CN210900215U - Novel microwave absorbing material sheet with heat conduction capability - Google Patents
Novel microwave absorbing material sheet with heat conduction capability Download PDFInfo
- Publication number
- CN210900215U CN210900215U CN201922191864.7U CN201922191864U CN210900215U CN 210900215 U CN210900215 U CN 210900215U CN 201922191864 U CN201922191864 U CN 201922191864U CN 210900215 U CN210900215 U CN 210900215U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- absorbing material
- foam
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011358 absorbing material Substances 0.000 title claims abstract description 42
- 239000002131 composite material Substances 0.000 claims abstract description 36
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 33
- 239000006260 foam Substances 0.000 claims abstract description 32
- 229920001971 elastomer Polymers 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 28
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 16
- 230000001681 protective effect Effects 0.000 claims abstract description 10
- 239000012780 transparent material Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 151
- 239000011810 insulating material Substances 0.000 claims description 8
- 239000012774 insulation material Substances 0.000 claims description 8
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 7
- 229920000742 Cotton Polymers 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000011496 polyurethane foam Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims 4
- 229920003023 plastic Polymers 0.000 claims 4
- 229910002804 graphite Inorganic materials 0.000 abstract 2
- 239000010439 graphite Substances 0.000 abstract 2
- -1 graphite alkene Chemical class 0.000 abstract 2
- 230000003139 buffering effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a novel microwave absorbing material sheet with heat conductivity in the technical field of microwave absorbing material sheets, which comprises a foam layer, wherein a flexible wave absorbing material layer is arranged on the top of the foam layer, a wave transparent material layer is arranged on the top of the flexible wave absorbing material layer, the foam layer and the bottoms of a left graphite alkene composite layer and a right graphite alkene composite layer are both connected with a heat conducting rubber layer, a protective film layer is arranged on the top of a silicon rubber graphene composite layer, the bottom of the heat conducting rubber layer is connected with a release material layer, the utility model is provided with a heat conducting rubber layer, a graphene composite layer and a silicon rubber graphene composite layer which are matched to form a good heat conducting channel, heat can be conveniently and rapidly led out and dissipated to the outside, heat conducting protrusions and the heat conducting rubber layer improve the heat conducting efficiency of the heat conducting rubber layer, simultaneously, the heat conducting rubber layer is, the three cooperate with each other, go out the heat fast, avoid damaging electronic components.
Description
Technical Field
The utility model relates to a microwave absorbing material piece technical field specifically is a novel and heat conductivility's microwave absorbing material piece.
Background
Microwave absorbing material sheets are widely used in the field of electronic products, and electronic products are increasingly developing towards intellectualization, integration, lightness and thinness, multi-functionalization and the like. Along with the increase of the integration level of the circuit board and the improvement of the data transmission speed, the heat productivity of electronic devices such as chips is larger and larger, and components on the circuit board often generate electromagnetic interference on adjacent components, so that the electric quantity of an electronic product is used too fast, the operation is failed, the operation is slow, and the like, and therefore wave-absorbing material pieces are often applied to the electronic components.
The existing wave-absorbing material sheet has the following defects: the microwave absorbing material sheet does not have good heat conducting performance, and if heat cannot be timely and effectively dissipated, electronic components can be damaged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel and heat conductivility's microwave absorption material piece to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a novel microwave absorbing material sheet with heat conductivity comprises a foam layer, wherein a flexible absorbing material layer is arranged on the top of the foam layer, a wave-transmitting material layer is arranged on the top of the flexible absorbing material layer, the wave-transmitting material layer and the left and right sides of the foam layer are respectively connected with a graphene composite layer, the top of the wave-transmitting material layer and the top of the left and right graphene composite layers are respectively connected with a silicon rubber graphene composite layer, the bottom of the foam layer and the bottom of the left and right graphene composite layers are respectively connected with a heat-conducting rubber layer, the left and right sides of the heat-conducting rubber layer and the silicon rubber graphene composite layer are respectively connected with a heat-insulating material layer, the left and right heat-insulating material layers are respectively connected with the left and right graphene composite layers, a protective film layer is arranged on the top of the silicon rubber graphene composite layer, the left and right ends of the bottom, and the left end and the right end of the top of the release material layer are respectively connected with the bottoms of the left side and the right side heat insulation material layers.
