CN210881183U - Wear-resistant heat-conducting gel - Google Patents
Wear-resistant heat-conducting gel Download PDFInfo
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- CN210881183U CN210881183U CN201921534615.7U CN201921534615U CN210881183U CN 210881183 U CN210881183 U CN 210881183U CN 201921534615 U CN201921534615 U CN 201921534615U CN 210881183 U CN210881183 U CN 210881183U
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- gel body
- heat conduction
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Abstract
The utility model discloses a relate to heat conduction gel technical field, specifically a wear-resisting heat conduction gel, including the gel body, the upper end of gel body is provided with the heating panel, and gel body and heating panel be provided with around the backplate, the lower extreme of heating panel is provided with evenly distributed heat conduction post, and the heat conduction post is wrapped up inside the gel body, the gel body includes adsorbed layer, barrier layer, heat-conducting layer and insulating layer, the lower extreme of heat-conducting layer is provided with the insulating layer, and the upper end of heat-conducting layer is provided with the adsorbed layer, evenly distributed miniature recess is seted up to the upper end surface of heat-conducting layer, and be provided with the heat conduction powder in the miniature recess, the lower; the utility model prevents the gel body from falling down between the heating element and the radiator to form a tiny cavity to slow down the heat conduction speed through the arranged heat conduction column; through the arranged enclosure plate, the friction possibly generated with elements around the heating element is avoided, so that the phenomenon of gel loss is avoided.
Description
Technical Field
The utility model relates to a heat conduction gel technical field specifically is a wear-resisting heat conduction gel.
Background
Along with the increasing intelligence and complexity of electronic products, the density of electronic components on a unit area is higher and higher, so that the heat generated by the electronic products in the operation process is larger and larger. In order to avoid excessive temperatures generated by the electronic components, the generated heat needs to be removed in time. Connecting an electronic component with a heat sink to transfer generated heat to the external environment through the heat sink is an important heat dissipation method for electronic components at present. The heat-conducting glue is a single-component, heat-conducting and room-temperature-curing organic silicon bonding sealant, generates condensation reaction through moisture in the air to release low molecules to cause crosslinking curing, is vulcanized into a high-performance elastomer, can prepare products with different thicknesses according to requirements, can be cut into different shapes according to requirements, is easy to use, can fully fill gaps due to infinite compressibility of heat-conducting gel to improve heat-conducting and heat-dissipating performance of a system, and still has the following defects in the actual use process:
1. the heat-conducting gel is soft, easy to deform and flowable, and can easily enter the gap of the heating element when contacting with the heating element, so that a tiny cavity is formed between the heating element and the radiator, and the heat-conducting speed is reduced;
2. because the heat-conducting gel is soft and easy to deform, in the actual use process, the periphery of the heat-conducting gel is lack of containment, and the heat-conducting gel may rub with elements around the heating element, so that the phenomenon of heat-conducting gel loss may be caused.
Therefore, we propose an abrasion-resistant heat-conducting gel to solve the above disadvantages well.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wear-resisting heat conduction gel to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a wear-resisting heat conduction gel, includes the gel body, the upper end of gel body is provided with the heating panel, just be provided with the apron board around gel body and the heating panel, the lower extreme of heating panel is provided with evenly distributed's heat conduction post, just the heat conduction post is wrapped up inside the gel body, the gel body includes adsorbed layer, barrier layer, heat-conducting layer and insulating layer, the lower extreme of heat-conducting layer is provided with the insulating layer, just the upper end of heat-conducting layer is provided with the adsorbed layer, evenly distributed's miniature recess is seted up to the upper end surface of heat-conducting layer, just be provided with the heat conduction powder in the miniature recess, the lower extreme.
Preferably, the heat dissipation plate is an aluminum alloy plate, and heat dissipation holes are uniformly distributed in the heat dissipation plate.
Preferably, a plurality of groups of folds are arranged on the periphery of the outer surface of the containment plate, and the top end and the tail end of the containment plate are connected through glue.
Preferably, the heat conducting layer comprises a teflon resin layer and a polyethylene resin layer, and the polyethylene resin layer is positioned on the top of the teflon resin layer.
Preferably, the insulating layer comprises an epoxy layer and a glass fiber layer, and the glass fiber layer is positioned on the top of the epoxy layer.
