the density and the weight of the heat conduction layer are small; the thickness on aerogel thin layer, the ultra-thin felt layer of aerogel and aerogel heat preservation sticky tape layer can be accomplished very thinly, and aerogel structure density such as aerogel thin layer, the ultra-thin felt layer of aerogel and aerogel heat preservation sticky tape layer is little, weight is little for whole thickness and the weight that are used for electronic equipment thermal management's structure all can be controlled at very little value, thereby save space and weight, can be used to compact structure's electronic equipment etc. ensure electronic equipment's frivolousness.
Specifically, the first base film layer, the heat conduction layer, the heat insulation layer and the second base film layer are sequentially glued.
Among the above-mentioned technical scheme, can be with the inseparable connection of each layer structure through gluing to do not influence holistic weight and thickness. And through the gluing mode between heat-conducting layer and the first base rete, can realize using the fixed area membrane of gluing of heat-conducting layer and first base rete, also can realize that the heat-conducting layer is glued with the demoulding after peeling off of first base rete and is used.
Specifically, the heat conducting layer can be selected from a graphite film layer, a copper film layer and the like.
Furthermore, first base rete with set up double-sided adhesive layer between the heat-conducting layer, first base rete double-sided adhesive layer with the heat-conducting layer is the gluing in proper order.
Among the above-mentioned technical scheme, tear the first base rete on the double-sided adhesive layer and can be used for bonding and carry out the deciduate use on the radiating structure of needs or equipment to realize that the deciduate of heat-conducting layer and first base rete glue after peeling off is used.
Specifically, the first base film layer is selected from any one of a PET release film, a PI release film, a PE release film, a PC release film or a PU release film; the second base film layer is any one of a PET film, a PI film, a PE film, a PC film or a PU film.
In the above technical scheme, the first base film layer is selected from any one of a PET release film, a PI release film, a PE release film, a PC release film or a PU release film, and can be peeled from the glue layer. The second base film layer is a PET film, a PI film, a PE film, a PC film or a PU film, has better strength and is used as a supporting structure.
Specifically, the thickness of the structure for electronic equipment heat management is 0.1-1.5 mm.
In the technical scheme, the structure for thermal management of the electronic equipment is small in overall thickness and can be used for electronic equipment and the like with compact structure.
Specifically, the area of the first base film layer is larger than or equal to the contact area of the first base film layer and a heat dissipation area of the electronic device.
In the above technical solution, the area of the first base film layer is larger than the contact area of the first base film layer with the heat dissipation area of the electronic device, and the excess part of the heat conduction layer can be in contact with air and the like, so as to dissipate heat.
The beneficial effects of the utility model reside in that:
the utility model adopts the heat-conducting layer to dissipate heat, which has the advantage of saving space, so that the electronic equipment is lighter and thinner; the aerogel heat insulation layer has excellent heat insulation performance, and the thickness of the heat insulation layer can be effectively reduced. Based on the structural arrangement of the heat conduction layer and the aerogel heat insulation layer, the heat dissipation function and the heat insulation function can be integrated. In addition, the structure for heat management of the electronic equipment is attached to the surface of the heat dissipation part, and the dustproof and moistureproof effects are achieved.
Drawings
Fig. 1 is a schematic structural diagram for thermal management of an electronic device according to the present invention.
Fig. 2 is a schematic diagram of the use of the structure for thermal management of an electronic device provided by the present invention.
In fig. 1, the structure represented by each reference numeral is listed as follows:
1. the heat-insulating layer comprises a first base film layer, a heat conducting layer, a heat insulating layer, a second base film layer and a heat insulating layer, wherein the first base film layer 2 is a heat conducting layer, the second base film layer 3 is a heat insulating layer, and the second base film layer is a second base film layer.
Detailed Description
The following description is made for the purpose of illustrating the principles and features of the present invention, and is not intended to limit the scope of the invention.