Further, the bottom of the foam layer is uniformly provided with arc-shaped heat conducting protrusions, the top of the heat conducting rubber layer is uniformly provided with arc-shaped grooves matched with the heat conducting protrusions, and a heat conducting adhesive layer is arranged between the heat conducting protrusions and the arc-shaped grooves.
Furthermore, the thickness of the flexible wave-absorbing material layer is 0.1-5 mm, and the thickness ratio of the wave-transmitting material layer to the flexible wave-absorbing material layer is 1: 1-50.
Further, the heat-conducting glue layer is a heat-conducting silicone grease layer.
Further, the foam layer is a PU foam layer or a PE foam layer.
Further, the heat insulation material layer is polyurethane foam.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model is provided with a heat conducting rubber layer, a graphene composite layer and a silicon rubber graphene composite layer which are matched to form a good heat conducting channel to conduct heat out, the heat can be conveniently and rapidly conducted out and dissipated to the outside, the heat conducting protrusion and the heat conducting adhesive layer improve the heat conducting efficiency of the heat conducting rubber layer, and simultaneously the heat conducting of the heat conducting rubber layer is more uniform, the graphene composite layer and the silicon rubber graphene composite layer have high heat transfer rate, the three cooperate with each other to rapidly transfer the heat out to avoid damaging electronic components, and a foam layer is arranged, which can meet the requirements of the internal structure of electronic products in buffer protection, and is provided with a wave-transparent material layer and a flexible wave-absorbing material layer which can fully and effectively absorb electromagnetic waves, and a protective film layer is arranged to play a role of protection and prevent the electronic products from being easily worn, and a release material, the microwave absorbing material sheet is arranged on a heat source (an electronic device), so that the microwave absorbing material sheet is convenient and quick to use.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: 1. soaking a cotton layer; 2. a flexible wave-absorbing material layer; 3. a heat-conducting adhesive layer; 4. a wave-transparent material layer; 5. a heat conducting rubber layer; 6. a silicone rubber graphene composite layer; 7. a layer of thermal insulation material; 8. a graphene composite layer; 9. a protective film layer; 10. a release material layer; 11. a heat conducting protrusion; 12. an arc-shaped groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: referring to fig. 1, the microwave absorbing material sheet with heat conductivity includes a foam layer 1, the foam layer 1 can meet the requirement of buffering and protection of the internal structure of an electronic product, and all layers of the microwave absorbing material sheet can be connected by bonding;
referring to fig. 1, a flexible wave-absorbing material layer 2 is disposed on the top of a foam layer 1, a wave-transmitting material layer 4 is disposed on the top of the flexible wave-absorbing material layer 2, and the flexible wave-absorbing material layer 2 and the wave-transmitting material layer 4 are widely applied in the prior art, for example, a portable application type wave-absorbing plate proposed by patent number "CN 201520746708.1" has been disclosed "to include: a flexible wave-absorbing material layer; the wave-transmitting material layer is tightly attached to the upper surface of the flexible wave-absorbing material layer, so that electromagnetic waves can be conveniently, fully and effectively absorbed;
referring to fig. 1, the flexible wave-absorbing material layer 2, the wave-transmitting material layer 4 and the foam layer 1 are connected with graphene composite layers 8 on the left and right sides, the wave-transmitting material layer 4 and the tops of the graphene composite layers 8 on the left and right sides are connected with silicon rubber graphene composite layers 6, and the graphene composite layers 8 and the silicon rubber graphene composite layers 6 are convenient for rapidly guiding heat of the heat-conducting rubber layer 5 outwards, so that heat transfer and heat dissipation are realized;
referring to fig. 1, the bottoms of the foam layer 1 and the left and right graphene composite layers 8 are connected with the heat conducting rubber layer 5, and the heat conducting rubber layer 5 has excellent heat conductivity and is matched with the graphene composite layer 8 and the silicon rubber graphene composite layer 6 to form a good heat conducting channel to conduct heat out;
referring to fig. 1, the heat-conducting rubber layer 5 and the silicon rubber graphene composite layer 6 are connected with heat-insulating material layers 7 on the left and right sides, the heat-insulating material not only has heat-insulating property, but also encapsulates multiple internal layers, so that the stability is improved, and the heat-insulating material layers 7 on the left and right sides are respectively connected with the graphene composite layers 8 on the left and right sides;
referring to fig. 1, a protective film layer 9 is disposed on the top of a silicon rubber graphene composite layer 6, and the left and right ends of the bottom of the protective film layer 9 are respectively connected to the tops of the left and right heat insulating material layers 7, the protective film layer 9 is usually a polymer protective film, such as a plastic film made of PET, PE, PP, PC, PVC, PI, but not limited to these materials, and plays a role in protection to meet personalized requirements of different users, thereby preventing the film from being easily worn;
referring to fig. 1, the bottom of the heat conducting rubber layer 5 is connected with a release material layer 10, the left and right ends of the top of the release material layer 10 are respectively connected with the bottoms of the left and right heat insulating material layers 7, the release material layer 10 is an oily release film, when in use, the release material layer 10 is torn off, and the microwave absorbing material sheet is disposed on a heat source (electronic device).