Preferably, the barrier layer comprises a polytetrafluoroethylene coating and a polyester layer, the polytetrafluoroethylene coating is 0.125 mm-0.15 mm thick, and the polyester layer is 0.002 mm-0.15 mm thick.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model has the advantages that through the arranged heat conducting column, when the gel body contacts with the heating element and enters the gap of the heating element, the heat of the gel body can be transferred to the heating panel through the heat conducting column, and the heat conducting speed is prevented from being slowed down due to the fact that the gel body falls down to form a small cavity between the heating element and the radiator;
2. the utility model discloses a backplate that sets up, backplate can enclose into any shape, and adhesive connection is passed through from beginning to end, and the friction that probably produces with heating element component all around is avoided to the enclosure gel body to avoid the phenomenon of gel loss.
Drawings
FIG. 1 is a schematic view of the appearance structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is a schematic view of the gel body structure of the present invention;
FIG. 4 is a schematic view of the heat-conducting layer of the present invention;
fig. 5 is a schematic view of the insulating layer of the present invention.
In the figure: 1. a heat dissipation plate; 2. a containment plate; 21. folding; 3. a gel body; 4. a heat-conducting column; 5. an adsorption layer; 6. a barrier layer; 7. a heat conductive layer; 71. a Teflon resin layer; 72. a polyethylene resin layer; 8. a micro groove; 9. heat conducting powder; 10. an insulating layer; 101. an epoxy resin layer; 102. a glass fiber layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 2, the present invention provides a technical solution: a wear-resistant heat-conducting gel comprises a gel body 3, wherein a heat dissipation plate 1 is arranged at the upper end of the gel body 3, the heat dissipation plate 1 is an aluminum alloy plate, the thickness of the aluminum alloy plate is 1mm, the gel body has high hardness and excellent heat dissipation effect, heat dissipation holes are uniformly distributed in the heat dissipation plate 1, a containment plate 2 is arranged around the gel body 3 and the heat dissipation plate 1, the gel body 3 is contained, and friction possibly generated with elements around a heating element is avoided, so that the gel loss phenomenon is avoided, the containment plate 2 is made of nano graphene materials, the graphene is of a sheet structure and has certain hardness, the wear resistance can be improved, a plurality of groups of creases 21 are arranged around the outer surface of the containment plate 2, the gel body is convenient to cut and tear by hand, the thickness between the heating element and the heat dissipation device is convenient to match, the top end and the tail end of the, the shape of cooperation heating element and radiator, the lower extreme of heating panel 1 is provided with evenly distributed's heat conduction post 4, and heat conduction post 4 is wrapped up inside gel body 3, the top and the heating panel 1 fixed connection of heat conduction post 4, bottom and 3 direct contact of gel body, can utilize heat conduction post 4 to transmit to heating panel 1 the heating element's that gel body 3 absorbed when gel body 3 whereabouts is at heating element gap inside and heating panel 1 lower extreme vacuole formation, thereby transmit to the radiator on.
Referring to fig. 3, the gel body 3 includes an absorption layer 5, a barrier layer 6, a heat conduction layer 7 and an insulation layer 10, the insulation layer 10 is disposed at the lower end of the heat conduction layer 7, the absorption layer 5 is disposed at the upper end of the heat conduction layer 7, the absorption layer 5 increases the absorption force between the gel body 3 and the top end of the heat dissipation plate 1, micro grooves 8 are uniformly distributed on the outer surface of the upper end of the heat conduction layer 7, heat conduction powder 9 is disposed in the micro grooves 8, the micro grooves 8 and the heat conduction powder 9 are matched with each other to avoid the loss of the heat conduction powder 9, the barrier layer 6 is disposed at the lower end of the insulation layer 10, the barrier layer 6 includes a teflon coating layer and a polyester layer, the teflon coating layer has a thickness of 0.125mm to 0.15mm, the teflon is insoluble in all solvents, the friction coefficient is extremely low, the teflon has a high temperature resistance, the polymer has stable chemical properties, and can reduce the harm of the precipitation of the silicone oil in the gel body 3 to electronic elements.
