CN208387168U - A kind of soft high thermal conductivity gel film - Google Patents
A kind of soft high thermal conductivity gel film Download PDFInfo
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- CN208387168U CN208387168U CN201821022438.XU CN201821022438U CN208387168U CN 208387168 U CN208387168 U CN 208387168U CN 201821022438 U CN201821022438 U CN 201821022438U CN 208387168 U CN208387168 U CN 208387168U
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- thermally conductive
- gel
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Abstract
The utility model discloses a kind of soft high thermal conductivity gel films; including gel film ontology; convex block is provided at the top of the gel film ontology; the gel film ontology includes heat-conducting layer and protective layer; the heat-conducting layer is located at the bottom of protective layer; the heat-conducting layer includes thermally conductive gel layer, thermally conductive nylon layer, and the protective layer includes polyvinyl resin layer, Teflon resin layer.The utility model is used cooperatively by setting gel film ontology, convex block, heat-conducting layer, protective layer, thermally conductive gel layer, thermally conductive nylon layer, polyvinyl resin layer, Teflon resin layer; solve existing gel film assemble use when and radiator and heater be bonded when poor contact; radiator and heater surface are uniformly contacted by gel film convex block; make low rigidity gels block deformable filler contact interface by applying pressure; reduce thermal contact resistance; effective thermal conducting path is formed in this way, improves electronics, electric equipment products internal element reliability.
Description
Technical field
The utility model relates to gel film technical field, specially a kind of soft high thermal conductivity gel film.
Background technique
Colloidal particle or macromolecule in colloidal sol or solution interconnect under certain condition, form space net structure,
It is filled in structural void and (is also possible to gas in xerogel, xerogel is also referred to as airsetting as the liquid of decentralized medium
Glue), such a special dispersion is referred to as gel, and it is internal often to contain big quantity of fluid without mobility, it is solidifying that elasticity can be divided into
Glue and brittleness gel, after elastic gel loses decentralized medium, volume is reduced significantly, and when reuptaking decentralized medium, volume
It expands again, such as gelatin etc., when brittleness gel loses or reuptakes decentralized medium, shape and volume do not change, example
Such as silica gel is known as gelatification by the process that solution or colloidal sol form gel.
Common thermally conductive sheet is widely used in various electronics, in electric equipment products, and when in use, hardness is higher for existing thermally conductive sheet
The higher stress of wiring board is caused to concentrate, the long-term wiring board that squeezes causes to cause electronics, electric equipment products internal component damage in this way,
The use of person inconvenient to use reduces the reliability of thermally conductive sheet.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of soft high thermal conductivity gel film, has thermally conductive effect
Fruit it is good the advantages that, solving the problems, such as existing thermally conductive sheet, hardness high effect is bad when in use.
(2) technical solution
For the purpose for realizing above-mentioned good heat conduction effect, the utility model is provided the following technical solutions: a kind of soft height is led
Heat setting film, including gel film ontology are provided with convex block at the top of the gel film ontology, and the gel film ontology includes thermally conductive
Layer and protective layer, the heat-conducting layer are located at the top of protective layer, and the heat-conducting layer includes thermally conductive gel layer, thermally conductive nylon layer, institute
Stating protective layer includes polyvinyl resin layer, Teflon resin layer.
Preferably, the thermally conductive gel layer is located at the top of thermally conductive nylon layer.
Preferably, the polyvinyl resin layer is located at the top of Teflon resin layer.
Preferably, the thermally conductive gel layer with a thickness of 0.2mm~15mm, the thermally conductive nylon layer with a thickness of
0.015mm~0.15mm.
Preferably, the polyvinyl resin layer with a thickness of 0.125mm~0.15mm, the thickness of the Teflon resin layer
For 0.002mm~0.15mm.