As shown in fig. 1: the bottom of the foam layer 1 is uniformly provided with arc-shaped heat conducting protrusions 11, the heat conducting protrusions 11 can be heat conducting silica gel protrusions with good heat conducting performance, the top of the heat conducting rubber layer 5 is uniformly provided with arc-shaped grooves 12 matched with the heat conducting protrusions 11, a heat conducting rubber layer 3 is arranged between the heat conducting protrusions 11 and the arc-shaped grooves 12, the heat conducting protrusions 11 and the arc-shaped grooves 12 are matched to improve the connection stability of the foam layer 1 and the heat conducting rubber layer 5 on one hand, and the overall heat conducting performance of the heat conducting rubber layer 5 is improved by matching with the heat conducting rubber layer 3 on;
the thickness of the flexible wave-absorbing material layer 2 is 0.1-5 mm, and the thickness ratio of the wave-transmitting material layer 4 to the flexible wave-absorbing material layer 2 is 1: 1-50, so that the attractiveness and stability of use are ensured;
the heat-conducting adhesive layer 3 is a heat-conducting silicone grease layer, and the heat-conducting silicone grease has excellent heat-conducting, insulating, shock-resistant and aging-resistant properties, has no corrosion effect on various materials, is widely applied in the field, and is not further detailed herein;
the foam layer is a PU foam layer or a PE foam layer, the PU foam or the PE foam has good compression resilience performance and can be used for buffering the interior of an electronic product well, and the foam layer is not limited to the materials and can be made of any material according to actual needs;
the heat insulation material layer 7 is made of polyurethane foam, the heat insulation material is widely applied in the field, other materials capable of performing heat insulation can be adopted, and the specific material can be determined according to actual needs.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A novel microwave absorbing material sheet with heat conductivity comprises a foam layer (1), and is characterized in that: the foam plastic composite material comprises a foam cotton layer (1), wherein a flexible wave absorbing material layer (2) is arranged on the top of the foam cotton layer (1), a wave transparent material layer (4) is arranged on the top of the flexible wave absorbing material layer (2), the wave transparent material layer (4) and the left and right sides of the foam cotton layer (1) are respectively connected with a graphene composite layer (8), the wave transparent material layer (4) and the tops of the left and right side graphene composite layers (8) are respectively connected with a silicon rubber graphene composite layer (6), the bottoms of the foam cotton layer (1) and the left and right side graphene composite layers (8) are respectively connected with a heat conducting rubber layer (5), the left and right sides of the heat conducting rubber layer (5) and the silicon rubber graphene composite layer (6) are respectively connected with a heat insulating material layer (7), a protective film layer (9) is arranged on the top of the silicon rubber graphene composite, and the left end and the right end of the bottom of the protective film layer (9) are respectively connected with the tops of the left side and the right side heat insulation material layers (7), the bottom of the heat conduction rubber layer (5) is connected with a release material layer (10), and the left end and the right end of the top of the release material layer (10) are respectively connected with the bottoms of the left side and the right side heat insulation material layers (7).