In one embodiment, as shown in fig. 1, the structure for thermal management of an electronic device includes a first base film layer 1, a heat conducting layer 2, a thermal insulating layer 3 and a second base film layer 4 which are sequentially adhered, wherein the area of the first base film layer 1 is smaller than that of the heat conducting layer 2.
The heat conducting layer 2 is a graphite film layer.
The heat insulation layer 3 is an aerogel thin film layer, an aerogel ultrathin felt layer or an aerogel heat insulation adhesive tape layer.
The first base film layer 1 is selected from any one of a PET release film, a PI release film, a PE release film, a PC release film or a PU release film;
the second base film layer 4 is any one selected from a PET film, a PI film, a PE film, a PC film, or a PU film.
The heat-conducting layer plays the radiating effect, and thermal-insulated heat preservation then can insulate against heat to the higher heat-conducting layer of temperature, avoids the user to contact the heat-conducting layer and produces uncomfortable sensation, is scalded even. The thickness of the heat conduction layer can be very thin, and the density and the weight of the heat conduction layer are small; the thickness on aerogel thin layer, the ultra-thin felt layer of aerogel and aerogel heat preservation sticky tape layer can be accomplished very thinly, and aerogel structure density such as aerogel thin layer, the ultra-thin felt layer of aerogel and aerogel heat preservation sticky tape layer is little, weight is little for whole thickness and the weight that are used for electronic equipment thermal management's structure all can be controlled at very little value, thereby save space and weight, can be used to compact structure's electronic equipment etc. ensure electronic equipment's frivolousness.
In one embodiment, a double-sided adhesive layer is disposed between the first base film layer 1 and the heat conductive layer 2, and the first base film layer 1, the double-sided adhesive layer and the heat conductive layer 2 are sequentially adhered. As shown in fig. 2, the structure for thermal management of electronic equipment provided by the present invention is used as a heat dissipation and insulation structure, the first base film layer is larger than the contact area of the heat dissipation area of the electronic equipment, and the extra part of the heat conduction layer can be in contact with air and the like, so as to dissipate heat. The first base film layer 1 can be torn off to be adhered to a structure or equipment needing heat dissipation. The heat conduction layer 2 plays a heat dissipation role, the heat insulation layer 3 can insulate heat to the heat conduction layer 2 with higher temperature, the user is prevented from contacting the heat conduction layer to generate uncomfortable feeling, even the user is scalded, and the heat dissipation and heat insulation effects are played.
Example 1
The structure for heat management of the electronic equipment comprises a first base film layer 1, a heat conducting layer 2, a heat insulating layer 3 and a second base film layer 4 which are sequentially glued.
The heat conducting layer 2 is a graphite film layer with the thickness of 0.05 mm.
The heat insulation layer 3 is an aerogel film layer, and the thickness is 0.05 mm.
The first base film layer 1 is a PET release film with the thickness of 0.01 mm.
The second base film layer 4 is a PET film with a thickness of 0.01 mm.
The thermal management structure is attached to a hot table with the temperature of 40 ℃, and the surface temperature of the thermal management structure when the thermal management structure reaches thermal equilibrium is tested as follows: 37 +/-0.3 ℃.
Example 2
The structure for heat management of the electronic equipment comprises a first base film layer 1, a heat conducting layer 2, a heat insulating layer 3 and a second base film layer 4 which are sequentially glued.
The heat conducting layer 2 is a graphite film layer with the thickness of 0.5 mm.
The heat insulation layer 3 is an aerogel ultrathin felt layer with the thickness of 0.6 mm.
The first base film layer 1 is a PI release film with the thickness of 0.05 mm.
The second base film layer 4 is a PI film with a thickness of 0.05 mm.
The thermal management structure is attached to a hot table with the temperature of 60 ℃, and the surface temperature of the thermal management structure when the thermal management structure reaches thermal equilibrium is tested as follows: the heat dissipation and insulation performance of the structure for electronic device heat management was tested at 32 ± 0.3 ℃ using the following method.