(3) beneficial effect
Compared with prior art, the utility model provides a kind of soft high thermal conductivity gel film, has following beneficial to effect
Fruit:
1, the utility model passes through setting gel film ontology, convex block, heat-conducting layer, protective layer, thermally conductive gel layer, thermally conductive nylon
Layer, polyvinyl resin layer, Teflon resin layer are used cooperatively, solve existing gel film assemble use when and radiator and
Poor contact when heater is bonded, uniformly contacts radiator and heater surface by gel film convex block, is made by applying pressure
Low rigidity gels block deformable filler contact interface reduces thermal contact resistance, forms effective thermal conducting path in this way, improves electronics, electric appliance
Interiors of products component reliability.
2, the utility model has excellent heating conduction by setting thermally conductive gel layer, thermally conductive gel layer, has superior
Electrical resistance, ageing-resistant, cold-and-heat resistent alternation performance, moisture-proof non-swelling, electrical insulation capability, power fade rate, shockproof, waterproof, suction
Vibration property and stability there is nontoxic, nonirritant gas to discharge, is solvent-free, corrosion-free, pollution-free, safer environmental protection, has excellent
Different high and low temperature resistance, by the way that thermally conductive nylon layer is arranged, there is thermally conductive nylon layer rock-steady structure to enhance gel film mechanical performance
Thermal stress is buffered, by the way that polyvinyl resin layer is arranged, polyvinyl resin layer is good etc. with flexibility, high adhesion force, thermal stability
Advantage can make thermally conductive gel piece fitting front surface keep clean, by the way that Teflon resin layer is arranged, be bonded polyvinyl resin table
Face has easily peelable characteristic, and gel layer surface is avoided to damage when removing polyvinyl resin layer to low rigidity gels surface.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the cross-sectional view of the utility model structural gel piece ontology；
Fig. 3 is the cross-sectional view of the utility model structure heat-conducting layer；
Fig. 4 is the cross-sectional view of the utility model structure protective layer.
In figure: 1 gel film ontology, 2 convex blocks, 101 heat-conducting layers, 102 protective layers, 3 thermally conductive gel layers, 4 thermally conductive nylon layers, 5
Polyvinyl resin layer, 6 Teflon resin layers.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Please refer to Fig. 1-4, a kind of soft high thermal conductivity gel film, including gel film ontology 1, the top of gel film ontology 1
It is provided with convex block 2, gel film ontology 1 includes heat-conducting layer 101 and protective layer 102, and heat-conducting layer 101 is located at the top of protective layer 102,
Heat-conducting layer 101 includes thermally conductive gel layer 3, thermally conductive nylon layer 4, and thermally conductive gel layer 3 is located at the top of thermally conductive nylon layer 4, thermally conductive solidifying
Glue-line 3 with a thickness of 0.2mm~15mm, thermally conductive nylon layer 4 with a thickness of 0.015~0.15mm, pass through setting thermally conductive gel layer
3, thermally conductive gel layer 3 have excellent heating conduction, have superior electrical resistance, ageing-resistant, cold-and-heat resistent alternation performance, it is moisture-proof not
There is nontoxic, nonirritant gas to release for swelling, electrical insulation capability, power fade rate, shockproof, waterproof, absorbing and stability
It puts, is solvent-free, is corrosion-free, is pollution-free, safer environmental protection, there is excellent high and low temperature resistance, by the way that thermally conductive nylon layer is arranged
4, thermally conductive nylon layer 4 has thermal coefficient high, and heat-radiating properties are superior, and mechanical strength is good, good electric insulating effect, protective layer
102 include polyvinyl resin layer 5, Teflon resin layer 6, and polyvinyl resin layer 5 is located at the top of Teflon resin layer 6, poly- second
Olefine resin layer 5 with a thickness of 0.0125mm~0.15mm, Teflon resin layer 6 with a thickness of 0.002mm~0.15mm, by setting
Polyvinyl resin layer 5 is set, polyvinyl resin layer 5 has flexible, low smell, high intensity, high adhesion force, inoxidizability and thermostabilization
Property it is good the advantages that, can protect gel layer stable structure, by be arranged Teflon resin layer 6, Teflon resin layer 6 has release
Property it is good, stability is good, erosion-resisting advantage, the utility model by setting gel film ontology 1, convex block 2, heat-conducting layer 101, protection
Layer 102, thermally conductive gel layer 3, thermally conductive nylon layer 4, polyvinyl resin layer 5, Teflon resin layer 6 are used cooperatively, and are solved existing
Gel film assemble use when and radiator and heater be bonded when poor contact, heat dissipation is uniformly contacted by gel film convex block
Device and heater surface make low rigidity gels block deformable filler contact interface by applying pressure, reduce thermal contact resistance, such shape
At effective access, electronics, electric equipment products internal element reliability are improved.