2. A novel and thermally conductive sheet of microwave absorbing material as defined in claim 1 wherein: the foam plastic heat-conducting plastic plate is characterized in that arc-shaped heat-conducting protrusions (11) are evenly arranged at the bottom of the foam plastic layer (1), arc-shaped grooves (12) matched with the heat-conducting protrusions (11) are evenly formed in the top of the heat-conducting rubber layer (5), and heat-conducting rubber layers (3) are arranged between the heat-conducting protrusions (11) and the arc-shaped grooves (12).
3. A novel and thermally conductive sheet of microwave absorbing material as defined in claim 1 wherein: the thickness of the flexible wave-absorbing material layer (2) is 0.1-5 mm, and the thickness ratio of the wave-transmitting material layer (4) to the flexible wave-absorbing material layer (2) is 1: 1-50.
4. A novel and thermally conductive sheet of microwave absorbing material as defined in claim 2 wherein: the heat-conducting adhesive layer (3) is a heat-conducting silicone grease layer.
5. A novel and thermally conductive sheet of microwave absorbing material as defined in claim 1 wherein: the foam layer is a PU foam layer or a PE foam layer.
6. A novel and thermally conductive sheet of microwave absorbing material as defined in claim 1 wherein: the heat insulation material layer (7) is made of polyurethane foam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922191864.7U CN210900215U (en) | 2019-12-07 | 2019-12-07 | Novel microwave absorbing material sheet with heat conduction capability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922191864.7U CN210900215U (en) | 2019-12-07 | 2019-12-07 | Novel microwave absorbing material sheet with heat conduction capability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210900215U true CN210900215U (en) | 2020-06-30 |
Family
ID=71315331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922191864.7U Expired - Fee Related CN210900215U (en) | 2019-12-07 | 2019-12-07 | Novel microwave absorbing material sheet with heat conduction capability |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210900215U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115847987A (en) * | 2022-12-02 | 2023-03-28 | 苏州铂韬新材料科技有限公司 | Membrane material with waveguide transmission heat function and preparation process thereof |
-
2019
- 2019-12-07 CN CN201922191864.7U patent/CN210900215U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115847987A (en) * | 2022-12-02 | 2023-03-28 | 苏州铂韬新材料科技有限公司 | Membrane material with waveguide transmission heat function and preparation process thereof |
| CN115847987B (en) * | 2022-12-02 | 2023-12-08 | 苏州铂韬新材料科技有限公司 | Film material with wave-transmitting and heat-conducting functions and preparation process thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204981729U (en) | High -efficient thermal film who contains thermal conductive adhesive | |
| CN204598564U (en) | A kind of heat radiation foam cushion | |
| CN208200824U (en) | A kind of graphene Heat dissipation adhesive tape with buffering effect | |
| CN206349356U (en) | High performance graphene heat conduction and heat radiation film | |
| CN210900215U (en) | Novel microwave absorbing material sheet with heat conduction capability | |
| CN103906418A (en) | Cooling fin and manufacturing method thereof | |
| CN209652218U (en) | Nickel plating copper foil shielding tape | |
| CN207820461U (en) | High heat conduction, high electromagnetic shielding copper mesh enhance the compound foam of graphite | |
| CN212864650U (en) | Combined type graphite alkene heat dissipation membrane | |
| CN206367230U (en) | Graphene composite film with high anti-seismic shock-absorbing capacity | |
| CN210011437U (en) | Heat-conducting silica gel heat-dissipation composite film | |
| CN216400771U (en) | Microwave absorbing material sheet with foam layer | |
| CN203884121U (en) | Radiating fin | |
| CN203289808U (en) | Novel graphite heat conduction device | |
| TWM589118U (en) | Thermal conductive film structure | |
| CN205467591U (en) | Thermal insulation piece | |
| CN209151435U (en) | A kind of Novel compressive wiring board | |
| CN210287214U (en) | Structure for thermal management of electronic equipment | |
| CN210560217U (en) | Graphene heat conduction and dissipation film | |
| CN218888912U (en) | Compound heat conduction silica gel pad | |
| CN216550235U (en) | OLED screen buffer mechanism | |
| CN203233633U (en) | Graphite radiation film applied to intelligent mobile phone and tablet computer | |
| CN202738258U (en) | Efficient heat dissipating flexible circuit board | |
| CN207987088U (en) | A kind of insulated type heat-conducting silica gel sheet | |
| CN210881183U (en) | Wear-resistant heat-conducting gel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200630 |