Example 3
The structure for heat management of the electronic equipment comprises a first base film layer 1, a heat conducting layer 2, a heat insulating layer 3 and a second base film layer 4 which are sequentially glued.
The heat conducting layer 2 is a copper film layer with the thickness of 1 mm.
The heat insulation layer 3 is an aerogel heat insulation adhesive tape layer, and the thickness is 0.3 mm.
The first base film layer 1 is a PU release film with the thickness of 0.01 mm.
The second base film layer 4 is a PET film with a thickness of 0.01 mm.
The thermal management structure is attached to a hot table with the temperature of 60 ℃, and the surface temperature of the thermal management structure when the thermal management structure reaches thermal equilibrium is tested as follows: the heat dissipation and insulation performance of the structure for electronic device heat management was tested at 34 ± 0.3 ℃ using the following method.
Comparative example 1
The structure for heat management of the electronic equipment comprises a first base film layer 1, a heat conduction layer 2 and a second base film layer 4 which are sequentially glued.
The heat conducting layer 2 is a graphite film layer with the thickness of 0.5 mm.
The first base film layer 1 is a PET release film with the thickness of 0.5 mm.
The second base film layer 4 is a PET film with a thickness of 0.05 mm.
The structure for electronic device thermal management was tested for heat dissipation and thermal insulation performance using the following method: the thermal management structure is attached to a hot table with the temperature of 60 ℃, and the surface temperature of the thermal management structure when the thermal management structure reaches thermal equilibrium is tested as follows: 39. + -. 0.3 ℃.
As can be seen by comparison, the heat insulation layer 3 is not arranged, the surface temperature of the second base film layer 4 is as high as 60 ℃, and the feeling of human touch is not comfortable.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (6)
1. The utility model provides a structure for electronic equipment thermal management, its characterized in that, includes first base rete (1), heat-conducting layer (2), thermal-insulated heat preservation (3) and second base rete (4) that stack gradually the setting and connect, wherein, thermal-insulated heat preservation (3) are aerogel thin layer, the ultra-thin felt layer of aerogel or aerogel heat preservation adhesive tape layer, the area of first base rete (1) is less than the area of heat-conducting layer (2).
2. The structure for thermal management of electronic devices of claim 1, wherein: the first base film layer (1), the heat conducting layer (2), the heat insulating layer (3) and the second base film layer (4) are sequentially glued.
3. The structure for thermal management of electronic devices of claim 2, wherein: first base rete (1) with set up the double-sided glue film between heat-conducting layer (2), first base rete (1) the double-sided glue film with heat-conducting layer (2) are the gluing in proper order.
4. The structure for thermal management of electronic devices of claim 1, wherein: the first base film layer (1) is selected from any one of a PET release film, a PI release film, a PE release film, a PC release film or a PU release film; the second base film layer (4) is any one of a PET film, a PI film, a PE film, a PC film or a PU film.
5. The structure for thermal management of electronic devices of claim 1, wherein: the thickness of the structure for thermal management of the electronic equipment is 0.1-1.5 mm.
6. The structure for thermal management of electronic devices of any of claims 1 to 5, wherein: the area of the first base film layer (1) is larger than or equal to the contact area of the first base film layer and a heat dissipation area of the electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920783794.1U CN210287214U (en) | 2019-05-28 | 2019-05-28 | Structure for thermal management of electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920783794.1U CN210287214U (en) | 2019-05-28 | 2019-05-28 | Structure for thermal management of electronic equipment |
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| CN210287214U true CN210287214U (en) | 2020-04-10 |
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| CN201920783794.1U Active CN210287214U (en) | 2019-05-28 | 2019-05-28 | Structure for thermal management of electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739154A (en) * | 2020-12-09 | 2021-04-30 | 维沃移动通信有限公司 | Wearable device |
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2019
- 2019-05-28 CN CN201920783794.1U patent/CN210287214U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739154A (en) * | 2020-12-09 | 2021-04-30 | 维沃移动通信有限公司 | Wearable device |
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