When in use, by the way that gel film ontology 1 is arranged, convex block 2, heat-conducting layer 101, protective layer 102, thermally conductive gel layer 3, leads
Hot nylon layer 4, polyvinyl resin layer 5, Teflon resin layer 6 are used cooperatively, and solve existing gel film when in use, usually
Electronics, electric equipment products can generate a large amount of residual stress at work, and gel sheet hardness is low, thus is avoided that and causes electronics, electricity
The problem of device interiors of products component wear, the use for the person of being convenient to use improve the practicability of gel film.
In conclusion the soft high thermal conductivity gel film, passes through gel film ontology 1, convex block 2, heat-conducting layer 101, protective layer
102, thermally conductive gel layer 3, thermally conductive nylon layer 4, polyvinyl resin layer 5, Teflon resin layer 6 are used cooperatively, and are solved existing
Thermally conductive sheet contact the problems in bad stress collection of effect when in use.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of soft high thermal conductivity gel film, including gel film ontology (1), it is characterised in that: the gel film ontology (1)
Top is provided with convex block (2), and the gel film ontology (1) includes heat-conducting layer (101) and protective layer (102), the heat-conducting layer
(101) it is located at the top of protective layer (102), the heat-conducting layer (101) includes thermally conductive gel layer (3), thermally conductive nylon layer (4), institute
Stating protective layer (102) includes polyvinyl resin layer (5), Teflon resin layer (6).
2. a kind of soft high thermal conductivity gel film according to claim 1, it is characterised in that: the thermally conductive gel layer (3)
Positioned at the top of thermally conductive nylon layer (4).
3. a kind of soft high thermal conductivity gel film according to claim 1, it is characterised in that: the polyvinyl resin layer
(5) it is located at the top of Teflon resin layer (6).
4. a kind of soft high thermal conductivity gel film according to claim 1, it is characterised in that: the thermally conductive gel layer (3)
With a thickness of 0.2mm~15mm, the thermally conductive nylon layer (4) with a thickness of 0.015mm~0.15mm.
5. a kind of soft high thermal conductivity gel film according to claim 1, it is characterised in that: the polyvinyl resin layer
(5) with a thickness of 0.0125mm~0.15mm, the Teflon resin layer (6) with a thickness of 0.005mm~0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821022438.XU CN208387168U (en) | 2018-06-29 | 2018-06-29 | A kind of soft high thermal conductivity gel film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821022438.XU CN208387168U (en) | 2018-06-29 | 2018-06-29 | A kind of soft high thermal conductivity gel film |
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| Publication Number | Publication Date |
|---|---|
| CN208387168U true CN208387168U (en) | 2019-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821022438.XU Active CN208387168U (en) | 2018-06-29 | 2018-06-29 | A kind of soft high thermal conductivity gel film |
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| CN (1) | CN208387168U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133621A (en) * | 2019-06-25 | 2020-12-25 | 中微半导体设备(上海)股份有限公司 | Heat conducting fin and plasma processing device |
-
2018
- 2018-06-29 CN CN201821022438.XU patent/CN208387168U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133621A (en) * | 2019-06-25 | 2020-12-25 | 中微半导体设备(上海)股份有限公司 | Heat conducting fin and plasma processing device |
| CN112133621B (en) * | 2019-06-25 | 2023-09-29 | 中微半导体设备(上海)股份有限公司 | Heat conducting fin and plasma processing device |
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