Referring to fig. 4, the heat conductive layer 7 includes a teflon resin layer 71 and a polyethylene resin layer 72, the polyethylene resin layer 72 is located on the top of the teflon resin layer 71, the polyethylene resin layer 72 has the advantages of flexibility, high adhesion, good thermal stability, and the like, so that the surface of the gel body 3 before being attached can be kept clean, and by providing the teflon resin layer 71, the surface of the attached polyethylene resin layer 72 has an easy-to-peel characteristic, thereby avoiding damaging the surfaces of other layers when peeling off the polyethylene resin layer 72.
Referring to fig. 5, the insulation layer 10 includes an epoxy layer 101 and a glass fiber layer 102, the glass fiber layer 102 is located on top of the epoxy layer 101, and the epoxy layer 101 and the glass fiber layer 102 improve the insulation of the gel body 3.
The working principle is as follows: through the arranged heat conduction column 4, when the gel body 3 is in contact with the heating element and enters the gap of the heating element, the heat of the gel body 3 can be transferred to the heat dissipation plate 1 through the heat conduction column 4, so that the heat conduction speed is prevented from being reduced due to the fact that the gel body 3 falls down to form a tiny cavity between the heating element and the heat dissipation device; through the apron plate 2 that sets up, the apron plate 2 can enclose into any shape, and head and the tail pass through adhesive bonding, and the friction that probably produces with heating element components all around is avoided to the gel body 3 of enclosing to avoid the phenomenon that the gel runs off.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A wear-resistant thermally conductive gel comprising a gel body (3), characterized in that: the upper end of the gel body (3) is provided with a heat dissipation plate (1), the peripheries of the gel body (3) and the heat dissipation plate (1) are provided with containment plates (2), the lower end of the heat dissipation plate (1) is provided with heat conduction columns (4) which are uniformly distributed, the heat conducting column (4) is wrapped inside the gel body (3), the gel body (3) comprises an adsorption layer (5), a barrier layer (6), a heat conducting layer (7) and an insulating layer (10), the insulating layer (10) is arranged at the lower end of the heat conducting layer (7), an adsorption layer (5) is arranged at the upper end of the heat conduction layer (7), micro grooves (8) are uniformly distributed on the outer surface of the upper end of the heat conduction layer (7), and heat-conducting powder (9) is arranged in the micro groove (8), and a barrier layer (6) is arranged at the lower end of the insulating layer (10).
2. A wear resistant thermally conductive gel in accordance with claim 1, wherein: the heat dissipation plate (1) is an aluminum alloy plate, and heat dissipation holes are uniformly distributed in the heat dissipation plate (1).
3. A wear resistant thermally conductive gel in accordance with claim 1, wherein: the outer surface of the enclosure plate (2) is provided with a plurality of groups of folds (21) all around, and the top end and the tail end of the enclosure plate (2) are connected through gluing.
4. A wear resistant thermally conductive gel in accordance with claim 1, wherein: the heat conducting layer (7) comprises a Teflon resin layer (71) and a polyethylene resin layer (72), and the polyethylene resin layer (72) is located at the top of the Teflon resin layer (71).
5. A wear resistant thermally conductive gel in accordance with claim 1, wherein: the insulation layer (10) comprises an epoxy resin layer (101) and a glass fiber layer (102), wherein the glass fiber layer (102) is located on the top of the epoxy resin layer (101).
6. A wear resistant thermally conductive gel in accordance with claim 1, wherein: the barrier layer (6) comprises a polytetrafluoroethylene coating and a polyester layer, the thickness of the polytetrafluoroethylene coating is 0.125-0.15 mm, and the thickness of the polyester layer is 0.002-0.15 mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921534615.7U CN210881183U (en) | 2019-09-16 | 2019-09-16 | Wear-resistant heat-conducting gel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921534615.7U CN210881183U (en) | 2019-09-16 | 2019-09-16 | Wear-resistant heat-conducting gel |
Publications (1)
Publication Number | Publication Date |
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CN210881183U true CN210881183U (en) | 2020-06-30 |
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Family Applications (1)
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CN201921534615.7U Expired - Fee Related CN210881183U (en) | 2019-09-16 | 2019-09-16 | Wear-resistant heat-conducting gel |
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CN (1) | CN210881183U (en) |
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2019
- 2019-09-16 CN CN201921534615.7U patent/CN210881183U/en not_active Expired - Fee Related
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200630 Termination date: 20210916 |